TWI562267B - Article storage facility and article storage method - Google Patents

Article storage facility and article storage method

Info

Publication number
TWI562267B
TWI562267B TW101146875A TW101146875A TWI562267B TW I562267 B TWI562267 B TW I562267B TW 101146875 A TW101146875 A TW 101146875A TW 101146875 A TW101146875 A TW 101146875A TW I562267 B TWI562267 B TW I562267B
Authority
TW
Taiwan
Prior art keywords
article storage
facility
storage facility
storage method
article
Prior art date
Application number
TW101146875A
Other languages
English (en)
Other versions
TW201347073A (zh
Inventor
Masahiro Takahara
Toshihito Ueda
Original Assignee
Daifuku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daifuku Kk filed Critical Daifuku Kk
Publication of TW201347073A publication Critical patent/TW201347073A/zh
Application granted granted Critical
Publication of TWI562267B publication Critical patent/TWI562267B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B5/00—Packaging individual articles in containers or receptacles, e.g. bags, sacks, boxes, cartons, cans, jars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • B65G1/0407—Storage devices mechanical using stacker cranes
    • B65G1/0414—Storage devices mechanical using stacker cranes provided with satellite cars adapted to travel in storage racks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733—Overhead conveying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
TW101146875A 2012-01-06 2012-12-12 Article storage facility and article storage method TWI562267B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012001557A JP5598734B2 (ja) 2012-01-06 2012-01-06 物品保管設備

Publications (2)

Publication Number Publication Date
TW201347073A TW201347073A (zh) 2013-11-16
TWI562267B true TWI562267B (en) 2016-12-11

Family

ID=48721496

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101146875A TWI562267B (en) 2012-01-06 2012-12-12 Article storage facility and article storage method

Country Status (5)

Country Link
US (1) US9266629B2 (zh)
JP (1) JP5598734B2 (zh)
KR (1) KR102043873B1 (zh)
CN (1) CN103199042B (zh)
TW (1) TWI562267B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014141563A1 (ja) * 2013-03-15 2014-09-18 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、基板収納器搬送方法及びプログラム
JP6102759B2 (ja) * 2014-01-16 2017-03-29 株式会社ダイフク 物品搬送台車
US10410894B2 (en) * 2014-06-16 2019-09-10 Murata Machinery, Ltd. Purge stocker and purging method
EP3157048B1 (en) * 2014-06-16 2021-03-24 Murata Machinery, Ltd. Purge device, purge system, purge method, and control method in purge system
JP6217611B2 (ja) 2014-12-02 2017-10-25 株式会社ダイフク 物品保管設備
US10766056B2 (en) * 2015-08-04 2020-09-08 Murata Machinery, Ltd. Purge device, purge stocker, and method for feeding purge gas
SG11201801353VA (en) * 2015-08-25 2018-03-28 Murata Machinery Ltd Purge device, purge stocker, and purge method
JP6414338B2 (ja) * 2015-08-28 2018-10-31 村田機械株式会社 保管装置および保管方法
JP6414525B2 (ja) * 2015-09-02 2018-10-31 株式会社ダイフク 保管設備
JP6885692B2 (ja) * 2016-09-01 2021-06-16 株式会社Ｆｕｊｉ ストッカシステム
JP6623988B2 (ja) * 2016-09-09 2019-12-25 株式会社ダイフク 容器収納設備
JP6610476B2 (ja) * 2016-09-09 2019-11-27 株式会社ダイフク 容器収納設備
JP6794898B2 (ja) * 2017-03-29 2020-12-02 株式会社ダイフク 収納棚

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5696689A (en) * 1994-11-25 1997-12-09 Nippondenso Co., Ltd. Dispatch and conveyer control system for a production control system of a semiconductor substrate
JP2004115220A (ja) * 2002-09-27 2004-04-15 Daifuku Co Ltd 物品保管設備
JP2008159734A (ja) * 2006-12-22 2008-07-10 Asyst Technologies Japan Inc コンテナの搬送システム及び測定用コンテナ
US20100000625A1 (en) * 2008-07-03 2010-01-07 Fumiki Goto Purge apparatus
JP2010182747A (ja) * 2009-02-03 2010-08-19 Dan Takuma:Kk 保管システムおよび保管方法
JP2011228391A (ja) * 2010-04-16 2011-11-10 Dan-Takuma Technologies Inc 保管システムおよび保管方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3177035B2 (ja) * 1992-11-26 2001-06-18 東京エレクトロン株式会社 縦型熱処理装置
US6275744B1 (en) * 1997-08-01 2001-08-14 Kokusai Electric Co., Ltd. Substrate feed control
JPH11168135A (ja) * 1997-12-03 1999-06-22 Toshiba Corp 基板保管装置および基板保管方法
US5988233A (en) * 1998-03-27 1999-11-23 Asyst Technologies, Inc. Evacuation-driven SMIF pod purge system
JP2000242304A (ja) * 1999-02-19 2000-09-08 Mitsubishi Electric Corp プロセス制御装置およびプロセス制御方法
JP2000332095A (ja) 1999-05-20 2000-11-30 Dan Sangyo Kk 基板保管装置及び基板保管方法
JP2003007800A (ja) * 2001-06-21 2003-01-10 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
JP2007186757A (ja) * 2006-01-13 2007-07-26 Tokyo Electron Ltd 真空処理装置及び真空処理方法
TWM304619U (en) * 2006-04-28 2007-01-11 Fortrend Taiwan Scient Corp Nitrogen cabinet with distinguishing and inflating apparatuses
WO2008008727A2 (en) * 2006-07-10 2008-01-17 Applied Materials, Inc. Scheduling method for processing equipment
US7679722B2 (en) * 2006-10-30 2010-03-16 Taiwan Semiconductor Manufacturing Co., Ltd. Reticle management systems and methods
JP4828503B2 (ja) * 2007-10-16 2011-11-30 東京エレクトロン株式会社 基板処理装置、基板搬送方法、コンピュータプログラムおよび記憶媒体
JP5615650B2 (ja) * 2010-09-28 2014-10-29 大日本スクリーン製造株式会社 基板処理方法および基板処理装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5696689A (en) * 1994-11-25 1997-12-09 Nippondenso Co., Ltd. Dispatch and conveyer control system for a production control system of a semiconductor substrate
JP2004115220A (ja) * 2002-09-27 2004-04-15 Daifuku Co Ltd 物品保管設備
JP2008159734A (ja) * 2006-12-22 2008-07-10 Asyst Technologies Japan Inc コンテナの搬送システム及び測定用コンテナ
US20100000625A1 (en) * 2008-07-03 2010-01-07 Fumiki Goto Purge apparatus
JP2010182747A (ja) * 2009-02-03 2010-08-19 Dan Takuma:Kk 保管システムおよび保管方法
JP2011228391A (ja) * 2010-04-16 2011-11-10 Dan-Takuma Technologies Inc 保管システムおよび保管方法

Also Published As

Publication number Publication date
KR102043873B1 (ko) 2019-11-12
CN103199042B (zh) 2017-03-01
JP5598734B2 (ja) 2014-10-01
US20140014229A1 (en) 2014-01-16
KR20130081201A (ko) 2013-07-16
JP2013142009A (ja) 2013-07-22
US9266629B2 (en) 2016-02-23
CN103199042A (zh) 2013-07-10
TW201347073A (zh) 2013-11-16

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