TWI561387B - Film debonding apparatus - Google Patents

Film debonding apparatus

Info

Publication number
TWI561387B
TWI561387B TW105106212A TW105106212A TWI561387B TW I561387 B TWI561387 B TW I561387B TW 105106212 A TW105106212 A TW 105106212A TW 105106212 A TW105106212 A TW 105106212A TW I561387 B TWI561387 B TW I561387B
Authority
TW
Taiwan
Prior art keywords
debonding apparatus
film
film debonding
debonding
Prior art date
Application number
TW105106212A
Other languages
Chinese (zh)
Other versions
TW201628864A (en
Inventor
Chen-Chu Tsai
Chih-Wei Kung
Cheng-Che Wu
Chia-Hua Lu
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Publication of TW201628864A publication Critical patent/TW201628864A/en
Application granted granted Critical
Publication of TWI561387B publication Critical patent/TWI561387B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
TW105106212A 2012-11-14 2013-10-25 Film debonding apparatus TWI561387B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201261726516P 2012-11-14 2012-11-14

Publications (2)

Publication Number Publication Date
TW201628864A TW201628864A (en) 2016-08-16
TWI561387B true TWI561387B (en) 2016-12-11

Family

ID=51294138

Family Applications (2)

Application Number Title Priority Date Filing Date
TW102138643A TWI542470B (en) 2012-11-14 2013-10-25 Film debonding apparatus and method of the same
TW105106212A TWI561387B (en) 2012-11-14 2013-10-25 Film debonding apparatus

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW102138643A TWI542470B (en) 2012-11-14 2013-10-25 Film debonding apparatus and method of the same

Country Status (2)

Country Link
CN (1) CN105252880B (en)
TW (2) TWI542470B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI709492B (en) * 2019-11-22 2020-11-11 辛耘企業股份有限公司 Stripping device

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105186249B (en) * 2015-07-22 2021-06-29 苏州海博智能系统有限公司 Separation device, separation container and method for separating laminates
CN106793488B (en) 2015-11-20 2019-04-30 财团法人工业技术研究院 Flexible electronic device and manufacturing process method thereof
CN106739424B (en) 2015-11-20 2020-02-14 财团法人工业技术研究院 Taking-down and bonding device, taking-down method and bonding method using same
CN109616573B (en) * 2018-10-31 2023-06-30 武汉华星光电半导体显示技术有限公司 Laser peeling device for flexible substrate and laser peeling method for flexible substrate
CN111172736B (en) * 2020-03-10 2022-01-28 江苏华艺服饰有限公司 Wrinkling process facilitating stripping of padding cotton

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1119404A (en) * 1994-08-03 1996-03-27 苏马吕株式会社 Method and apparatus for removing film
TW360901B (en) * 1996-08-27 1999-06-11 Seiko Epson Corp Method of peeling thin-film device, method of transferring thin-film device, thin-film device thereby, thin-film IC circuit device, and liquid crystal display device
TW200806124A (en) * 2006-03-20 2008-01-16 Adtec Eng Co Ltd Film removing device
US20090294042A1 (en) * 2008-06-02 2009-12-03 Fujifilm Corporation Cutting method and cutting apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3970813B2 (en) * 2002-09-05 2007-09-05 三星コーニング精密琉璃株式会社 Film removing apparatus and film removing method
CN1739129A (en) * 2003-01-15 2006-02-22 株式会社半导体能源研究所 Peeling method and method for manufacturing display device using the peeling method
JP5020563B2 (en) * 2006-08-02 2012-09-05 日東電工株式会社 Method for producing adsorption film and method for producing adsorption film with release film
CN101123168A (en) * 2006-08-09 2008-02-13 黄伟民 Thin film peel-off device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1119404A (en) * 1994-08-03 1996-03-27 苏马吕株式会社 Method and apparatus for removing film
TW360901B (en) * 1996-08-27 1999-06-11 Seiko Epson Corp Method of peeling thin-film device, method of transferring thin-film device, thin-film device thereby, thin-film IC circuit device, and liquid crystal display device
TW200806124A (en) * 2006-03-20 2008-01-16 Adtec Eng Co Ltd Film removing device
US20090294042A1 (en) * 2008-06-02 2009-12-03 Fujifilm Corporation Cutting method and cutting apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI709492B (en) * 2019-11-22 2020-11-11 辛耘企業股份有限公司 Stripping device

Also Published As

Publication number Publication date
TW201628864A (en) 2016-08-16
CN105252880B (en) 2018-05-15
TWI542470B (en) 2016-07-21
TW201418031A (en) 2014-05-16
CN105252880A (en) 2016-01-20

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