TWI560504B - - Google Patents

Info

Publication number
TWI560504B
TWI560504B TW103126272A TW103126272A TWI560504B TW I560504 B TWI560504 B TW I560504B TW 103126272 A TW103126272 A TW 103126272A TW 103126272 A TW103126272 A TW 103126272A TW I560504 B TWI560504 B TW I560504B
Authority
TW
Taiwan
Application number
TW103126272A
Other languages
Chinese (zh)
Other versions
TW201516546A (en
Inventor
Mitsukuni Sakashita
Yoshikazu Ohtani
Original Assignee
Shinetsu Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Eng Co Ltd filed Critical Shinetsu Eng Co Ltd
Publication of TW201516546A publication Critical patent/TW201516546A/en
Application granted granted Critical
Publication of TWI560504B publication Critical patent/TWI560504B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133354—Arrangements for aligning or assembling substrates

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Fluid Mechanics (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
TW103126272A 2013-08-13 2014-07-31 Bonding equipment manufacturing device and bonding equipment manufacturing method TW201516546A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013168024A JP5395306B1 (en) 2013-08-13 2013-08-13 Bonding device manufacturing apparatus and bonding device manufacturing method

Publications (2)

Publication Number Publication Date
TW201516546A TW201516546A (en) 2015-05-01
TWI560504B true TWI560504B (en) 2016-12-01

Family

ID=50112323

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103126272A TW201516546A (en) 2013-08-13 2014-07-31 Bonding equipment manufacturing device and bonding equipment manufacturing method

Country Status (4)

Country Link
JP (1) JP5395306B1 (en)
KR (1) KR102038158B1 (en)
CN (1) CN104369517B (en)
TW (1) TW201516546A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106710451B (en) * 2017-03-06 2019-08-06 京东方科技集团股份有限公司 The support shaft production method and flexible display panels of flexible display panels
CN108121093B (en) * 2017-12-29 2020-08-04 深圳市华星光电技术有限公司 Pressure regulating device and spraying cutter
JP7079639B2 (en) * 2018-03-29 2022-06-02 株式会社ジャパンディスプレイ Manufacturing method of crimping device and display device
CN112198682B (en) * 2019-07-08 2023-07-04 夏普株式会社 Attaching device of liquid crystal panel
WO2021084582A1 (en) * 2019-10-28 2021-05-06 パナソニックＩｐマネジメント株式会社 Vacuum pasting apparatus
CN110827690B (en) * 2019-11-26 2024-01-23 云谷（固安）科技有限公司 Attaching device
CN111061112B (en) * 2020-01-02 2023-02-17 上海天马微电子有限公司 Display panel, manufacturing method thereof and display device
CN113325624B (en) * 2021-06-10 2022-10-18 业成科技（成都）有限公司 Removable adhesive and display device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007053412A (en) * 2006-11-30 2007-03-01 Dainippon Screen Mfg Co Ltd Thin film forming apparatus and thin film forming method
TW201330155A (en) * 2011-11-25 2013-07-16 Shinetsu Eng Co Ltd Wafer transport apparatus and wafer assembly line

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3542956B2 (en) * 2000-10-30 2004-07-14 信越エンジニアリング株式会社 LCD panel substrate bonding equipment
KR100662497B1 (en) * 2002-11-18 2007-01-02 엘지.필립스 엘시디 주식회사 substrates bonding device for manufacturing of liquid crystal display
JP4379435B2 (en) * 2006-05-17 2009-12-09 株式会社日立プラントテクノロジー Board assembly apparatus and board assembly method using the same
JP2009230039A (en) 2008-03-25 2009-10-08 Epson Imaging Devices Corp Method of manufacturing electrooptic device
KR101100836B1 (en) 2009-11-26 2012-01-02 세메스 주식회사 Apparatus and method for treating substrate
KR101471705B1 (en) * 2010-08-30 2014-12-10 신에츠 엔지니어링 가부시키가이샤 Method and system for manufacturing display panel

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007053412A (en) * 2006-11-30 2007-03-01 Dainippon Screen Mfg Co Ltd Thin film forming apparatus and thin film forming method
TW201330155A (en) * 2011-11-25 2013-07-16 Shinetsu Eng Co Ltd Wafer transport apparatus and wafer assembly line

Also Published As

Publication number Publication date
CN104369517A (en) 2015-02-25
KR20150020310A (en) 2015-02-25
TW201516546A (en) 2015-05-01
JP5395306B1 (en) 2014-01-22
JP2015036739A (en) 2015-02-23
KR102038158B1 (en) 2019-10-29
CN104369517B (en) 2017-06-13

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees