TWI560255B - Pressure sensitive adhesive, pressure sensitive adhesive sheet, and electronic device - Google Patents

Pressure sensitive adhesive, pressure sensitive adhesive sheet, and electronic device

Info

Publication number
TWI560255B
TWI560255B TW101105237A TW101105237A TWI560255B TW I560255 B TWI560255 B TW I560255B TW 101105237 A TW101105237 A TW 101105237A TW 101105237 A TW101105237 A TW 101105237A TW I560255 B TWI560255 B TW I560255B
Authority
TW
Taiwan
Prior art keywords
sensitive adhesive
pressure sensitive
electronic device
adhesive sheet
sheet
Prior art date
Application number
TW101105237A
Other languages
English (en)
Chinese (zh)
Other versions
TW201237135A (en
Inventor
Katsunori Fukuta
Takayuki Kobayashi
Noboru Kojima
Etsuko Yoshinari
Chiyo Ishizu
Original Assignee
Toyo Ink Sc Holdings Co Ltd
Toyochem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Ink Sc Holdings Co Ltd, Toyochem Co Ltd filed Critical Toyo Ink Sc Holdings Co Ltd
Publication of TW201237135A publication Critical patent/TW201237135A/zh
Application granted granted Critical
Publication of TWI560255B publication Critical patent/TWI560255B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C

Landscapes

  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Position Input By Displaying (AREA)
TW101105237A 2011-03-15 2012-02-17 Pressure sensitive adhesive, pressure sensitive adhesive sheet, and electronic device TWI560255B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011056983A JP5712706B2 (ja) 2011-03-15 2011-03-15 粘着剤、粘着シートおよびディスプレイ

Publications (2)

Publication Number Publication Date
TW201237135A TW201237135A (en) 2012-09-16
TWI560255B true TWI560255B (en) 2016-12-01

Family

ID=46808661

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101105237A TWI560255B (en) 2011-03-15 2012-02-17 Pressure sensitive adhesive, pressure sensitive adhesive sheet, and electronic device

Country Status (4)

Country Link
JP (1) JP5712706B2 (ko)
KR (1) KR101890713B1 (ko)
CN (1) CN102676092B (ko)
TW (1) TWI560255B (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5790089B2 (ja) * 2011-03-31 2015-10-07 Dic株式会社 両面粘着テープ
JP6057693B2 (ja) * 2012-12-17 2017-01-11 藤森工業株式会社 粘着剤層、及び粘着フィルム
CN103087503B (zh) * 2013-01-14 2015-04-01 徐广敏 一种电子灌封胶及其制备方法
JP6130246B2 (ja) * 2013-06-28 2017-05-17 リンテック株式会社 粘着性組成物、粘着剤および粘着シート
JP6325778B2 (ja) * 2013-06-28 2018-05-16 リンテック株式会社 粘着シートおよび積層体
JP6442879B2 (ja) * 2013-06-28 2018-12-26 三菱ケミカル株式会社 積層防湿フィルム
JP6130245B2 (ja) * 2013-06-28 2017-05-17 リンテック株式会社 粘着性組成物、粘着剤および粘着シート
JP2015193706A (ja) * 2014-03-31 2015-11-05 リンテック株式会社 導電性基板用表面保護フィルムの製造方法
CN104175697B (zh) * 2014-07-04 2016-01-27 京东方科技集团股份有限公司 偏光片的贴附方法、偏光片单元及显示装置
WO2016111526A1 (ko) 2015-01-06 2016-07-14 엘지전자 주식회사 방송 신호 송신 장치, 방송 신호 수신 장치, 방송 신호 송신 방법, 및 방송 신호 수신 방법
TWI597340B (zh) * 2015-03-31 2017-09-01 住友化學股份有限公司 光學積層體及液晶顯示裝置
JP5956044B1 (ja) * 2015-10-07 2016-07-20 住友化学株式会社 光学積層体及び液晶表示装置
JP7112227B2 (ja) * 2017-03-31 2022-08-03 積水化学工業株式会社 アクリル系粘着剤組成物及び粘着シート

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200600558A (en) * 2004-04-30 2006-01-01 Sumitomo Chemical Co Acrylic resin composition
TW200842171A (en) * 2006-12-06 2008-11-01 Nitto Denko Corp Removable pressure-sensitive adhesive composition and pressure-sensitive adhesive tape or sheet
TW201006905A (en) * 2008-07-31 2010-02-16 Lintec Corp Adhesive sheet

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4788937B2 (ja) 2001-05-07 2011-10-05 綜研化学株式会社 粘着剤組成物及び該組成物を用いたディスプレイ用粘着シート
JP4534431B2 (ja) * 2003-04-30 2010-09-01 東洋インキ製造株式会社 粘着剤およびそれを用いた光学部材
JP5299804B2 (ja) 2004-08-03 2013-09-25 綜研化学株式会社 金属貼着用粘着シート
JP2007297452A (ja) * 2006-04-28 2007-11-15 Daio Paper Corp 粘着シート
JP4931197B2 (ja) * 2006-08-24 2012-05-16 リケンテクノス株式会社 粘着剤組成物およびそれを用いた粘着シート部材
JP4531099B2 (ja) 2007-09-06 2010-08-25 日東電工株式会社 粘着剤組成物及びそれを用いた粘着製品、ディスプレイ
CN102482539A (zh) * 2009-08-28 2012-05-30 日东电工株式会社 粘合带或粘合片用基材及粘合带或粘合片
JP5715955B2 (ja) * 2009-09-01 2015-05-13 綜研化学株式会社 光学部材用放射線硬化型粘着剤組成物および粘着型光学部材

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200600558A (en) * 2004-04-30 2006-01-01 Sumitomo Chemical Co Acrylic resin composition
TW200842171A (en) * 2006-12-06 2008-11-01 Nitto Denko Corp Removable pressure-sensitive adhesive composition and pressure-sensitive adhesive tape or sheet
TW201006905A (en) * 2008-07-31 2010-02-16 Lintec Corp Adhesive sheet

Also Published As

Publication number Publication date
TW201237135A (en) 2012-09-16
CN102676092A (zh) 2012-09-19
JP2012193248A (ja) 2012-10-11
CN102676092B (zh) 2016-03-16
KR101890713B1 (ko) 2018-08-22
KR20120105361A (ko) 2012-09-25
JP5712706B2 (ja) 2015-05-07

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