TWI559993B - Ultrasonic cleaning method and ultrasonic cleaning apparatus - Google Patents

Ultrasonic cleaning method and ultrasonic cleaning apparatus

Info

Publication number
TWI559993B
TWI559993B TW102117188A TW102117188A TWI559993B TW I559993 B TWI559993 B TW I559993B TW 102117188 A TW102117188 A TW 102117188A TW 102117188 A TW102117188 A TW 102117188A TW I559993 B TWI559993 B TW I559993B
Authority
TW
Taiwan
Prior art keywords
ultrasonic cleaning
cleaning apparatus
cleaning method
ultrasonic
cleaning
Prior art date
Application number
TW102117188A
Other languages
English (en)
Other versions
TW201347867A (zh
Inventor
Etsuko Kubo
Teruo Haibara
Yoshihiro Mori
Masashi Uchibe
Original Assignee
Siltronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag filed Critical Siltronic Ag
Publication of TW201347867A publication Critical patent/TW201347867A/zh
Application granted granted Critical
Publication of TWI559993B publication Critical patent/TWI559993B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
TW102117188A 2012-05-24 2013-05-15 Ultrasonic cleaning method and ultrasonic cleaning apparatus TWI559993B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012118633A JP5894858B2 (ja) 2012-05-24 2012-05-24 超音波洗浄方法

Publications (2)

Publication Number Publication Date
TW201347867A TW201347867A (zh) 2013-12-01
TWI559993B true TWI559993B (en) 2016-12-01

Family

ID=48428374

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102117188A TWI559993B (en) 2012-05-24 2013-05-15 Ultrasonic cleaning method and ultrasonic cleaning apparatus

Country Status (7)

Country Link
US (1) US20130312788A1 (zh)
EP (1) EP2666552B1 (zh)
JP (1) JP5894858B2 (zh)
KR (2) KR20130132286A (zh)
CN (1) CN103418573B (zh)
MY (1) MY179404A (zh)
TW (1) TWI559993B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5872382B2 (ja) * 2012-05-24 2016-03-01 ジルトロニック アクチエンゲゼルシャフトＳｉｌｔｒｏｎｉｃ ＡＧ 超音波洗浄方法
US10195667B2 (en) * 2015-11-23 2019-02-05 Delavan Inc. Powder removal systems
US20170213705A1 (en) * 2016-01-27 2017-07-27 Applied Materials, Inc. Slit valve gate coating and methods for cleaning slit valve gates
JP6609231B2 (ja) * 2016-09-16 2019-11-20 キオクシア株式会社 基板処理装置および半導体装置の製造方法
US11168978B2 (en) 2020-01-06 2021-11-09 Tokyo Electron Limited Hardware improvements and methods for the analysis of a spinning reflective substrates
US11738363B2 (en) 2021-06-07 2023-08-29 Tokyo Electron Limited Bath systems and methods thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0860866A1 (en) * 1997-02-18 1998-08-26 International Business Machines Corporation Cleaning of semiconductor wafers and microelectronics substrates
US5985811A (en) * 1996-01-17 1999-11-16 Tadhiro Ohmi Cleaning solution and cleaning method
US20050081884A1 (en) * 2003-10-15 2005-04-21 Infineon Technologies North America Corp. Semiconductor device cleaning employing heterogeneous nucleation for controlled cavitation
US20060061225A1 (en) * 2004-09-17 2006-03-23 Beck Mark J Method and apparatus for cavitation threshold characterization and control
TWI306793B (en) * 2002-07-31 2009-03-01 Inst Data Storage A method and apparatus for cleaning surfaces

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5996594A (en) * 1994-11-30 1999-12-07 Texas Instruments Incorporated Post-chemical mechanical planarization clean-up process using post-polish scrubbing
US6082373A (en) * 1996-07-05 2000-07-04 Kabushiki Kaisha Toshiba Cleaning method
JPH10109072A (ja) * 1996-10-04 1998-04-28 Puretetsuku:Kk 高周波洗浄装置
US6039055A (en) * 1998-01-08 2000-03-21 International Business Machines Corporation Wafer cleaning with dissolved gas concentration control
JP2002316027A (ja) * 2001-04-19 2002-10-29 Ebara Corp ガス溶解水製造装置、およびその方法、超音波洗浄装置、およびその方法
JP3834611B2 (ja) * 2001-08-16 2006-10-18 独立行政法人産業技術総合研究所 キャビテーション気泡観察装置
WO2005027202A1 (en) * 2003-09-11 2005-03-24 Fsi International, Inc. Semiconductor wafer immersion systems and treatments using modulated acoustic energy
JP4623706B2 (ja) * 2004-04-14 2011-02-02 東京エレクトロン株式会社 超音波洗浄処理装置
US20060060991A1 (en) * 2004-09-21 2006-03-23 Interuniversitair Microelektronica Centrum (Imec) Method and apparatus for controlled transient cavitation
US7392814B2 (en) * 2004-12-24 2008-07-01 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and method
JP4999338B2 (ja) 2006-03-15 2012-08-15 東京エレクトロン株式会社 基板洗浄方法、基板洗浄装置、プログラム、および記録媒体
JP4705517B2 (ja) * 2006-05-19 2011-06-22 東京エレクトロン株式会社 基板洗浄方法、基板洗浄装置、プログラム、および記録媒体
JP2011119514A (ja) * 2009-12-04 2011-06-16 Toshiba Corp 基板の洗浄方法及び基板の洗浄装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5985811A (en) * 1996-01-17 1999-11-16 Tadhiro Ohmi Cleaning solution and cleaning method
EP0860866A1 (en) * 1997-02-18 1998-08-26 International Business Machines Corporation Cleaning of semiconductor wafers and microelectronics substrates
TWI306793B (en) * 2002-07-31 2009-03-01 Inst Data Storage A method and apparatus for cleaning surfaces
US20050081884A1 (en) * 2003-10-15 2005-04-21 Infineon Technologies North America Corp. Semiconductor device cleaning employing heterogeneous nucleation for controlled cavitation
US20060061225A1 (en) * 2004-09-17 2006-03-23 Beck Mark J Method and apparatus for cavitation threshold characterization and control

Also Published As

Publication number Publication date
CN103418573B (zh) 2015-11-04
KR20130132286A (ko) 2013-12-04
TW201347867A (zh) 2013-12-01
US20130312788A1 (en) 2013-11-28
MY179404A (en) 2020-11-05
EP2666552B1 (en) 2015-07-08
JP5894858B2 (ja) 2016-03-30
KR20150073929A (ko) 2015-07-01
EP2666552A1 (en) 2013-11-27
JP2013247183A (ja) 2013-12-09
CN103418573A (zh) 2013-12-04

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees