TWI554028B - Oscillator package structure with temperature sensing element and its making method - Google Patents

Description

Oscillator package structure with temperature sensing element and manufacturing method thereof

The invention relates to an oscillator package structure and a manufacturing method thereof, in particular to an oscillator package structure having a temperature sensing element and a manufacturing method thereof.

Referring to FIG. 1 , the invention of the invention of the invention is disclosed in Japanese Patent No. 201334404 A1, which comprises: a base 11 , a piezoelectric element 12 , two adhesive members 13 , an upper surrounding wall 14 , An upper cover 15, a thermistor element 16, and a lower surrounding wall 17.

The base 11 has an upper surface 110 and a lower surface 111 opposite the upper surface 110. The piezoelectric element 12 is coupled to the upper surface 110 of the susceptor 11 through the adhesive members 13 . The upper peripheral wall 14 is disposed on the upper surface 110 around the piezoelectric element 12. The upper cover 15 is disposed on the upper surrounding wall 14 and defines a closed chamber 112 for receiving the piezoelectric element 12 together with the base 11. The thermistor element 16 is disposed on the lower surface 111 of the susceptor 11. The lower surrounding wall 17 is disposed around the thermistor element 16 on the lower surface 111 of the base 11.

It is known to those skilled in the art that the temperature and frequency characteristics of the piezoelectric element 12 due to temperature changes will follow The cutting angle of the piezoelectric element 12 is different, and therefore, when the piezoelectric element 12 has different cutting angles, different temperature and frequency characteristics are generated.

Moreover, the package structure 1 of the oscillator is usually mounted on an external circuit board (not shown), and the operating temperature of the package structure 1 of the oscillator is detected by the thermistor element 16, and is returned. An application-specific integrated circuit (ASIC) (not shown) on the external circuit board, and the special application integrated circuit compensates for the frequency drift of the piezoelectric element 12 due to temperature, and then outputs A stable reference frequency. The lower surrounding wall 17 is a package structure 1 for raising the entire oscillator, and protects and prevents the thermistor element 16 from contacting the external circuit board, and the lower surrounding wall 17 is mainly composed of a plurality of alumina ceramics. A substrate or a printed circuit board (PCB) is used.

In addition, in the process of bonding the package structure 1 of the oscillator to the external circuit board, a spacer (not shown) is first disposed on the external circuit board, and then solder paste is printed on the spacer; Then, the package structure 1 of the oscillator is mounted on the external circuit board by a mounter; finally, the package structure 1 of the oscillator is electrically coupled to the external circuit board via reflow.

It can be seen from the above description that the package structure 1 of the oscillator needs to be printed on the gasket of the external circuit board before it can be electrically combined with the external circuit board. Therefore, it is easy to cause solder paste and gasket because of two kinds of The problem of solder repelling is caused by poor wettability between the materials.

Furthermore, in order to protect the thermistor element 16 from being pressed and destroyed by the external circuit board, the package structure 1 of the oscillator must pass through the lower surrounding wall 17 to raise the thermistor element 16. However, the lower surrounding wall 17 is mainly composed of a multilayer alumina ceramic substrate or a printed circuit board, which needs to be produced by using a co-fired ceramic process or a printed circuit board manufacturing process, thereby making the lower surrounding wall 17 Higher production costs and more complex processes are required. Moreover, since the alumina ceramic substrate or the printed circuit board is formed by laminating the multilayer structures, the laminated structure also limits the height adjustment of the lower surrounding wall 17, and the optimum adjustment cannot be obtained. Meet the trend of thinning.

Therefore, improving the package structure of the existing oscillator to solve the problem of high cost and overall height limitation is a subject to be solved by those skilled in the art.

Accordingly, it is an object of the present invention to provide an oscillator package structure having temperature sensing elements.

Thus, the oscillator package structure of the present invention having a temperature sensing element is electrically connected to an external circuit board and includes a base, a piezoelectric element, a temperature sensing element, a plurality of pads, and a plurality of electrodes. Sexual support block.

The base has a body formed with a chamber, a cover plate enclosing the chamber, and a first wiring pattern disposed on the body With a second wiring pattern. The piezoelectric element is disposed in a chamber of the susceptor and electrically connected to the first wiring pattern. The temperature sensing element is disposed on a lower surface of the body of the base and electrically connected to the first wiring pattern and the second wiring pattern, and is electrically connected to the piezoelectric element through the first wiring pattern . The pads are disposed on a lower surface of the body of the base and electrically connected to the second wiring pattern. The electrically conductive support blocks are respectively connected to the lower surface of the body of the base through the pads and surround the temperature sensing component, and are electrically connected to the circuit of the external circuit board, the pads and the like The electrical support block has a predetermined height sufficient to form a space between the base and the external circuit board for receiving the temperature sensing element.

Furthermore, it is another object of the present invention to provide a method of fabricating an oscillator package having temperature sensing elements.

Thus, the method for fabricating an oscillator package structure having a temperature sensing element comprises a material preparation step, a piezoelectric element setting step, a sealing step, an electrical support block and a step, and a temperature sensing element Carrying steps.

The material preparation step is to prepare a pedestal, a piezoelectric element, a temperature sensing element, and a plurality of electrical support blocks, wherein the pedestal has a body formed with a chamber, a cover plate, and each other The electrically isolated one of the first wiring pattern and the second wiring pattern disposed on the body.

The piezoelectric element setting step is to set the piezoelectric element to the The chamber of the susceptor is electrically connected to the first wiring pattern.

The sealing step is to close the chamber of the body of the base by the cover plate to enclose the piezoelectric element in the chamber.

The electrical support block is followed by a plurality of pads disposed on the lower surface of the pedestal and electrically connected to the second wiring pattern to connect the plurality of electrical support blocks to the lower surface of the pedestal.

The temperature sensing component is mounted on the lower surface of the pedestal and surrounded by the electrical support blocks, and electrically connected to the first wiring pattern and the second wiring pattern. The temperature sensing element and the piezoelectric element are electrically connected through the first wiring pattern to form an oscillator package structure having a temperature sensing element.

In the present invention, the pads and the electrical support blocks are formed to a predetermined height sufficient to form the oscillator package structure between the base and the external circuit board when electrically connected to an external circuit board. A space for housing the temperature sensing element.

The invention has the advantages that the surrounding walls formed by the multilayer alumina ceramic substrate or the printed circuit board can be effectively solved by the electrical support blocks disposed directly under the susceptor, and the high cost is derived therefrom. In addition to the problem of height limitation; in addition, when the oscillator package structure of the present invention is bonded to the external circuit board, the problem of solder resisting due to different materials can also be solved.

2‧‧‧Base

21‧‧ ‧ room

22‧‧‧Ontology

23‧‧‧ Cover

3‧‧‧First wiring pattern

31‧‧‧First line

311‧‧‧ first end

312‧‧‧Extension

313‧‧‧ second end

32‧‧‧second line

321‧‧‧ first end

322‧‧‧First Extension

323‧‧‧second end

324‧‧‧Second extension

325‧‧‧ third end

4‧‧‧Second wiring pattern

41‧‧‧First line

411‧‧‧ first end

412‧‧‧Extension

413‧‧‧ second end

42‧‧‧second line

421‧‧‧ first end

422‧‧‧Extension

423‧‧‧second end

43‧‧‧ third line

431‧‧‧First end

432‧‧‧Extension

433‧‧‧second end

44‧‧‧fourth line

441‧‧‧ first end

442‧‧‧ Extension

443‧‧‧ second end

5‧‧‧Piezoelectric components

51‧‧‧First electrical adhesive

6‧‧‧Temperature sensing components

61‧‧‧Second electrical adhesive

7‧‧‧ solder pads

8‧‧‧Electric support block

91‧‧‧Material preparation steps

92‧‧‧ Piezoelectric component setting steps

93‧‧‧Steps to stop

94‧‧‧Electric support block next steps

95‧‧‧ Temperature sensing component mounting steps

96‧‧‧Package test steps

200‧‧‧External circuit board

H‧‧‧Predetermined height

Other features and effects of the present invention will be described with reference to the drawings. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view showing the package structure of an oscillator disclosed in the Patent Publication No. 201334404A1, the disclosure of which is incorporated herein by reference. FIG. 2 is an exploded perspective view showing the temperature of the present invention. An embodiment of the oscillator package structure of the sensing element; FIG. 3 is a side view showing the connection relationship between the components of the embodiment of the present invention; FIG. 4 is a top plan view showing a base of the embodiment of the present invention. An upper surface of the socket, and a first wiring pattern displayed on the upper surface thereof; FIG. 5 is a schematic view showing the interior of the susceptor of the embodiment of the present invention, and the first wiring pattern and the interior thereof displayed a second wiring pattern; FIG. 6 is a bottom view showing the first wiring pattern, the second wiring pattern and the plurality of pads of the lower surface of the susceptor and the lower surface thereof according to the embodiment of the present invention; FIG. An XY scatter diagram illustrating the relationship between the ball diameter of the electrical support block of the embodiment of the present invention and a predetermined height; and FIG. 8 is an XY scatter diagram illustrating the diameter of the pad and the predetermined height of the embodiment of the present invention. Relationships; and FIG. 9 is a flow chart illustrating an embodiment of a method of fabricating an oscillator package structure having temperature sensing elements of the present invention.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals. Related to this The technical content, features and effects of the invention will be apparent from the following detailed description.

Referring to FIG. 2 and FIG. 3, an embodiment of an oscillator package structure having a temperature sensing element of the present invention is electrically connected to an external circuit board 200. The embodiment of the oscillator package structure of the present invention having a temperature sensing element A susceptor 2, a piezoelectric element 5, a temperature sensing element 6, a plurality of pads 7, and a plurality of electrical support blocks 8 are included.

The susceptor 2 has a body 22 formed with a chamber 21, a cover plate 23 enclosing the chamber 21, and a first wiring pattern 3 and a second wiring pattern 4 disposed on the body 22. In the embodiment of the present invention, the first wiring pattern 3 and the second wiring pattern 4 are as shown in FIGS. 4, 5, and 6. Further, the susceptor 2 is made of a ceramic material (Ceramics), but is not limited thereto.

The piezoelectric element 5 is disposed in the chamber 21 of the susceptor 2 and electrically connected to the first wiring pattern 3 through a first electrical adhesive 51, and is protected by the cover 23 to be enclosed therein. In the chamber 21, in the present embodiment, the piezoelectric element 5 is made of quartz (Quartz), but the invention is not limited thereto.

The temperature sensing component 6 is disposed on a lower surface of the body 22 of the susceptor 2, and is configured to detect the working environment temperature of the piezoelectric component 5 and pass through an integrated temperature compensation integrated circuit or a self-temperature compensation product. The bulk circuit compensates for the frequency drift of the piezoelectric element 5 due to temperature differences. In this embodiment, the temperature sensing element 6 is an integrated body compensated by its own temperature. The circuit comprises a temperature sensing read architecture, a compensation circuit architecture, and a drive circuit architecture for driving the piezoelectric element 5 to generate oscillation. The temperature sensing element 6 is electrically connected to the first wiring pattern 3 and the second wiring pattern 4 through a plurality of second electrical adhesives 61 as shown in FIG. 3, and the first wiring pattern 3 is transmitted through the first wiring pattern 3. The piezoelectric element 5 is electrically connected, and outputs a stable reference frequency through the second wiring pattern 4. In addition, it should be noted that the temperature sensing component 6 can also be a thermistor component, and electrically connected to the external circuit board 200 through the second wiring pattern 4, and compensated by the external circuit board 200. The piezoelectric element 5 drifts in frequency due to temperature difference.

The pads 7 are disposed on the lower surface of the body 22 of the susceptor 2 and electrically connected to the second wiring pattern 4, respectively.

The electrical support blocks 8 are electrically connected to the external circuit board 200 and are respectively bonded to the lower surface of the body 22 of the base 2 through the pads 7 and surround the temperature sensing element 6 . The pads 7 and the electrically conductive support blocks 8 have a predetermined height H which is sufficient to form a space between the susceptor 2 and the external circuit board 200 for accommodating the temperature sensing element 6. Each of the electrically conductive support blocks 8 is made of a material having electrical conductivity. In the present embodiment, the electrically conductive support blocks 8 are exemplified by a solder ball.

In detail, the first wiring pattern 3 of the susceptor 2 has a first line 31 and a second line 32 as shown in FIG. Referring again to FIG. 2, and referring to FIG. 4, FIG. 5 and FIG. 6, the first wiring pattern is further referred to. The first line 31 of 3 has a first end 311 extending from the upper surface of the body 22 toward the lower surface thereof, and an extension 312 extending laterally from the first end portion 311 to the interior of the body 22, and a a second end portion 313 extending downward from the extension portion 312 to the lower surface of the body 22; the second line 32 of the first wiring pattern 3 has a first extending from the upper surface of the body 22 toward the lower surface thereof An end portion 321 , a first extension portion 322 extending laterally from the first end portion 321 thereof to the interior of the body 22 , and a second end portion extending downward from the first extension portion 322 to a lower surface of the body 22 323, a second extension 324 extending laterally from the first extension 322 thereof to the interior of the body 22, and a third end 325 extending downwardly from the second extension 324 to the lower surface of the body 22. .

Referring again to FIGS. 5 and 6, the second wiring pattern 4 has a first line 41, a second line 42, a third line 43, and a fourth line 44. The first line 41, the second line 42, the third line 43 and the fourth line 44 of the second wiring pattern 4 respectively have a first end portion 411, 421 extending from a lower surface of the body 22 toward the upper surface. 431, 441, an extension portion 412, 422, 432, 442 extending laterally from the first end portion 411, 421, 431, 441 of the body 22 toward the periphery of the body 22, and a portion 412 extending therefrom 422, 432, 442 extend downward to the second ends 413, 423, 433, 443 of the lower surface of the body 22.

Referring to FIG. 2 again, and referring to FIG. 4, FIG. 5 and FIG. 6, at the same time, the piezoelectric element 5 is connected to the first line 31 and the second line 32 of the first wiring pattern 3. One end 311, 321 while The temperature sensing element 6 is connected to the second end portion 313 of the first line 31 of the first wiring pattern 3 and the second end portion 323 and the third end portion 325 of the second line 32, and is connected to the first end portion 325 First lines 41, 421, 431, and 441 of the first line 41, the second line 42, the third line 43, and the fourth line 44 of the second wiring pattern 4; the pads 7 are respectively connected to the second line The first line 41, the second line 42, the third line 43, and the second ends 413, 423, 433, 443 of the fourth line 44 of the wiring pattern 4.

Referring to FIG. 7, the spherical diameter of the electric support block 8 (tin ball) of the embodiment is changed, and the diameter of the solder pads 7 is fixed to 0.3 mm. As shown by the measurement data shown in FIG. 7, the The ball diameter of the isoelectric support block 8 is increased, and the predetermined height H formed by it is gradually increased, that is, the predetermined height H is proportional to the ball diameter of the electric support blocks 8. Referring to FIG. 8, the diameter of the pads 7 in this embodiment is changed, and the ball diameter of the electric support blocks 8 (tin balls) is fixed to 0.45 mm. The measurement data shown in FIG. 8 is known. As the diameter of the pads 7 increases, the predetermined height H formed is gradually decreased, that is, the predetermined height H is inversely proportional to the diameter of the pads 7. Therefore, it can be seen from the above description that the size of the pads 7 and the electrical support blocks 8 affect the predetermined height H, that is, the present invention can be modified by changing the pads 7 and the like. The size of the electrical support block 8 can further control the predetermined height H, and the predetermined height H can be adjusted to a range of less than 0.1 mm, which is effective compared with the existing alumina ceramic substrate or printed circuit board. The problem of solving the height limitation is also more in line with the trend of thinning.

In this embodiment of the present invention, the piezoelectric element 5 and the piezoelectric element 5 respectively disposed in the chamber 21 of the susceptor 2 are disposed on the susceptor 2 by the mutual cooperation of the first wiring pattern 3 and the second wiring pattern 4. The temperature sensing component 6 of the lower surface of the body 22 is electrically connected, and the second wiring pattern 4 is electrically connected to the pads 7, and the pads 7 and the electrical support block 8 are respectively The bonding is electrically connected to each other, so that the embodiment can be electrically connected to the external circuit board 200 through the electrical support block 8 .

Referring to FIG. 9, an embodiment of a method of fabricating an oscillator package structure having a temperature sensing element of the present invention is to fabricate an oscillator package structure having a temperature sensing element as shown in FIG. This embodiment of the manufacturing method of the present invention comprises a material preparation step 91, a piezoelectric element setting step 92, a sealing step 93, an electrical support block followed by step 94, a temperature sensing element mounting step 95, and a Package test step 96.

The material preparation step 91 is to prepare the susceptor 2, the piezoelectric element 5, the temperature sensing element 6, and the electrical support blocks 8. In the present invention, the detailed structure of the susceptor 2, and the specific materials used for the susceptor 2 and the piezoelectric element 5 are described in the foregoing description, and will not be described herein. However, it should be particularly noted herein that in the embodiment of the manufacturing method, the extension silicon via technology is used to extend the portion 312 of the first line 31 of the first wiring pattern 3, the first The first extension portion 322 and the second extension portion 324 of the second line 32 of the wiring pattern 3, and the first line 41, the second line 42, the third line 43 and the fourth line 44 of the second wiring pattern 4 Extensions 412, 422, 432, 442 are disposed in the Inside the body 22. In addition, the piezoelectric element 5 is first ground to a desired thickness to coarsely adjust its frequency; then, the quartz is etched and cleaned to remove cracks and adhering foreign matter and oil stains generated during the grinding process, and perform Drying to make the frequency range of the quartz more concentrated; finally, the electrode is vapor-deposited on the surface of the quartz (the electrode component may be Ag, Cr/Ag/Cr or Cr/Ag), and the piezoelectric element is ready to be obtained. 5.

The piezoelectric element setting step 92 is that the piezoelectric element 5 is disposed in the chamber 21 of the susceptor 2, and is electrically connected to the first wiring pattern 3 through the first electrical adhesive 51. The first ends 311, 321 of the line 31 and the second line 32 are then hardened. It should be additionally noted here that before the sealing step 93, a crystal frequency adjustment step (not shown) is also implemented. The crystal frequency adjustment step uses an ion beam (Ion beam) to dry-etch the electrode of the quartz to thereby fine-tune its frequency.

The sealing step 93 utilizes a sealing ring (not shown) disposed on the top edge of the body 22 of the base 2 to seal the cover 23 by means of Seam sealing. The chamber 21 of the body 22 of the seat 2 encloses the piezoelectric element 5 in the chamber 21. In the present embodiment, the seal ring and the cover plate 23 are described by taking Fe-Co-Ni as an example, but the present invention is not limited thereto.

The electrical support block is further connected to the first line 41, the second line 42, the third line 43 and the fourth line which are respectively disposed on the lower surface of the base 2 and electrically connected to the second wiring pattern 4, respectively. The pads 7 of each of the second ends 413, 423, 433, 443 of the line 44 to treat the electrical properties The support block 8 is then disposed on the lower surface of the base 2 to have a predetermined height H when electrically connected to the external circuit board 200, so that the base 2 and the external circuit board 200 can form the same The space of the temperature sensing element 6 is accommodated.

It should be noted here that the electrically conductive support blocks 8 are in principle composed of a material having electrical conductivity and the shape is not limited. However, when the materials selected are different, the way they follow will be different. In the embodiment of the manufacturing method of the present invention, the electrical support block 8 is exemplified by a solder ball, and the solder ball can utilize a ball grid array (Ball grid array, BGA) Ball attachment process or screen printing solder paste technology is formed by reflow soldering under the solder pads 7 which are rounded.

Further, it is further explained that in order to control the predetermined height H more precisely, it is necessary to make the appearance of the pads 7 circular in order to match the contour of the electric support blocks 8 (tin balls). Therefore, in order to make the appearance of the pads 7 circular, the first line 41, the second line 42, and the third line 43 of the second wiring pattern 4 are required to be processed by using a via. Each of the extensions 412, 422, 432, 442 of the fourth line 44 extends through the perforations to the second ends 413, 423, 433, 443 of the lower surface of the body 22 (see FIGS. 5 and 6). . That is, the respective extension portions 412, 422, 432, and 442 of the second wiring pattern 4 are electrically connected to the respective second end portions 413, 423, 433, and 443 by perforation, and the conventional method is performed via an external lead. Compared with the way of conduction, it can be effectively avoided. During the process of implanting the solder balls, the tin is adsorbed by the external wires, causing the height of the solder balls to shift, thereby affecting the predetermined height H.

The temperature sensing element mounting step 95 is performed by the surface mounting technology (SMT), and the temperature sensing element 6 is disposed on the lower surface of the susceptor 2 and surrounded by the electrical support blocks 8 and The second end portion 313 of the first line 31 of the first wiring pattern 3 and the second end portion 323 and the third end portion 325 of the second line 32 are electrically connected to the first wiring pattern 3 through the second electrical adhesive 61. And connecting the first ends 41, 421, 431, and 441 of the first line 41, the second line 42, the third line 43, and the fourth line 44 of the second wiring pattern 4 to sense the temperature. The element 6 and the piezoelectric element 5 are electrically connected through the first wiring pattern 3, thereby constituting the oscillator package structure having the temperature sensing element as shown in FIG.

The package test step 96 performs an electrical characteristic test and an aging test on the oscillator package structure to confirm that the oscillator package structure is functioning properly and meets the requirements of the application end.

The manufacturing method of the oscillator package structure having the temperature sensing component of the present invention is different from the package structure 1 of the oscillator. (There is an advantage of referring to FIG. 1 ), the package structure 1 of the oscillator is electrically connected. When the external circuit board is used, the surface soldering technology is also needed to print the solder paste on the external circuit board, so that the package structure 1 of the oscillator can be electrically connected to the external circuit board. However, according to the contents described in the prior art of the present invention, it is known that the problem of solder repelling due to poor wettability is caused by the difference in materials. In contrast In this embodiment of the method for fabricating an oscillator package structure having a temperature sensing element, since the isoelectric support block 8 (the solder ball) directly replaces the lower surrounding wall 17 of the package structure 1 of the oscillator, The problem of solder resisting caused by different materials is avoided, and the oscillator package structure having the temperature sensing element of the present invention can be easily adhered to the external circuit board 200; on the other hand, the lower surrounding wall 17 can also be improved. High cost and height limitations caused by expensive materials such as multilayer alumina ceramics or fiberglass.

In summary, the present invention has an oscillator package structure having a temperature sensing element and a manufacturing method thereof, which are replaced by the electrical support block 8 disposed under the pedestal 2 to replace the package structure 1 of the general oscillator. The lower wall 17 not only improves the problem of high cost, but also has the problem of no solder repelling due to material compatibility when the oscillator package structure of the present invention is bonded to the outer circuit board 200. In addition, the welding is adjusted by using the same. The size of the pad 7 or the electrical support blocks 8 is such that a predetermined height H is desired to be used, so that the object of the present invention can be achieved.

However, the above is only the embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the patent application scope and the patent specification of the present invention are still It is within the scope of the patent of the present invention.

2‧‧‧Base

21‧‧ ‧ room

22‧‧‧Ontology

23‧‧‧ Cover

3‧‧‧First wiring pattern

5‧‧‧Piezoelectric components

51‧‧‧First electrical adhesive

6‧‧‧Temperature sensing components

61‧‧‧Second electrical adhesive

7‧‧‧ solder pads

8‧‧‧Electric support block

200‧‧‧External circuit board

H‧‧‧Predetermined height

Claims (8)

An oscillator package structure having a temperature sensing element electrically connected to an external circuit board, the oscillator package structure having a temperature sensing element comprising: a base having a body formed with a chamber, and a body a cover plate enclosing the chamber, and a first wiring pattern and a second wiring pattern disposed on the body, the first wiring pattern having a first line and a second line, the first of the first wiring patterns The wire has a first end extending from an upper surface of the body toward a lower surface thereof, an extension extending laterally from the first end thereof to the interior of the body, and a portion extending downwardly from the extension thereof to the a second end of the lower surface of the body, the second line of the first wiring pattern having a first end extending from an upper surface of the body toward a lower surface thereof, and a first end portion of the body from the first end thereof a laterally extending first extension, a second end extending downwardly from the first extension thereof to a lower surface of the body, and a second end extending laterally from the first extension thereof to the interior of the body a second extension portion, and a third end portion extending downward from the second extension portion thereof to a lower surface of the body, the second wiring pattern having a first line, a second line, a third line, and a a fourth line, the first line, the second line, the third line, and the fourth line of the second wiring pattern respectively have a first end extending from a lower surface of the body toward the upper surface, and a first end thereof An extension extending laterally of the body toward the periphery of the body, and an extension extending downwardly from the extension to the body a second end portion of the lower surface of the body; a piezoelectric element disposed in the chamber of the base and electrically connected to the first ends of the first line and the second line of the first wiring pattern; a temperature sensing element disposed on a lower surface of the body of the base and connected to the second end of the first line of the first wiring pattern and the second end and the third end of the second line, and connected The first ends of the first line, the second line, the third line, and the fourth line of the second wiring pattern are electrically connected to the first wiring pattern and the second wiring pattern, and are transparent to the first wiring pattern a wiring pattern is electrically connected to the piezoelectric element; a plurality of solder pads are disposed on the lower surface of the body of the base and are respectively connected to the first line, the second line, and the third line of the second wiring pattern And the second end portions of the fourth line; and the plurality of electrical support blocks are respectively connected to the lower surface of the body of the base through the pads and surround the temperature sensing element, and are electrically connected to The circuit of the external circuit board, the pads and the electrical support blocks It has a predetermined height, the predetermined height sufficient to enable the base forming a receiving space of the temperature sensing element and between the external circuit board. The oscillator package structure with a temperature sensing component according to claim 1, wherein the temperature sensing component is configured to detect an operating environment temperature of the piezoelectric component and pass through an external temperature compensation integrated circuit or self temperature compensation. The integrated circuit compensates for the frequency drift of the piezoelectric element due to temperature differences. An oscillator package structure having a temperature sensing element according to claim 1, wherein the pads are circular, and the predetermined height is inversely proportional to the diameters of the pads. An oscillator package structure having a temperature sensing element according to claim 1, wherein the electrically conductive support block is made of a material having conductivity. A method for fabricating an oscillator package structure having a temperature sensing element includes the following steps: a material preparation step of preparing a pedestal, a piezoelectric element, a temperature sensing element, and a plurality of electrical support blocks, wherein The pedestal has a body formed with a chamber, a cover plate, and a first wiring pattern and a second wiring pattern disposed on the body electrically isolated from each other, the first wiring pattern having a first And a second line, the first line of the first wiring pattern having a first end extending from an upper surface of the body toward a lower surface thereof, and a first end extending laterally from the first end portion of the body And a second end extending downward from the extension portion to the lower surface of the body, the second line of the first wiring pattern having a first extending from the upper surface of the body toward the lower surface thereof An end portion, a first extension portion extending laterally from the first end portion thereof to the interior of the body, and a second end portion extending downward from the first extension portion thereof to a lower surface of the body A portion extending from the second inner portion which extends in a first transversely extending in the body, and a second extending portion which extends downwardly from the third end portion to the lower surface of the body, The second wiring pattern has a first line, a second line, a third line, and a fourth line, and the first line, the second line, the third line, and the fourth line of the second wiring pattern are respectively Having a first end extending from the lower surface of the body toward the upper surface, an extension extending laterally from the first end to the interior of the body toward the periphery of the body, and one extending downwardly from the extension thereof a second end portion of the lower surface of the body; a piezoelectric element disposing step of disposing the piezoelectric element in the chamber of the pedestal and connecting to the first line and the second line of the first wiring pattern a first end portion of the line; a sealing step of closing the chamber of the body of the base with the cover plate to enclose the piezoelectric element in the chamber; an electrical support block is followed by a step a plurality of pads disposed on a lower surface of the pedestal and connected to the first line, the second line, the third line, and the second ends of the fourth line of the second wiring pattern to Sexual support blocks are respectively attached to the pedestal And a temperature sensing component mounting step of disposing the temperature sensing component on a lower surface of the pedestal and surrounded by the electrical support blocks, and connecting to the first line of the first wiring pattern a second end portion and a second end portion of the second end portion, and the first end, the second line, the third line, and the first end of the fourth line connected to the second wiring pattern a portion for electrically connecting the temperature sensing element and the piezoelectric element through the first wiring pattern to form a temperature sensing element The oscillator package structure; wherein the pads and the electrical support blocks are formed at a predetermined height sufficient for the oscillator package structure to electrically connect to an external circuit board to cause the base and the exterior A space for accommodating the temperature sensing element is formed between the boards. The method for fabricating an oscillator package structure having a temperature sensing element according to claim 5, further comprising a package test step of performing an electrical characteristic test and an aging test on the oscillator package structure, Confirm that the oscillator package structure is functioning properly and meets the needs of the application. The method for fabricating an oscillator package structure having a temperature sensing element according to claim 5, wherein in the subsequent step of the electrical support block, the pads are circular, and the predetermined height and the pads are The diameter is inversely proportional. The method of fabricating an oscillator package structure having a temperature sensing element according to claim 5, wherein in the subsequent step of the electrical support block, the electrically conductive support block is made of a material having conductivity.