JP2010171239A - Electronic device and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic device in which an element component is sealed hermetically, and to provide a manufacturing method for suppressing the production cost of the electronic device. <P>SOLUTION: A base having an element component mounted thereon is bonded to a lid for sealing the element component by ultraviolet-ray curing resin. The method for manufacturing the electronic device includes an element component mounting step of mounting an element component on a portion, as a base of a base wafer where the plurality of bases are provided; an applying step of applying ultraviolet-ray curing resin on one main surface of the base wafer or on one main surface of the lid wafer where the plurality of lids are provided; a superimposing step of superimposing the base wafer and the lid wafer with the ultraviolet-ray curing resin sandwiched to surround the element component by the base and the lid; a bonding step of emitting an ultraviolet-ray from the surrounding of the superimposed wafers to bond the base wafer to the lid wafer; and a singulation step of singulating the bonded base wafer and lid wafer for each base where the element component is mounted and for each lid. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to an electronic device used in an electronic apparatus and a method for manufacturing the electronic device.

In recent years, with the downsizing of electronic equipment, there is an increasing demand for downsizing and thinning of electronic devices widely used in electronic equipment.
Examples of the electronic device include a piezoelectric vibrator.
Here, a crystal resonator will be described as a conventional piezoelectric resonator.

  In recent years, in response to the miniaturization of crystal resonators, it has become difficult to handle the crystal resonator element mounted on the crystal resonator after being processed into individual pieces. For example, a crystal resonator as shown in Patent Document 1 and a method for manufacturing the crystal resonator have been proposed.

First, an example of the structure of the crystal unit as described above will be described.
This crystal resonator is mainly composed of a crystal resonator element which is an element part, a lid body having a recess, and a base body. The vibration element of the crystal resonator is mounted on one main surface of the base body and sealed with the base body and the lid body. Here, the base body and the lid body are joined by direct joining.

Next, a method for manufacturing this conventional crystal resonator will be described.
As an example of a conventional method of manufacturing a crystal resonator, there is a method of manufacturing in a wafer state.
This method of manufacturing a crystal resonator mainly includes, for example, an element component mounting process, a bonding process, and an individualization process.

The element component mounting step is a step of mounting an element component on one main surface of a portion that becomes a base body in a base wafer provided with a portion that becomes a plurality of base bodies.
One main surface of the base wafer provided with a plurality of base body portions is in a mirror state by a method such as mirror polishing, and the flatness of one main surface of the base wafer is several nanometers or less. It has become.

The bonding step is a step of bonding one main surface of the base wafer that is in a mirror state and flat and one main surface of the lid wafer that is in a mirror surface state and flat by direct bonding. It is.
A plurality of recesses are provided on one main surface of the lid wafer on which portions to be a plurality of lids are provided. Further, the one principal surface of the lid wafer is in a mirror surface state by a method such as mirror polishing, and the flatness of the one principal surface of the lid wafer is several nanometers or less.
When the lid wafer and the base wafer are bonded by direct bonding, the lid wafer and the base wafer are generally heat-treated in a temperature atmosphere of 200 ° C. to 500 ° C. for a predetermined time, whereby the base wafer and the lid wafer are Are joined.
Moreover, since the flatness of the surfaces to be joined is several nanometers or less, it is possible to join by direct joining.

  The singulation step is a step of cutting between a portion that becomes an adjacent lid body and a portion that becomes an adjacent base body in a state in which the base wafer and the lid wafer are bonded and a plurality of crystal resonators are provided. It is.

As a method for bonding the base wafer and the lid wafer, for example, a bonding method using anodic bonding as shown in Patent Document 2 is also known.
In an electronic device in which a base body and a lid are bonded by anodic bonding, a bonding layer made of metal is provided between the base and the lid.
When bonding the base wafer and the lid wafer by anodic bonding, first, a first bonding metal layer is provided on one main surface of the base wafer, and a second bonding metal layer is provided on one main surface of the lid wafer. It is done. Next, generally, a voltage of 500 V to 1000 V is applied to the first bonding metal layer and the second bonding metal layer which are superimposed in a temperature atmosphere of 200 ° C. to 400 ° C. As a result, the first bonding metal layer provided on one main surface of the base wafer and the second bonding metal layer provided on one main surface of the lid wafer serve as a bonding layer. And the lid wafer are bonded together.

  In addition, the quartz resonator manufactured and manufactured in the wafer state has been described. As a method of joining the base body and the lid body in the state of being separated into pieces, generally, glass frit, seam welding, heat fusion, etc. The method is known. In these methods, heat is used to join the base body and the lid.

JP 2006-339896 A JP 2007-13608 A

  However, a conventional electronic device manufactured using direct bonding may be incompletely bonded when the flatness of the bonding surface is larger than several nanometers. In such a conventional electronic device, since the element component is not sealed in an airtight state, the element component may be affected by the temperature and humidity outside the electronic device.

In addition, a conventional electronic device manufactured using direct bonding is used for the base body and the lid body because the base body and the lid body are joined in a high temperature atmosphere of 200 ° C. to 500 ° C. When the main materials having different thermal expansion coefficients are different from each other, there is a risk that breakage such as cracks may occur in the base body and the lid body cooled after joining. For this reason, in the conventional electronic device, main materials used for the base body and the lid are limited.
That is, in the conventional electronic device, depending on the materials used for the base body and the lid body, there is a possibility that the element parts are not sealed in an airtight state due to breakage such as cracks.

  In addition, the conventional method of manufacturing an electronic device using direct bonding requires a processing step such as mirror polishing so that the bonding surface is in a mirror state and the flatness is several nanometers or less, and thus time and labor are required. There is such a problem. In other words, the conventional manufacturing method takes time and labor, and thus the manufacturing cost of the electronic device may increase.

  Further, in the conventional method of manufacturing an electronic device using direct bonding, when the base body and the lid have different thermal expansion coefficients, the base body and the lid may be damaged due to a temperature difference during bonding. There is. Therefore, in the conventional method for manufacturing an electronic device, a defect due to breakage such as a crack occurs and the yield decreases, which may increase the manufacturing cost of the electronic device.

  In addition, the conventional method for manufacturing an electronic device using anodic bonding has a step of forming a metal layer for bonding on the bonding surface by vapor deposition or the like, which takes time and labor, and manufacturing the electronic device. Costs may increase.

  Therefore, an object of the present invention is to provide an electronic device that can easily seal element components in an airtight state and a manufacturing method that reduces the manufacturing cost of the electronic device.

  In order to solve the above problems, the present invention provides a base body on which element parts are mounted, a lid body for sealing the element parts, and a transparent ultraviolet ray interposed between the base body and the lid body. The base body and the lid body are joined with the ultraviolet curable resin.

  Moreover, in order to solve the said subject, the element component mounting process which mounts an element component on one main surface of the part used as the said base body of the base wafer provided with the several base body, The said base body, An application step of applying an ultraviolet curable resin to a main surface on which the element parts are mounted and / or one main surface of a lid wafer provided with a plurality of lids, An overlapping step of overlapping one main surface of the wafer and one main surface of the lid wafer with the ultraviolet curable resin sandwiched therebetween to surround the element component with the base body and the lid body, and the overlapping base wafer An ultraviolet ray is irradiated on the ultraviolet curable resin from the periphery of the lid wafer to bond the base wafer and the lid wafer, and the individual electronic devices are bonded to the base wafer and the lid wafer. Fragment A singulation step of, characterized in that it consists.

In such an electronic device, a transparent ultraviolet curable resin is interposed between the base body and the lid, and the ultraviolet curable resin is cured by irradiating the ultraviolet rays, thereby joining the base body and the lid. Since it is in the state, the element component can be hermetically sealed with the base body and the lid body.
Therefore, such an electronic device can easily hermetically seal element components regardless of the flatness of the joint surface.

Further, in such an electronic device, a transparent ultraviolet curable resin is interposed between the base body and the lid body, and the ultraviolet curable resin in the back is cured even when ultraviolet rays are irradiated from the surroundings. Since it is in a state, it can be in a joined state without limiting the main materials used for the base body and the lid. That is, since the main materials used for the base body and the lid are not limited, defects due to breakage such as cracks due to differences in the thermal expansion coefficients of the main materials used for the base body and the lid can be prevented.
Therefore, such an electronic device can hermetically seal element components without limiting the main materials used for the base body and the lid.

In addition, since the ultraviolet curable resin is transparent in such a method for manufacturing an electronic device, the ultraviolet curable resin in the back can be cured by irradiating ultraviolet rays from the periphery of the base body and the lid that are overlaid.
In addition, since such a method for manufacturing an electronic device can join the base body and the lid body with an ultraviolet curable resin, it is troublesome to make the joint surface into a mirror surface state such as joining by direct joining or joining by anodic joining. The trouble of providing such a joining metal layer becomes unnecessary. That is, in such a method for manufacturing an electronic device, the base body and the lid can be easily joined, so that the manufacturing cost of the electronic device can be reduced.

It is sectional drawing which shows an example of the electronic device which concerns on 1st embodiment of this invention. It is a conceptual diagram which shows the state of a base wafer. It is a conceptual diagram which shows the state which mounted the element components on the base wafer. It is an example of the conceptual diagram which shows the state by which the ultraviolet curable resin was apply | coated to the base wafer in which the element component was mounted. It is a conceptual diagram which shows the state of a cover wafer. It is a conceptual diagram which shows the state before superimposing a base wafer and a cover wafer. It is a conceptual diagram which shows an example of the state which joins a base wafer and a cover wafer. It is a conceptual diagram which shows the state separated into pieces for every electronic device. It is sectional drawing which shows an example of the electronic device which concerns on 2nd embodiment of this invention. It is sectional drawing which shows an example of the electronic device which concerns on 3rd embodiment of this invention. It is sectional drawing which shows an example of the electronic device which concerns on 4th embodiment of this invention. It is an example of the conceptual diagram which shows the state by which the ultraviolet curable resin was apply | coated to the base wafer in which the element component was mounted.

  Next, the best mode for carrying out the present invention will be described. In each drawing, the state of each component is exaggerated for easy understanding.

(First Embodiment) An electronic device according to a first embodiment of the present invention will be described. The electronic device will be described as a crystal resonator.
FIG. 1 is a cross-sectional view showing an example of an electronic device according to the first embodiment of the present invention.
As shown in FIG. 1, the electronic device 100 according to the first embodiment of the present invention mainly includes a base body 10a, a lid body 30a, an element component 20a, and an ultraviolet curable resin 40.

  Here, the lid 30a is made of, for example, metal or ceramic, and is provided with an element component recess 31a surrounding the element component 20a on one main surface, and the remaining one main surface is a bonding surface.

Here, the element component 20a is described as a crystal resonator element.
The element component 20a is configured, for example, as a crystal resonator element in which a first electrode 21a, a second electrode 22a, and a plurality of lead patterns are provided on a quartz plate that is a piezoelectric material.
A first electrode 21a is provided on one main surface of the quartz plate, and a second electrode 22a is provided on the other main surface so as to face the first electrode 21a.
Two drawer patterns are provided as a pair. One predetermined lead pattern is connected to the first electrode 21a, and one other predetermined lead pattern is connected to the second electrode 22a. One end of the two pairs of lead patterns is provided side by side on the short side. Further, one end portion of the drawing pattern may be routed to the opposite main surface.

For example, the base body 10a is mainly made of ceramic and is formed in a flat plate shape. A plurality of tower terminals P are provided on one main surface, and a plurality of external connection terminals G are provided on the other main surface. Is provided. Each mounting terminal P is electrically connected to a predetermined external connection terminal G through a through hole (not shown) and an internal wiring N. In such a base body 10a, a predetermined drawing pattern and a predetermined tower terminal P are electrically connected to the tower terminal P using a tower material D such as a conductive adhesive. The element component 20a is mounted. The number of tower terminals P varies depending on the element component 20a. Here, for example, two tower terminals P are arranged side by side on one short side of the base body. The external connection terminals G are provided, for example, at the four corners of the base body 10a.
The position where the ultraviolet curable resin 40 described later is applied is a position that does not contact the element component 20a and is opposed to one main surface where the element component recess 31a of the lid 30a is provided. That is, the ultraviolet curable resin 40 is annularly applied around the element component 20a.

The ultraviolet curable resin 40 is interposed between the base body 10a and the lid body 30a, and serves to join the base body 10a and the lid body 30a by being cured by irradiation with ultraviolet rays.
Since the ultraviolet curable resin 40 is cured in a transparent state when irradiated with ultraviolet rays, it transmits ultraviolet rays even after being cured. That is, when ultraviolet rays are irradiated through the ultraviolet curable resin, for example, the inside of the ultraviolet curable resin 40 can be cured. Similarly, when ultraviolet rays are irradiated through the ultraviolet curable resin and irradiated, The ultraviolet curable resin 40 applied in a mesh shape around 20a can be cured.
Here, the ultraviolet curable resin 40 has, for example, heat resistance and is mainly made of an epoxy resin. The heat resistance of the ultraviolet curable resin 40 should be high enough to withstand heating by reflow or the like performed when the electronic device 100 is manufactured and mounted on a wiring board (not shown) such as a mother board. That's fine.

  In such an electronic device 100, the base body 10a coated with the ultraviolet curable resin 40 and the lid body 30a are overlapped with the element part recess 31a of the lid body 30a facing the element part 20a side. The base body 10a and the lid body 30a are joined by curing the irradiated ultraviolet curable resin 40.

  Further, in such an electronic device 100, since the ultraviolet curable resin 40 is interposed between the base body 10a and the lid body 30a, the joining surface between the base body 10a and the lid body 30a is flat. It can be easily joined regardless of the degree. That is, by configuring such an electronic device 100, the element component 20a can be easily hermetically sealed.

  Further, in such an electronic device, a transparent ultraviolet curable resin 40 is interposed between the base body 10a and the lid body 30a, and the ultraviolet curable resin 40 in the back is provided even when ultraviolet rays are irradiated from the surroundings. Therefore, the main material used for the base body 10a and the lid body 30a does not need to consider the thermal expansion coefficient as in the prior art. That is, breakage such as cracks due to differences in thermal expansion coefficients of main materials used for the base body 10a and the lid body 30a does not occur, and airtight defects due to cracks and the like can be prevented.

Next, a method for manufacturing an electronic device according to the first embodiment will be described.
The electronic device manufacturing method according to the first embodiment of the present invention mainly includes an element component mounting process, a coating process, an overlaying process, a bonding process, and a singulation process.

As shown in FIGS. 2 and 3, the element component mounting step is a step of mounting the element component 20a on one main surface of the portion that becomes the base body 10a of the base wafer W1 provided with the plurality of base bodies 10a. It is.
In the base wafer W1, the base body 10a includes a pair of two tower terminals P on one main surface, and four external connection terminals G on the other main surface. Is provided. One predetermined tower terminal P provided on one main surface is electrically connected to one predetermined external connection terminal G through one predetermined internal wiring (not shown). . Similarly, one other predetermined tower terminal P is connected to be connected to one other predetermined external connection terminal G via one other predetermined internal wiring N. .

The element component 20a is, for example, a crystal resonator element, and is configured as a crystal resonator element in which a first electrode 21a, a second electrode 22a, and a plurality of lead patterns are provided on a crystal plate that is a piezoelectric material.
A first electrode 21a is provided on one main surface of the quartz plate, and a second electrode 22a is provided on the other main surface so as to face the first electrode 21a.
Two drawer patterns are provided as a pair. One predetermined lead pattern is connected to the first electrode 21a, and one other predetermined lead pattern is connected to the second electrode 22a. One end of the two pairs of lead patterns is provided side by side on the short side. Further, one end portion of the drawing pattern may be routed to the opposite main surface.

A predetermined one lead-out pattern provided on one main surface of the element component 20a is connected to a predetermined one mounting terminal provided on the base body 10a via a mounting material D such as a conductive adhesive. P is electrically connected. Further, the predetermined other one drawing pattern is electrically connected to a predetermined other one mounting terminal P via a mounting material D such as a conductive adhesive.
In this way, the element component 20a is mounted on the tower terminal P provided on one main surface of the base body 10a.
Thereby, as shown in FIG. 3, the base wafer W <b> 1 after the element component mounting step is in a state where the element components 20 a are respectively mounted on the portions that become the base bodies 10 a arranged in a matrix.

As shown in FIG. 4, the coating process is performed at the edge of the portion that becomes the base body 10a, the main surface on which the element component 20 is mounted, or a lid provided with a plurality of lids 30a as shown in FIG. In this process, the ultraviolet curable resin 40 is applied to one main surface of the wafer W2.
Here, for example, a case where the ultraviolet curable resin 40 is applied to the base body 10a will be described.
The ultraviolet curable resin 40 is circularly applied around the element component 20a on the main surface of the base body 10a on the side where the element component 20a is mounted. The application position of the ultraviolet curable resin 40 is a position opposed to one main surface of the lid 30a where the element component recess 31a is provided at a position not in contact with the element component 20a.

As shown in FIGS. 6 and 7, the superimposing process superimposes one main surface of the base wafer W1 and one main surface of the lid wafer W2 with the ultraviolet curable resin 40 interposed therebetween, and the element component 20a is used as a base. This is a process of enclosing the body 10a and the lid 30a.
Here, the state in which the element component 20a is surrounded means that the element component 20a includes a side surface of the element component recess 31a provided on one main surface of the plurality of base bodies 10a and one main surface of the lid body 30a. The state confined in the space formed by.
First, the lid wafer W2 will be described.

The lid wafer W2 is made of, for example, metal or ceramic, and the portions to be the plurality of lid bodies 30a are arranged in a matrix. The arrangement position of the plurality of lid bodies 30a of the lid wafer W2 corresponds to the arrangement position of the base bodies 10a of the base wafer W1. One main surface of the lid 30a is provided with a component element recess 31a, and the remaining one main surface serves as a bonding surface.
As shown in FIG. 6, the ultraviolet curable resin 40 is applied so that the element component recess 31a provided on one main surface of the lid wafer W2 faces the element component 20a mounted on the base wafer W1. The base wafer W1 and the lid wafer W2 are overlapped.

As shown in FIG. 7, the bonding step is a step of bonding the base wafer W1 and the lid wafer W2 by irradiating the ultraviolet curable resin 40 with ultraviolet rays from around the overlapped base wafer W1 and lid wafer W2.
The ultraviolet curable resin 40 is transparent and is in a transparent state that transmits ultraviolet rays before and after curing. In other words, the ultraviolet curable resin 40 interposed between the overlapped base wafer W1 and the vicinity of the center of the lid wafer W2 passes through the ultraviolet curable resin 40 interposed near the edge of the base wafer W1 and the lid wafer W2. It can be cured. That is, the ultraviolet curable resin 40 interposed between the base wafer W1 and the lid wafer W2 is cured by being irradiated with ultraviolet rays from around the base wafer W1.
As shown in FIG. 7, the base wafer W <b> 1 and the lid wafer W <b> 2 are joined by irradiating the ultraviolet curable resin 40 with ultraviolet rays from around the overlapped base wafer W <b> 1 and lid wafer W <b> 2. Here, the ultraviolet curable resin 40 is cured in a normal temperature atmosphere such as 5 ° C. to 35 ° C., for example.

  The singulation process is a process of dividing into individual electronic devices in a state where the base wafer W1 and the lid wafer W2 are bonded. In this singulation process, the base wafer W1 and the lid wafer W2 are joined, and a plurality of recesses 31a provided in the lid wafer W2 are separated for each electronic device using dicing, laser, or the like. Disconnected. After the singulation step, a plurality of electronic devices 100 are provided as shown in FIG.

  In such an electronic device manufacturing method, since the base body 10a and the lid body 30a are bonded by curing the ultraviolet curable resin 40, the flatness and shape of the bonding surface are less restricted. That is, in such a manufacturing method of the electronic device 100, time and labor are not required in the step of flattening the surfaces to be bonded and the step of forming the bonding metal layer. Cost can be reduced.

  Moreover, since the manufacturing method of such an electronic device can join the base body 10a and the cover body 30a by the ultraviolet curable resin 40 without heating, an element like the conventional manufacturing method of an electronic device. The influence by the heating at the time of joining to the component 20a can be prevented.

  In addition, since the ultraviolet curable resin 40 is transparent in such a method for manufacturing an electronic device, the ultraviolet curable resin 40 inside the wafer is cured even when the ultraviolet rays are irradiated from around the base wafer W1 and the lid wafer W2 that are overlaid. Can do. Thereby, since airtight defects such as cracks caused by the difference in thermal expansion coefficient between the base body 10a and the lid body 30a can be eliminated, the manufacturing cost of the electronic device can be reduced.

  In addition, since the electronic device manufacturing method joins the base wafer W1 in the wafer state and the lid wafer W2 using a transparent ultraviolet curable resin, the element component 20a is hermetically sealed. An electronic device can be easily manufactured. Such an electronic device manufacturing method can be easily manufactured even for a small electronic device having a long side length of 2 mm or less, for example.

(Second embodiment)

Next, an electronic device according to a second embodiment of the present invention will be described. The electronic device is described as a crystal oscillator.
FIG. 9 is a cross-sectional view showing an example of an electronic device according to the second embodiment.
In the electronic device 110 according to the second embodiment of the present invention, the base body 10b has an element component recess 11b and a tower mounting recess 12b, and the tower mounting component 50b is mounted on the tower mounting recess 12b. This is different from the first embodiment.
As shown in FIG. 9, the electronic device 110 according to the second embodiment of the present invention is mainly composed of a base body 10b, a lid body 30b, an element part 20b, an ultraviolet curable resin 40, and a tower part 50b. Yes.

Here, the tower component 50b is an integrated circuit element. The integrated circuit element 50b incorporates an oscillation circuit that controls the oscillation output based on the vibration of the element part component 20b.
The base body 10b is mainly provided with an element component recess 11b on one main surface, and a tower component recess 12b and a plurality of external connection terminals G on the other main surface. A plurality of mounting terminals P are provided on the bottom surface of the element component recess 11b provided on one main surface. Similarly, a plurality of wiring patterns H are provided on the bottom surface of the tower-mounted component recess 12b provided on the other main surface. The wiring component H is mounted on the wiring pattern H using the mounting material D. That is, the tower component 50b is in a state of being tower mounted in the tower component recess 12b.
The number of wiring patterns H provided according to the tower component 50b is different. Here, it is assumed that, for example, six wiring patterns H are provided in accordance with the tower component 50b. At this time, for example, three wiring patterns H are arranged along one long side and three are arranged along the other long side. The wiring component H is mounted on the wiring pattern H by the mounting material D.

  Two tower terminals P are provided side by side on one short side. The device component 20b is mounted on the tower terminal P using the tower material D. That is, the element component 20b is placed in the element component recess 11b. The predetermined tower terminal P is connected to a predetermined terminal of the tower component 50b.

  Assume that four external connection terminals G are provided at the four corners of the other main surface of the base body 10b where the tower mounting recesses 12b are provided. The predetermined external connection terminal G is connected to a predetermined terminal of the tower component 50b.

The ultraviolet curable resin 40 is annularly applied to one main surface where the element component recess 11b is provided.
In such an electronic device 110, the base body 10b coated with the ultraviolet curable resin 40 and the lid body 30b are overlapped so as to surround the element component 20b mounted in the element component recess 11b. The base body 10a and the lid body 30a are joined by curing the irradiated ultraviolet curable resin 40.

  In such an electronic device 110 according to the second embodiment of the present invention, the element component 20b mounted on the base body 10b is sealed with the ultraviolet curable resin 40 between the base body 10b and the lid body 30b. . Therefore, the same effects as those of the first embodiment are obtained.

(Third embodiment)

Next, an electronic device according to a third embodiment of the present invention will be described.
FIG. 10 is a cross-sectional view illustrating an example of an electronic device according to the third embodiment.
The electronic device 120 according to the third embodiment of the present invention is different from the second embodiment in that the tower component recess 12c is provided in the element component recess 11c.

The base body 10c is provided with an element component recess 11c on one main surface, and a plurality of external connection terminals G on the other main surface. Further, the tower terminal P and the tower component recess 12c are provided on the bottom surface of the element component recess 11c. Furthermore, a plurality of wiring patterns H are provided on the bottom surface of the recessed part 12c for tower components.
Two tower terminals P are paired, and the element component 20c is mounted on the tower terminal P by a tower material D such as a conductive adhesive. The predetermined tower terminal P is electrically connected to a predetermined terminal of the element component 20c.
The recessed part 12c for tower components is provided in the position which does not overlap with the tower terminal P on the bottom face of the recessed part 11c for element components. In addition, the tower component 50 c is mounted on the wiring material H provided on the bottom surface of the tower component recess 12 c with the tower material D. The depth of the recessed part 12c for tower parts is mounted on the tower part 50c and the tower terminal P when the tower part 50c is mounted in the recessed part 12c for tower parts. The depth is such that it does not come into contact with the element component 20c.

The ultraviolet curable resin 40 is annularly applied to one main surface provided with the element component recess 11c.
Such an electronic device 120 includes an ultraviolet curable resin so as to surround the element component 20c mounted in the element component recess 11c and the tower component 50c mounted in the tower component recess 12c. The base body 10c applied with 40 and the lid body 30c are overlapped, and the base body 10c and the lid body 30c are joined by curing the ultraviolet curable resin 40 irradiated with ultraviolet rays.

  In such an electronic device 120 according to the third embodiment of the present invention, the element component 20c mounted on the base body 10c is sealed with the ultraviolet curable resin 40 between the base body 10c and the lid body 30c. Therefore, the same effects as those of the first embodiment are obtained.

(Fourth embodiment)
Next, an electronic device according to a fourth embodiment of the present invention will be described.
FIG. 11 is a cross-sectional view illustrating an example of an electronic device according to the fourth embodiment.
The electronic device 121 shown in the fourth embodiment of the present invention is the third embodiment in that an element component recess 11d and a tower mount recess 12d are provided on one main surface of the base body 10d. And different.

  The base body 10d has an element component recess 11d and a tower mount recess 12d on one main surface, and a plurality of external connection terminals 12c on the other main surface. In the element component recess 11d, the element component 20d is mounted on the tower terminal P by the tower material D. In addition, the tower component 50d is mounted on the wiring pattern H by the tower material D in the tower component 12d.

The ultraviolet curable resin 40 is annularly applied to one main surface provided with the element component recess 11d and the tower mount recess 12d.
Here, as shown in FIG. 11, the element component recess 11d and the tower mounting recess 12d are illustrated together, but the element component recess 11d and the tower mounting recess 12d are combined. It does not have to be. At this time, the ultraviolet curable resin 40 is applied on the one main surface provided with the element component recess 11d in a ring shape around the element component 20d, and is provided on the one main surface provided with the tower component recess 12d. However, it is applied in a ring around the tower component 50d.

  In such an electronic device 121, an element component 20d mounted in the element component recess 11d and a tower component 50d mounted in the tower component recess 12d include a base body 10d and a lid 30d. The base body 10d coated with the ultraviolet curable resin 40 and the lid body 30d are overlapped with each other, and the base body 10d and the lid body are cured by curing the ultraviolet curable resin 40 irradiated with ultraviolet rays. 30d is joined.

  In such an electronic device 121 according to the fourth embodiment of the present invention, the element component 20d mounted on the base body 10d is sealed with the ultraviolet curable resin 40 between the base body 10d and the lid body 30d. . Therefore, the same effects as those of the first embodiment are obtained.

  As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment. For example, although the case where the element component is made of a piezoelectric material has been mainly described, an integrated circuit element, a chip capacitor, or the like may be used.

  In addition, the shape of the base body and the lid body is not limited as long as the element component recess is provided in either the base body or the lid body and the element component is sealed with the base body and the lid body. .

Further, although the case where the ultraviolet curable resin is applied to the base wafer is described, the ultraviolet curable resin may be applied to the lid wafer, or the ultraviolet curable resin may be applied to the base wafer and the lid wafer.
Here, when the ultraviolet curable resin is applied to the lid wafer, the ultraviolet curable resin is applied to one main surface of the lid wafer provided with a plurality of recesses for element parts. At this time, if the periphery of the element component is annularly applied so that the edge of the UV curable resin on the element component recess side is closer to the element component recess side than the edge of the lid, the application shape is It doesn't matter.

  Further, in the coating process, the case where the ultraviolet curable resin is applied to each base body has been described. However, as shown in FIG. 12, the edge of the ultraviolet curable resin on the element component side is around the element component. If it is applied so as to be closer to the element component side than the edge of the base body, the applied shape is not limited.

  Furthermore, in the bonding process, the case where ultraviolet rays are irradiated from four directions of the base wafer and the lid wafer that are overlapped is described. However, ultraviolet rays may be irradiated from one direction or more than one direction.

100, 110, 120, 121 Electronic device

10a, 10b, 10c, 10d Base body 20a, 20b, 20c, 20d Element parts

30a, 30b, 30c, 30d Lid 40 UV curable resin 50b, 50c, 50d Tower component W1 Base wafer W2 Lid wafer 21 First electrode 22 Second electrode

31a Concave part 11b, 11c, 11d of cover body Concave part for element parts of base body

12b, 12c, 12d Recesses for mounting parts of base body

P Tower terminal G External connection terminal

D Tower material

Claims (2)

A base body on which element parts are mounted;
A lid for sealing the element component;
A transparent ultraviolet curable resin interposed between the base body and the lid;
With
The electronic device, wherein the base body and the lid body are joined with the ultraviolet curable resin.
An element component mounting step for mounting an element component on one main surface of a portion of the base wafer provided with a plurality of base bodies, which becomes the base body;
Application step of applying an ultraviolet curable resin to an edge portion of the portion to be the base body and the main surface on which the element parts are mounted and / or one main surface of a lid wafer provided with a plurality of lid bodies When,
An overlapping step in which one main surface of the base wafer and one main surface of the lid wafer are overlapped with the ultraviolet curable resin interposed therebetween to surround the element component with the base body and the lid;
A process of joining the base wafer and the lid wafer by irradiating the ultraviolet curable resin with ultraviolet rays from around the base wafer and the lid wafer,
A singulation process for singulating into individual electronic devices in a state where the base wafer and the lid wafer are bonded,
An electronic device manufacturing method comprising:

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