JP4780700B2 - ELECTRONIC PROTECTION ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - Google Patents

Description

  The present invention is a package using a glass-to-metal sealing structure (hereinafter referred to as GTMS), and in particular, device components such as a semiconductor light emitting device and a crystal resonator can be mounted in the package to enable monitoring from outside the package and laser trimming. The present invention relates to an electronic component for protecting an element that is reduced in size and thickness and a method for manufacturing the same.

In general, a crystal oscillator package for mounting a crystal oscillator in a hermetically sealed package includes a ceramic base and a cap bonded thereon. In such a structure, the frequency of the AT-cut quartz crystal is adjusted by roughly removing the excitation electrode after measuring the frequency of the quartz crystal after incorporating the crystal into the base. After the cap is joined to the base, the excitation electrode is finely adjusted by ion beam etching through the through hole while measuring the frequency in the same manner, and the package is hermetically sealed (see Patent Document 1). For such fine-tuning of the frequency, the crystal base package is manufactured by manufacturing the base material of the package with glass having a high transmittance, bonding the crystal unit with silver paste, mounting it in a cantilevered state, and sealing it with a cap. Is proposed, and it is known that the frequency adjustment of the crystal resonator inside the package is facilitated by laser beam irradiation from the outside of the package (see Patent Document 2). On the other hand, in addition to the above-mentioned ceramic base and metal cap, glass base and ceramic cap, the quartz resonator package includes a base member and a cylindrical type using a general airtight terminal structure GTMS (glass-to-metal sealing structure). A metal cap member is known (see Patent Document 3).
JP 2002-76815 A JP 2002-124845 A JP 2003-152129 A

  By the way, the ceramic base and the package using the glass base shown in Patent Documents 1 and 2 cannot avoid the glass breakage from the end portion, and use a low melting point glass to seal the glass and the metal material. However, there were still problems such as difficulty in making Pb-less. Further, it is difficult to reduce the size and height of the package of Patent Document 3 type using a base member of a normal hermetic terminal (GTMS), and laser trimming from outside cannot be performed for frequency adjustment of the crystal resonator.

  Accordingly, an object of the present invention has been proposed in order to eliminate the above-mentioned drawbacks, and a package using a base member of a glass-to-metal sealing structure using transparent glass capable of transmitting laser light as glass. It is an object of the present invention to provide a new and improved element protecting electronic component constituting the above. In order to achieve the object of the present invention, for example, a base member using GTMS for mounting a crystal piece uses a Pb-free bonding material such as AuSn for bonding and sealing with a metal lid member, an electron beam device or seam welding. Disclosed is an element-protecting electronic component that achieves Pb-lessness along with reduction in height and size by using a device.

  In addition, in order to manufacture a small and thin package having a package size of 3.2 × 1.5 mm and a thickness of 0.55 mm or less, a metal in which a base member having a hermetic terminal (GTMS) structure is molded into a predetermined shape in advance. It is an object of the present invention to propose a method of manufacturing an element protection electronic component using a new and improved GTMS type package which is manufactured by assembling and sealing a shell and a chip or plate-like glass material in a jig. With this manufacturing method, it is possible to easily mass-produce element protection electronic components that are reduced in height and downsized in a package size of about 1.5 × 0.8 mm.

According to the present invention, a package in which a metal lid member is bonded and sealed to a base member in which a metal frame and a translucent glass substrate having a through conductor are sealed by interposing a metal frame and metal melting or a bonding material. An element protection electronic component is provided in which an element component is mounted on the base member and accommodated in an airtight space in the package, and the through conductor is used as a signal lead. The above-described joint sealing structure of the base member and the lid member can be joined and sealed by superimposing the inner peripheral side surface of the metal lid member on the outer peripheral side surface of the metal frame body of the base member, or on the upper surface of the metal frame body of the base member. The bottom surface of the bent portion of the metal lid member is overlapped and sealed, and the bonding is performed by using a Pb-free bonding material such as AuSn alloy or using an electron beam device or a seam welding device. Disclosed is a Pb-less process by metal fusion bonding. In addition, a metal metallized electrode portion connected to a conductor penetrating the light-transmissive glass substrate of the base member is provided for mounting element parts, for example, a crystal piece, and a conductive adhesive such as Ag epoxy is used for the lead-out electrode portion. Also disclosed.

  In other words, the electronic device for protecting an element of the present invention uses a base member utilizing a strong terminal structure of a hermetic seal and a metal lid member that is Pb-less and can be easily processed. The substrate is translucent to enable monitoring of element parts and laser trimming from the outside of the package, and the translucent glass substrate is formed with a metal metallized electrode part connected to the through conductor, and this electrode part is interposed with an Ag epoxy adhesive. A crystal piece as an element part is fixed. Further, the metal frame of the base member is a wafer-like metal shell in which a number of metal shells are connected to each other. For example, a metal shell having a rectangular outer frame frame and a bridge frame that bridges the long sides thereof is provided. Prepare. In addition, a frame-shaped lead member is prepared in which a large number of leads are arranged at predetermined positions and connected to each other in the through conductor. A GTMS structure in which a chip-like or plate-like glass material is melted and a metal shell and a lead are integrally sealed is characterized in that the structural strength is enhanced and the structure is advantageous for mass production. In the case of the former frame-shaped metal shell, the translucent glass substrate becomes a GTMS type base member separated by this bridge frame and sealed on the metal frame. When the latter frame-shaped lead member is used, the wafer-shaped metal shell and As a result, a plurality of through conductors and a metal frame are integrally processed, cut and separated after sealing with a translucent glass substrate, and a base member having a high mechanical strength is prepared. The Therefore, mechanical strength is remarkably improved as compared with a package using a conventional glass base or glass lid, and mass production is also possible, thereby realizing a reduction in size, thickness and height.

  According to another aspect of the present invention, a lid member is bonded and sealed to a base member in which a translucent glass substrate having a through conductor and a metal frame are sealed by interposing a metal frame and metal or a bonding material. In a method for manufacturing an element protecting electronic component containing a package and an element component mounted on a base member in the space of the package, a wafer-like metal shell member, a frame-like lead member, a chip or a plate-like glass material, The process of forming and molding the wafer into a predetermined shape, the step of assembling and arranging the wafer-like metal shell member, the frame-like lead member and the glass material in a predetermined position using a heating jig, and heating the glass material to a molten state to form a metal The process of sealing the shell and the lead together, the process of etching or polishing the surface of the integrally sealed glass material, and heating the glass material in a flat shape with translucency Manufacturing process of the base member including the process of plating, the process of plating the metal shell and the lead, the manufacturing process of the lid member including the process of sheet metal processing the metal plate material into a predetermined shape, and joining the base member and the lid member Disclosed is a method for manufacturing an electronic component for protecting a device, which includes a process for manufacturing a package by joining and sealing either material intervening or metal melting by electron beam or seam welding.

  As another manufacturing method, a plate-shaped glass material cut and adjusted to a predetermined size is used to prepare a predetermined jig using a frame-shaped lead member and a metal material processing preparation member integrated with a wafer-shaped metal shell member. The wafer-shaped metal shell member and the frame-shaped lead member are integrally sealed by assembling and arranging at the position, in which the glass sheet material is melted. The surface of the integrally sealed metal shell and lead and glass material is polished or etched to a flat surface. Thereafter, the glass material is translucent and heat-treated into a planar shape to obtain a translucent glass substrate having a through conductor. Note that the wafer-like metal shell member and the frame-like lead member are individually divided by cutting in an appropriate process after integral sealing. Further, the metal shell and the lead are subjected to necessary plating to complete the production of the base member. On the other hand, the lid member is manufactured including a step of processing a metal plate into a predetermined shape, and either the base member and the lid member manufactured in each process are either an intervening material, or an electron beam or seam welding metal melting. A package is manufactured by bonding and sealing. In addition to this, the manufacture of electronic components for device protection that enables the frequency adjustment of the element component of the crystal piece mounted on the base member in the package space by laser trimming from the outside of the translucent glass substrate A method is proposed.

  The electronic device for device protection of the present invention can observe and monitor the inside of the package from the outside, and allows trimming of the device component by transmitting a laser beam. When a crystal piece is used for the device component, the frequency of the crystal resonator is reduced. Can be used for adjustment. On the other hand, since the translucent glass substrate having the through conductor is sealed with the metal frame, the translucent glass substrate is reinforced with the metal frame to increase the mechanical strength, and the glass material is cracked or damaged. Reduced, does not cause practical problems, and helps improve reliability. In addition, since the base member having the GTMS structure is used in the method for manufacturing the element protecting electronic component, in addition to enhancing the mechanical strength, mass production is easy and the cost is reduced. Therefore, the device protecting electronic component and the manufacturing method thereof according to the present invention can avoid the glass breakage from the glass edge portion and can be made Pb-less compared to the conventional package, and the outside of the package from the outside. Enables observation monitoring and laser trimming. In addition, a manufacturing method that can realize a reduction in profile as well as a reduction in size and thickness is also provided, which is useful for cost reduction by mass production.

  The embodiment according to the present invention is produced by inserting a conductor of a frame-like lead member into a softened and melted glass material, and sealing it integrally with a wafer-like metal shell member to make the glass material transparent. The base member in which the metal frame and the translucent glass substrate with the through conductor are sealed and the lid member in which the metal plate is molded into a predetermined shape are joined and sealed by a Pb-less method, It is an electronic component for element protection which mounts an element component in a package space. The joint sealing of the Pb-less method includes the case of sealing via a Pb-free joining material and the case of joint sealing by metal melting using an electron beam device or a seam welding device. In addition, the element component to be mounted in the internal space of the package is provided with a metal metallization for connection to the conductor penetrating the translucent glass substrate of the base member to form a lead lead-out electrode portion, on which a conductive adhesive such as Ag epoxy Use to place. Here, annealing heating, etching, or polishing treatment is used so that the above-described translucent glass substrate transmits laser light. In addition, the sealing structure of the base member and the lid member includes a case where the inner peripheral side surface of the metal lid member is press-fitted and sealed on the outer peripheral side surface of the metal frame of the base member, and the upper surface of the flange of the metal shell of the base member In some cases, the lower surface of the lower end flange of the metal lid member is overlaid and pressure sealed. Specifically, when bonding and sealing is performed with a Pb-free bonding material, a Pb-free bonding material such as an AuSn alloy is used. Also, Pb-less joint sealing by metal fusion joining using an electron beam device or a seam welding device can be used.

  On the other hand, for mass production of the base member, a wafer-like metal shell member in which a large number of metal shells to be metal frames are connected and a plurality of leads to be through conductors are formed as a single sheet metal as necessary. Each frame-shaped lead member that can be handled as a processed part is used. Furthermore, in order to improve the strength of the translucent glass substrate, if necessary, the base member is formed by providing a metal frame as a metal frame with a rectangular outer frame and a bridge frame that bridges the long side of the outer frame. The base member of the GTMS structure using the processed metal shell, and the translucent glass substrate provides a package satisfying strength that is separated and divided by a bridge frame for reinforcement.

  Another embodiment relates to a method of manufacturing an element protecting electronic component, and relates to the manufacture of a package in which a lid member is bonded and sealed to a base member by melting metal or interposing a bonding material. First, in order to constitute the metal frame of the base member, a plurality of metal shells are procured as wafer-like metal shell members. Further, a frame-like lead member in which a plurality of straight leads to be through conductors are formed is procured by another sheet metal processing. If necessary, the wafer-shaped metal shell member and the frame-shaped lead member can be integrally formed by sheet metal processing of a metal plate. On the other hand, in order to constitute the translucent glass substrate of the base member, a chip-like glass material or a plate-like glass material is procured by processing such as cutting and cutting into a predetermined shape. Next, the glass material, the metal shell, and the lead that have been procured are assembled and arranged in a predetermined positional relationship using a heating assembly jig, and passed through the heating furnace. The glass material heated in the furnace passing process is softened and melted and sealed together with the metal shell and leads. After sealing, unnecessary portions of the metal shell and the lead member and excess portions of the glass material are removed by etching or polishing, and processed into a desired shape and dimension. In addition, the glass material is subjected to heat treatment so as to be transparent as a translucent glass substrate. Next, the metal surface of the metal shell or lead is plated to form the metal frame and the through conductor of the constituent parts of the base member. An electrode part for metal metallization is formed on a predetermined surface of the glass substrate to enable mounting of element parts. After the element parts are mounted on the base member, the base member is bonded and sealed to the lid member produced by sheet metal processing of the metal plate by melting the metal by electron beam or seam welding or by interposing a bonding material, and the element protecting electronic part is manufactured. The

  Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings. As shown in FIGS. 1A and 1B, the element protecting electronic component of the present invention comprises a base member 10 and a lid member 20, and a crystal piece element component 30 is mounted on the base member 10. Configured. The base member 10 has a GTMS structure in which a translucent glass substrate 16 having a through conductor 14 is sealed on a metal frame 12 of a wafer-like metal shell having a substantially rectangular frame, and the wafer-like metal shell is preliminarily attached to a heating assembly jig. It is prepared by incorporating a glass chip or a sheet glass material together with the member and the frame-shaped lead member. The assembly jig is heated by passing through a heating furnace, and the softened and melted glass material is sealed together with the metal shell and leads. After the integral sealing, unnecessary portions of the glass material are removed into a predetermined shape by etching or polishing, and thereafter, the glass material is processed into a transparent translucent glass substrate 16 by heat treatment by annealing. On the other hand, the frame-like lead member material that is inserted through the glass material and the wafer-like metal shell member that is sealed to the glass material expose the desired surface by removing unnecessary portions in the etching or polishing process. This exposed surface is a base member 10 of a translucent glass substrate 16 that has a through conductor 14 surrounded by a metal frame 12 by performing necessary plating. An element component 30 of a crystal piece is connected and mounted on the through conductor 14 on the upper surface side of the glass substrate 16 through an Ag epoxy conductive adhesive 17. Further, a solder ball is provided at a required position as the external electrode 18 on the lower surface of the translucent glass substrate 16 to facilitate surface mounting. In order to form a package, the lid member 20 is formed with a cap width of a predetermined height by pressing a metal plate, and a flange 22 is provided at the lower end thereof. In the packaging process, the lid member 20 is hermetically pressure sealed with a Pb-free bonding material (not shown) on the upper surface of the metal frame 12 of the base member 10 on which the element component 30 is mounted. That is, an AuSn bonding material that is a Pb-free solder alloy is interposed between the upper surface of the metal frame 12 of the base member 10 and the lower surface of the flange 22 of the lid member 20, and the package is completed by pressure-welding by heating. To do. In this case, the pressure sealing can be performed by metal melting using an electron beam device or a seam welding device, and in any case, the processing is Pb-less. In the completed package, a transparent glass material through which the light-transmitting glass substrate 16 transmits laser light is used. Therefore, the element component 30 mounted inside is monitored from the outside to enable laser trimming.

  In the above-described embodiment, a modification example in which the base member and the lid member are joined differently and the electrode formation of the base member is different is shown in FIGS. 2A and 2B. Description is omitted. As shown in FIG. 2, the lid member 24 is prepared and prepared by press forming a metal plate with a predetermined height providing a cap width and a joining width. Then, the lid member 24 is press-fitted into the outer peripheral side surface of the metal frame 12 of the base member 10, and the inner peripheral side surface is overlapped and press-fitted and sealed by metal melting using an electron beam device or a seam welding device to make Pb-less. The package is manufactured. Here, a metal metallized electrode portion 19 connected to the through conductor 14 is provided as a lead lead electrode on the inner and outer surfaces of the translucent glass substrate 16 as a signal lead electrode portion, and this metal is used for mounting the element component 30 inside the package. This is performed using an Ag epoxy adhesive 17 via the metallized electrode portion 19.

  As another modification, as shown in FIG. 3A and FIG. 3B, the external electrode portion 18 of the solder ball and the metal metallized electrode portion 19 can be used in combination as a signal derivation lead means. In this modified example, the solder ball external electrode portion 18 in FIG. 1 and the metal metallized electrode portion 19 in FIG. 2 are used as the respective lead-out leads, and the mounting structure of the crystal component element 30 and the surface mounting of the package itself are used. This is advantageous. In addition, the same code | symbol is used for the same part and detailed description is abbreviate | omitted.

  As shown in FIGS. 4A and 4B, another embodiment of the present invention includes a rectangular outer frame 43 as a metal frame of the base member 40 and a bridge frame 45 that bridges the long side thereof. A metal shell 42 having a metal shell is used. A GTMS structure in which the first translucent glass substrate 46 having the through conductor 44 and the second translucent glass substrate 47 not having the through conductor 44 are separated by the bridge frame 45 and sealed to the metal shell 42, respectively. is there. The lead electrode portion of the base member 40 is formed of the metal metallization shown in FIG. 2, and the same portions are denoted by the same reference numerals and detailed description thereof is omitted. This embodiment is characterized in that since the glass material is divided and sealed, the window frame of the glass substrate can be reduced and the mechanical strength can be increased.

  Another embodiment of the present invention is shown in FIGS. 5 (a) and 5 (b). The element protecting electronic component includes a GTMS type package in which a base member 50 and a lid member 24 are bonded and sealed, and an element component 30 mounted on the base member. The base member 50 is composed of a translucent glass substrate 56 having a metal frame 52 and a through conductor 54. The surface of the translucent glass substrate 56 is an outer surface of the metal frame 52 or the through conductor 54 (hereinafter referred to as a reference plane). ) Is recessed more concavely by etching. Therefore, the gap between the component parts 30 to be mounted is made larger than the reference plane to form a gap of approximately 50 μm. In addition, the distance between the metal frame 52 and the through conductor 54 is set to about 0.1 to 0.2 mm, and the package external size is reduced from 3.2 × 1.5 mm to about 1.5 mm × 0.8 mm. ing. The base member used for manufacturing such an element protecting electronic component is manufactured by the process shown in FIG. First, the base member 50 is manufactured by using a wafer-like metal shell obtained by three-dimensionally punching Kovar metal by sheet metal processing so that a large number of portions that eventually become the metal frame 52 and the through conductors 54 can be obtained. An integrated member of the frame-like lead is procured. Also, a large number of borosilicate glass sheet materials cut to approximately the same size as the metal shell are procured. The Kovar integrated member and the borosilicate glass material are assembled and stacked on a firing jig and passed through a heating furnace. The glass material is softened and melted in the furnace to become a GTMS sealing body in which the metal shell and the lead are sealed. The sealing body in which the metal frame is left as the outer frame is etched or polished on both sides, and is ground and polished to a predetermined thickness. In particular, the etching process is carried out using a hydrofluoric acid-based etchant (trade name), and the glass surface is recessed in a concave shape. Next, this glass material is heat-treated to form a transparent glass substrate 56 having a smooth and transparent surface. In this way, the plurality of base members are completed as parts, but the connected parts are cut off from the integrated member of the wafer-like metal shell and the frame-like lead before the plating process in the next step. Separately divided. In the plating step, a desired plating film is formed on the metal surface. Although not shown in FIG. 6, the cutting / separating step may be performed in a step after the plating step, or a metal metallized electrode portion or a solder ball electrode portion may be provided at a predetermined position on the translucent glass substrate. A base member which is a part is completed. The base member 50 on which the element component is mounted is joined and sealed with the lid member 24 to become an element protecting electronic component. In this embodiment, a plurality of metal frame bodies 52 and through conductors 54 are produced by an integrated member, which facilitates mass production and contributes to the realization of cost reduction. In particular, the integrated member of the metal shell and the lead greatly reduces the number of assembly steps, stabilizes the work, and contributes to the improvement of product accuracy.

It is a principal part schematic diagram of the element protection electronic component which shows Example 1 of this invention. It is a principal part schematic diagram of the element protection electronic component which shows the modification of FIG. It is a principal part schematic diagram of the electronic component for element protection which shows another modification of FIG. It is a principal part schematic diagram of the element protection electronic component which shows Example 2 of this invention. It is a principal part schematic diagram of the electronic component for element protection which shows Example 3 of this invention. It is the schematic which shows the principal part of the manufacturing process of the base member used for FIG.

Explanation of symbols

10, 40, 50 ... base member, 12, 42, 52 ... metal frame (metal shell),
14, 44, 54 ... penetrating conductor (lead),
16, 56 ... translucent glass substrate, 17 ... conductive adhesive (Ag epoxy),
18, 48 ... external electrode part (solder ball), 19 ... metal metallized electrode part,
20, 24 ... Lid member, 22 ... Flange, 30 ... Element part (crystal piece),
43 ... outer peripheral frame, 45 ... bridge frame, 46 ... first translucent glass substrate,
47. Second translucent glass substrate.

Claims (5)

A base member in which a metal frame and a translucent glass substrate with a through conductor are sealed, and a lid member is bonded and sealed to the metal frame with an intervening bonding material, and mounted on the base member An element component such as a crystal piece is fixed to the metal metallized electrode portion formed on the translucent glass substrate by interposing a conductive adhesive , accommodated in an airtight space of the package, and penetrates the translucent glass substrate. The conductor is a signal lead, and the sealing of the base member and the lid member is a sealing in which the lower surface or inner peripheral surface of the lid member is overlapped with either the upper surface or the outer peripheral surface of the metal frame. An electronic component for device protection. The base member is a hermetic terminal assembly in which a plurality of the translucent glass substrates arranged in a separable manner and the metal frame made of a metal shell of a bridge frame of the outer frame are sealed. The electronic component for protecting an element according to claim 1.   A metal shell, a lead for penetration, and a step of processing and forming a glass material into a predetermined shape using a preselected metal material and glass material, a metal shell formed in a heating assembly jig, a lead for penetration and a glass material A process of assembling and arranging in a predetermined position, a process of heating the glass material in a softened / molten state to integrally seal the metal shell and the lead for penetration, etching for flattening the surface of the glass material after sealing Or a base member including a step of polishing, a step of heat treatment for transparentizing the glass material whose surface is flattened, and a step of plating the metal shell and the through lead to form a predetermined plating layer on the metal surface A manufacturing process of the lid member including a process of processing the metal plate into a predetermined shape, and after mounting the element component on the base member Serial manufacturing method for the device for protecting electronic components, characterized in that it comprises a package fabrication process a lid member joined sealing by interposing a bonding material. The base member fabrication process includes a wafer-shaped metal shell member that connects a plurality of metal shells to each other and a frame-shaped lead member that arranges a plurality of penetrating leads at predetermined positions and connects them to each other, And a processing and forming step of batch-preparing a plurality of chips or plate-like glass materials, and the wafer-like metal shell member and the frame shape after the glass material is integrally sealed with the metal shell and the lead for penetration 4. The method of manufacturing an element protecting electronic component according to claim 3 , further comprising a cutting step of separating and dividing the lead member into a plurality of metal shells and penetrating leads. The metal shell and the through lead are prepared by integrating them by sheet metal processing of the same metal plate material, and the glass material is prepared by cutting a sheet glass into a predetermined size, thereby assembling the assembly arrangement of the production process of the base member The method for manufacturing an element protecting electronic component according to claim 3 , wherein the method is facilitated.

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