TWI546852B - Laser processing method - Google Patents

Laser processing method Download PDF

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Publication number
TWI546852B
TWI546852B TW101100603A TW101100603A TWI546852B TW I546852 B TWI546852 B TW I546852B TW 101100603 A TW101100603 A TW 101100603A TW 101100603 A TW101100603 A TW 101100603A TW I546852 B TWI546852 B TW I546852B
Authority
TW
Taiwan
Prior art keywords
cut
line
sic substrate
modified region
along
Prior art date
Application number
TW101100603A
Other languages
English (en)
Chinese (zh)
Other versions
TW201246331A (en
Inventor
Junji Okuma
Takeshi Sakamoto
Original Assignee
Hamamatsu Photonics Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics Kk filed Critical Hamamatsu Photonics Kk
Publication of TW201246331A publication Critical patent/TW201246331A/zh
Application granted granted Critical
Publication of TWI546852B publication Critical patent/TWI546852B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/18—Sheet panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
TW101100603A 2011-01-13 2012-01-06 Laser processing method TWI546852B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011005184A JP5775312B2 (ja) 2011-01-13 2011-01-13 レーザ加工方法

Publications (2)

Publication Number Publication Date
TW201246331A TW201246331A (en) 2012-11-16
TWI546852B true TWI546852B (zh) 2016-08-21

Family

ID=46507006

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101100603A TWI546852B (zh) 2011-01-13 2012-01-06 Laser processing method

Country Status (3)

Country Link
JP (1) JP5775312B2 (ja)
TW (1) TWI546852B (ja)
WO (1) WO2012096093A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6358941B2 (ja) * 2014-12-04 2018-07-18 株式会社ディスコ ウエーハの生成方法
JP6399913B2 (ja) * 2014-12-04 2018-10-03 株式会社ディスコ ウエーハの生成方法
JP6563093B1 (ja) 2018-08-10 2019-08-21 ローム株式会社 ＳｉＣ半導体装置
US10562130B1 (en) 2018-12-29 2020-02-18 Cree, Inc. Laser-assisted method for parting crystalline material
US10576585B1 (en) 2018-12-29 2020-03-03 Cree, Inc. Laser-assisted method for parting crystalline material
US11024501B2 (en) 2018-12-29 2021-06-01 Cree, Inc. Carrier-assisted method for parting crystalline material along laser damage region
US10611052B1 (en) 2019-05-17 2020-04-07 Cree, Inc. Silicon carbide wafers with relaxed positive bow and related methods

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080070380A1 (en) * 2004-06-11 2008-03-20 Showda Denko K.K. Production Method of Compound Semiconductor Device Wafer
JP5151444B2 (ja) * 2007-12-14 2013-02-27 株式会社デンソー 半導体チップ及びその製造方法
JP5493275B2 (ja) * 2008-02-27 2014-05-14 富士電機株式会社 半導体装置の製造方法
JP5377016B2 (ja) * 2009-03-23 2013-12-25 スタンレー電気株式会社 半導体装置の製造方法
JP5148575B2 (ja) * 2009-09-15 2013-02-20 浜松ホトニクス株式会社 レーザ加工方法、及び、レーザ加工装置
JP5625521B2 (ja) * 2010-06-16 2014-11-19 豊田合成株式会社 レーザ加工方法

Also Published As

Publication number Publication date
JP2012146875A (ja) 2012-08-02
TW201246331A (en) 2012-11-16
WO2012096093A1 (ja) 2012-07-19
JP5775312B2 (ja) 2015-09-09

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