TWI544610B - The mounting structure of the solid-state imaging element and the solid-state imaging device - Google Patents

The mounting structure of the solid-state imaging element and the solid-state imaging device Download PDF

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Publication number
TWI544610B
TWI544610B TW101127625A TW101127625A TWI544610B TW I544610 B TWI544610 B TW I544610B TW 101127625 A TW101127625 A TW 101127625A TW 101127625 A TW101127625 A TW 101127625A TW I544610 B TWI544610 B TW I544610B
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Taiwan
Prior art keywords
solid
electrode pads
state imaging
imaging device
main surface
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TW101127625A
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English (en)
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TW201312735A (zh
Inventor
Tomohiro IKEYA
Toshiyuki Fukui
Hisanori Suzuki
Masaharu Muramatsu
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Hamamatsu Photonics Kk
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Publication of TW201312735A publication Critical patent/TW201312735A/zh
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Publication of TWI544610B publication Critical patent/TWI544610B/zh

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Description

固體攝像元件及固體攝像元件之安裝構造
本發明係關於一種固體攝像元件及固體攝像元件之安裝構造。
作為固體攝像元件，已知有所謂表面入射型固體攝像元件，該表面入射型固體攝像元件包括具有感應區域之半導體基板、及排列於半導體基板之主面上之複數個電極墊，且將半導體基板之主面側設為受光面側(例如參照專利文獻1)。亦已知有所謂背面入射型固體攝像元件，該背面入射型固體攝像元件包括具有感應區域之半導體基板、及排列於半導體基板之主面上之複數個電極墊，且將半導體基板之主面之背面側設為受光面側(例如參照專利文獻2)。
先前技術文獻 專利文獻
專利文獻1：日本專利特開平10-107255號公報
專利文獻2：日本專利特開平06-045574號公報
於上述表面入射型之固體攝像元件與背面入射型之固體攝像元件中，與載置固體攝像元件之載置構件(例如配線基板等)相對向之面為相反，且排列於半導體基板之主面上之複數個電極墊之配置亦為相反。於將表面入射型固體攝像元件與背面入射型固體攝像元件載置於相同構造之載 置構件之情形時，電性連接於固體攝像元件之電極墊之載置構件之輸出端子之配置亦為相反。因此，需要配合載置構件之輸出端子之配置而準備2種經由載置構件而連接於固體攝像元件之外部電路(例如驅動電路等)。
為了使外部電路於表面入射型固體攝像元件與背面入射型固體攝像元件共用化，需要於表面入射型固體攝像元件與背面入射型固體攝像元件將輸出端子之配置設為相同。因此，必需準備表面入射型固體攝像元件用載置構件與背面入射型固體攝像元件用載置構件。無論如何，必需準備2種外部電路或載置構件等，從而外部電路或載置構件等之成本及準備時間增加。
本發明之目的在於提供一種可容易地削減外部電路或載置構件等之成本及準備時間之固體攝像元件及固體攝像元件之安裝構造。
自一觀點而言，本發明係一種固體攝像元件，其包括：半導體基板，其具有光感應區域；複數個第一電極墊，其排列於半導體基板之主面上；複數個第二電極墊，其於半導體基板之主面上，排列於沿著排列有複數個第一電極墊之方向之方向上；及複數根配線，其1對1地連接複數個第一電極墊與複數個第二電極墊；且複數根配線連接處於相對於與複數個第一及第二電極墊之排列方向正交之中心線成線對稱之位置關係之第一電極墊與第二電極墊。
於本發明中，通過上述配線而連接處於相對於與複數個 第一及第二電極墊之排列方向正交之中心線成線對稱之位置關係之第一電極墊與第二電極墊。因此，即便使主面與該主面之背面反轉，通過配線而相互連接之第一電極墊與第二電極墊之位置於各電極墊之排列方向上亦為相同。
於使主面與載置構件相對向地載置該固體攝像元件之情形時、與使主面之背面與載置構件相對向地載置該固體攝像元件之情形時，電性連接於第一電極墊或第二電極墊之載置構件之端子之位置關係未反轉。該結果為無需準備2種驅動電路等外部電路，又，亦無需準備2種載置構件。因此，於本發明中，可容易地削減外部電路或載置構件等之成本及準備時間。
複數個第一電極墊亦可位於較複數個第二電極墊更靠近半導體基板之邊緣。於該情形時，使主面之背面與載置構件相對向地載置固體攝像元件時，藉由打線接合(wire bonding)向各第一電極墊之連接變得容易。
自另一觀點而言，本發明係一種固體攝像元件，其包括：半導體基板，其具有光感應區域且呈矩形形狀；複數個第一電極墊，其於半導體基板之主面上，排列於沿著半導體基板之一條邊之第一方向上；複數個第二電極墊，其於半導體基板之主面上排列於第一方向上；及複數根配線，其1對1地連接複數個第一電極墊與複數個第二電極墊；且複數根配線連接處於複數個第一電極墊之第一方向上之排列順序、與複數個第二電極墊之與第一方向相反之第二方向上之排列順序為相同順序關係之第一電極墊與第 二電極墊。
於本發明中，處於複數個第一電極墊之第一方向上之排列順序、與複數個第二電極墊之第二方向上之排列順序為相同順序關係之第一電極墊與第二電極墊係通過上述配線而連接。因此，即便使半導體基板之主面與該主面之背面反轉，通過配線而相互連接之第一電極墊與第二電極墊之位置於各電極墊之排列順序亦為相同。
於使主面與載置構件相對向地載置該固體攝像元件之情形時、與於使主面之背面與載置構件相對向地載置該固體攝像元件之情形時，電性連接於第一電極墊或第二電極墊之載置構件之端子之位置關係未反轉。該結果為無需準備2種驅動電路等外部電路，又，亦無需準備2種載置構件。因此，於本發明中，可容易地削減外部電路或載置構件等之成本及準備時間。
複數個第一電極墊亦可較複數個第二電極墊位於更靠近半導體基板之上述一邊。於該情形時，使主面之背面與載置構件相對向地載置固體攝像元件時，藉由打線接合向各第一電極墊之連接變得容易。
半導體基板中，既可將主面側設為受光面側，又，半導體基板中，亦可將主面之背面側設為受光面側。於將主面側設為受光面側之情形時，表面入射型固體攝像元件得以實現。於將主面之背面側設為受光面側之情形時，背面入射型固體攝像元件得以實現。
自又一觀點而言，本發明係一種固體攝像元件之安裝構 造，其包括：上述固體攝像元件；及載置構件，其載置固體攝像元件，且於主面上配置有複數個第三電極墊；且固體攝像元件係以固體攝像元件之主面之背面與載置構件之主面相對向之方式載置於載置構件上，且複數個第一電極墊與複數個第三電極墊藉由打線接合而連接。
又，自另一觀點而言，本發明係一種固體攝像元件之安裝構造，其包括：上述固體攝像元件；及載置構件，其載置固體攝像元件，且於主面上配置有複數個第三電極墊；且固體攝像元件係以固體攝像元件之主面與載置構件之主面相對向之方式載置於載置構件上，且複數個第二電極墊與複數個第三電極墊係藉由覆晶接合(flip chip bonding)而連接。
又，自另一觀點而言，本發明係一種固體攝像元件之安裝構造，其包括：上述固體攝像元件；及載置構件，其載置固體攝像元件，且於主面上配置有複數個第三電極墊；且固體攝像元件係以固體攝像元件之主面與載置構件之主面之背面相對向之方式載置於載置構件上，且複數個第一電極墊與複數個第三電極墊係藉由打線接合而連接。
於任一之固體攝像元件之安裝構造中，均如上所述，無需準備2種外部電路或載置構件等。因此，於本發明中，可容易地削減外部電路或載置構件等之成本及準備時間。
根據本發明，可提供一種可容易地削減外部電路或載置構件等之成本及準備時間之固體攝像元件及固體攝像元件 之安裝構造。
以下，參照隨附圖式，詳細地說明本發明之較佳之實施形態。再者，於說明中，於相同要素或具有相同功能之要素使用相同符號，並省略重複之說明。
首先，參照圖1及圖2，說明本實施形態之表面入射型固體攝像元件IS1之構成。圖1係表示本實施形態之表面入射型固體攝像元件之平面圖。圖2係說明本實施形態之表面入射型固體攝像元件之剖面構成之圖。
表面入射型固體攝像元件IS1係如圖1及圖2所示，包括半導體基板1、複數個第一電極墊10、複數個第二電極墊12、及複數根配線14。固體攝像元件IS1係所謂FI(Front-Illuminated，表面入射型)-CCD(Charge Coupled Device，電荷耦合元件)影像感測器。於圖2中，省略配線14之圖示。
半導體基板1於俯視時呈矩形形狀，且具有構成半導體基板1之邊緣之4邊2a~2d。半導體基板1包含相互對向之主面1a、1b。半導體基板1具有形成於主面1a側之光感應區域(攝像區域)3。於光感應區域3中，形成有包含複數個垂直移位暫存器(省略圖示)之攝像用CCD作為像素。固體攝像元件IS1係將主面1a側設為受光面側。圖1係自受光面(主面1a)側觀察固體攝像元件IS1之平面圖。
入射至光感應區域3之光學影像被轉換為二維電荷圖案(charge pattern)，電荷藉由垂直移位暫存器而沿垂直方向 傳送。於光感應區域3之電荷傳送方向之終端設置有水平移位暫存器(省略圖示)。於垂直方向上傳送而來之各像素之電荷係藉由水平移位暫存器而沿水平方向依序傳送。作為CCD之電荷傳送方式，已知有幀傳送方式、交錯傳送方式、或全幀傳送方式等。
各第一電極墊10係配置於半導體基板1之主面1a上。各第一電極墊10係以夾隔光感應區域3之方式分別設置於靠近對向之二條邊2a、2b之區域。於本實施形態中，於靠近各邊2a、2b之區域分別設置有12個第一電極墊10。即，設置有24個第一電極墊10。各第一電極墊10係排列於沿著半導體基板1之邊2a、2b之方向上。第一電極墊10呈矩形形狀。
各第二電極墊12亦配置於半導體基板1之主面1a上。各第二電極墊12與第一電極墊10同樣地分別設置於靠近上述二條邊2a、2b之區域，且排列於沿著半導體基板1之邊2a、2b之方向上。於本實施形態中，於靠近各邊2a、2b之區域分別設置有12個第二電極墊12。即，設置有24個第二電極墊12。第二電極墊12呈圓形狀。第一電極墊10位於較第二電極墊12更靠近半導體基板1之邊緣、即靠近邊2a、2b之位置。
第一電極墊10與第二電極墊12係呈鋸齒狀地配置。各第一電極墊10與各第二電極墊12分別包含：用以向於垂直方向上傳送電荷之電荷傳送電極施加傳送電壓之電極墊、用以向於水平方向上傳送電荷之電荷傳送電極施加傳送電壓 之電極墊、用以將半導體基板1接地(ground)連接之電極墊、用以讀出於水平方向上傳送之電荷之電極墊、用以提取輸出之電極墊、及用以進行測試動作之電極墊等。
各配線14係如圖1所示，設置於半導體基板1上，且1對1地連接第一電極墊10與第二電極墊12。各配線14連接處於相對於中心線1成線對稱之位置關係之第一電極墊10與第二電極墊12，該中心線1與第一及第二電極墊10、12之排列方向正交。即，於第一電極墊10之沿著邊2a(或邊2b)之第一方向(例如自邊2c朝向邊2d之方向)上之排列順序、及與上述第一方向相反之第二方向(例如自邊2d朝向邊2c之方向)上之排列順序中，各配線14連接處於相同順序關係之第一電極墊10與第二電極墊12。於圖1中，省略電性連接光感應區域3與各電極墊10、12之配線之圖示。
繼而，參照圖3及圖4，說明本實施形態之背面入射型固體攝像元件IS2之構成。圖3係表示本實施形態之背面入射型固體攝像元件之平面圖。圖4係說明本實施形態之背面入射型固體攝像元件之剖面構成之圖。於圖4中，省略配線14之圖示。
背面入射型固體攝像元件IS2係如圖3及圖4所示，與固體攝像元件IS1同樣地包括半導體基板1、複數個第一電極墊10、複數個第二電極墊12、及複數根配線14。固體攝像元件IS2係所謂BT(Back-Thinned，背面入射型)-CCD影像感測器。
半導體基板1係藉由自主面1b側對中央區域以KOH水溶 液等進行蝕刻，而得以薄型化。藉由該薄型化，於半導體基板1之中央區域且主面1b側形成有凹部。於半導體基板1之凹部之周圍存在厚於凹部之框部。框部亦可藉由蝕刻除去，藉此亦可將固體攝像元件IS2製成半導體基板1之整個區域經薄膜化之BT-CCD影像感測器。
固體攝像元件IS2係將主面1b側設為受光面側。圖3係自受光面之背面(主面1a)側觀察固體攝像元件IS2之平面圖。於圖3中，與圖1同樣地省略電性連接光感應區域3與各電極墊10、12之配線之圖示。
於固體攝像元件IS2中同樣地，各配線14係如圖3所示，連接處於相對於中心線1成線對稱之位置關係之第一電極墊10與第二電極墊12，該中心線1與第一及第二電極墊10、12之排列方向正交。因此，如圖5所示，自受光面(主面1b)側透視固體攝像元件IS2時，固體攝像元件IS2之各第一電極墊10之排列方向上之位置(排列順序)係與於固體攝像元件IS1中通過配線14連接於相對應之第一電極墊10之第二電極墊12之排列方向上之位置(排列順序)相同。同樣地，自受光面(主面1b)側透視固體攝像元件IS2時，固體攝像元件IS2之各第二電極墊12之排列方向上位置(排列順序)係與於固體攝像元件IS1中通過配線14連接於相對應之第二電極墊12之第一電極墊10之排列方向上之位置(排列順序)相同。
繼而，參照圖6及圖7，說明載置固體攝像元件IS1、IS2之載置構件20之構成。圖6係表示本實施形態之載置構件 之平面圖。圖7係說明本實施形態之載置構件之剖面構成之圖。
載置構件20係所謂封裝體，包括俯視時為矩形形狀之基板21。基板21包含相互對向之主面21a、21b。於基板21中，於其主面21a上之特定位置配置有複數個電極墊23、24。於基板21之內部配置有內部配線25，於基板21之側面配置有外部端子26。
各電極墊23係配置於基板21之主面21a上且載置預定區域22之內側。此處，載置預定區域22係載置固體攝像元件IS1、IS2之區域，呈位於俯視時為矩形形狀之基板21之大致中央的矩形形狀。電極墊23係遍佈載置預定區域22之周緣部而呈一行地排列。電極墊23係連接於背面入射型固體攝像元件IS2之第二電極墊12。電極墊23之位置係與載置之固體攝像元件IS2之第二電極墊12之排列位置相對應。電極墊23呈圓形狀。
各電極墊24係配置於基板21之主面21a上且載置預定區域22之外側。即，各電極墊24係於載置預定區域22之外側呈一行地排列。電極墊24設置有與電極墊23相同數量。電極墊24係連接於表面入射型固體攝像元件IS1之第一電極墊10。電極墊24之位置係與載置之固體攝像元件IS1之第一電極墊10之排列位置相對應。電極墊23、24係使用金屬等導電性材料，藉由印刷或濺鍍等方法而形成。電極墊24呈矩形形狀。
相對應之電極墊23與電極墊24係藉由內部配線25而電性 連接。各內部配線25係電性連接於以自基板21之側面向下方延伸之方式配置之複數個外部端子26。該結果為於相對應之電極墊23與電極墊24中，經由內部配線25及外部端子26而共用之輸入輸出信號得以傳輸。
繼而，參照圖8~圖11，說明使用載置構件20之固體攝像元件IS1、IS2之安裝構造。圖8及圖10係表示本實施形態之固體攝像元件之安裝構造之平面圖。圖9及圖11係說明本實施形態之固體攝像元件之安裝構造之剖面構成之圖。
如圖8及圖9所示，固體攝像元件IS1係以主面1b(主面1a之背面)與載置構件20(基板21)之主面21a相對向之方式載置於載置構件20(基板21之載置預定區域22)。固體攝像元件IS1之半導體基板1與載置構件20之基板21係藉由樹脂(例如環氧系樹脂、胺基甲酸酯系樹脂、矽酮系樹脂、或丙烯酸系樹脂、或使該等複合者等)R而接著。第一電極墊10與電極墊24係藉由打線接合而連接。
如圖10及圖11所示，固體攝像元件IS2係以主面1a與載置構件20(基板21)之主面21a相對向之方式載置於載置構件20(基板21之載置預定區域22)。固體攝像元件IS2之半導體基板1與載置構件20之基板21係藉由樹脂R而接著。第二電極墊12與電極墊23係藉由覆晶接合而連接。
繼而，參照圖12及圖13，說明載置固體攝像元件IS1、IS2之載置構件30之構成。圖12係表示本實施形態之載置構件之平面圖。圖13係說明本實施形態之載置構件之剖面構成之圖。
載置構件30係所謂內插器(interposer)，包括俯視時為矩形形狀之基板31。基板31包含相互對向之主面31a、31b。於基板31中，於主面31a上之特定位置配置有複數個電極墊33、34配置，於主面31b上之特定位置配置有複數個電極墊35。於基板31之內部配置有內部配線36。
載置構件30係配置於封裝體40之收納空間內，且介隔台座41而載置於封裝體40之底部。於封裝體40之框部，於其特定位置配置有複數個電極墊43。於封裝體40之框部內配置有內部配線45，於封裝體40之側面配置有外部端子46。相對應之電極墊43與外部端子46係藉由內部配線45而電性連接。電極墊43係使用金屬等導電性材料，藉由印刷或濺鍍等方法而形成。封裝體40包括與載置構件30相對向地配置之窗部(省略圖示)。亦可代替台座41使用珀爾帖(Peltier)元件。
各電極墊33係配置於基板31之主面31a上且載置預定區域32之外側。此處，載置預定區域32係載置固體攝像元件IS1、IS2之區域，呈位於俯視時為矩形形狀之基板31之大致中央的矩形形狀。各電極墊33係於載置預定區域32之外側呈一行地排列。電極墊33係連接於表面入射型固體攝像元件IS1之第一電極墊10。電極墊33之位置與載置之固體攝像元件IS1之第一電極墊10之排列位置相對應。
各電極墊34係配置於基板31之主面31a上且載置構件30之緣部。電極墊34係沿載置構件30之緣部呈一行地排列。電極墊34係藉由打線接合連接於封裝體40之電極墊43。電 極墊34之位置與封裝體40之電極墊43之排列位置相對應。電極墊34設置有與電極墊43相同數量。
各電極墊35係配置於基板31之主面31b上且與載置預定區域32相對應之區域之內側。各電極墊35係呈一行地排列於與載置預定區域32相對應之區域之內側。電極墊35係設置有與電極墊33相同數量，並且亦與電極墊34為相同數量。電極墊35係連接於背面入射型固體攝像元件IS2之第二電極墊12。電極墊35之位置與載置之固體攝像元件IS2之第二電極墊12之排列位置相對應。電極墊33、34、35係使用金屬等導電性材料，藉由印刷或濺鍍等方法而形成。
於載置構件30中，形成有用以藉由打線接合連接固體攝像元件IS2之第二電極墊12與電極墊35之貫通孔37。貫通孔37係沿著電極墊35之排列而形成。貫通孔37係形成於使載置於載置構件30之固體攝像元件IS2之第二電極墊12臨向貫通孔37之位置。
相對應之電極墊33、電極墊34及電極墊35係藉由內部配線36而電性連接。該結果為於相對應之電極墊33與電極墊35中，經由內部配線36、電極墊35、接合線(bonding wire)、電極墊43、內部配線45、及外部端子26而共用之輸入輸出信號得以傳輸。
繼而，參照圖14~圖17，說明使用載置構件30之固體攝像元件IS1、IS2之安裝構造。圖14及圖16係表示本實施形態之固體攝像元件之安裝構造之平面圖。圖15及圖17係說明本實施形態之固體攝像元件之安裝構造之剖面構成之 圖。
如圖14及圖15所示，固體攝像元件IS1係以主面1b(主面1a之背面)與載置構件30(基板31)之主面31a相對向之方式載置於載置構件30(基板31之載置預定區域32)。固體攝像元件IS1之半導體基板1與載置構件30之基板31係藉由樹脂而接著。第一電極墊10與電極墊33係藉由打線接合而連接。
如圖16及圖17所示，固體攝像元件IS2係以主面1a與載置構件30(基板31)之主面31a相對向之方式載置於載置構件30(基板31之載置預定區域32)。固體攝像元件IS2之半導體基板1與載置構件30之基板31係藉由樹脂而接著。第二電極墊12與電極墊35係通過貫通孔37藉由打線接合而連接。
如上所述，於本實施形態中，通過配線14連接處於相對於中心線1成線對稱之位置關係之第一電極墊10與第二電極墊12，該中心線1與複數個第一及第二電極墊10、12之排列方向正交。即，處於複數個第一電極墊10之沿著邊2a、2b之第一方向上之排列順序、與複數個第二電極墊12之沿著邊2a、2b之第二方向上之排列順序為相同順序關係之第一電極墊10與第二電極墊12係通過配線14而連接。因此，即便使主面1a與主面1b反轉，通過配線14而相互連接之第一電極墊10與第二電極墊12之位置於各電極墊10、12之排列方向上亦為相同。
於使固體攝像元件IS1之主面1b與載置構件20、30相對向地載置之情形時、與於使固體攝像元件IS2之主面1a與 載置構件20、30相對向地載置之情形時，電性連接於第一電極墊10或第二電極墊12之載置構件20之外部端子26、及載置構件30之電極墊34及封裝體40之外部端子46之位置關係未反轉。該結果為無需預先準備2種驅動電路等之外部電路，且亦無需預先準備2種載置構件20、30。因此，於本實施形態中，可容易地削減外部電路或載置構件等之成本及準備時間。
於本實施形態中，複數個第一電極墊10位於較複數個第二電極墊12更靠近半導體基板1之邊緣之位置。即，複數個第一電極墊10位於較複數個第二電極墊12更靠近半導體基板1之邊2a、2b之位置。藉此，使主面1b與載置構件20、30相對向地載置固體攝像元件IS1時，藉由打線接合對各第一電極墊10之連接變得容易。
以上說明了本發明之較佳之實施形態，但本發明並非必須限定於上述實施形態，可於不脫離其主旨之範圍內進行各種變更。
第一及第二電極墊10、12係以夾隔光感應區域3之方式分別配置於靠近相對向之二條邊2a、2b之區域，但並不限定於此。例如，第一及第二電極墊10、12亦可設置於靠近二條邊2a、2b中之一條邊2a或2b之區域。
第一及第二電極墊10、12之數量及排列數亦不限定於上述實施形態所揭示者。第一及第二電極墊10、12無需呈鋸齒狀地配置，既可呈一行地配置，亦可呈並列地配置。
產業上之可利用性
本發明可利用於表面入射型或背面入射型固體攝像元件及其安裝構造。
1‧‧‧半導體基板
1a‧‧‧主面
1b‧‧‧主面
2a‧‧‧邊
2b‧‧‧邊
2c‧‧‧邊
2d‧‧‧邊
3‧‧‧光感應區域
10‧‧‧第一電極墊
12‧‧‧第二電極墊
14‧‧‧配線
20‧‧‧載置構件
21a‧‧‧主面
21b‧‧‧主面
22‧‧‧載置預定區域
23‧‧‧電極墊
24‧‧‧電極墊
25‧‧‧內部配線
26‧‧‧外部端子
30‧‧‧載置構件
31‧‧‧基板
31a‧‧‧主面
31b‧‧‧主面
32‧‧‧載置預定區域
33‧‧‧電極墊
34‧‧‧電極墊
35‧‧‧電極墊
36‧‧‧內部配線
37‧‧‧貫通孔
40‧‧‧封裝體
41‧‧‧台座
43‧‧‧電極墊
45‧‧‧內部配線
46‧‧‧外部端子
IS1‧‧‧固體攝像元件
IS2‧‧‧固體攝像元件
1‧‧‧中心線
R‧‧‧樹脂
圖1係表示本實施形態之表面入射型固體攝像元件之平面圖。
圖2係說明本實施形態之表面入射型固體攝像元件之剖面構成之圖。
圖3係表示本實施形態之背面入射型固體攝像元件之平面圖。
圖4係說明本實施形態之背面入射型固體攝像元件之剖面構成之圖。
圖5係用以說明本實施形態之背面入射型固體攝像元件之第一及第二電極墊之透視平面圖。
圖6係表示本實施形態之載置構件之平面圖。
圖7係說明本實施形態之載置構件之剖面構成之圖。
圖8係表示本實施形態之固體攝像元件之安裝構造之平面圖。
圖9係說明本實施形態之固體攝像元件之安裝構造之剖面構成之圖。
圖10係表示本實施形態之固體攝像元件之安裝構造之平面圖。
圖11係說明本實施形態之固體攝像元件之安裝構造之剖面構成之圖。
圖12係表示本實施形態之載置構件之平面圖。
圖13係說明本實施形態之載置構件之剖面構成之圖。
圖14係表示本實施形態之固體攝像元件之安裝構造之平面圖。
圖15係說明本實施形態之固體攝像元件之安裝構造之剖面構成之圖。
圖16係表示本實施形態之固體攝像元件之安裝構造之平面圖。
圖17係說明本實施形態之固體攝像元件之安裝構造之剖面構成之圖。
1‧‧‧半導體基板
1a‧‧‧主面
2a‧‧‧邊
2b‧‧‧邊
2c‧‧‧邊
2d‧‧‧邊
3‧‧‧光感應區域
10‧‧‧第一電極墊
12‧‧‧第二電極墊
14‧‧‧配線
IS1‧‧‧固體攝像元件
1‧‧‧中心線

Claims (9)

  1. 一種固體攝像元件，其包括：半導體基板，其具有光感應區域；複數個第一電極墊，其排列於上述半導體基板之主面上；複數個第二電極墊，其於上述半導體基板之上述主面上，排列於沿著上述複數個第一電極墊排列之方向之方向上；及複數根配線，其1對1地連接上述複數個第一電極墊與上述複數個第二電極墊；且上述複數根配線連接處於相對於與上述複數個第一及第二電極墊之排列方向正交之中心線成線對稱之位置關係之上述第一電極墊與上述第二電極墊。
  2. 如請求項1之固體攝像元件，其中上述複數個第一電極墊位於較上述複數個第二電極墊更靠近上述半導體基板之邊緣。
  3. 一種固體攝像元件，其包括：半導體基板，其具有光感應區域，且呈矩形形狀；複數個第一電極墊，其於上述半導體基板之主面上，排列於沿著上述半導體基板之一條邊之第一方向上；複數個第二電極墊，其於上述半導體基板之上述主面上，排列於上述第一方向上；及複數根配線，其1對1地連接上述複數個第一電極墊與上述複數個第二電極墊；且 上述複數根配線連接處於上述複數個第一電極墊之上述第一方向上之排列順序、與上述複數個第二電極墊之與上述第一方向相反之第二方向上之排列順序為相同順序關係之上述第一電極墊與上述第二電極墊。
  4. 如請求項3之固體攝像元件，其中上述複數個第一電極墊位於較上述複數個第二電極墊更靠近上述半導體基板之上述一條邊。
  5. 如請求項1至4中任一項之固體攝像元件，其中上述半導體基板以其上述主面側為受光面側。
  6. 如請求項1至4中任一項之固體攝像元件，其中上述半導體基板以其上述主面之背面側為受光面側。
  7. 一種固體攝像元件之安裝構造，其包括：如請求項5之固體攝像元件；及載置構件，其載置上述固體攝像元件，且於主面上配置有複數個第三電極墊；且上述固體攝像元件係以上述固體攝像元件之上述主面之背面與上述載置構件之上述主面相對向之方式載置於上述載置構件，且上述複數個第一電極墊與上述複數個第三電極墊藉由打線接合而連接。
  8. 一種固體攝像元件之安裝構造，其包括：如請求項6之固體攝像元件；及載置構件，其載置上述固體攝像元件，且於主面上配置有複數個第三電極墊；且 上述固體攝像元件係以上述固體攝像元件之上述主面與上述載置構件之上述主面相對向之方式載置於上述載置構件上，且上述複數個第二電極墊與上述複數個第三電極墊藉由覆晶接合而連接。
  9. 一種固體攝像元件之安裝構造，其包括：如請求項6之固體攝像元件；及載置構件，其載置上述固體攝像元件，且於主面上配置有複數個第三電極墊；且上述固體攝像元件係以上述固體攝像元件之上述主面與上述載置構件之上述主面之背面相對向之方式載置於上述載置構件上，且上述複數個第二電極墊與上述複數個第三電極墊藉由打線接合而連接。
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