TWI544293B - Apparatus for amending tilt of mask and substrate processing apparatus - Google Patents

Description

Apparatus for correcting the inclination of a reticle and a substrate processing apparatus

The present invention relates to an apparatus and substrate processing apparatus for correcting the tilt angle of a reticle, and more particularly to an apparatus for correcting the tilt angle of a reticle for patterning a substrate by using a laser beam, The apparatus for correcting the tilt angle of the reticle is applied to a substrate processing apparatus.

According to the materials and processes of the organic electroluminescence device, the organic electroluminescence display device can be classified into a polymer device using a wet process and a low molecular device using a deposition process. In the case of the inkjet printing method among the methods of patterning the polymer light-emitting layer or the low molecular light-emitting layer, the organic layer other than the light-emitting layer is limited in material, and it is inconvenient to form a spray on the substrate. The structure of ink printing. Moreover, when the light-emitting layer is patterned by a deposition process, it is difficult to manufacture a large device due to the use of the metal mask.

As an alternative to the patterning method, a laser induced thermal imaging (LITI) method is used. The LITI method is defined as such a The method wherein the laser beam generated from the light source is converted into thermal energy, and then the material used to form the pattern is transferred to the substrate due to thermal energy to form a pattern on the substrate. To this end, the donor film has a structure in which the substrate as the acceptor is completely covered by the donor film, and the donor film and the substrate are fixed to the stage. The donor film and the substrate are further attached to each other by a lamination process, and then transferred to the substrate by using a laser beam to completely pattern the substrate. That is, when the laser is irradiated onto the donor film or donor substrate on which the luminescent layer was previously formed, the luminescent layer is separated from the donor film or donor substrate and subsequently transferred to the acceptor substrate to form Picture.

1 is a view of a substrate processing apparatus using a laser beam.

A substrate processing apparatus 10 using a laser beam includes a laser source 300 for generating a laser beam, a projection lens 400 disposed below the laser source 300, and a reticle M The mask M is disposed between the laser source 300 and the projection lens 400 and transmits a pattern by using the laser beam L. However, when the reticle M is replaced by a new reticle, the laser beam has a change in focus and position on the substrate. When replacing the reticle, the reticle can vary in height, tilt, position, etc., and thus the laser beam can also vary in focus and position on the substrate. Since the focus and position of the laser beam vary due to the replacement of the reticle, the substrate processing process may not perform the substrate processing smoothly.

[Prior Art Literature] [Patent Literature]

Korean Patent Publication No. 2012-0042144

The present invention provides an apparatus for correcting the tilt angle to prevent a change in the focus and position of the laser beam even in the case of replacing the reticle.

The present invention also provides a substrate processing apparatus capable of stably processing a substrate even in the case of replacing a photomask.

According to an exemplary embodiment, an apparatus for correcting an inclination of a reticle includes: a reticle support body configured to support a reticle having a pattern formed thereon; a reticle support body moving unit, The reticle support body moving unit is configured to change an inclination of an XY plane of the reticle support body; the camera unit photographs a laser beam passing through a substrate disposed on the substrate support to generate a laser beam a penetrating image; and a control unit configured to control the reticle support body moving unit, thereby changing an inclination of the XY plane of the reticle such that when the laser beam penetration image deviates from the reference focus image The laser beam penetration image is matched to the reference focus image.

The reticle support body may include: a reticle holder having a central portion penetrating frame shape, the reticle holder having first, second, third, and fourth vertices, wherein The reticle is placed on the reticle holder and the XY plane of the reticle holder varies in tilt angle; the reticle state configured to support the reticle holder on the top surface thereof; A tilt change module configured to individually adjust a Z-axis height of a apex of the reticle holder to change an inclination of the XY plane.

The inclination change module may include: a height adjustment portion, the height The adjustment portion is configured to enable the Z-axis heights of the first, second, and third vertices of the reticle holder to be individually raised or lowered; and to support a body configured to hold the reticle holder The fourth vertex is connected to the reticle stage.

The height adjustment portion may include: a first height adjustment portion configured to enable a Z-axis height of the first apex of the reticle holder to be raised or lowered; a second height adjustment portion, The second height adjustment portion is configured to enable the Z-axis height of the second apex of the reticle holder to be raised or lowered; and a third height adjustment portion configured to cause the reticle holder The Z-axis height of the third vertex can be raised or lowered.

According to another exemplary embodiment, a substrate processing apparatus includes: a chamber having an inner space in which a substrate is patterned; a substrate support disposed in the inner space to support the substrate; a laser source configured to generate a laser beam; a reticle supporting body disposed between the laser source and the substrate support to support a mask formed thereon a reticle supporting body moving unit, the reticle supporting body moving unit configured to change an inclination of an XY plane of the reticle support body; a camera unit configured to pass through a substrate disposed on the substrate support Photographing a laser beam to produce a laser beam penetration image; and a control unit configured to control the reticle support body moving unit, thereby changing the tilt angle of the XY plane of the reticle to enable The laser beam penetration image matches the reference focus image when the beam penetration image deviates from the reference focus image.

1‧‧‧rail

2‧‧‧ platform

10‧‧‧Substrate processing equipment

100‧‧‧ chamber

200‧‧‧Substrate support

300‧‧‧Laser source

350‧‧‧Mirror

400‧‧‧Projection lens

500‧‧‧Photomask support body

510‧‧‧Photomask Holder

Edge of 510a‧‧

520‧‧‧Dip Change Module

521‧‧‧Support subject

522, 522a, 522b, 522c‧‧‧ height adjustment section

530‧‧‧Photomask stage

600‧‧‧Control unit

700‧‧‧Photomask support body mobile unit

800‧‧‧ camera unit

M‧‧‧Photo Mask

L‧‧‧Laser beam

W‧‧‧Substrate

The exemplary embodiments can be understood in more detail from the following description taken in conjunction with the accompanying drawings in which: FIG. 1 is a view of a substrate processing apparatus using a laser beam.

FIG. 2 is a view illustrating a configuration of a substrate processing apparatus according to an exemplary embodiment.

3 is a coupling diagram of a reticle support body, in accordance with an exemplary embodiment.

4 is an exploded view of a reticle support body, in accordance with an exemplary embodiment.

FIG. 5 is a view illustrating an example in which a reticle stage moving portion is implemented as a linear motor (LM) guide, according to an exemplary embodiment.

(a) and (b) of FIG. 6 are views illustrating a state in which the height adjusting portion is adjusted in the Z-axis length so that the first vertex of the reticle holder can be raised in the Z-axis direction.

(a) and (b) of FIG. 7 are views illustrating a state in which the height adjusting portion is adjusted in the Z-axis length so that the third vertex of the reticle holder can be raised in the Z-axis direction.

Specific embodiments will be described in detail below with reference to the accompanying drawings. However, the invention may be embodied in different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and will be The same reference in the full text Reference numerals refer to the same components.

FIG. 2 is a view illustrating a configuration of a substrate processing apparatus according to an exemplary embodiment.

In the substrate processing apparatus 10, a laser beam generated from the laser source 300 passes through the reticle M and is irradiated onto the substrate W. Here, the light-emitting layer of the donor film formed on the substrate W is separated and then the substrate W is patterned to form a pixel. To this end, the substrate processing apparatus 10 includes a chamber 100, a substrate support 200, a laser source 300, a reticle support body 500, a reticle support body moving unit 700, a camera unit 800, and a control unit 600.

Although the chamber 100 has a rectangular box shape with an internal space, the invention is not limited thereto. For example, the chamber can have a variety of container shapes. That is, the chamber 100 may have a cylindrical shape or a polygonal box shape. The substrate disposed in the internal space is patterned to form a pixel. An inlet for loading/unloading the substrate is defined in each of one side surface and the other side surface of the chamber. Here, at least one inlet is connected to the substrate transfer module.

A projection lens 400 is disposed on the top surface of the chamber 100 to capture a laser beam that is illuminated from the laser source 300, thereby emitting the laser beam onto the substrate on the substrate support. Although the projection lens 400 is disposed on the top surface of the chamber 100, the invention is not limited thereto. For example, the projection lens 400 may be disposed in a laser beam irradiation passage having an upper portion that penetrates the outside or the inside of the chamber 100.

The substrate support 200 is disposed in the inner space of the chamber 100 to support the base The board W is such that the pixel area of the substrate W faces the upper side. Moreover, the substrate support 200 moves horizontally and raises the substrate W. The substrate support 200 may be attached to a cylinder as a unit for providing an elevating force. The substrate W is placed on the substrate support 200. Here, the donor film is laminated on the top surface of the substrate (ie, the surface to be patterned) (hereinafter referred to as "patterned surface").

The laser source 300 irradiates the laser beam onto the pattern surface of the substrate W through the opening of the patterned mask M. The substrate processing apparatus may further include a mirror 350. The laser beam emitted from the laser source 300 is reflected by the mirror 350 and then irradiated onto the reticle M. The laser beam can partially heat a smaller area than the open area of the reticle M. Gas lasers, such as argon lasers, krypton lasers, excimer lasers, etc., ie, lasers using a medium in which krypton, xenon, chrome, titanium, tantalum, niobium, tantalum and niobium At least one of them is added to single crystal yttrium aluminum garnet, bismuth vanadate, magnesium silicate (Mg ₂ SiO ₄ ), YAlO 3 , GdVO ₄ or polycrystalline (ceramic) yttrium aluminum garnet, yttrium oxide, yttrium vanadate, YAlO3, GdVO4 as a dopant, or at least one of a glass laser, a ruby laser, a purple emerald laser, a titanium sapphire laser, a copper vapor laser, and a gold vapor laser can be used A laser source 300 is used. The laser beam can be provided as a linear beam that can be easily collected and immediately illuminated onto the entire surface of the substrate as compared to a planar beam having a relatively wide area.

The reticle M may be a light control unit for selectively blocking or reflecting a laser beam that is illuminated from the laser source 300. The reticle M has a pattern having an opening through which a laser beam passes; and a blocking portion for blocking or reflecting the laser beam. Since the deposition material does not pass through the opening of the mask M, unlike the deposition mask, The mask M can have a relatively thick thickness. Therefore, since the reticle M has a relatively thick thickness, the reticle can prevent the laser beam from being diffracted without being easily affected by heat. Moreover, the mask M may be formed of a material capable of withstanding irradiation of a laser beam, for example, a high melting point material such as tungsten, tantalum, chromium, nickel or molybdenum, an alloy of the above; or a metal material having a low coefficient of thermal expansion, The metal material is not easily deformed by heat, for example, stainless steel, inconel, Hastelloy, and the like. Moreover, the photomask M may be formed of a material having the same coefficient of thermal expansion as that of the material for the donor film attached to the substrate W. This is to prevent the mask M and the donor film from being misaligned with each other by expanding the mask M and the donor film with the same coefficient of thermal expansion even if the mask M is heated.

The substrate processing apparatus 10 includes a reticle tilt correction means for correcting the focus and position of the reticle M to a reference value when the reticle M is replaced. The reticle tilt correction device for correcting the focus and position of the reticle M to the reference value includes the reticle support body 500, the reticle support body moving unit 700, the camera unit 800, and the control unit 600.

The reticle support body 500 is disposed between the laser source 300 and the substrate support 200 to support the patterned reticle M. The reticle support body 500 is movable in the X-axis, Y-axis, and Z-axis directions and is rotated by using the reticle support body moving unit 700 including the tilt angle changing module 520 and the reticle stage moving portion. The reticle support body 500 and the reticle stage moving portion will be described with reference to FIGS. 3, 4, and 5.

3 is a coupling view of a reticle support body according to an exemplary embodiment, FIG. 4 is an exploded view of a reticle support body according to an exemplary embodiment, and FIG. 5 is an illustration of light therein according to an exemplary embodiment Cover stage moving part A view that is implemented as an example of a linear motor (LM) guide.

The reticle support body 500 includes a reticle holder 510 supporting the reticle M; a reticle stage 530 for supporting the reticle holder 510; and a tilt variation module 520, which is separately adjusted The Z-axis height of each of the vertices of the reticle holder changes the inclination of the XY plane.

The reticle stage 530 moves in the X-axis and Y-axis directions and is rotated by using the reticle stage moving portion. For example, the reticle stage moving portion can effect movement of the reticle stage 530 in the X-axis and Y-axis directions and rotation of the reticle stage 530. For example, a linear motor (LM) guide can be implemented as a reticle stage moving portion. An example in which the LM guide is implemented as a moving portion of the reticle stage is illustrated in FIG. In the LM guide, the Y-axis transfer platform 2 moves along the LM guide 1, and the reticle stage 530 moves in the X-axis direction along the Y-axis transfer stage 2. Therefore, when the process is performed, the reticle stage 530 is set at an appropriate position by movement in the X-axis and Y-axis directions. Here, the X axis and the Y axis are axes that form a two-dimensional plane. Moreover, the reticle stage 530 may include a separate rotary motor that rotates in a level other than the movement of the X-axis and the Y-axis.

The reticle holder 510 illustrated in Figures 3 and 4 has a frame shape with a central portion of the frame shape being permeable. Here, the edge of the reticle M is located on and supported by the edge 510a of the reticle holder 510. The laser beam passing through the reticle M can pass through the area of the reticle holder, the central portion of which is permeable. Of course, in some cases, a separate fixing unit for supporting and fixing the reticle M may be further provided in the reticle holder 510. Photomask holding The 510 may be implemented as a rectangular frame shape having four vertices, the first vertices being the first vertices, the second vertices, the third vertices, and the fourth vertices. Alternatively, the reticle holder 510 can be implemented as a frame shape having three vertices, five vertices, or six vertices. Hereinafter, a frame shape having four vertices will be described as an example. However, a reticle holder having a number of vertices with fewer or more than four vertices can be provided.

In an exemplary embodiment, the inclination of the XY plane of the reticle holder 510 may vary. The Z-axis height of the apex of the reticle holder can be individually adjusted to change the tilt angle of the XY plane. Accordingly, the tilt variation module 520 is provided to individually adjust the Z-axis height of each of the vertices to change the XY plane. The tilt change module 520 includes height adjustment portions 522, 522a, 522b, and 522c for enabling the Z-axis heights of the first, second, and third vertices of the reticle holder 510 to be individually raised or lowered; The main body 521 is supported, and the support main body 521 connects the fourth vertex of the reticle holder 510 to the reticle stage 530. Each of the height adjustment portions 522 is a motor whose height is variably adjusted in the longitudinal direction along the Z axis in accordance with the stretching operation of the motor. The apexes of the reticle stage 530 and the reticle holder 510 are respectively connected to both ends of the height adjustment portion in the longitudinal direction. The length adjustable height adjustment portion 522 can be implemented by various length adjustment units (eg, linear motors).

The height adjustment portion 522 includes a first height adjustment portion 522a through which the height of the first apex of the reticle holder 510 is raised or lowered in the Z-axis direction; the second height adjustment portion 522b, the reticle holding 510 of the device The height of the two apexes is raised or lowered in the Z-axis direction by the second height adjusting portion 522b; and the third height adjusting portion 522c, the Z-axis height of the third apex of the reticle holder 510 is adjusted by the third height Partially raised or lowered. Each of the height adjustment portions 522 is a motor that is variably adjustable in length in the longitudinal direction. Each of the height adjustment portions 522 has a structure in which each of the apex of the reticle stage 530 and the reticle holder 510 is connected to each of the height adjustment portions 522 in the longitudinal direction. On the end.

The support body 521 is disposed on the fourth apex to support the fourth apex of the reticle holder 510 on the reticle stage 530. The support body 521 can be realized by a spring having a spring force or a metal bar having no elasticity.

Therefore, when the height of a certain vertex is raised or lowered on the Z axis, the inclination of the XY plane of the reticle holder 510 may vary. For example, as shown in (a) and (b) of FIG. 6, the first height adjusting portion 522a disposed on the first vertex extends over the length of the Z axis to lift the mask holder in the Z-axis direction. At the first vertex of 510, the XY plane of the reticle holder 510 has a certain tilt angle at which the first apex is disposed at a height relatively higher than the other vertices. Here, the support body 521 (for example, a spring) disposed on the fourth vertex extends, and thus the second height adjustment portion 522b disposed on the second vertex may also extend at a height corresponding to the height of the fourth vertex . Further, as shown in (a) and (b) of FIG. 7, the third height adjusting portion 522a disposed on the third apex extends over the Z-axis length to lift the reticle holder 510 in the Z-axis direction. At the third vertex, the XY plane of the reticle holder 510 has a certain inclination angle, and the third apex is set at the inclination angle relatively higher than the other The height of the vertices. Here, the spring as the support body 521 disposed on the fourth vertex may extend, and thus the second height adjustment portion 522b disposed on the second vertex may also extend at a height corresponding to the height of the fourth vertex.

Therefore, when the focus of the laser beam changes after the replacement of the mask M, the height adjustment portion 522 disposed at the first, second, and third vertices can be controlled to adjust the inclination of the XY plane of the reticle holder 510 by This restores the focus of the laser beam to its original state. Since the change in the inclination of the XY plane of the reticle holder 510 means a change in the XY plane of the reticle M, the focus of the laser beam passing through the reticle M can be corrected by the change in the inclination of the reticle M. Therefore, even if the reticle is replaced, the reticle can be loaded to a position that is most close to the position previously provided by the reticle.

As shown in FIG. 2, camera unit 800 is provided in an exemplary embodiment to detect a change in focus of the laser beam after replacing the reticle. Camera unit 800 takes a picture of a laser beam passing through a substrate disposed on a substrate support to produce a laser beam penetration image. The camera unit 800 is disposed in a substrate support 200 in a region in which a laser beam is illuminated to capture an image of a laser beam passing through the substrate by using a camera imaging sensor. Thus, camera unit 800 can capture an image of the illuminated laser beam passing through substrate W to produce a laser beam penetration image. An infrared (IR) camera, a near-infrared (NIR) camera, may be implemented as the camera unit 800. Here, a 10x lens, a filter, or the like can be applied to the camera unit 800.

When the laser beam penetration image deviates from the reference focus image, the control unit 600 The control reticle supports the body moving unit 700 to change the inclination of the XY plane of the reticle holder 510 such that the laser beam penetration image matches the reference focus image. The control unit 600 stores a reference focus image concentrated in the memory before replacing the reticle. Since the laser beam is illuminated in a line shape, a state in which the shape of the laser beam has a good contrast can be determined by referring to the focus image. When the laser beam penetration image acquired by capturing the image of the laser beam passing through the substrate after the reticle holder 510 is displaced from the reference focus image, the inclination of the XY plane of the reticle holder 510 is changed to Match the focus to the reference focus. The contrast of the reference focus image can be compared by various methods, such as a method of comparing the thickness of the line and a method of comparing the contrast. The method of comparing the thicknesses of the lines is a method of determining whether the thickness of the line through which the imaged laser beam penetrates the image and the thickness of the line of the reference focus image exceed a critical value. Moreover, the method of comparing contrast is a method of determining whether the contrast of the line of the imaged laser beam that penetrates the image exceeds the critical value of the reference focus image.

When it is determined that the threshold value is deviated, the control unit 600 may correct the inclination of the XY plane with respect to the reticle holder. For example, in the laser beam penetration image and the reference focus image (each of which has a line shape), when the laser beam penetration image has a thickness greater than the reference focus image, the control unit 600 boosts the light. At least one of the first, second, and third vertices of the hood holder 510 is adapted to change the inclination of the XY plane of the reticle holder 510. Similarly, when the laser beam penetration image has a thickness smaller than the reference focus image, the control unit 600 enables at least one of the first, second, and third vertices of the reticle holder 510 to be lowered, thereby The inclination of the XY plane of the reticle holder 510 is changed.

When the laser beam imaging image imaged in the camera unit 800 deviates from the reference position, the control unit 600 may move the reticle stage 530 supporting the reticle holder in the X-axis and Y-axis directions, and make the reticle The stage 530 rotates. That is, when the laser beam penetration image deviates from the previously stored reference position, the control unit 600 controls the reticle stage moving portion to move the reticle stage 530 in the X-axis and Y-axis directions and The reticle stage 530 is rotated such that the laser beam penetration image matches the reference position. The reference position represents position information of the reference focus image based on the plane coordinates of the substrate support. When focusing, positional information of a laser beam having a line shape irradiated onto the substrate is registered as a reference position. Subsequently, when the position of the laser beam deviates from the critical value at the reference position due to replacement of the reticle holder, the control unit moves the reticle stage 530 in the X-axis and Y-axis directions and causes the reticle stage 530 Rotate to adjust the position of the laser beam.

In an exemplary embodiment, the tilt angle of the reticle support body can be adjusted to prevent the focus and position of the laser beam from changing even if the reticle is replaced.

Although the apparatus for correcting the tilt angle and the substrate processing apparatus have been described with reference to the specific embodiments, they are not limited thereto. It will be apparent to those skilled in the art that various modifications and changes can be made without departing from the spirit and scope of the invention as defined by the appended claims.

10‧‧‧Substrate processing equipment

100‧‧‧ chamber

200‧‧‧Substrate support

300‧‧‧Laser source

350‧‧‧Mirror

400‧‧‧Projection lens

500‧‧‧Photomask support body

510‧‧‧Photomask Holder

Edge of 510a‧‧

520‧‧‧Dip Change Module

530‧‧‧Photomask stage

600‧‧‧Control unit

700‧‧‧Photomask support body mobile unit

800‧‧‧ camera unit

M‧‧‧Photo Mask

W‧‧‧Substrate

Claims (13)

An apparatus for correcting a tilt angle of a reticle, characterized in that the apparatus comprises: a reticle support body configured to support a reticle having a pattern having an opening formed thereon; the reticle support body a moving unit, the reticle support body moving unit configured to change an inclination of an XY plane of the reticle support body; a camera unit that is the opening through the pattern of the reticle and Photographing a laser beam passing through a substrate disposed on the substrate support to produce a laser beam penetration image; and a control unit configured to control the reticle support body moving unit, thereby changing The tilt angle of the XY plane of the reticle such that when the laser beam penetration image deviates from a reference focus image, the laser beam penetration image matches the reference focus image . The apparatus of claim 1, wherein the camera unit is disposed in the substrate support. The apparatus of claim 2, wherein the camera unit comprises one of an infrared camera and a near infrared camera. The apparatus of claim 1, wherein the reticle support body comprises: a reticle holder having a central portion penetrating frame shape, the reticle holder having a first Vertex, second vertex, third vertex, and fourth a vertex, wherein the reticle is placed on the reticle holder, and an inclination of the XY plane of the reticle holder is varied; a reticle state, the reticle state configured to support a top thereof a reticle holder on the surface; and a tilt variation module configured to individually adjust a Z-axis height of the apex of the reticle holder to change the XY plane The inclination angle. The apparatus of claim 4, wherein the tilt angle change module comprises: a height adjustment portion configured to cause the first vertex of the reticle holder, the first The Z-axis height of the two vertices and the third apex can be raised or lowered individually; and a support body configured to connect the fourth apex of the reticle holder to the reticle On the stage. The apparatus of claim 5, wherein the height adjustment portion is a motor whose length is variably adjusted in a longitudinal direction thereof, and both ends of the longitudinal direction thereof are respectively connected to the reticle stage And on the apex of the reticle holder. The apparatus of claim 5, wherein the height adjustment portion comprises: a first height adjustment portion configured to cause the first apex of the reticle holder The Z-axis height can be raised or lowered; a second height adjustment portion configured to enable the Z-axis height of the second apex of the reticle holder to be raised or lowered; and a third height adjustment portion, The third height adjustment portion is configured to enable the Z-axis height of the third apex of the reticle holder to be raised or lowered. The apparatus of claim 5, wherein the reticle support body moving unit further comprises a reticle stage moving portion configured to be in the X-axis and the Y-axis direction The reticle stage is moved up and the reticle stage is rotated. The apparatus of claim 8, wherein the reticle stage moving portion is controlled to move in the X-axis and Y-axis directions when the laser beam penetration image deviates from the reference position The reticle stage is rotated and the reticle stage is rotated such that the laser beam penetration image matches the reference position. The apparatus of claim 5, wherein each of the laser beam penetration image and the reference focus image has a line shape, and when the laser beam penetration image has a larger value The control unit enables at least one of the first vertex, the second vertex, and the third vertex of the reticle holder to be raised when the thickness of the reference focus image is referenced. The apparatus of claim 5, wherein each of the laser beam penetration image and the reference focus image has a line shape, and when the laser beam penetration image has a smaller value The control unit causes the first vertex, the second vertex, and the photo of the reticle holder when the thickness of the reference focus image is referenced At least one of the third vertices can be lowered. A substrate processing apparatus characterized by comprising: a chamber having an inner space in which a substrate is patterned; a substrate support, the substrate support being disposed in the inner space to support the substrate; a source of light, the laser source configured to generate a laser beam; a reticle supporting body disposed between the laser source and the substrate support to support thereon having a mask of the open pattern; the reticle supports a body moving unit configured to change an inclination of an XY plane of the reticle support body; a camera unit configured to pass through The opening of the pattern of the reticle and the laser beam passing through the substrate disposed on the substrate support are photographed to generate a laser beam penetration image; and a control unit The control unit is configured to control the reticle support body moving unit, thereby changing the tilt angle of the XY plane of the reticle such that when the laser beam penetrates an image The laser beam penetration image matches the reference focus image when the focus image is tested. The substrate processing apparatus of claim 12, wherein the reticle support body moving unit moves the reticle support body in the X-axis and Y-axis directions and rotates the reticle support.