CN104423146B - For correcting the equipment and matrix treatments equipment at the inclination angle of mask - Google Patents
For correcting the equipment and matrix treatments equipment at the inclination angle of mask Download PDFInfo
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- CN104423146B CN104423146B CN201410412432.3A CN201410412432A CN104423146B CN 104423146 B CN104423146 B CN 104423146B CN 201410412432 A CN201410412432 A CN 201410412432A CN 104423146 B CN104423146 B CN 104423146B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/72—Repair or correction of mask defects
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The present invention provides a kind of equipment for correcting the inclination angle of mask.The equipment includes: mask support main body, is configured to support and forms figuratum mask thereon；Mask support main body mobile unit is configured to change the inclination angle of the X/Y plane of mask support main body；Camera unit is taken pictures for the laser beam across the matrix being arranged on matrix support part, to generate laser beam transmitted image；And control unit, it is configured to control mask support main body mobile unit, thus changes the inclination angle of the X/Y plane of mask, so that when laser beam transmitted image deviates with reference to focus image, laser beam transmitted image and refers to focus images match.
Description
Technical field
The present invention relates to a kind of equipment for correcting the inclination angle of mask, the mask is used to make base by using laser beam
Matter patterning, the equipment application for correcting the inclination angle of mask is in matrix treatments equipment.
Background technique
According to the material and technique of Organnic electroluminescent device, organic electroluminescence display device and method of manufacturing same can be divided into using wet process
The high score sub-device of technique and the low molecule device for using depositing operation.Make polymeric luminescence layer or the luminous layer pattern of low molecule
In the case where ink jet printing method among the method for change, the organic layer other than luminescent layer is restricted on material, and
And it is not easy to form the structure for being used for ink jet printing in matrix.Moreover, when luminescent layer obtains patterning by depositing operation,
Due to metal mask use and be difficult to manufacture large-scale plant.
As the substitute technology of patterning method, laser induced thermal imaging (laser induced thermal is used
Imaging, LITI) method.LITI method is defined as such a method, wherein being converted into from the laser beam that light source generates
Thermal energy, and the material for being subsequently used for forming of pattern is transmitted in matrix to form pattern in matrix due to thermal energy.For this purpose,
Donor film has a configuration that, wherein the matrix as receptor is covered by donor film completely, and donor film and
Matrix is fixed on objective table.Donor film and matrix are further attached to each other by laminating technology, and then by making
It is transmitted in matrix with laser beam so that matrix patterns completely.That is, being previously formed when laser is irradiated to luminescent layer
When on donor film thereon or donor matrix, luminescent layer is separated and is subsequently passed to donor film or donor matrix
To form pixel on receiver substrate.
Fig. 1 is the view using the matrix treatments equipment of laser beam.
Matrix treatments equipment 10 using laser beam includes laser source 300, and the laser source 300 is for generating laser beam；
The lower section of laser source 300 is arranged in projecting lens 400, the projecting lens 400；And mask M, the mask M setting are swashing
Pattern is transmitted between light source 300 and projecting lens 400 and by using laser beam L.However, when mask M is replaced by new mask
When changing, it is varied in terms of focus and position of the laser beam in matrix.When replacing mask, mask can height, inclination angle,
Position etc. etc. is varied, and therefore laser beam can also in matrix focus and position in terms of be varied.By
Change in the focus of laser beam and position because of the replacement of mask, therefore matrix treatments process may execute matrix with can not be successfully
Treatment process.
[existing technical literature]
[patent document]
2012-0042144 Korean patent disclosure
Summary of the invention
The present invention provides a kind of equipment for correcting inclination angle, can prevent laser in the case where replacing mask
The focus of beam and position change.
The present invention also provides a kind of matrix treatments equipment, can steadily handle base in the case where replacing mask
Matter.
According to an exemplary embodiment, the equipment at the inclination angle for correcting mask includes: mask support main body, described to cover
Mould supportive body is configured to support and forms figuratum mask thereon；Mask support main body mobile unit, the mask support
Main body mobile unit is configured to change the inclination angle of the X/Y plane of mask support main body；Camera unit, the camera unit
To take pictures across the laser beam for the matrix being arranged on matrix support part, to generate laser beam transmitted image；And control unit,
Described control unit is configured to control mask support main body mobile unit, thus changes the inclination angle of the X/Y plane of mask, so that
When proper laser beam transmitted image is deviateed with reference to focus image, the laser beam transmitted image refers to focus image with described
Match.
The mask support main body may include: mask holder, and there is the mask holder central part to penetrate
Frame shape, the mask holder have the first, second, third and fourth vertex, and wherein mask is placed on mask fixing
On device, and the X/Y plane of mask holder is varied in terms of inclination angle；Mask objective table, the mask objective table are configured
To support the mask holder on its top surface；And change of pitch angle module, the change of pitch angle module are configured to individually
Ground adjusts the Z axis height on the vertex of mask holder, to change the inclination angle of X/Y plane.
The change of pitch angle module may include: height adjustment part, and the height adjusting part lease making configuration is so that mask
The first, second of holder and the Z axis height on third vertex can individually be raised and lowered；And supportive body, the branch
Support main body is configured to for being connected on mask objective table on the 4th vertex of mask holder.
The height adjustment part may include: the first height adjustment part, the first height adjusting part lease making configuration
So that the Z axis height on the first vertex of mask holder can be raised and lowered；Second height adjustment part, second height
Adjustment portion lease making configures so that the Z axis height on the second vertex of mask holder can be raised and lowered；And third height tune
Save part, the third height adjustment portion lease making configure so that the Z axis height on the third vertex of mask holder can increase or
It reduces.
According to another exemplary embodiment, matrix treatments equipment includes: chamber, and the chamber has matrix pattern wherein
The inner space of change；Matrix support part, the matrix support part are arranged in the inner space with support matrix；Laser source,
The laser source is configured to generate laser beam；Mask support main body, the mask support main body are arranged in laser source and matrix
Between supporting element, figuratum mask is formed thereon with support；Mask support main body mobile unit, the mask support main body are moved
Moving cell is configured to change the inclination angle of the X/Y plane of mask support main body；Camera unit, the camera unit are configured
Think that the laser beam across the matrix being arranged on matrix support part is taken pictures, to generate laser beam transmitted image；And control is single
Member, described control unit are configured to control mask support main body mobile unit, thus change the inclination angle of the X/Y plane of mask, with
So that the laser beam transmitted image refers to focus image with described when laser beam transmitted image deviates with reference to focus image
Match.
Detailed description of the invention
It can be more fully understood exemplary embodiment from the following description with the drawings, in which:
Fig. 1 is the view using the matrix treatments equipment of laser beam.
Fig. 2 is the view for illustrating the composition of matrix treatments equipment according to an exemplary embodiment.
Fig. 3 is the coupling figure of mask support main body according to an exemplary embodiment.
Fig. 4 is the exploded view of mask support main body according to an exemplary embodiment.
Fig. 5 is that wherein mask objective table movable part is implemented as linear electrical for explanation according to an exemplary embodiment
The view of the example of machine (linear motor, LM) guiding piece.
Fig. 6 (a), (b) are to illustrate that wherein height adjustment part is adjusted in Z axis length, so that mask holder
The view of state that can increase in the Z-axis direction of the first vertex.
Fig. 7 (a), (b) are to illustrate that wherein height adjustment part is adjusted in Z axis length, so that mask holder
The view of state that can increase in the Z-axis direction of third vertex.
Main element label declaration:
1: guide rail
2: platform
10: matrix treatments equipment
100: chamber
200: matrix support part
300: laser source
350: reflecting mirror
400: projecting lens
500: mask support main body
510: mask holder
510a: edge
520: change of pitch angle module
521: supportive body
522,522a, 522b, 522c: height adjustment part
530: mask objective table
600: control unit
700: mask support main body mobile unit
800: camera unit
M: mask
L: laser beam
W: matrix
Specific embodiment
Specific embodiment is described in detail below with reference to attached drawing.However, the present invention can embody in different forms,
And it should not be construed as limited by embodiments set forth herein.On the contrary, thesing embodiments are provided so that of the invention thoroughly and complete
It is whole, and will fully convey the scope of the invention to those skilled in the art.Identical Ref. No. refers to phase in full text
Same element.
Fig. 2 is the view for illustrating the composition of matrix treatments equipment according to an exemplary embodiment.
In matrix treatments equipment 10, the laser beam generated from laser source 300 passes through mask M and is irradiated to matrix
On W.Herein, the luminescent layer for the donor film being formed on matrix W is separated and then matrix W is patterned to pixel.
For this purpose, matrix treatments equipment 10 includes chamber 100, matrix support part 200, laser source 300, mask support main body 500, mask branch
Support main body mobile unit 700, camera unit 800 and control unit 600.
Although chamber 100 has the rectangular box shape with inner space, but the invention is not restricted to this.For example,
Chamber can have a variety of container shapes.That is, chamber 100 can have cylindrical shape or Polygonal box shape.If
The matrix set in the interior space is patterned to pixel.Entrance for load/unload matrix is defined at chamber
In each of one side surface and another side surface.Herein, at least one entrance is connected in matrix transfer module.
Projecting lens 400 is arranged on the top surface of chamber 100, to capture the laser beam irradiated from laser source 300, by
This will be in the matrix on radiating laser beams to matrix support part.Although the top surface of chamber 100 is arranged in projecting lens 400
On, but the invention is not restricted to this.For example, projecting lens 400 can be set in laser beam irradiation tunnel, the laser
Beam irradiation tunnel has the upper part for the outside or inside for penetrating chamber 100.
Matrix support part 200 is arranged in the inner space of chamber 100 with support matrix W, so that the pixel region of matrix W
Domain is towards upside.Moreover, matrix support part 200 moves horizontally and raises matrix W.Matrix support part 200 may be coupled to work
For the cylindrical body of the unit for providing lifting force.Matrix W is placed on matrix support part 200.Herein, donor film tegillum
It is pressed on the top surface (that is, surface to be patterned) (hereinafter referred to as " patterned surface ") of matrix.
Laser beam is irradiated on the patterned surfaces of matrix W by laser source 300 by the opening of pattern mask M.At matrix
Reason equipment can further include reflecting mirror 350.The laser beam emitted from laser source 300 reflected by reflecting mirror 350 and with
After be irradiated on mask M.Laser beam can partly heat the region smaller than the open area of mask M.Gas laser, example
Such as argon laser, Kr laser, excimer laser, that is, using the laser of medium, wherein neodymium, ytterbium, chromium, titanium, holmium,
At least one of erbium, thulium and tantalum are added to single crystal YAG, Yttrium Orthovanadate, silicic acid magnesite (Mg2SiO4)、YA1O3、
GdVO4 or polycrystalline (ceramics) yttrium-aluminium-garnet, Yttrium Orthovanadate, swash in YAlO3, GdVO4 at yttrium oxide as dopant or glass
In light device, ruby laser, alexandrite laser, titanium sapphire laser device, copper vapor laser and gold vapor laser
At least one may be used as laser source 300.Laser beam may be provided as linear beam, the linear beam with there is relatively wide area
The plane pencil of forms in domain is compared to be readily derived and is collected into and is irradiated in the whole surface of matrix immediately.
Mask M can be the light control unit for selectively stopping or reflecting the laser beam irradiated from laser source 300.
Mask M has pattern, the opening that there is the pattern laser beam to pass through；And for stopping or the blocking of reflection laser beam
Part.Since deposition materials are not through the opening of mask M, different from deposition mas, mask M can have relatively thick
Thickness.Therefore, because mask M has relatively thick thickness, therefore the mask will not be influenced by heat easily
In the case of can prevent laser beam diffraction.Moreover, mask M can be formed by the material that can be subjected to the irradiation of laser beam, for example,
Materials with high melting point, such as tungsten, tantalum, chromium, nickel or molybdenum, the alloy of the above items；Or the metal material with low thermal coefficient of expansion, institute
Stating metal material will not be deformed due to heat and easily, for example, stainless steel, inconel, Hastelloy etc..Moreover,
Mask M can be formed by the material with thermal expansion coefficient identical with the material of donor film for being attached on matrix W.
This be in order to prevent mask M and donor film and making mask M and donor film expansion with same coefficient of thermal expansion each other not
Alignment, even if mask M is heated.
Matrix treatments equipment 10 include mask inclination correction device, for when replacing mask M by the focus of mask M and position
It sets and is adapted to reference value.For including mask by the mask inclination correction device of the focus of mask M and position correction to reference value
Supportive body 500, mask support main body mobile unit 700, camera unit 800 and control unit 600.
Mask support main body 500 is arranged between laser source 300 and matrix support part 200, to support pattern mask M.
Mask support main body 500 can move in X-axis, Y-axis and Z-direction and by using comprising 520 and of change of pitch angle module
The mask support main body mobile unit 700 of mask objective table movable part and rotate.Mask will be described with reference to Fig. 3, Fig. 4 and Fig. 5
Supportive body 500 and mask objective table movable part.
Fig. 3 is the coupling figure of mask support main body according to an exemplary embodiment, and Fig. 4 is according to an exemplary reality
The exploded view and Fig. 5 for applying the mask support main body of example are explanation according to an exemplary embodiment wherein mask objective tables
Movable part is implemented as the view of the example of linear motor (liner motor, LM) guiding piece.
Mask support main body 500 includes the mask holder 510 of support mask M；It is used to support covering for mask holder 510
Mould objective table 530；And change of pitch angle module 520, the change of pitch angle module 520 individually adjust the vertex of mask holder
Middle each Z axis height is to change the inclination angle of X/Y plane.
Mask objective table 530 is moved in X-axis and Y direction and is rotated by using mask objective table movable part.
For example, mask objective table movable part may be implemented the moving in X-axis and Y direction of mask objective table 530 and cover
The rotation of mould objective table 530.For example, linear motor (liner motor, LM) guiding piece may be implemented as mask load
Object platform movable part.Illustrate that wherein LM guiding piece is implemented as an example of mask objective table movable part in Fig. 5.Draw in LM
In guiding element, Y-axis delivery platform 2 is moved along LM guide rail 1, and mask objective table 530 along Y-axis delivery platform 2 in X-direction
Upper movement.Therefore, when implementation procedure, mask objective table 530 is by the mobile setting in X-axis and Y direction in appropriate position
It sets.Herein, X-axis and Y-axis are the axis to form two-dimensional surface.Moreover, mask objective table 530 may include individual rotary electric
Machine, horizontally to be rotated other than the movement of X-axis and Y-axis.
Fig. 3 and mask holder 510 illustrated in fig. 4 have frame shape, and the central part of the frame shape is to wear
Saturating.Herein, the edge of mask M is located on the edge 510a of mask holder 510 and is supported by the edge 510a.It passes through
The laser beam of mask M can pass through the region of mask holder, and the central part of the mask holder penetrates.Certainly,
In some cases, mask holder 510 can be further provided on the independent fixed cell of permanent mask M by being used to support
In.Mask holder 510 may be implemented as tool there are four the rectangular frame shape on vertex, and four vertex are the first top
Point, the second vertex, third vertex and the 4th vertex.Alternatively, mask holder 510 may be implemented as tool, there are three vertex, five
The frame shape on a vertex or six vertex.Hereinafter, will be used as an example description tool, there are four the frame shapes on vertex.So
And the mask holder of the number on vertex having less than or more than four vertex can be provided.
In the exemplary embodiment, the inclination angle of the X/Y plane of mask holder 510 can change.Mask holder
The Z axis height on vertex can individually change the inclination angle of X/Y plane through adjusting.Therefore it provides change of pitch angle module 520 is with list
The Z axis height for solely adjusting each in vertex, to change X/Y plane.Change of pitch angle module 520 includes height adjustment part
522,522a, 522b and 522c, for making the first vertex of mask holder 510, the Z axis height on the second vertex and third vertex
It can individually be raised and lowered；And supportive body 521, the supportive body 521 is by the 4th vertex of mask holder 510
It is connected on mask objective table 530.Each of height adjustment part 522 is motor, and the height of the motor is according to electricity
The stretching, extension operation of motivation obtains variable adjusting along Z axis in a longitudinal direction.Mask objective table 530 and mask holder 510
Vertex be connected to the both ends of height adjustment part in a longitudinal direction respectively.The height adjustment part 522 of adjustable in length can
To pass through various length adjusting units (for example, linear motor) Lai Shixian.
Height adjustment part 522 includes the first height adjustment part 522a, the height on the first vertex of mask holder 510
It increases in the Z-axis direction high by first height adjustment part or reduces；Second height adjustment part 522b, mask holder
The height on 510 the second vertex is increased or is reduced in the Z-axis direction by second height adjustment part 522b；And third
The Z axis height of height adjustment part 522c, the third vertex of mask holder 510 are high by the third height adjustment portion decilitre
Or it reduces.Each of height adjustment part 522 is length changeably adjustable motor in a longitudinal direction.Height is adjusted
Each of section part 522 has a configuration that, wherein in the vertex of mask objective table 530 and mask holder 510
Each be connected on the both ends of each of height adjustment part 522 in a longitudinal direction.
Supportive body 521 is arranged on the 4th vertex, and the 4th vertex of mask holder 510 is supported on mask loading
On platform 530.Supportive body 521 can be by springy spring or metal bar without elastic force is realized.
Therefore, when the height on a certain vertex is raised and lowered on Z axis, the inclination angle of the X/Y plane of mask holder 510
It can change.For example, as shown in Fig. 6 (a), (b), when the first height adjustment part being arranged on the first vertex
522a extends in Z axis length, when the first vertex to promote mask holder 510 in the Z-axis direction, mask holder 510
X/Y plane have a certain inclination angle, first vertex is arranged at the height for being relatively higher than other vertex with the inclination angle.Herein,
The supportive body 521 (for example, spring) being arranged on the 4th vertex extends, and second be therefore arranged on the second vertex is high
Degree adjusts part 522b can also extend in height corresponding with the height on the 4th vertex.Moreover, such as Fig. 7 (a), (b) institute
Show, extends in Z axis length when the third height being arranged on third vertex adjusts part 522a, to be promoted in the Z-axis direction
When the third vertex of mask holder 510, the X/Y plane of mask holder 510 has a certain inclination angle, and the third vertex is with this
Inclination angle is arranged at the height for being relatively higher than other vertex.Herein, the bullet as the supportive body 521 being arranged on the 4th vertex
Spring can extend, and the second height adjustment part 522b being therefore arranged on the second vertex can also with the 4th vertex
Extend in highly corresponding height.
Therefore, it is arranged on the first, second, and third vertex when the focal variation of laser beam after replacing mask M
Height adjustment part 522 can adjust the inclination angle of the X/Y plane of mask holder 510 through controlling, thus by the focus of laser beam
It is restored to its reset condition.Since the change of pitch angle of the X/Y plane of mask holder 510 means the change of the X/Y plane of mask M
Change, therefore the focus of the laser beam across mask M can be corrected by the variation at the inclination angle of mask M.Therefore, even if replacement
Mask, mask can also be loaded into the position previously set with mask farthest on close position.
As shown in Fig. 2, camera unit 800 is provided in exemplary embodiment, swash to be detected after replacing mask
The variation of the focus of light beam.Camera unit 800 is taken pictures for the laser beam across the matrix being arranged on matrix support part, to produce
Raw laser beam transmitted image.Camera unit 800 is arranged in the matrix support part 200 in a certain region, in this region,
Laser beam is through irradiating with the image by using the capture of camera imaging sensor across the laser beam of matrix.Therefore, camera
Unit 800 can capture the image of the laser beam through irradiating across matrix W, to generate laser beam transmitted image.Infrared ray
(infrared, IR) camera, near infrared ray (Near-infrared, NIR) camera may be implemented as camera unit
800.Herein, 10 times of lens, optical filterings etc. can be applied to camera unit 800.
When laser beam transmitted image deviates with reference to focus image, it is mobile single that control unit 600 controls mask support main body
Member 700 is to change the inclination angle of the X/Y plane of mask holder 510, so that laser beam transmitted image and referring to focus image
Match.Before replacing mask, reference focus image in memory is concentrated in the storage of control unit 600.Since laser beam is with line
Shape irradiation, therefore wherein there is the shape of laser beam the state of good contrast can be determined by reference to focus image.When
Ginseng is deviateed across the laser beam transmitted image that the image of the laser beam of matrix obtains by capture after replacing mask holder 510
When examining focus image, the inclination angle of the X/Y plane of mask holder 510 changes so that focus is matched with reference to focus.With reference to coke
The contrast of point image can be compared by a variety of methods, for example, the method for the thickness of alternative line and comparing contrast
Method.The method of the thickness of alternative line is to determine the thickness of the line of laser beam transmitted image of imaging and with reference to focus image
The thickness of line whether be more than critical value method.Moreover, the method for comparing contrast is to determine the laser beam transmitted image of imaging
The contrast of line whether be more than method with reference to the critical value of focus image.
When determining deviation critical value, control unit 600 can be relative to the inclination angle of mask holder modified chi Y plane.It lifts
For example, in laser beam transmitted image and with reference to (each of them has linear) in focus image, when laser beam transmitted image
When with being greater than the thickness with reference to focus image, control unit 600 promotes the first, second, and third top of mask holder 510
At least one of point, to change the inclination of the X/Y plane of mask holder 510.Similarly, when laser beam transmitted image has
Less than reference focus image thickness when, control unit 600 makes in the first, second, and third vertex of mask holder 510
At least one can reduce, and thus change the inclination angle of the X/Y plane of mask holder 510.
When the laser beam transmitted image that is imaged in camera unit 800 deviates reference position, control unit 600 can be with
The mask objective table 530 of mobile support mask holder in X-axis and Y direction, and rotate mask objective table 530.?
That is it is mobile that control unit 600 controls mask objective table when laser beam transmitted image deviates previously stored reference position
Part with mask objective table 530 mobile in X-axis and Y direction and rotates mask objective table 530, so that laser beam
Transmitted image is matched with reference position.Reference position indicates the position of the reference focus image of the plane coordinates based on matrix support part
Confidence breath.When focused, the location information with linear laser beam being irradiated in matrix is registered as reference position.With
Afterwards, when the critical value of reference position is deviateed due to the replacement of mask holder in the position of laser beam, control unit is in X-axis
With mask objective table 530 mobile in Y direction and rotate mask objective table 530, to adjust the position of laser beam.
In the exemplary embodiment, the inclination angle of mask support main body can be adjusted, even if in replacement mask
In the case of also can prevent the focus of laser beam and position from changing.
Although having referred to specific embodiment describes equipment and matrix treatments equipment for correcting inclination angle, they
It is without being limited thereto.Therefore, those skilled in the art will readily appreciate that, is not departing from this hair being defined by the following claims
In the case where bright spirit and scope, various modifications and change can be made to it.
Claims (11)
1. a kind of equipment for correcting the inclination angle of mask, which is characterized in that the equipment includes:
Mask support main body, the mask support main body are configured to support and form figuratum mask thereon；
Mask support main body mobile unit, the mask support main body mobile unit are configured to change the mask support main body
X/Y plane inclination angle；
Camera unit, the camera unit are across the linear of the mask and the matrix being arranged on matrix support part
Laser beam is taken pictures, to generate laser beam transmitted image, wherein the camera unit is arranged in the matrix support part, it is described
Camera unit includes one of infrared camera and near infrared camera；And
Control unit, described control unit are configured to control the mask support main body mobile unit, thus cover described in change
The inclination angle of the X/Y plane of mould, so that when the laser beam transmitted image deviates with reference to focus image, it is described to swash
Light beam transmitted image refers to focus images match with described.
2. equipment according to claim 1, which is characterized in that the mask support main body includes:
Mask holder, the mask holder have the frame shape that penetrates of central part, and the mask holder has the
One vertex, the second vertex, third vertex and the 4th vertex, wherein the mask is placed on the mask holder, and institute
The inclination angle for stating the X/Y plane of mask holder is variation；
Mask objective table, the mask objective table are configured to support the mask holder on its top surface；And
Change of pitch angle module, the change of pitch angle module are configured to individually adjust the vertex of the mask holder
Z axis height, to change the inclination angle of the X/Y plane.
3. equipment according to claim 2, which is characterized in that the change of pitch angle module includes:
Height adjustment part, the height adjusting part lease making configures so that first vertex of the mask holder, described
The Z axis height on the second vertex and the third vertex can individually be raised and lowered；And
Supportive body, the supportive body are configured to the 4th vertex of the mask holder being connected to mask loading
On platform.
4. equipment according to claim 3, which is characterized in that each of the height adjustment part is in its longitudinal direction side
The motor that upward length is changeably adjusted, and the both ends on its longitudinal direction are connected respectively to the mask objective table and institute
State on a corresponding vertex of mask holder, wherein the corresponding vertex be first vertex, second vertex with it is described
Vertex corresponding with each position of the height adjustment part in third vertex.
5. equipment according to claim 3, which is characterized in that the height adjusting part, which divides, includes:
First height adjustment part, the first height adjusting part lease making configure first top so that the mask holder
The Z axis height of point can be raised and lowered；
Second height adjustment part, the second height adjusting part lease making configure second top so that the mask holder
The Z axis height of point can be raised and lowered；And
Third height adjusts part, and the third height adjustment portion lease making configures the third top so that the mask holder
The Z axis height of point can be raised and lowered.
6. equipment according to claim 3, which is characterized in that the mask support main body mobile unit further comprises covering
Mould objective table movable part, the mask objective table movable part are configured in X-axis and Y direction the mobile mask and carry
Object platform and rotate the mask objective table.
7. equipment according to claim 6, which is characterized in that when the laser beam transmitted image deviates reference position,
The mask objective table movable part is controlled with the mask objective table mobile in X-axis and Y direction and makes described cover
Mould objective table rotation, so that the laser beam transmitted image is matched with the reference position.
8. equipment according to claim 3, which is characterized in that the laser beam transmitted image and the reference focus image
Each of have it is linear, and when the laser beam transmitted image has and is greater than the thickness with reference to focus image,
Described control unit makes in first vertex, second vertex and the third vertex of the mask holder at least
One can increase.
9. equipment according to claim 3, which is characterized in that the laser beam transmitted image and the reference focus image
Each of have it is linear, and when the laser beam transmitted image has and is less than the thickness with reference to focus image,
Described control unit makes in first vertex, second vertex and the third vertex of the mask holder at least
One can reduce.
10. a kind of matrix treatments equipment characterized by comprising
Chamber, the chamber have matrix patterned inner space wherein；
Matrix support part, the matrix support part are arranged in the inner space to support the matrix；
Laser source, the laser source are configured to generate linear laser beam；
Mask support main body, the mask support main body are arranged between the laser source and the matrix support part, with support
Figuratum mask is formed thereon；
Mask support main body mobile unit, the mask support main body mobile unit are configured to change the mask support main body
X/Y plane inclination angle；
Camera unit, the camera unit be configured to for across the mask and be arranged on the matrix support part
The linear laser beam of the matrix take pictures, to generate laser beam transmitted image, wherein camera unit setting exists
In the matrix support part, the camera unit includes one of infrared camera and near infrared camera；And
Control unit, described control unit are configured to control the mask support main body mobile unit, thus cover described in change
The inclination angle of the X/Y plane of mould, so that when the laser beam transmitted image deviates with reference to focus image, it is described to swash
Light beam transmitted image refers to focus images match with described.
11. matrix treatments equipment according to claim 10, which is characterized in that the mask support main body mobile unit exists
The mask support main body is moved in X-axis and Y direction and rotates the mask support main body.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2013-0102478 | 2013-08-28 | ||
| KR1020130102478A KR101825091B1 (en) | 2013-08-28 | 2013-08-28 | Apparatus for amending tilt and method for processing substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104423146A CN104423146A (en) | 2015-03-18 |
| CN104423146B true CN104423146B (en) | 2019-10-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410412432.3A Expired - Fee Related CN104423146B (en) | 2013-08-28 | 2014-08-20 | For correcting the equipment and matrix treatments equipment at the inclination angle of mask |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101825091B1 (en) |
| CN (1) | CN104423146B (en) |
| TW (1) | TWI544293B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105159037B (en) * | 2015-09-30 | 2017-06-30 | 合肥芯碁微电子装备有限公司 | A kind of angle calibration method of direct-write type lithography machine pattern generator |
| JP6860429B2 (en) * | 2017-06-07 | 2021-04-14 | 株式会社ディスコ | Laser processing method and laser processing equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000232061A (en) * | 1999-02-12 | 2000-08-22 | Nikon Corp | Aligner and exposure method |
| CN101750714A (en) * | 2008-12-19 | 2010-06-23 | Ap系统股份有限公司 | Vision system for substrate alignment apparatus and method for focusing the same |
| WO2012173692A1 (en) * | 2011-06-17 | 2012-12-20 | Applied Materials, Inc. | Cvd mask alignment for oled processing |
-
2013
- 2013-08-28 KR KR1020130102478A patent/KR101825091B1/en active IP Right Grant
-
2014
- 2014-08-20 CN CN201410412432.3A patent/CN104423146B/en not_active Expired - Fee Related
- 2014-08-26 TW TW103129254A patent/TWI544293B/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000232061A (en) * | 1999-02-12 | 2000-08-22 | Nikon Corp | Aligner and exposure method |
| CN101750714A (en) * | 2008-12-19 | 2010-06-23 | Ap系统股份有限公司 | Vision system for substrate alignment apparatus and method for focusing the same |
| WO2012173692A1 (en) * | 2011-06-17 | 2012-12-20 | Applied Materials, Inc. | Cvd mask alignment for oled processing |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201508424A (en) | 2015-03-01 |
| KR101825091B1 (en) | 2018-02-02 |
| TWI544293B (en) | 2016-08-01 |
| KR20150025170A (en) | 2015-03-10 |
| CN104423146A (en) | 2015-03-18 |
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