TWI539246B - Drawing apparatus - Google Patents
Drawing apparatus Download PDFInfo
- Publication number
- TWI539246B TWI539246B TW103128406A TW103128406A TWI539246B TW I539246 B TWI539246 B TW I539246B TW 103128406 A TW103128406 A TW 103128406A TW 103128406 A TW103128406 A TW 103128406A TW I539246 B TWI539246 B TW I539246B
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- amount
- head
- optical system
- received
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
本發明係關於一種向對象物照射光而進行圖案之描繪之描繪裝置。 The present invention relates to a drawing device for drawing a pattern by irradiating light onto an object.
習知,有一種描繪裝置,其係藉由將進行了空間調變之光照射至載置台上之對象物,且於對象物上掃描該光之照射區域而描繪圖案。此種描繪裝置中,因光源之劣化、空間光調變元件之特性劣化、光學系統之穿透率下降、異物之附著等而存在對象物上之光量降低之情況。因此,於此種描繪裝置中,由設置於載置台附近之光量感測器檢測來自描繪頭之光量。 Conventionally, there is a drawing device that draws a pattern by irradiating a spatially modulated light onto an object on a mounting table and scanning an irradiation region of the light on the object. In such a drawing device, the amount of light on the object is lowered due to deterioration of the light source, deterioration of characteristics of the spatial light modulation element, decrease in transmittance of the optical system, adhesion of foreign matter, and the like. Therefore, in such a drawing device, the amount of light from the drawing head is detected by a light amount sensor provided in the vicinity of the mounting table.
例如,於日本專利特開2003-177553號公報(文獻1)之雷射描繪裝置中,於聲光調變器與多面鏡之間設置有第1光量監控器,且於描繪載置台上設置有第2光量監控器。該雷射描繪裝置中,即便因光學零件之特性劣化或異物之附著等而使第1光量監控器之光學特性產生變化,亦可根據藉由第2光量監控器檢測出之光量而校正第1光量監控器之光量檢測精度。 For example, in the laser drawing device of Japanese Laid-Open Patent Publication No. 2003-177553 (Document 1), a first light amount monitor is provided between the acousto-optic modulator and the polygon mirror, and is provided on the drawing stage. The second light quantity monitor. In the laser drawing device, even if the optical characteristics of the first light amount monitor are changed due to deterioration of characteristics of the optical component or adhesion of foreign matter, the first light quantity can be corrected based on the amount of light detected by the second light amount monitor. The light quantity detection accuracy of the light quantity monitor.
於日本專利特開2008-242173號公報(文獻2)之曝光描繪裝置中,於使來自光源之光分離之光圈(aperture)構件與空間光調變手段之間設置有第1光量感測器,且於被曝光體平台上設置有第2光量感測器。該曝光描繪裝置根據來自第1光量感測器之輸出 與來自第2光量感測器之輸出,而判斷自光圈構件至被曝光體之狀況。 In the exposure drawing device of Japanese Laid-Open Patent Publication No. 2008-242173 (Document 2), a first light amount sensor is provided between an aperture member that separates light from a light source and a spatial light modulation means. A second light amount sensor is disposed on the exposed body platform. The exposure drawing device is based on an output from the first light amount sensor The output from the second light amount sensor is judged from the state of the aperture member to the object to be exposed.
於日本專利特開2010-85507號公報(文獻3)之曝光裝置中,將測定光源之光量之第1光量感測器設置於光源之附近,且將測定經由光學元件之光量之第2光量感測器設置於基板之周邊。該曝光裝置係根據來自第1光量感測器之輸出而判定光源之壽命期間。若根據來自第1光量感測器之輸出而判定光源為壽命期間內,則根據來自第2光量感測器之輸出而判定光學元件之特性之良否。 In the exposure apparatus of Japanese Laid-Open Patent Publication No. 2010-85507 (Document 3), the first light amount sensor that measures the amount of light of the light source is placed in the vicinity of the light source, and the second light amount of the amount of light passing through the optical element is measured. The detector is disposed at the periphery of the substrate. The exposure device determines the lifetime of the light source based on the output from the first light amount sensor. When it is determined that the light source is within the lifetime of the light source based on the output from the first light amount sensor, the quality of the optical element is determined based on the output from the second light amount sensor.
然而,於文獻1之雷射描繪裝置中,於第2光量監控器之光學特性劣化之情形時,難以精度良好地校正第1光量監控器之光量檢測精度。又,於文獻2及文獻3之曝光裝置中,於第1光量感測器及第2光量感測器之任一者產生光學特性之劣化等情形時,亦存在基於來自第1光量感測器之輸出與來自第2光量感測器之輸出之檢查精度降低之虞。 However, in the laser drawing device of Document 1, when the optical characteristics of the second light amount monitor are deteriorated, it is difficult to accurately correct the light amount detection accuracy of the first light amount monitor. Further, in the exposure apparatus of the documents 2 and 3, when the optical characteristics are deteriorated in any of the first light amount sensor and the second light amount sensor, there is also a case based on the first light amount sensor. The output is reduced from the inspection accuracy of the output from the second light sensor.
本發明適合於向對象物照射光而進行圖案之描繪之描繪裝置,其目的在於精度良好地檢測出描繪頭之劣化原因。 The present invention is suitable for a drawing device for drawing a pattern by irradiating light onto an object, and an object thereof is to accurately detect the cause of deterioration of the drawing head.
本發明之描繪裝置係具備有:描繪頭,其向對象物照射經空間調變之光;保持部,其保持上述對象物,並且藉由相對於上述描繪頭進行相對移動,而將來自上述描繪頭之光之照射區域在上述對象物上進行掃描;及檢查部,其進行上述描繪頭之檢查;且上述描繪頭係具備有:光源,其射出光;空間光調變元件;照明光學系統,其將來自上述光源之光,導引至上述空間光調變元件;及投影光學系統,其將在上述空間光調變元件經空間調變之光,導引 至上述保持部;且上述檢查部係具備有:光量感測器,其相對於上述描繪頭而當位在以相對之方式所設定之描繪光量測定位置之時,接收來自上述投影光學系統之光;感測器移動機構,其使上述光量感測器移動在上述描繪光量測定位置與預先所設定之中間光量測定位置之間;採光頭,其被插入至自上述光源至上述空間光調變元件之光路上,捕捉自上述光源而朝向上述空間光調變元件之光之至少一部分;測定光學系統,其將在上述採光頭所捕捉之光,導引至位在上述中間光量測定位置之上述光量感測器;及採光頭移動機構,其將上述採光頭插入至上述光路上,或者使該採光頭自上述光路上脫離。 The drawing device of the present invention includes: a drawing head that irradiates the object with spatially modulated light; and a holding unit that holds the object and moves relative to the drawing head to perform the above-described drawing The illumination area of the head light is scanned on the object; and the inspection unit performs the inspection of the drawing head; and the drawing head includes a light source that emits light, a spatial light modulation element, and an illumination optical system. The light from the light source is guided to the spatial light modulation component; and the projection optical system is guided by the spatially modulated light of the spatial light modulation component. The inspection unit includes: a light amount sensor that receives light from the projection optical system when the position of the drawing light amount set in a relative manner with respect to the drawing head is received a sensor moving mechanism that moves the light amount sensor between the drawing light amount measuring position and a preset intermediate light amount measuring position; the lighting head is inserted from the light source to the spatial light modulation element a light path that captures at least a portion of the light directed from the light source toward the spatial light modulation element, and a measurement optical system that guides the light captured by the light collection head to the amount of light at the intermediate light amount measurement position a sensor; and a head moving mechanism that inserts the head to the optical path or disengages the head from the optical path.
該描繪裝置可精度良好地檢測出描繪頭之劣化原因。 This drawing device can accurately detect the cause of deterioration of the drawing head.
本發明之一較佳實施形態中,上述光量感測器係被設置在上述保持部,自上述投影光學系統之前端至上述光量感測器之受光面之距離係相等於自上述投影光學系統之上述前端至上述對象物之表面之距離,上述感測器移動機構係使上述保持部相對於上述描繪頭進行相對移動。 In a preferred embodiment of the present invention, the light amount sensor is provided in the holding portion, and a distance from a front end of the projection optical system to a light receiving surface of the light amount sensor is equal to that from the projection optical system. The distance between the front end and the surface of the object, the sensor moving mechanism relatively moves the holding portion relative to the drawing head.
本發明之其他較佳實施形態中,上述照明光學系統係具備有積分器,上述採光頭係被插入至自上述積分器至上述空間光調變元件之光路上。 In another preferred embodiment of the present invention, the illumination optical system includes an integrator, and the illumination head is inserted into an optical path from the integrator to the spatial light modulation element.
本發明之其他較佳實施形態中,自上述光源所射出之光係為紫外光。 In another preferred embodiment of the present invention, the light emitted from the light source is ultraviolet light.
本發明之其他較佳實施形態中,上述空間光調變元件係將方向為可變更之多數個微小鏡面以平面之方式加以排列之光學元件。 In another preferred embodiment of the present invention, the spatial light modulation element is an optical element in which a plurality of minute mirror surfaces that are changeable are arranged in a planar manner.
本發明之其他較佳實施形態中,在上述光量感測器所 接收之來自上述測定光學系統之光之光量係為在上述光量感測器所接收之來自上述投影光學系統之光之光量之10%以上100%以下。 In another preferred embodiment of the present invention, in the above light quantity sensor The amount of light received from the measuring optical system is 10% or more and 100% or less of the amount of light received from the projection optical system received by the light amount sensor.
本發明之其他較佳實施形態中,上述檢查部係更進一 步具備有異常檢測部,該異常檢測部係根據在上述光量感測器所接收之來自上述測定光學系統之光之光量、及在上述光量感測器所接收之來自上述投影光學系統之光之光量,而加以檢測上述描繪頭之異常。 In another preferred embodiment of the present invention, the inspection unit is further improved. The step includes an abnormality detecting unit that determines the amount of light from the measuring optical system received by the light amount sensor and the light from the projection optical system received by the light amount sensor. The amount of light is detected, and the abnormality of the above-described drawing head is detected.
更佳為,上述檢查部係更進一步具備有另一個異常檢 測部,該另一個異常檢測部係根據藉由上述光量感測器所接收之來自上述測定光學系統之光之光量、及供給至上述光源之電流或電力,而加以檢測上述描繪頭之異常。 More preferably, the inspection department further has another abnormality check. The detecting unit detects the abnormality of the drawing head based on the amount of light from the measuring optical system received by the light amount sensor and the current or electric power supplied to the light source.
本發明之其他較佳實施形態中,更進一步具備有其他 之描繪頭,該其他之描繪頭係具有與上述描繪頭同樣之構造,上述檢查部係更進一步具備有:其他之採光頭,其在上述其他之描繪頭中,被插入至自光源至空間光調變元件之光路上,捕捉自上述光源而朝向上述空間光調變元件之光之至少一部分;及其他之測定光學系統,其將在上述其他之採光頭所捕捉之光,導引至位在上述中間光量測定位置之上述光量感測器;上述光量感測器係藉由上述感測器移動機構,相對於上述其他之描繪頭而朝向以相對之方式所設定之其他描繪光量測定位置進行移動,且當位在上述其他之描繪光量測定位置之時,接收來自上述其他之描繪頭之投影光學系統之光。 In other preferred embodiments of the present invention, there are further In the drawing head, the other drawing head has the same structure as the drawing head, and the inspection unit further includes another lighting head that is inserted into the self-light source to the spatial light in the other drawing head. a light path of the modulation element capturing at least a portion of the light directed from the light source toward the spatial light modulation element; and other measuring optical systems that direct light captured by the other of the light collecting heads in position The light amount sensor of the intermediate light amount measuring position; wherein the light amount sensor is moved toward the other drawing light amount measuring position set in a relative manner with respect to the other drawing head by the sensor moving mechanism And when the position is at the other described light amount measuring position, the light from the projection optical system of the other drawing head is received.
更佳為,上述描繪光量測定位置、上述其他描繪光量 測定位置、及上述中間光量測定位置係配置在直線上。 More preferably, the light amount measurement position and the other light amount described above are described above. The measurement position and the intermediate light amount measurement position are arranged on a straight line.
上述之目的及其他目的、特徵、態樣及優點可根據以下參照隨附圖式而進行之本發明之詳細之說明而明確。 The above and other objects, features, aspects and advantages of the invention will be apparent from
1‧‧‧描繪裝置 1‧‧‧Drawing device
3‧‧‧描繪部 3‧‧‧Drawing Department
4‧‧‧檢查部 4‧‧‧ Inspection Department
9‧‧‧基板 9‧‧‧Substrate
21‧‧‧載置台 21‧‧‧ mounting table
22‧‧‧移動機構 22‧‧‧Mobile agencies
23‧‧‧第1移動機構 23‧‧‧1st mobile agency
24‧‧‧第2移動機構 24‧‧‧2nd mobile agency
31‧‧‧描繪頭 31‧‧‧Drawing head
32‧‧‧光源 32‧‧‧Light source
33‧‧‧照明光學系統 33‧‧‧Lighting optical system
34‧‧‧空間光調變元件 34‧‧‧Spatial light modulation components
35‧‧‧投影光學系統 35‧‧‧Projection optical system
41‧‧‧檢查頭 41‧‧‧Check head
42‧‧‧採光頭 42‧‧‧Lighting head
43‧‧‧束纖維 43‧‧‧Bundle fiber
44‧‧‧光量感測器 44‧‧‧Light quantity sensor
45‧‧‧採光頭移動機構 45‧‧‧Lighting head moving mechanism
46‧‧‧頭異常檢測部 46‧‧‧ Head Anomaly Detection Department
91‧‧‧上表面 91‧‧‧Upper surface
331‧‧‧積分器 331‧‧‧ integrator
332‧‧‧透鏡 332‧‧‧ lens
333‧‧‧反射鏡 333‧‧‧Mirror
341‧‧‧矽基板 341‧‧‧矽 substrate
342‧‧‧微小鏡面群 342‧‧‧Small mirror group
343‧‧‧微小鏡面 343‧‧‧Small mirror
441‧‧‧受光面 441‧‧‧Stained surface
461‧‧‧第1異常檢測部 461‧‧‧1st abnormality detection department
462‧‧‧第2異常檢測部 462‧‧‧2nd abnormality detection department
S11~S18‧‧‧步驟 S11~S18‧‧‧Steps
圖1係一實施形態之描繪裝置之前視圖。 Figure 1 is a front elevational view of a depiction device of an embodiment.
圖2係描繪頭及檢查頭之立體圖。 Figure 2 is a perspective view of the head and the inspection head.
圖3係表示空間光調變元件之圖。 Fig. 3 is a view showing a spatial light modulation element.
圖4係表示頭異常檢測部之功能之方塊圖。 Fig. 4 is a block diagram showing the function of the head abnormality detecting unit.
圖5係表示描繪頭之檢查之流程之圖。 Fig. 5 is a view showing the flow of the inspection of the drawing head.
圖6係描繪裝置之前視圖。 Figure 6 is a front view depicting the device.
圖1係表示本發明之一實施形態之描繪裝置1之構成之前視圖。描繪裝置1係藉由將進行了空間調變之大致束狀之光照射至對象物上之感光材料,且於對象物上掃描該光之照射區域而進行圖案之描繪之直接描繪裝置(所謂之直描裝置)。於圖1所示之例中,對象物係印刷配線基板(以下,僅稱為「基板9」)。基板9中,於銅層上設置有藉由感光材料而形成之光阻膜。描繪裝置1係於基板9之光阻膜上描繪電路圖案。 Fig. 1 is a front view showing the configuration of a drawing device 1 according to an embodiment of the present invention. The drawing device 1 is a direct drawing device that performs pattern drawing by irradiating a light beam having a substantially beam shape that is spatially modulated onto a light-sensitive material on an object, and scanning an irradiation region of the light on the object (so-called Straight drawing device). In the example shown in FIG. 1, the object is a printed wiring board (hereinafter, simply referred to as "substrate 9"). In the substrate 9, a photoresist film formed of a photosensitive material is provided on the copper layer. The drawing device 1 draws a circuit pattern on the photoresist film of the substrate 9.
描繪裝置1具備載置台21、移動機構22、描繪部3、及檢查部4。描繪部3具備排列於X方向之數個描繪頭31。數個描繪頭31具有彼此同樣之構造。檢查部4具備檢查頭41、數個採光頭42、數個束纖維(bundle fiber)43、光量感測器44、及採光頭移動機構45。檢查頭41配置於數個描繪頭31之(+X)側。光量感測器 44設置於載置台21上。於圖1所示之例中,於3個描繪頭31之上方(即,(+Z)側),分別配置有3個採光頭42。檢查部4係利用數個採光頭42而進行數個描繪頭31之檢查。 The drawing device 1 includes a mounting table 21, a moving mechanism 22, a drawing unit 3, and an inspection unit 4. The drawing unit 3 includes a plurality of drawing heads 31 arranged in the X direction. The plurality of drawing heads 31 have the same configuration as each other. The inspection unit 4 includes an inspection head 41, a plurality of lighting heads 42, a plurality of bundle fibers 43, a light amount sensor 44, and a head moving mechanism 45. The inspection head 41 is disposed on the (+X) side of the plurality of drawing heads 31. Light quantity sensor 44 is disposed on the mounting table 21. In the example shown in FIG. 1, three heads 42 are disposed above the three drawing heads 31 (that is, on the (+Z) side). The inspection unit 4 performs inspection of a plurality of drawing heads 31 by using a plurality of lighting heads 42.
載置台21係自下側保持基板9之保持部。移動機構22使基板9與載置台21一併相對於數個描繪頭31及檢查頭41而相對移動。移動機構22具備:第1移動機構23,其使載置台21於與X方向垂直之Y方向移動;及第2移動機構24,其使載置台21於X方向移動。於以下之說明中,將X方向及Y方向亦分別稱為「副掃描方向」及「主掃描方向」。再者,亦可藉由移動機構22而使基板9與載置台21一併於水平面內可旋轉 The mounting table 21 holds the holding portion of the substrate 9 from the lower side. The moving mechanism 22 relatively moves the substrate 9 together with the mounting table 21 with respect to the plurality of drawing heads 31 and the inspection head 41. The moving mechanism 22 includes a first moving mechanism 23 that moves the mounting table 21 in the Y direction perpendicular to the X direction, and a second moving mechanism 24 that moves the mounting table 21 in the X direction. In the following description, the X direction and the Y direction are also referred to as "sub scanning direction" and "main scanning direction", respectively. Furthermore, the substrate 9 and the mounting table 21 can be rotated together in the horizontal plane by the moving mechanism 22.
於描繪裝置1中,一方面自描繪部3之數個描繪頭31將進行了空間調變之光照射至基板9之(+X)側之表面即上表面91上,一方面藉由第1移動機構使基板9於主掃描方向移動,藉此於基板9上掃描來自數個描繪頭31之光之照射區域。繼而,藉由第2移動機構24使基板9於副掃描方向僅移動既定之距離,再次一方面將進行了空間調變之光照射至基板9上一方面使基板9於主掃描方向移動。如此,描繪裝置1藉由反覆進行基板9向主掃描方向之移動、及向副掃描方向之移動,而對基板9描繪電路圖案。 In the drawing device 1, on the one hand, the spatially modulated light is irradiated onto the upper surface 91 which is the surface on the (+X) side of the substrate 9 from the plurality of drawing heads 31 of the drawing unit 3, on the one hand, by the first The moving mechanism moves the substrate 9 in the main scanning direction, thereby scanning the irradiation area of the light from the plurality of drawing heads 31 on the substrate 9. Then, the second moving mechanism 24 moves the substrate 9 by only a predetermined distance in the sub-scanning direction, and on the other hand, the spatially modulated light is irradiated onto the substrate 9 to move the substrate 9 in the main scanning direction. In this manner, the drawing device 1 draws a circuit pattern on the substrate 9 by repeatedly moving the substrate 9 in the main scanning direction and moving in the sub-scanning direction.
圖2係表示描繪部3之3個描繪頭31中最靠(+X)側之描繪頭31、及檢查頭41之立體圖。於圖2中,為了容易地理解描繪頭31及檢查頭41之內部構造,以虛線描繪描繪頭31及檢查頭41之外殼,且以實線描繪外殼內部之構成。 2 is a perspective view showing the drawing head 31 on the (+X) side of the three drawing heads 31 of the drawing unit 3 and the inspection head 41. In FIG. 2, in order to easily understand the internal structure of the drawing head 31 and the inspection head 41, the outer casing of the drawing head 31 and the inspection head 41 is shown by a broken line, and the inside of the casing is drawn by a solid line.
描繪頭31具備光源32、照明光學系統33、空間光調變元件34、及投影光學系統35。光源32射出光。自光源32射出 之光例如係紫外光。作為光源32,可利用例如發光二極體(LED,Light Emitting Diode)。照明光學系統33將來自光源32之光導引至空間光調變元件34。照明光學系統33具備例如積分器331、透鏡332、及反射鏡333。積分器331使來自光源32之光之照度分佈之均勻性提高。作為積分器331,可利用例如石英棒。 The drawing head 31 includes a light source 32, an illumination optical system 33, a spatial light modulation element 34, and a projection optical system 35. Light source 32 emits light. From the light source 32 The light is, for example, ultraviolet light. As the light source 32, for example, a light emitting diode (LED) can be used. Illumination optics 33 directs light from source 32 to spatial light modulation element 34. The illumination optical system 33 includes, for example, an integrator 331, a lens 332, and a mirror 333. The integrator 331 increases the uniformity of the illuminance distribution of the light from the light source 32. As the integrator 331, for example, a quartz rod can be used.
作為空間光調變元件34,可利用例如將各者之方向 可個別地變更之多數個微小鏡面排列於平面上之光學元件即數位微鏡元件(DMD,Digital Micro-mirror Device)。圖3係表示空間光調變元件34之圖。空間光調變元件34具備設置於矽基板341上之微小鏡面群342。微小鏡面群342中,將多數個微小鏡面343二維排列(即,排列於相互垂直之2方向上)。實際之微小鏡面群342包含較圖3所示更多之微小鏡面343。空間光調變元件34中,根據寫入至與各微小鏡面343對應之記憶格(memory cell)中之資料,各微小鏡面343藉由靜電作用而相對於矽基板341之表面僅傾斜既定之角度。繼而,僅藉由來自處於與既定之接通狀態對應之姿勢之微小鏡面343之反射光所形成之光(即,進行了空間調變之光)被導引至圖2所示之投影光學系統35。 As the spatial light modulation element 34, for example, the direction of each can be utilized A plurality of micro-mirror devices (DMDs, digital micro-mirror devices), which are optical elements arranged on a flat surface, can be individually changed. FIG. 3 is a diagram showing the spatial light modulation element 34. The spatial light modulation element 34 includes a micro mirror group 342 provided on the ruthenium substrate 341. In the micro mirror group 342, a plurality of minute mirror faces 343 are two-dimensionally arranged (that is, arranged in two directions perpendicular to each other). The actual tiny mirror group 342 contains more tiny mirrors 343 than shown in FIG. In the spatial light modulation element 34, each of the minute mirror surfaces 343 is inclined by a predetermined angle with respect to the surface of the 矽 substrate 341 by electrostatic action based on the data written in the memory cell corresponding to each of the minute mirror faces 343. . Then, only the light formed by the reflected light from the minute mirror surface 343 in the posture corresponding to the predetermined ON state (that is, the spatially modulated light) is guided to the projection optical system shown in FIG. 35.
由空間光調變元件34進行了空間調變之光藉由投影 光學系統35而被導引至載置台21上之基板9(參照圖1)。來自投影光學系統35之光照射至相對於空間光調變元件34之微小鏡面群342(參照圖3)而光學共軛之基板9上之照射區域。 Spatially modulated light by the spatial light modulation element 34 is projected by The optical system 35 is guided to the substrate 9 on the mounting table 21 (see Fig. 1). The light from the projection optical system 35 is irradiated onto the irradiation region on the substrate 9 optically conjugate with respect to the minute mirror group 342 (see FIG. 3) of the spatial light modulation element 34.
如圖2所示,檢查部4之採光頭42插入至檢查對象 即描繪頭31之自光源32至空間光調變元件34之光路上。採光頭42於該光路上,捕捉自光源32射向空間光調變元件34之光之至少 一部分。於圖2所示之例中,採光頭42插入至自積分器331至空間光調變元件34之光路上。具體而言,採光頭42係緊靠積分器331之後方而插入,即,插入至積分器331與透鏡332之間。其他採光頭42亦同樣地,於其他描繪頭31上插入至自光源32至空間光調變元件34之光路上,且捕捉自光源32射向空間光調變元件34之光之至少一部分。於圖1所示之描繪裝置1中,其他採光頭42亦插入至其他描繪頭31之自積分器331至空間光調變元件34之光路上。 As shown in FIG. 2, the lighting head 42 of the inspection unit 4 is inserted into the inspection object. That is, the light path from the light source 32 to the spatial light modulation element 34 of the head 31 is depicted. The concentrating head 42 is on the optical path, capturing at least the light from the light source 32 that is directed toward the spatial light modulation element 34. portion. In the example shown in FIG. 2, the head 42 is inserted into the optical path from the integrator 331 to the spatial light modulation element 34. Specifically, the head 42 is inserted immediately after the integrator 331, that is, inserted between the integrator 331 and the lens 332. Similarly, the other lighting heads 42 are inserted into the optical path from the light source 32 to the spatial light modulation element 34 to the other drawing heads 31, and capture at least a portion of the light that is directed from the light source 32 toward the spatial light modulation element 34. In the drawing device 1 shown in FIG. 1, the other lighting heads 42 are also inserted into the optical paths of the other drawing heads 31 from the integrator 331 to the spatial light modulation element 34.
數個束纖維43係將數個採光頭42分別連接於檢查頭 41。束纖維43係將數百至數千根素線即細光纖捆束而成者。關於3根束纖維43中之2根束纖維43,圖2中僅圖示其一部分。 a plurality of bundle fibers 43 are connected to the inspection heads by a plurality of lighting heads 42 respectively 41. The bundle fiber 43 is formed by bundling hundreds to thousands of fine wires, that is, fine fibers. Regarding the two bundle fibers 43 of the three bundle fibers 43, only a part thereof is shown in Fig. 2 .
檢查頭41具備固定於檢查頭41之外殼上之積分器 (例如,石英棒)或透鏡等。由採光頭42捕捉之光經由與採光頭42連接之束纖維43而被導引至檢查頭41,於檢查頭41中使照度分佈之均勻性提高後被導引至光量感測器44。檢查頭41及圖2中顯示出整體之束纖維43係將由連接有該束纖維43之採光頭42捕捉之光導引至光量感測器44之測定光學系統。又,該檢查頭41及其他束纖維43係將由連接有其他束纖維43之其他採光頭42捕捉之光導引至光量感測器44之其他測定光學系統。檢查頭41係由數個測定光學系統共有。 The inspection head 41 has an integrator fixed to the outer casing of the inspection head 41 (for example, quartz rods) or lenses. The light captured by the lighting head 42 is guided to the inspection head 41 via the bundle fibers 43 connected to the polishing head 42, and the uniformity of the illuminance distribution is improved in the inspection head 41, and then guided to the light amount sensor 44. The inspection head 41 and the entire bundle fiber 43 are shown in Fig. 2 to guide the light captured by the head 42 to which the bundle fiber 43 is attached to the measurement optical system of the light amount sensor 44. Further, the inspection head 41 and the other bundle fibers 43 guide the light captured by the other collection heads 42 to which the other bundle fibers 43 are connected to the other measurement optical system of the light amount sensor 44. The inspection head 41 is shared by several measuring optical systems.
如圖1所示,採光頭移動機構45使數個採光頭42相 對於數個描繪頭31而相對移動。於圖1所示之例中,數個採光頭42藉由採光頭移動機構45而於上下方向(即,Z方向)同時移動。藉此,數個採光頭42如圖2所示分別插入至數個描繪頭31之光路上, 又分別自該光路上脫離。於圖2中,以二點鏈線描繪自光路上脫離之位置之採光頭42。於圖2中,省略採光頭移動機構45之圖示。作為採光頭移動機構45,可利用例如氣缸。 As shown in FIG. 1, the head moving mechanism 45 causes a plurality of lighting heads 42 to phase Relative movement for several drawing heads 31. In the example shown in FIG. 1, a plurality of lighting heads 42 are simultaneously moved in the up and down direction (i.e., the Z direction) by the head moving mechanism 45. Thereby, a plurality of lighting heads 42 are respectively inserted into the optical paths of the plurality of drawing heads 31 as shown in FIG. 2, They are separated from the light path. In Fig. 2, the head 42 is separated from the position on the optical path by a two-dot chain line. In Fig. 2, the illustration of the head moving mechanism 45 is omitted. As the head moving mechanism 45, for example, a cylinder can be utilized.
如上所述,光量感測器44配置於載置台21上。如圖1所示,光量感測器44之受光面441與保持於載置台21上之基板9之上表面91於Z方向位於大致相同之位置。於描繪裝置1中,載置台21藉由移動機構22而於X方向及Y方向移動,藉此光量感測器44亦於X方向及Y方向移動。 As described above, the light amount sensor 44 is disposed on the mounting table 21. As shown in FIG. 1, the light receiving surface 441 of the light amount sensor 44 and the upper surface 91 of the substrate 9 held on the mounting table 21 are located at substantially the same position in the Z direction. In the drawing device 1, the mounting table 21 is moved in the X direction and the Y direction by the moving mechanism 22, whereby the light amount sensor 44 also moves in the X direction and the Y direction.
檢查部4進而具備檢測描繪部3之描繪頭31之異常之頭異常檢測部。圖4係表示頭異常檢測部46之功能之方塊圖。頭異常檢測部46成為將執行各種運算處理之中央處理單元(CPU,Central Processing Unit)、記憶基本程式之唯讀記憶體(ROM,Read Only Memory)、及記憶各種資訊之隨機存取記憶體(RAM,Random Access Memory)等連接於匯流排線之一般的電腦系統之構成。頭異常檢測部46具備異常檢測部461、及其他異常檢測部462。於以下之說明中,為了區別異常檢測部461、462,分別稱為「第1異常檢測部461」及「第2異常檢測部462」。於圖4中,亦一併圖示連接於頭異常檢測部46之描繪裝置1之其他構成。 The inspection unit 4 further includes a head abnormality detecting unit that detects an abnormality of the drawing head 31 of the drawing unit 3. FIG. 4 is a block diagram showing the function of the head abnormality detecting unit 46. The head abnormality detecting unit 46 is a central processing unit (CPU, Central Processing Unit) that executes various arithmetic processing, a read only memory (ROM) that memorizes a basic program, and a random access memory that memorizes various kinds of information ( RAM, Random Access Memory, etc. constitutes a general computer system connected to a bus bar. The head abnormality detecting unit 46 includes an abnormality detecting unit 461 and another abnormality detecting unit 462. In the following description, in order to distinguish the abnormality detecting units 461 and 462, the first abnormality detecting unit 461 and the second abnormality detecting unit 462 are respectively referred to. In FIG. 4, the other configuration of the drawing device 1 connected to the head abnormality detecting unit 46 is also shown.
其次,一方面參照圖5一方面對描繪裝置1中之數個描繪頭31之檢查之流程進行說明。描繪裝置1中,首先,藉由移動機構22使載置台21移動,如圖6所示,光量感測器44位於最靠(+X)側之描繪頭31之正下方(即,(-Z)側)(步驟S11)。於以下之說明中,將圖6所示之光量感測器44之位置稱為「描繪光量測定位置」。描繪光量測定位置係相對於位於最靠(+X)側之描繪頭31而相 對固定之位置。 Next, on the one hand, the flow of inspection of the plurality of drawing heads 31 in the drawing device 1 will be described with reference to FIG. 5. In the drawing device 1, first, the mounting table 21 is moved by the moving mechanism 22, and as shown in Fig. 6, the light amount sensor 44 is located directly below the drawing head 31 on the (+X) side (i.e., (-Z) ) side) (step S11). In the following description, the position of the light amount sensor 44 shown in FIG. 6 is referred to as a "drawing light amount measurement position". The light measurement position is drawn with respect to the drawing head 31 located on the most (+X) side. The fixed position.
若光量感測器44位於描繪光量測定位置,則圖2所 示之最靠(+X)側之描繪頭31之光源32被點亮,來自光源32之光經由照明光學系統33、空間光調變元件34及投影光學系統35而被導引至圖6所示之位於描繪光量測定位置之光量感測器44。光量感測器44接收來自投影光學系統35之光,且取得該光之光量(步驟S12)。於以下之說明中,將藉由位於描繪光量測定位置之光量感測器44所接收之來自投影光學系統35之光之光量(即,照度)稱為「描繪光量」。描繪頭31中,以使描繪光量與既定之目標光量(例如,於基板9上描繪案時之光量)相等之方式,調整供給至光源32之電流。 If the light amount sensor 44 is located at the position where the light amount is measured, then FIG. 2 The light source 32 of the drawing head 31 on the most (+X) side is illuminated, and the light from the light source 32 is guided to the light source 33 through the illumination optical system 33, the spatial light modulation element 34, and the projection optical system 35. The light amount sensor 44 is shown at the position where the light amount is measured. The light amount sensor 44 receives the light from the projection optical system 35 and acquires the amount of light of the light (step S12). In the following description, the amount of light (i.e., illuminance) of the light from the projection optical system 35 received by the light amount sensor 44 at the position where the light amount is measured is referred to as "the amount of light to be drawn". In the drawing head 31, the current supplied to the light source 32 is adjusted so that the amount of drawing light is equal to a predetermined amount of target light (for example, the amount of light when the substrate 9 is drawn on the substrate).
若取得圖6中之最靠(+X)側之描繪頭31之描繪光 量,則光量感測器44與載置台21一併藉由第2移動機構24而向(-X)方向移動,且位於3個描繪頭31中之中央之描繪頭31之正下方。換言之,光量感測器44位於下一個描繪頭31之描繪光量測定位置(步驟S13、S11)。若光量感測器44位於下一個描繪光量測定位置,則中央之描繪頭31之光源32被點亮,藉由光量感測器44而接收該描繪頭31之來自投影光學系統35之光,且取得該光之光量即描繪光量(步驟S12)。繼而,以使描繪光量與上述目標光量相等之方式,調整供給至光源32之電流。 If the drawing light of the drawing head 31 on the (+X) side of the most (+X) side in Fig. 6 is obtained The amount of light sensor 44 is moved in the (-X) direction by the second moving mechanism 24 together with the mounting table 21, and is located directly below the drawing head 31 in the center of the three drawing heads 31. In other words, the light amount sensor 44 is located at the drawing light amount measurement position of the next drawing head 31 (steps S13, S11). When the light amount sensor 44 is located at the next drawing light amount measuring position, the light source 32 of the central drawing head 31 is illuminated, and the light from the projection optical system 35 of the drawing head 31 is received by the light amount sensor 44, and The amount of light of the light, that is, the amount of light to be drawn is obtained (step S12). Then, the current supplied to the light source 32 is adjusted so that the amount of drawing light is equal to the amount of the target light.
於描繪裝置1中,光量感測器44係依序移動至與數 個描繪頭31對應之數個描繪光量測定位置,而依序取得數個描繪頭31之描繪光量,且以使描繪光量與目標光量相等之方式,調整供給至光源32之電流(步驟S11~S13)。數個描繪頭31之各者之描 繪光量係自光量感測器44被傳輸至圖4所示之頭異常檢測部46之第1異常檢測部461。被傳輸至第1異常檢測部461之數個描繪頭31之描繪光量與目標光量大致相等。 In the drawing device 1, the light amount sensor 44 is sequentially moved to the number The plurality of drawing light amount measurement positions corresponding to the drawing head 31 are sequentially obtained, and the drawing light amounts of the plurality of drawing heads 31 are sequentially acquired, and the current supplied to the light source 32 is adjusted so that the drawing light amount is equal to the target light amount (steps S11 to S13). ). Several depictions of each of the heads 31 The amount of light is transmitted from the light amount sensor 44 to the first abnormality detecting unit 461 of the head abnormality detecting unit 46 shown in Fig. 4 . The amount of drawing light of the plurality of drawing heads 31 transmitted to the first abnormality detecting unit 461 is substantially equal to the target light amount.
若取得數個描繪頭31之描繪光量,則光量感測器44 藉由第2移動機構24而向(+X)方向移動,且如圖1及圖2所示,位於檢查頭41之正下方(即,(-Z)側)(步驟S14)。於以下之說明中,將圖1及圖2所示之光量感測器44之位置稱為「中間光量測定位置」。中間光量測定位置係相對於檢查頭41而預先設定之相對位置。 When the amount of drawing light of the plurality of drawing heads 31 is obtained, the light amount sensor 44 The second moving mechanism 24 moves in the (+X) direction, and as shown in FIGS. 1 and 2, is located immediately below the inspection head 41 (that is, on the (-Z) side) (step S14). In the following description, the position of the light amount sensor 44 shown in FIGS. 1 and 2 is referred to as "intermediate light amount measurement position". The intermediate light amount measurement position is a relative position set in advance with respect to the inspection head 41.
於描繪裝置1中,中間光量測定位置、及與數個描繪 頭31分別對應之數個描繪光量測定位置係配置於與X方向平行之大致直線上。第2移動機構24係藉由使載置台21相對於檢查頭41及數個描繪頭31於X方向相對移動,而使光量感測器44於中間光量測定位置與數個描繪光量測定位置之間移動之感測器移動機構。 In the drawing device 1, the intermediate light amount measurement position, and a plurality of depictions The plurality of drawing light amount measurement positions corresponding to the heads 31 are arranged on a substantially straight line parallel to the X direction. The second moving mechanism 24 moves the light amount sensor 44 between the intermediate light amount measuring position and the plurality of drawing light amount measuring positions by relatively moving the mounting table 21 in the X direction with respect to the inspection head 41 and the plurality of drawing heads 31. Moving sensor moving mechanism.
若光量感測器44位於中間光量測定位置,則各採光 頭42藉由採光頭移動機構45而下降,且如圖2中實線所示,插入至對應之描繪頭31之光路上(步驟S15)。繼而,於數個描繪頭31中之1個描繪頭31中,光源32被點亮,於其他描繪頭31中,光源32被熄滅。例如,僅最靠(+X)側之描繪頭31之光源32被點亮,其他描繪頭31之光源32被熄滅。繼而,藉由插入至光源32已被點亮之描繪頭31之光路上之採光頭42而捕捉來自該光源32之光之一部分。由採光頭42捕捉之光藉由與該採光頭42對應之測定光學系統(即,與該採光頭42連接之束纖維43及檢查頭41)而被導引至位於中間光量測定位置之光量感測器44,且藉由該光量感測器44而受光。於以下之說明中,將藉由位於中間光量測定位置之光量 感測器44接收之來自測定光學系統之光之光量(即,照度)稱為「中間光量」。 If the light amount sensor 44 is located at the intermediate light amount measuring position, each lighting The head 42 is lowered by the head moving mechanism 45, and as shown by the solid line in Fig. 2, is inserted into the optical path of the corresponding drawing head 31 (step S15). Then, in one of the plurality of drawing heads 31, the light source 32 is turned on, and in the other drawing head 31, the light source 32 is turned off. For example, only the light source 32 of the drawing head 31 closest to the (+X) side is illuminated, and the light source 32 of the other drawing head 31 is extinguished. A portion of the light from the source 32 is then captured by insertion into the head 42 on the optical path of the drawing head 31 that has been illuminated by the source 32. The light captured by the lighting head 42 is guided to the light amount at the intermediate light amount measuring position by the measuring optical system corresponding to the lighting head 42 (that is, the beam fiber 43 and the inspection head 41 connected to the lighting head 42). The detector 44 is received by the light amount sensor 44. In the following description, the amount of light at the position where the intermediate light is measured is The amount of light (i.e., illuminance) received by the sensor 44 from the measuring optical system is referred to as "intermediate light amount".
若取得最靠(+X)側之描繪頭31之中間光量,則3個 描繪頭31中之中央之描繪頭31之光源32被點亮,其他描繪頭31之光源32被熄滅。繼而,與上述同樣地,藉由插入至中央之描繪頭31之光路上之中央之採光頭42而捕捉來自該描繪頭31之光源32之光之一部分。由採光頭42捕捉之光藉由與該採光頭42對應之測定光學系統而被導引至位於中間光量測定位置之光量感測器44。來自測定光學系統之光藉由光量感測器44而受光,藉此取得中央之描繪頭31之中間光量。 If the amount of intermediate light of the drawing head 31 on the (+X) side is obtained, then 3 The light source 32 of the drawing head 31 in the center of the drawing head 31 is illuminated, and the light source 32 of the other drawing head 31 is turned off. Then, in the same manner as described above, a part of the light from the light source 32 of the drawing head 31 is captured by the head 42 inserted in the center of the optical path of the central drawing head 31. The light captured by the lighting head 42 is guided to the light amount sensor 44 located at the intermediate light amount measuring position by the measuring optical system corresponding to the lighting head 42. The light from the measuring optical system is received by the light amount sensor 44, thereby obtaining the intermediate light amount of the central drawing head 31.
描繪裝置1中,對數個描繪頭31之各者以上述順序 依序取得中間光量(步驟S16)。於對數個描繪頭31依序取得中間光量之期間,光量感測器44並未自中間光量測定位置移動。數個描繪頭31之各者之中間光量係被傳輸至圖4所示之頭異常檢測部46之第1異常檢測部461及第2異常檢測部462。各描繪頭31之中間光量為描繪光量以下。於各描繪頭31中,中間光量例如為描繪光量之10%以上100%以下。再者,數個描繪頭31之中間光量並非必須彼此相等。 In the drawing device 1, each of the plurality of drawing heads 31 is in the above order The amount of intermediate light is sequentially obtained (step S16). While the number of intermediate light amounts is sequentially acquired by the plurality of drawing heads 31, the light amount sensor 44 does not move from the intermediate light amount measuring position. The intermediate light amount of each of the plurality of drawing heads 31 is transmitted to the first abnormality detecting unit 461 and the second abnormality detecting unit 462 of the head abnormality detecting unit 46 shown in Fig. 4 . The amount of intermediate light in each of the drawing heads 31 is equal to or less than the amount of light to be drawn. In each of the drawing heads 31, the amount of intermediate light is, for example, 10% or more and 100% or less of the amount of light to be drawn. Furthermore, the amount of intermediate light of the plurality of drawing heads 31 does not have to be equal to each other.
若完成各描繪頭31之中間光量之取得,則數個採光 頭42藉由採光頭移動機構45而上升,且自數個描繪頭31之光路上脫離(步驟S17)。繼而,藉由頭異常檢測部46之第1異常檢測部461,根據各描繪頭31之中間光量與描繪光量而檢測各描繪頭31之異常。具體而言,首先,根據來自光量感測器44之輸出,藉由第1異常檢測部461求出描繪頭31之描繪光量相對於中間光量之 比例(以下,稱為「測定光量比例」)。於第1異常檢測部461中,預先記憶有描繪頭31於正常狀態下之測定光量比例即基準光量比例。 If the intermediate light amount of each drawing head 31 is obtained, several lightings are completed. The head 42 is raised by the head moving mechanism 45, and is detached from the optical path of the plurality of drawing heads 31 (step S17). Then, the first abnormality detecting unit 461 of the head abnormality detecting unit 46 detects an abnormality of each of the drawing heads 31 based on the intermediate light amount and the amount of drawing light of each of the drawing heads 31. Specifically, first, based on the output from the light amount sensor 44, the first abnormality detecting unit 461 obtains the amount of the drawing light of the drawing head 31 with respect to the intermediate light amount. The ratio (hereinafter referred to as "measurement light amount ratio"). In the first abnormality detecting unit 461, the reference light amount ratio which is the ratio of the measured light amount in the normal state of the drawing head 31 is stored in advance.
於第1異常檢測部461中,若測定光量比例小於基準 光量比例,則判定於描繪頭31之較採光頭42之插入位置更靠後之構成中,因經年劣化或異物之附著等而產生光學特性之劣化。所謂較採光頭42之插入位置更靠後之構成係投影光學系統35、及該插入位置與投影光學系統35之間之構成。於圖2所示之例中,其係照明光學系統33之透鏡332及反射鏡333、空間光調變元件34、及投影光學系統35。於第1異常檢測部461中,若測定光量比例較基準光量比例小既定之值(例如,基準光量比例之10%)以上,則檢測出描繪頭31之較採光頭42之插入位置更靠後之構成中之光學特性之異常。由第1異常檢測部461檢測之描繪頭31之異常主要係為了使光進行空間調變而被頻繁地驅動之空間光調變元件34之異常。由第1異常檢測部461檢測出之描繪頭31之異常係藉由對監控器之顯示或警告聲等通知手段而被通知給作業者。 In the first abnormality detecting unit 461, when the measured light amount ratio is smaller than the reference In the light amount ratio, it is determined that the optical head is deteriorated due to deterioration over time, adhesion of foreign matter, or the like, in the configuration in which the drawing head 31 is positioned further rearward than the optical head 42. The configuration in which the insertion position of the optical head 42 is further rearward is the configuration between the projection optical system 35 and the insertion position and the projection optical system 35. In the example shown in FIG. 2, it is a lens 332 and a mirror 333 of the illumination optical system 33, a spatial light modulation element 34, and a projection optical system 35. In the first abnormality detecting unit 461, when the measured light amount ratio is smaller than the reference light amount ratio (for example, 10% of the reference light amount ratio), it is detected that the drawing head 31 is inserted later than the light collecting head 42. An abnormality in optical characteristics in the configuration. The abnormality of the drawing head 31 detected by the first abnormality detecting unit 461 is mainly an abnormality of the spatial light modulation element 34 that is frequently driven to spatially modulate light. The abnormality of the drawing head 31 detected by the first abnormality detecting unit 461 is notified to the operator by means of a notification means such as display of a monitor or a warning sound.
於頭異常檢測部46中,又藉由第2異常檢測部462, 根據各描繪頭31之中間光量、及各描繪頭31之供給至光源32之電流而檢測各描繪頭31之異常(步驟S18)。具體而言,首先,根據來自光量感測器44之輸出,進行中間光量與理想光量之比較。作為理想光量,預先設定以電流及時間為變數之理想劣化函數。於測定中間光量時,由於供給至光源32之電流為固定值,故而理想光量成為以時間為變數之函數。中間光量亦同樣地,由以時間為變數之函數表示,且求出中間光量相對於理想光量之比例。繼而,若該 比例未滿既定之值(例如,10%),則檢測出於描繪頭31之較採光頭42之插入位置更近前之構成中之除光源32外之構成(即,照明光學系統33)的光學特性之異常。由第2異常檢測部462檢測出之異常藉由對監控器之顯示或警告聲等通知手段而通知作業者。再者,中間光量與理想光量之比較亦可於未以使描繪光量與目標光量相等之方式調整供給至光源32之電流之狀態下進行。 The head abnormality detecting unit 46 is further provided by the second abnormality detecting unit 462. The abnormality of each drawing head 31 is detected based on the amount of intermediate light of each drawing head 31 and the current supplied to the light source 32 by each drawing head 31 (step S18). Specifically, first, based on the output from the light amount sensor 44, the comparison between the intermediate light amount and the ideal light amount is performed. As the ideal light amount, an ideal deterioration function with current and time as variables is set in advance. When the amount of intermediate light is measured, since the current supplied to the light source 32 is a fixed value, the ideal amount of light becomes a function of time. Similarly, the amount of intermediate light is expressed by a function of time as a function, and the ratio of the amount of intermediate light to the amount of ideal light is obtained. Then, if If the ratio is less than a predetermined value (for example, 10%), the optical configuration of the configuration other than the light source 32 (i.e., the illumination optical system 33) in the configuration of the drawing head 31 closer to the insertion position of the head 42 is detected. Anomalous characteristics. The abnormality detected by the second abnormality detecting unit 462 is notified to the operator by a notification means such as a display of the monitor or a warning sound. Further, the comparison between the intermediate light amount and the ideal light amount may be performed in a state where the current supplied to the light source 32 is not adjusted so that the amount of the drawn light is equal to the target light amount.
又,於第2異常檢測部462中,將以使描繪光量與目 標光量相等之方式調整後之電流值(供給至光源32之電流)、與光源32之最大額定電流加以比較。繼而,於供給至光源32之電流以最大額定電流為基準而大出某程度以上之情形,檢測出光源32之異常,且藉由對監控器之顯示或警告聲等通知手段而被通知給作業者。光源32之異常之通知係,例如,亦可根據供給至光源32之電流之大小而分為「服務請求」及「要交換」之2階段。 Further, in the second abnormality detecting unit 462, the amount of light to be drawn is displayed. The adjusted current value (current supplied to the light source 32) in a manner equal to the amount of light is compared with the maximum rated current of the light source 32. Then, when the current supplied to the light source 32 is larger than the maximum rated current, the abnormality of the light source 32 is detected, and the operation is notified to the operation by means of a notification means such as display or warning sound of the monitor. By. The notification of the abnormality of the light source 32 may be divided into two stages of "service request" and "to be exchanged" depending on the magnitude of the current supplied to the light source 32, for example.
如以上所說明,描繪裝置1之檢查部4具備:光量感 測器44,其在位於描繪光量測定位置時接收描繪頭31之來自投影光學系統35之光;第2移動機構24,其使光量感測器44在描繪光量測定位置與中間光量測定位置之間移動;採光頭42,其插入至描繪頭31之光路上而捕捉自光源32射向空間光調變元件34之光之至少一部分;測定光學系統(即,束纖維43及檢查頭41),其將由採光頭42捕捉之光導引至位於中間光量測定位置之光量感測器44;及採光頭移動機構45,其使採光頭42插入至上述光路上,又使該採光頭42自該光路上脫離。 As described above, the inspection unit 4 of the drawing device 1 is provided with a sense of light quantity The detector 44 receives the light from the projection optical system 35 of the drawing head 31 when it is located at the drawing light amount measuring position, and the second moving mechanism 24 causes the light amount sensor 44 between the drawing light amount measuring position and the intermediate light amount measuring position. Moving; the lighting head 42 is inserted into the optical path of the drawing head 31 to capture at least a portion of the light that is directed from the light source 32 toward the spatial light modulation element 34; the measuring optical system (ie, the beam fiber 43 and the inspection head 41) The light captured by the lighting head 42 is guided to the light amount sensor 44 at the intermediate light amount measuring position; and the head moving mechanism 45, which inserts the head 42 into the optical path, and causes the head 42 to follow the light path. Get rid of.
如此,於描繪裝置1中,由同一光量感測器44取得 描繪頭31之來自投影光學系統35之光之光量、及自描繪頭31之 光源32與空間光調變元件34之間取出之光之光量並加以比較。因此,即便於假設光量感測器44之光學特性變化之情形時,該光學特性之變化亦不會對上述光量之比較造成較大之影響。因此,於描繪頭31中,可精度良好地檢測於採光頭42之插入位置之前後之任一方是否產生光學特性之劣化。換言之,描繪裝置1可精度良好地檢測描繪頭31之劣化原因。 Thus, in the drawing device 1, the same light amount sensor 44 is obtained. The amount of light from the projection optical system 35 of the head 31 and the self-drawing head 31 The amount of light taken out between the light source 32 and the spatial light modulation element 34 is compared and compared. Therefore, even if the optical characteristics of the light amount sensor 44 are changed, the change in the optical characteristics does not greatly affect the comparison of the above-described amounts of light. Therefore, in the drawing head 31, whether or not the optical characteristics are deteriorated can be accurately detected before or after the insertion position of the lighting head 42. In other words, the drawing device 1 can accurately detect the cause of deterioration of the drawing head 31.
又,由於可藉由採光頭移動機構45進行採光頭42之 移動,故而可不打開描繪裝置1之外殼(圖示省略)而進行描繪頭31之檢查。其結果為,可降低隨著外殼之打開而產生之描繪裝置1內之污染。 Moreover, since the lighting head 42 can be performed by the polishing head moving mechanism 45 Since it is moved, the inspection of the drawing head 31 can be performed without opening the outer casing (not shown) of the drawing device 1. As a result, contamination in the drawing device 1 caused by the opening of the outer casing can be reduced.
如上所述,於描繪裝置1中,具備根據中間光量及描 繪光量而檢測描繪頭31之異常之第1異常檢測部461。藉此,於描繪頭31中,可自動地檢測較採光頭42之插入位置更靠後之構成中之異常(尤其空間光調變元件34之異常)。又,於描繪裝置1中,具備根據中間光量及供給至光源32之電流而檢測描繪頭31之異常之第2異常檢測部462。藉此,於描繪頭31中,可自動地檢測較採光頭42之插入位置更近前之構成中之異常。 As described above, in the drawing device 1, it is provided based on the amount of intermediate light and The first abnormality detecting unit 461 that detects the abnormality of the drawing head 31 by detecting the amount of light. Thereby, in the drawing head 31, an abnormality in the configuration of the rear end of the insertion position of the optical head 42 (especially, the abnormality of the spatial light modulation element 34) can be automatically detected. Further, the drawing device 1 includes a second abnormality detecting unit 462 that detects an abnormality of the drawing head 31 based on the amount of intermediate light and the current supplied to the light source 32. Thereby, in the drawing head 31, the abnormality in the configuration closer to the insertion position of the optical head 42 can be automatically detected.
於描繪裝置1中,將光量感測器44設置於載置台21 上,且第2移動機構24使載置台21相對於描繪頭31進行相對移動,藉此光量感測器44在中間光量測定位置與描繪光量測定位置之間移動。藉此,可簡化描繪裝置1之構成。 In the drawing device 1, the light amount sensor 44 is placed on the mounting table 21 Further, the second moving mechanism 24 relatively moves the mounting table 21 with respect to the drawing head 31, whereby the light amount sensor 44 moves between the intermediate light amount measuring position and the drawing light amount measuring position. Thereby, the configuration of the drawing device 1 can be simplified.
又,如上所述,光量感測器44之受光面441與基板 9之上表面91關於上下方向位於大致相同之位置。即,自各描繪頭31之投影光學系統35之前端至位於描繪光量測定位置之光量感測 器44之受光面441之上下方向的距離、與自投影光學系統35之前端至基板9之上表面91之上下方向的距離大致相等。因此,藉由光量感測器44取得之各描繪頭31之描繪光量、與對基板9描繪時自各描繪頭31之投影光學系統35照射至基板9之上表面91之光之光量大致相等。因此,可藉由位於描繪光量測定位置之光量感測器44而容易地測定於基板9上描繪圖案時之基板9上之光量。繼而,藉由於描繪光量測定位置將由光量感測器44取得之描繪光量調整為目標光量,而可容易地將來自描繪頭31之光之於基板9上之光量調整為所需之光量。 Further, as described above, the light receiving surface 441 of the light amount sensor 44 and the substrate The upper surface 91 is located at substantially the same position with respect to the up and down direction. That is, the light amount sensing from the front end of the projection optical system 35 of each drawing head 31 to the position where the light amount is measured is The distance from the upper surface of the light receiving surface 441 of the device 44 is substantially equal to the distance from the front end of the projection optical system 35 to the upper and lower surfaces of the upper surface 91 of the substrate 9. Therefore, the amount of light to be drawn by each of the drawing heads 31 obtained by the light amount sensor 44 is substantially equal to the amount of light that is irradiated onto the upper surface 91 of the substrate 9 by the projection optical system 35 of each drawing head 31 when the substrate 9 is drawn. Therefore, the amount of light on the substrate 9 when the pattern is drawn on the substrate 9 can be easily measured by the light amount sensor 44 located at the position where the light amount is measured. Then, by adjusting the amount of drawing light acquired by the light amount sensor 44 to the target light amount by the light amount measuring position, the amount of light from the drawing head 31 on the substrate 9 can be easily adjusted to a desired amount of light.
描繪裝置1中,描繪頭31之照明光學系統33具備積 分器331,檢查部4之採光頭42插入至自積分器331至空間光調變元件34之光路上。即,採光頭42插入至藉由積分器331而使均勻性提高後之光中。因此,即便為採光頭42之插入位置於與描繪頭31之光軸垂直之方向上產生若干偏移之情形,亦可抑制藉由採光頭42捕捉且藉由光量感測器44接收之光之光量之變化。藉此,可提高由檢查部4對描繪頭31之檢查精度。 In the drawing device 1, the illumination optical system 33 of the drawing head 31 has a product The divider 331, the head 42 of the inspection unit 4 is inserted into the optical path from the integrator 331 to the spatial light modulation element 34. That is, the head 42 is inserted into the light whose uniformity is improved by the integrator 331. Therefore, even if the insertion position of the polishing head 42 is shifted in a direction perpendicular to the optical axis of the drawing head 31, the light captured by the lighting head 42 and received by the light amount sensor 44 can be suppressed. The change in the amount of light. Thereby, the inspection accuracy of the drawing head 31 by the inspection unit 4 can be improved.
如上所述,各描繪頭31中,自光源32射出之光係紫 外光。因此,照明光學系統33、空間光調變元件34及投影光學系統35之各構成之劣化變得較早。因此,可精度良好地檢測出描繪頭31之劣化原因之描繪裝置1之上述構造特別適合於自光源射出之光係紫外光之描繪裝置。 As described above, in each of the drawing heads 31, the light emitted from the light source 32 is purple. External light. Therefore, deterioration of the respective configurations of the illumination optical system 33, the spatial light modulation element 34, and the projection optical system 35 becomes earlier. Therefore, the above-described structure of the drawing device 1 capable of accurately detecting the cause of deterioration of the drawing head 31 is particularly suitable for a light-based ultraviolet light drawing device that is emitted from a light source.
描繪裝置1中,如上所述,由光量感測器44接收之 中間光量為描繪光量之10%以上100%以下。如此,藉由使中間光量為適當之光量範圍,可精度良好地進行描繪頭31之檢查。又, 於中間光量為描繪光量之10%以上100%以下之光量範圍內,檢查部4可適用於與描繪裝置1之投影光學系統35之倍率不同之其他描繪裝置。換言之,檢查部4可分別適用於投影光學系統35之倍率互不相同之數種描繪裝置。 The drawing device 1 is received by the light amount sensor 44 as described above. The amount of intermediate light is 10% or more and 100% or less of the amount of light to be drawn. As described above, the inspection of the drawing head 31 can be performed accurately by setting the intermediate light amount to an appropriate light amount range. also, The inspection unit 4 can be applied to other drawing devices different from the magnification of the projection optical system 35 of the drawing device 1 in a range of light amount in which the amount of intermediate light is 10% or more and 100% or less of the amount of light to be drawn. In other words, the inspection unit 4 can be applied to several kinds of drawing devices in which the magnifications of the projection optical system 35 are different from each other.
如上所述,於描繪部3中設置有數個描繪頭31,檢 查部4具備與各描繪頭31對應之採光頭42及測定光學系統。而且,數個測定光學系統共有檢查頭41,且將由各採光頭42捕捉之光導引至位於中間光量測定位置之光量感測器44。藉此,可簡化檢查部4之構造。又,可不使光量感測器44移動而取得數個描繪頭31之中間光量,故而可縮短數個描繪頭31之檢查所需之時間。進而,由於將中間光量測定位置及數個描繪光量測定位置配置於直線上,故而於檢查數個描繪頭31時,可簡化光量感測器44之移動。 As described above, a plurality of drawing heads 31 are provided in the drawing unit 3, and inspection is performed. The inspection unit 4 includes a lighting head 42 and a measuring optical system corresponding to each drawing head 31. Further, the plurality of measuring optical systems share the inspection head 41, and guide the light captured by each of the collecting heads 42 to the light amount sensor 44 located at the intermediate light amount measuring position. Thereby, the configuration of the inspection unit 4 can be simplified. Moreover, the amount of intermediate light of the plurality of drawing heads 31 can be obtained without moving the light amount sensor 44, so that the time required for the inspection of the plurality of drawing heads 31 can be shortened. Further, since the intermediate light amount measurement position and the plurality of drawing light amount measurement positions are arranged on a straight line, the movement of the light amount sensor 44 can be simplified when the plurality of drawing heads 31 are inspected.
於描繪裝置1中可進行各種變更。 Various changes can be made in the drawing device 1.
例如,光量感測器44並非必須設置於載置台21上,亦可自載置台21獨立而設置。又,自使載置台21相對移動之移動機構22獨立而使光量感測器44移動之感測器移動機構亦可設置於描繪裝置1。 For example, the light amount sensor 44 is not necessarily provided on the mounting table 21, and may be provided independently from the mounting table 21. Further, the sensor moving mechanism that moves the light amount sensor 44 independently of the moving mechanism 22 that moves the mounting table 21 may be provided in the drawing device 1.
檢查部4中,亦可設置與數個描繪頭31相同數目之數個檢查頭41。各檢查頭41係,例如,於對應之描繪頭31之(+X)側,配置於相對於該描繪頭31而相對設定之位置上。即,數個描繪頭31與數個檢查頭41於X方向上交替配置。而且,光量感測器44一方面於X方向移動,一方面依序取得各描繪頭31之描繪光量及中間光量。藉此,於描繪頭31與檢查頭41之數個組合中,可使連接描繪頭31與檢查頭41之束纖維43之長度大致相同。 In the inspection unit 4, a plurality of inspection heads 41 of the same number as the plurality of drawing heads 31 may be provided. Each of the inspection heads 41 is disposed at a position opposite to the drawing head 31, for example, on the (+X) side of the corresponding drawing head 31. That is, the plurality of drawing heads 31 and the plurality of inspection heads 41 are alternately arranged in the X direction. Further, the light amount sensor 44 moves in the X direction on the one hand, and sequentially acquires the amount of light and the amount of intermediate light of each of the drawing heads 31 on the one hand. Thereby, in the combination of the drawing head 31 and the inspection head 41, the length of the bundle fibers 43 connecting the drawing head 31 and the inspection head 41 can be made substantially the same.
於描繪裝置1中,光量感測器44係僅相對於描繪頭31及檢查頭41相對移動即可。例如,亦可光量感測器44並不移動,而描繪頭31及檢查頭41於光量感測器44之上方於X方向移動。該情形時,檢查頭41位於光量感測器44之正上方之狀態係光量感測器44位於中間光量測定位置之狀態。又,描繪頭31位於光量感測器44之正上方之狀態係光量感測器44位於描繪光量測定位置之狀態。 In the drawing device 1, the light amount sensor 44 may be relatively moved only with respect to the drawing head 31 and the inspection head 41. For example, the light amount sensor 44 may not move, and the drawing head 31 and the inspection head 41 move in the X direction above the light amount sensor 44. In this case, the state in which the inspection head 41 is located directly above the light amount sensor 44 is a state in which the light amount sensor 44 is located at the intermediate light amount measurement position. Further, in a state where the drawing head 31 is located directly above the light amount sensor 44, the light amount sensor 44 is in a state of drawing the light amount measuring position.
採光頭42並非必須緊靠積分器331之後而插入,只要插入至自積分器331至空間光調變元件34之光路上即可。但,如上所述,藉由將採光頭42緊靠積分器331之後而插入,即便為採光頭42之插入位置於與描繪頭31之光軸垂直之方向上產生若干偏移之情形時,亦可抑制藉由採光頭42捕捉而藉由光量感測器44接收之光之光量之變化。其結果為,可提高檢查部4對描繪頭31之檢查精度。 The head 42 is not necessarily inserted immediately after the integrator 331 and may be inserted into the optical path from the integrator 331 to the spatial light modulation element 34. However, as described above, by inserting the polishing head 42 against the integrator 331, even if the insertion position of the polishing head 42 is slightly offset in the direction perpendicular to the optical axis of the drawing head 31, The variation in the amount of light received by the light amount sensor 44 by the light collecting head 42 can be suppressed. As a result, the inspection accuracy of the drawing head 31 by the inspection unit 4 can be improved.
採光頭42係只要插入至自光源32至空間光調變元件34之光路上,則並非必須插入至自積分器331至空間光調變元件34之光路上。即便為該情形,如上所述,亦可精度良好地檢測出描繪頭31之劣化原因。 The lighting head 42 is not necessarily inserted into the optical path from the integrator 331 to the spatial light modulation element 34 as long as it is inserted into the optical path from the light source 32 to the spatial light modulation element 34. Even in this case, as described above, the cause of deterioration of the drawing head 31 can be accurately detected.
數個採光頭42並非必須同時於上下方向移動。例如,亦可於各採光頭42上設置採光頭移動機構45,數個採光頭42彼此獨立地於上下方向移動。換言之,各採光頭42向光路之插入及自光路之脫離亦可自其他採光頭42獨立而進行。 The plurality of lighting heads 42 do not have to move in the up and down direction at the same time. For example, the head moving mechanism 45 may be provided in each of the heads 42, and the plurality of heads 42 may be moved in the vertical direction independently of each other. In other words, the insertion of each of the daylighting heads 42 into the optical path and the detachment from the optical path can be performed independently of the other daylighting heads 42.
檢查部4中,亦可相對於數個描繪頭31而僅設置1個採光頭42。該情形時,使採光頭42於X方向移動而位於測定對 象之描繪頭31之正上方,且使採光頭42下降,藉此將採光頭42插入至該描繪頭31之光路上。 In the inspection unit 4, only one of the lighting heads 42 may be provided with respect to the plurality of drawing heads 31. In this case, the head 42 is moved in the X direction to be in the measurement pair. Immediately above the drawing head 31, the head 42 is lowered, whereby the head 42 is inserted into the optical path of the drawing head 31.
光源32並不限定於LED,例如,亦可將雷射二極體 (LD,Laser Diode)或高壓水銀燈等用作光源32。於使用高壓水銀燈作為光源32之情形時,於描繪頭31中,供給至光源32之電力將被調整。繼而,於步驟S18中,藉由第2異常檢測部462,根據各描繪頭31之中間光量、及各描繪頭31之供給至光源32之電力,檢測各描繪頭31之異常。於描繪裝置1中,用以代替由頭異常檢測部46對描繪頭31之異常之自動檢測,亦可根據自光量感測器44輸出之中間光量及描繪光量、及供給至光源32之電流或電力,由作業者檢測描繪頭31之異常。 The light source 32 is not limited to the LED, and for example, the laser diode can also be used. (LD, Laser Diode) or a high pressure mercury lamp or the like is used as the light source 32. In the case where a high pressure mercury lamp is used as the light source 32, the power supplied to the light source 32 in the drawing head 31 will be adjusted. Then, in step S18, the second abnormality detecting unit 462 detects an abnormality of each of the drawing heads 31 based on the intermediate light amount of each of the drawing heads 31 and the electric power supplied to the light source 32 by each of the drawing heads 31. In the drawing device 1 , instead of the automatic detection of the abnormality of the drawing head 31 by the head abnormality detecting unit 46 , the intermediate light amount and the amount of the drawn light output from the light amount sensor 44 and the current supplied to the light source 32 or In the electric power, the operator detects the abnormality of the drawing head 31.
各描繪頭31中,亦可代替DMD而設置例如光柵光 閥(GLV,grating light valve)(註冊商標)作為空間光調變元件34。描繪部3中,亦可僅設置1個描繪頭31。 In each of the drawing heads 31, for example, grating light may be provided instead of the DMD. A valve (GLV, grating light valve) (registered trademark) is used as the spatial light modulation element 34. In the drawing unit 3, only one drawing head 31 may be provided.
於描繪裝置1進行描繪之基板9並非必須限定於印刷 配線基板。於描繪裝置1中,亦可進行例如對半導體基板、液晶顯示裝置或電漿顯示裝置等平板顯示裝置用之玻璃基板、光罩用之玻璃基板、太陽電池板用之基板等之電路圖案之描繪。 The substrate 9 to be drawn by the drawing device 1 is not necessarily limited to printing. Wiring board. In the drawing device 1, for example, a circuit pattern such as a glass substrate for a flat panel display device such as a semiconductor substrate, a liquid crystal display device, or a plasma display device, a glass substrate for a photomask, or a substrate for a solar cell panel can be used. .
上述實施形態及各變形例中之構成於不相互矛盾之限度內亦可適當組合。 The configurations in the above-described embodiments and modifications may be combined as appropriate within the limits that do not contradict each other.
已詳細地描寫並說明了發明,但既已敍述之說明為例示而非限定性者。因此可說於不脫離本發明之範圍之限度內能有多數個變形或態樣。 The invention has been described and illustrated in detail, by way of illustration Therefore, many variations or aspects can be made without departing from the scope of the invention.
3‧‧‧描繪部 3‧‧‧Drawing Department
4‧‧‧檢查部 4‧‧‧ Inspection Department
21‧‧‧載置台 21‧‧‧ mounting table
31‧‧‧描繪頭 31‧‧‧Drawing head
32‧‧‧光源 32‧‧‧Light source
33‧‧‧照明光學系統 33‧‧‧Lighting optical system
34‧‧‧空間光調變元件 34‧‧‧Spatial light modulation components
35‧‧‧投影光學系統 35‧‧‧Projection optical system
41‧‧‧檢查頭 41‧‧‧Check head
42‧‧‧採光頭 42‧‧‧Lighting head
43‧‧‧束纖維 43‧‧‧Bundle fiber
44‧‧‧光量感測器 44‧‧‧Light quantity sensor
331‧‧‧積分器 331‧‧‧ integrator
332‧‧‧透鏡 332‧‧‧ lens
333‧‧‧反射鏡 333‧‧‧Mirror
441‧‧‧受光面 441‧‧‧Stained surface
Claims (30)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013199333A JP6116457B2 (en) | 2013-09-26 | 2013-09-26 | Drawing device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201516579A TW201516579A (en) | 2015-05-01 |
TWI539246B true TWI539246B (en) | 2016-06-21 |
Family
ID=52832437
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103128406A TWI539246B (en) | 2013-09-26 | 2014-08-19 | Drawing apparatus |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6116457B2 (en) |
KR (1) | KR101600187B1 (en) |
CN (1) | CN104991421B (en) |
TW (1) | TWI539246B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018020535A1 (en) * | 2016-07-25 | 2018-02-01 | 株式会社島津製作所 | Photometer |
JP6917751B2 (en) * | 2017-03-31 | 2021-08-11 | 株式会社Screenホールディングス | Drawing device |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60177623A (en) * | 1984-02-24 | 1985-09-11 | Hitachi Ltd | Exposure device |
JPS61267323A (en) * | 1985-05-22 | 1986-11-26 | Toshiba Corp | Exposing equipment for semiconductor device manufacture |
JPH07104203B2 (en) * | 1987-10-01 | 1995-11-13 | 株式会社ニコン | Lighting optics |
JP3376688B2 (en) * | 1993-10-06 | 2003-02-10 | 株式会社ニコン | Exposure apparatus and exposure method using the same |
JP3612903B2 (en) * | 1996-12-06 | 2005-01-26 | 株式会社ニコン | Aberration measuring method, aberration measuring apparatus, and exposure apparatus and device manufacturing method including the same |
JP4029134B2 (en) * | 1997-01-17 | 2008-01-09 | 株式会社ニコン | Projection exposure equipment |
US5978391A (en) * | 1997-07-18 | 1999-11-02 | Cymer, Inc. | Wavelength reference for excimer laser |
JP2000173893A (en) * | 1998-12-04 | 2000-06-23 | Nikon Corp | Projection exposure system and contamination discriminating method of optical element |
JP4289755B2 (en) * | 2000-02-24 | 2009-07-01 | キヤノン株式会社 | Exposure amount control method, device manufacturing method, and exposure apparatus |
TW200301848A (en) * | 2002-01-09 | 2003-07-16 | Nikon Corp | Exposure apparatus and exposure method |
JP2003324047A (en) * | 2002-04-26 | 2003-11-14 | Canon Inc | Device manufacturing device |
JP2006330163A (en) | 2005-05-24 | 2006-12-07 | Citizen Watch Co Ltd | Exposure device and manufacturing method for exposure device |
JP5182913B2 (en) * | 2006-09-13 | 2013-04-17 | 大日本スクリーン製造株式会社 | Pattern drawing apparatus and pattern drawing method |
JP4885029B2 (en) * | 2007-03-28 | 2012-02-29 | 株式会社オーク製作所 | Exposure drawing device |
JP2009174158A (en) | 2008-01-23 | 2009-08-06 | Ochiken Kk | Deformation analysis method associated with pile foundation and pile draft foundation for bearing horizontal force in multilayered ground, based on hybrid elastic theory |
JP5205101B2 (en) | 2008-03-28 | 2013-06-05 | 大日本スクリーン製造株式会社 | Pattern drawing apparatus and pattern drawing method |
CN101561636B (en) * | 2009-05-19 | 2011-06-29 | 上海微电子装备有限公司 | Device and method for controlling photoetching exposure dose |
CN102128678B (en) * | 2010-01-12 | 2013-07-17 | 上海微电子装备有限公司 | Device and method for measuring and correcting energy sensor |
CN102589686B (en) * | 2011-01-07 | 2014-04-16 | 上海微电子装备有限公司 | Calibration method of energy sensors |
CN102914945B (en) * | 2011-08-04 | 2015-05-13 | 上海微电子装备有限公司 | Distributed exposure dose control system and method |
CN202472238U (en) * | 2012-01-12 | 2012-10-03 | 合肥芯硕半导体有限公司 | Light energy monitoring system for lithography system |
-
2013
- 2013-09-26 JP JP2013199333A patent/JP6116457B2/en active Active
-
2014
- 2014-08-19 TW TW103128406A patent/TWI539246B/en active
- 2014-08-27 KR KR1020140112213A patent/KR101600187B1/en active IP Right Grant
- 2014-09-19 CN CN201410482524.9A patent/CN104991421B/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR20150034604A (en) | 2015-04-03 |
KR101600187B1 (en) | 2016-03-04 |
CN104991421B (en) | 2017-06-23 |
JP6116457B2 (en) | 2017-04-19 |
CN104991421A (en) | 2015-10-21 |
JP2015064525A (en) | 2015-04-09 |
TW201516579A (en) | 2015-05-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI592654B (en) | Inspection equipment and inspection methods | |
JP5481400B2 (en) | Micromirror device sorting method, micromirror device sorting apparatus, and maskless exposure apparatus | |
KR20160016571A (en) | Light source device and exposure device | |
TWI539246B (en) | Drawing apparatus | |
JP6655753B2 (en) | Micro LED array as illumination source | |
JP6917751B2 (en) | Drawing device | |
KR101338362B1 (en) | Digital Micro-mirror Device of Mirror defective detection system | |
JP6748428B2 (en) | Lithographic apparatus, article manufacturing method, stage apparatus, and measuring apparatus | |
JP6486167B2 (en) | Exposure apparatus, photometric apparatus for exposure apparatus, and exposure method | |
JP2009174957A (en) | Foreign matter detection method and foreign matter detector | |
JP2010016317A (en) | Exposure apparatus and method of manufacturing device | |
CN109932876B (en) | Measuring device, lithographic apparatus, method of manufacturing article, and measuring method | |
JP4037800B2 (en) | Illumination method, surface state detection method, and surface state detection device | |
JP2008140795A (en) | Stepper and method, and process for fabricating device | |
KR100550521B1 (en) | Facing exposure apparatus and glass arranger and arranging method of the same | |
CN220773415U (en) | Photomask inspection apparatus | |
US20240110844A1 (en) | Exposure apparatus and inspection method | |
JP2018159603A (en) | Projector, measuring device, system, and method for manufacturing goods | |
KR102040564B1 (en) | Performance inspection system of optical image stabilizer | |
JP2018112453A (en) | Projection device, measurement device, system, and method for manufacturing article | |
TW202024798A (en) | Optical device and exposure device confirms the exposure amount even during exposure of a substrate and the loss of the exposure amount can be reduced | |
TW202210207A (en) | Laser processing device and laser processing method | |
JP2023058264A (en) | Pupil observation method, imaging method and imaging device | |
JP2012255670A (en) | Macro inspection device | |
JP2019152819A (en) | Pattern drawing method and pattern drawing device |