TWI538266B - Package structure of light emitting device and connection substrate thereof - Google Patents

Description

Light-emitting element package structure and connection substrate thereof

The present invention relates to a light emitting device package structure and a connecting substrate thereof, and more particularly to a connecting substrate composed of different heat dissipating substrates and a package structure thereof.

Light-emitting diode wafers have been widely used in living environments due to their small size, high efficiency, long life, fast reaction time, high color rendering, and no mercury harmful to the environment. In addition, the global government's ban on mercury environmental protection policies has also driven manufacturers to invest in the development and application of white light-emitting diodes. At a time when the global environmental protection trend is on the rise, the LED industry is one of the most promising industries.

However, at present, most of the input power of the LED chip is converted into heat. For example, only about 20% of the input power of a general high-power LED chip is converted into light, and the remaining 80% is converted into heat. If these heats are not discharged to the outside in time, the grain boundary temperature of the light and short light-emitting diode wafers is too high, and the luminous efficiency and life are lowered. For example, a conventional light-emitting diode wafer generally uses sapphire as a substrate, and its sapphire has a heat transfer coefficient of only about 20 W/mK, and it is difficult to quickly discharge heat generated by the epitaxial layer. The conventional lead frame type or printed circuit board (PCB) type LED package structure, the package substrate and the package material are both poor in thermal conductivity such as plastic or resin. The material of the light-emitting diode wafer continuously generates heat energy when it emits light. Therefore, in the case where the heat cannot be quickly and efficiently dissipated, the accumulated heat will increase the temperature of the light-emitting diode wafer and affect the light-emitting diode wafer. Luminous efficiency and service life.

One of the objects of the present invention is to provide a light emitting device package structure and a connection substrate thereof to solve the limitations and disadvantages of the prior art.

A preferred embodiment of the present invention provides a connection substrate for carrying a light-emitting element. The hair joining substrate comprises a first heat dissipating substrate and a second heat dissipating substrate. The first heat dissipation substrate has at least a first through hole and a second through hole. The second heat dissipation substrate is at least partially filled in the first through hole and the second through hole of the first heat dissipation substrate, and the second heat dissipation substrate in the first through hole and the second heat dissipation substrate in the second through hole They are electrically disconnected from each other, wherein the heat dissipation coefficient of the first heat dissipation substrate and the second heat dissipation substrate is greater than 100 W/mk, and the second heat dissipation substrate has electrical conductivity.

A preferred embodiment of the present invention further provides a light emitting device package structure including the above connecting substrate and one or more light emitting elements. The illuminating element is disposed on the connecting substrate, wherein the illuminating element comprises a negative electrode and a positive electrode, and is electrically connected to the second heat dissipating substrate in the first through hole and the second through hole, respectively.

The light-emitting device package structure of the present invention utilizes a connection substrate composed of a first heat-dissipating substrate and a second heat-dissipating substrate having a high thermal conductivity, so that heat generated when the light-emitting element carried on the connection substrate is illuminated can be directly passed through The connection substrate conducts heat dissipation downward. In addition, the second heat dissipation substrate is electrically conductive, whereby the external power source is transmitted to the light emitting element through the second heat dissipation substrate. Therefore, the heat conduction and conduction design of the invention can effectively provide the maximum heat conduction area and improve the heat dissipation effect.

The present invention will be described in detail with reference to the preferred embodiments of the invention, It should be noted that the drawings are for illustrative purposes only and are not drawn to the original dimensions. In addition, certain terms are used throughout the description and the appended claims to refer to particular elements. Those of ordinary skill in the art should understand that the manufacturer may refer to the same component by different nouns. The scope of this specification and the subsequent patent application do not use the difference of the names as the means for distinguishing the elements, but the differences in the functions of the elements as the basis for the distinction. The term "including" as used throughout the specification and subsequent claims is an open term and should be interpreted as "including but not limited to".

Please refer to FIG. 1 , which is a schematic diagram of a light emitting device package structure and a connection substrate thereof according to a first preferred embodiment of the present invention. As shown in FIG. 1, the light emitting device package structure of the first preferred embodiment mainly includes a connection substrate 10 and a light emitting element 15. The connecting substrate 10 is used to carry the light emitting element 15 , and the connecting substrate 10 includes a first heat dissipating substrate 11 and a second heat dissipating substrate 12 . The heat dissipation coefficient of the first heat dissipation substrate 11 and the second heat dissipation substrate 12 is greater than 100 W/mk. In the preferred embodiment, the light-emitting element 15 is a light-emitting diode chip, but not limited thereto, and may be other light-emitting elements having heat dissipation requirements. Therefore, the heat generated by the light-emitting element 15 during light emission can directly conduct heat dissipation downward through the connection substrate 10, and since the first heat dissipation substrate 11 and the second heat dissipation substrate 12 have a high heat transfer coefficient, the light-emitting element 15 can be improved. heat radiation. In addition, as shown in FIG. 1 , the first heat dissipation substrate 11 has at least a first through hole 13 and a second through hole 14 . The first through hole 13 and the second through hole 14 of the preferred embodiment respectively have a vertical side wall, but the invention is not limited thereto, and may be, for example, a slanted side wall. In addition, the second heat dissipation substrate 12 is at least partially filled in the first through hole 13 and the second through hole 14 of the first heat dissipation substrate 11 . For example, in the preferred embodiment, the second heat dissipation substrate 12 fills the first through hole 13 and the second through hole 14. However, the present invention is not limited thereto. In other embodiments, the second heat dissipation substrate 12 does not need to fill the first through hole 13 and the second through hole 14 , and only needs to be partially filled in the first through hole 13 . The second through hole 14 is sufficient. Moreover, the second heat dissipation substrate 12 in the first through hole 13 and the second heat dissipation substrate 12 in the second through hole 14 are electrically disconnected from each other. Further, the second heat dissipation substrate 12 is electrically conductive, whereby the external power source is transmitted to the light-emitting element 15 through the second heat dissipation substrate 12. Since the second heat-dissipating substrate 12 serves as a conductive path, its electrical conductivity is preferably greater than 10 ^-6 Ω/cm. In this embodiment, the first heat dissipation substrate 11 may be a crucible, and the second heat dissipation substrate 12 may be a metal material having a high thermal conductivity, such as silver or aluminum, but not limited thereto.

The light-emitting device package structure and the connection substrate thereof of the present invention are not limited to the above embodiments, but have other different embodiments. In order to simplify the description and facilitate comparison, in the following preferred embodiments, the same elements are denoted by the same symbols. Please refer to FIG. 2, which is a schematic diagram of a light emitting device package structure and a connection substrate thereof according to a second preferred embodiment of the present invention. As shown in FIG. 2, the light-emitting device package structure of the second preferred embodiment includes a connection substrate 10 and a light-emitting element 20, wherein the light-emitting element 20 is a flip-chip LED. . The following is only a description of the main changes of the first preferred embodiment, and the same portions will not be described again. In the first portion, the second heat dissipating substrate 12 of the second preferred embodiment is directly under the light emitting element 20. Therefore, in the second preferred embodiment, the length of the conductive path of the light-emitting element 20 through the second heat-dissipating substrate 12 can be shorter than the length of the conductive path of the first preferred embodiment, thereby reducing the electrical resistance. In the second part, an insulating layer 16 is further included between the first heat dissipation substrate 11 and the second heat dissipation substrate 12 of the second preferred embodiment. Accordingly, in the case where the first heat dissipation substrate has electrical conductivity, the insulation layer 16 can electrically isolate the first heat dissipation substrate 11 and the second heat dissipation substrate 12 from the first through hole 13 and the second through hole. The second heat dissipation substrate 12 in the 14 is electrically connected to each other through the first heat dissipation substrate 11 . In addition, in the preferred embodiment, an electrostatic protection component 17 can be disposed in the first heat dissipation substrate 11. For example, in the second preferred embodiment, the electrostatic protection element 17 may be a buried Zener diode to prevent the light-emitting element 20 from being damaged by a surge or an excessive voltage. However, the electrostatic protection component 17 of the present invention is not limited thereto, and may be other components having an anti-surge function. It should be noted that the insulating layer 16 for electrically isolating the first heat-dissipating substrate 11 and the second heat-dissipating substrate 12, or the electrostatic protection element 17 for resisting the surge, may also be applied to the first product according to the requirements of the product. The preferred embodiment or other preferred embodiments of the invention are not limited to the second preferred embodiment.

It should be noted that in the second preferred embodiment, the position of the insulating layer 16 is not limited to the second drawing. Please refer to FIG. 3, which is a schematic diagram of a light emitting device package structure and a connection substrate thereof according to another embodiment of the second preferred embodiment of the present invention. As shown in FIG. 3, the insulating layer 16 may be provided not only on the side walls of the first through hole 13 and the second through hole 14, but also on the upper surface and the lower surface of the connection substrate 10. In other words, the insulating layer 16 may coat the first heat dissipation substrate 11 . Accordingly, the insulating layer 16 can be used to electrically isolate the first heat-dissipating substrate 11 from the second heat-dissipating substrate 12, and can electrically isolate the first heat-dissipating substrate 11 from the light-emitting element 20 and electrically isolate the first heat-dissipating base. The material 11 and other components (not shown) below the connection substrate 10.

Please refer to FIG. 4, which is a schematic diagram of a light emitting device package structure and a connection substrate thereof according to a third preferred embodiment of the present invention. As shown in FIG. 4, the light emitting device package structure of the third preferred embodiment includes a light emitting device 20 and a connecting substrate 10, and the light emitting device 20 is disposed on the connecting substrate 10. The light-emitting element 20 is the same as the second preferred embodiment, and is a flip-chip light-emitting diode chip. The structure of the light-emitting element 20 will be further described below with reference to the drawings. In the third preferred embodiment, the light-emitting element 20 includes a negative electrode 21, a positive electrode 22, a P-type doped layer 23, an active layer 24, an N-type doped layer 25, and a transparent substrate 26, but is not limited thereto. . Further, in order to increase the light extraction efficiency of the light-emitting element 20, a micro-protrusion structure (not shown) may be further formed on the surface of the N-type doping layer 25. Furthermore, in order to increase the luminous efficiency or to consider other factors, the light-emitting element 20 may further comprise other film layers (not shown), such as a common film layer such as an injection layer or a transmission layer. In addition, the negative electrode 21 of the light-emitting element 20 is electrically connected to the second heat-dissipating substrate 12 in the first through-hole 13 , and the positive electrode 22 of the light-emitting element 20 is electrically connected to the second heat-dissipating substrate 12 in the second through-hole 14 . . Accordingly, the external power source can transmit the external power signal expected to be supplied to the negative electrode 21 and the positive electrode 22 to the light emitting element 20 through the first through hole 13 and the second heat dissipation substrate 12 in the second through hole 14, respectively, to drive the light. Element 20. In the preferred embodiment, the light-emitting element 20 can be driven by an alternating current or a direct current. The connection substrate 10 of the preferred embodiment has the design of the first heat dissipation substrate 11 and the second heat dissipation substrate 12, and the second heat dissipation substrate 12 has a conductivity design, and can be matched with the flip chip light-emitting element 20, The package size of the light-emitting element 20 is effectively reduced to 3 mm ² or less, and in particular, it can be further reduced to 2 mm ² or less. In contrast, the conventional type of light-emitting device package structure is limited by the package wire, so that the package size of the conventional type generally needs to be larger than 3 mm ² . Therefore, the design of the heat conduction and the conduction of the preferred embodiment not only allows the light-emitting element 20 to be thermally conductive as a whole but is not limited to the through-conducting passage to achieve the maximum heat conduction area, and can effectively reduce the package size of the light-emitting element 20. .

Please refer to FIG. 5, which is a schematic diagram of a light emitting device package structure and a connection substrate thereof according to a fourth preferred embodiment of the present invention. As shown in FIG. 5, the light-emitting element package structure of the fourth preferred embodiment includes two light-emitting elements 201 and 202 and a connection substrate 10, wherein the light-emitting elements 201 and the light-emitting elements 202 are connected in series with each other. More specifically, the preferred embodiment uses the patterned conductive layer 27 disposed on one of the upper surfaces of the connection substrate 10 to be electrically connected to the positive electrode 22 of the light-emitting element 201 and the negative electrode 21 of the light-emitting element 202, respectively, to achieve series illumination. The effect of the element 201 and the light-emitting element 202. In addition, the second heat dissipation substrate 12 in the first through hole 13 of the connection substrate 10 is electrically connected to the negative electrode 21 of the light emitting element 201, and the second heat dissipation substrate 12 in the second through hole 14 of the connection substrate 10 is electrically connected. Connected to the positive electrode 22 of the light emitting element 202. Furthermore, the external power source can transmit the external power signal to the series connected light-emitting element 201 and the light-emitting element 202 through the first through-hole 13 and the second heat-dissipating substrate 12 in the second through-hole 14 respectively. Accordingly, the light emitting device package structure of the preferred embodiment utilizes the patterned conductive layer 27 on the connection substrate 10 to match the first through hole 13 of the connection substrate 10 and the second heat dissipation substrate 12 in the second through hole 14. The series connection of the light-emitting elements 201 and 202 can be easily realized without the need of a conventional package wire or an additional circuit converter, thereby achieving the effect of reducing the package size and reducing the manufacturing cost. It should be noted that, in order to simplify the description, the preferred embodiment takes two light-emitting elements as an example, but the present invention is not limited thereto, and three or more light-emitting elements may be connected in series to each other. Further, by connecting a plurality of light-emitting elements in series with each other, the light-emitting element of the light-emitting element package structure of the present invention can be operated at a high voltage.

Please refer to FIG. 6. FIG. 6 is a schematic diagram of a light emitting device package structure and a connection substrate thereof according to a fifth preferred embodiment of the present invention. As shown in FIG. 6, the light emitting device package structure of the fifth preferred embodiment includes two light emitting elements 201 and 202 and a connecting substrate 10, wherein the two light emitting elements 20 are connected to each other in series by the connecting substrate 10. More specifically, in the preferred embodiment, the negative electrode 21 of the light-emitting element 201 is electrically connected to the second heat-dissipating substrate 12 in the first through-hole 131 of the first heat-dissipating substrate 11, and the positive electrode of the light-emitting element 201 22 is electrically connected to the second heat dissipation substrate 12 in the second through hole 141 of the first heat dissipation substrate 11; and the first electrode 21 of the light emitting element 202 and the first through hole 132 of the first heat dissipation substrate 11 The second heat dissipating substrate 12 is electrically connected, and the positive electrode 22 of the light emitting element 202 is electrically connected to the second heat dissipating substrate 12 in the second through hole 142 of the connecting substrate 10 . In addition, the preferred embodiment further includes a patterned conductive layer 28 disposed on the lower surface of the connection substrate 10 for the second heat dissipation substrate 12 and the second through hole 141 of the first heat dissipation substrate 11 The second heat dissipating substrate 12 in the consistent perforation 132 is electrically connected. Accordingly, the preferred embodiment can connect the light-emitting element 201 and the light-emitting element 202 to each other in series through the connection substrate 10, without the need of a conventional package wire or an additional circuit converter, thereby reducing the package size. And reduce the cost of production. Also, the present invention is not limited to two light-emitting elements, but can be applied to a series design of three or more light-emitting elements.

Please refer to FIG. 7. FIG. 7 is a schematic diagram of a light emitting device package structure and a connection substrate thereof according to a sixth preferred embodiment of the present invention. As shown in FIG. 7, the light emitting device package structure of the sixth preferred embodiment includes a light emitting device 20 and a connecting substrate 10, and the light emitting device 20 is disposed on the connecting substrate 10, wherein the first through hole of the connecting substrate 10 is connected. 13 and the second through hole 14 respectively have an inclined side wall. More specifically, in the preferred embodiment, the inclined sidewalls of the first through hole 13 and the second through hole 14 may have inclined sidewalls of two different inclination angles, such that the first through hole 13 and the second through hole 14 The apertures on the surface of the first heat dissipation substrate 11 are larger than the apertures of the first through hole 13 and the second through hole 14 in the first heat dissipation substrate 11 respectively, and the apertures of the first through hole 13 and the second through hole 14 are respectively The surface of the first heat dissipation substrate 11 is tapered toward the inner side of the first heat dissipation substrate 11. Furthermore, the second heat dissipation substrate 12 is at least partially filled in the first through hole 13 and the second through hole 14 of the first heat dissipation substrate 11 . In other words, the second heat dissipation substrate 12 of the sixth preferred embodiment does not fill the first through hole 13 and the second through hole 14 , but only fills the first through hole 13 and the second through hole 14 and emits light. One side of element 20. However, the present invention is not limited thereto, and may be filled in the first through hole 13 and other portions in the second through hole 14 depending on product requirements. Accordingly, the preferred embodiment can not only transmit the heat generated by the light-emitting element 20 when the first heat-dissipating substrate 11 and the second heat-dissipating substrate 12 are transmitted through the high heat-conducting coefficient, but also can transmit heat through the first pass. The second heat dissipation substrate 12 having conductivity in the through hole 13 and the second through hole 14 supplies an external power source to the light emitting element 20. In addition, the preferred embodiment further includes a lens 18 disposed on the light-emitting element 20 and the connection substrate 10 for increasing the light extraction efficiency of the light-emitting element 20, thereby improving the light-emitting efficiency of the light-emitting element 20. The lens 18 may be in the shape of a half sphere, but the invention is not limited thereto, and may be other structures that contribute to improving the light extraction efficiency. In addition, in the conventional type of light-emitting element package structure, in order to make the connection between the lens and the substrate have sufficient physical strength, the lens often requires an additional cassette geometry, or a lens is fixed on the substrate to fix the lens. support. However, the form of the stent will be limited by The lens process causes the disadvantage that the brightness cannot be effectively optimized. In contrast, the lens 18 of the preferred embodiment has no other card-like geometry, and has only a plurality of protrusions 181 partially filled into the first through holes 13 and the second through holes 14 to make the lens 18 The protruding portion 181 is caught in the first through hole 13 and the second through hole 14, whereby the lens 18 is fixed to the connection substrate 10. Accordingly, the preferred embodiment utilizes the design of the first through hole 13 and the second through hole 14 to increase the physical strength of the connection between the lens 18 and the connection substrate 10 in the light emitting device package structure, and to increase the lens process adjustability. At the same time, the advantage of optimizing the luminance of the light-emitting element 20 can be achieved.

In summary, the light-emitting device package structure of the present invention utilizes a connection substrate composed of a first heat-dissipating substrate and a second heat-dissipating substrate having a high thermal conductivity to cause a light-emitting element carried on the connection substrate to be emitted. Heat can conduct heat directly downward through the connection substrate. In addition, the second heat dissipation substrate is electrically conductive, whereby the external power source is transmitted to the light emitting element through the second heat dissipation substrate. Accordingly, the heat conduction and conduction design of the present invention can effectively provide the maximum heat conduction area and enhance the heat dissipation effect. In addition, the present invention can be combined with a flip-chip light-emitting element to effectively reduce the package size of the light-emitting element. Furthermore, the plurality of light-emitting elements can be connected in series with each other or in series with each other through the connection substrate, without the need for a conventional package wire, and no additional circuit converter is required, thereby achieving a reduction in package size and a reduction in manufacturing cost. efficacy. In addition, by using the design of the first through hole and the second through hole, the physical strength of the connection between the lens and the connection substrate in the light emitting element package structure can be increased, the adjustability of the lens process can be increased, and the light emission brightness of the light emitting element can be effectively optimized.

The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

10‧‧‧Connecting substrate

11‧‧‧First heat sink substrate

12‧‧‧Second heat sink substrate

13‧‧‧First through hole

14‧‧‧Second through hole

15‧‧‧Lighting elements

16‧‧‧Insulation

17‧‧‧Electrostatic protection components

20‧‧‧Lighting elements

21‧‧‧negative

22‧‧‧ positive

23‧‧‧P type doping layer

24‧‧‧ active layer

25‧‧‧N-doped layer

26‧‧‧Transparent substrate

201‧‧‧Lighting elements

202‧‧‧Lighting elements

27‧‧‧ patterned conductive layer

28‧‧‧ patterned conductive layer

131‧‧‧First through hole

132‧‧‧First through hole

141‧‧‧Second through hole

142‧‧‧Second through hole

18‧‧‧ lens

181‧‧‧Protruding

FIG. 1 is a schematic view showing a light emitting device package structure and a connection substrate thereof according to a first preferred embodiment of the present invention.

2 is a schematic view showing a light emitting device package structure and a connection substrate thereof according to a second preferred embodiment of the present invention.

FIG. 3 is a schematic view showing a light emitting device package structure and a connection substrate thereof according to another embodiment of the second preferred embodiment of the present invention.

4 is a schematic view showing a light emitting device package structure and a connection substrate thereof according to a third preferred embodiment of the present invention.

FIG. 5 is a schematic view showing a light emitting device package structure and a connection substrate thereof according to a fourth preferred embodiment of the present invention.

Figure 6 is a schematic view showing a light-emitting device package structure and a connection substrate thereof according to a fifth preferred embodiment of the present invention.

Figure 7 is a schematic view showing a light-emitting device package structure and a connection substrate thereof according to a sixth preferred embodiment of the present invention.

10‧‧‧Connecting substrate

11‧‧‧First heat sink substrate

12‧‧‧Second heat sink substrate

13‧‧‧First through hole

14‧‧‧Second through hole

20‧‧‧Lighting elements

18‧‧‧ lens

181‧‧‧Protruding

Claims (15)

a connecting substrate for carrying a light-emitting component, the connecting substrate comprising: a first heat-dissipating substrate having at least a first through hole and a second through hole, wherein the first through hole and the second through hole respectively have At least one inclined sidewall, such that a diameter of the first through hole on the surface of the first heat dissipation substrate is larger than an aperture size of the first through hole in the first heat dissipation substrate, and the second through hole is in the first heat dissipation The aperture of the surface of the substrate is larger than the aperture of the second through hole in the first heat dissipation substrate, and the apertures of the first through hole and the second through hole are respectively from a surface of the first heat dissipation substrate. The inner surface of the first heat dissipation substrate is tapered; and a second heat dissipation substrate is at least partially filled in the first through hole and the second through hole of the first heat dissipation substrate, and the first through hole is The second heat dissipation substrate and the second heat dissipation substrate in the second through hole are electrically disconnected from each other, wherein the first heat dissipation substrate and the second heat dissipation substrate have a heat conduction coefficient greater than 100 W/mk. And the second heat dissipation substrate has electrical conductivity Sex. The connection substrate of claim 1, wherein the first heat dissipation substrate has electrical conductivity, and the first heat dissipation substrate and the second heat dissipation substrate further comprise an insulation layer for electrically isolating the first a heat dissipating substrate and the second heat dissipating substrate. The connection substrate according to claim 1, further comprising an electrostatic protection component disposed in the first heat dissipation substrate. The connection substrate of claim 3, wherein the electrostatic protection element comprises a Zener diode. The connection substrate according to claim 1, wherein the electrical conductivity of the second heat dissipation substrate is greater than 10 ^-6 Ω/cm. A light-emitting device package structure, comprising: the connection substrate according to any one of claims 1 to 5; one or a plurality of light-emitting elements disposed on the connection substrate, wherein the light-emitting element comprises a negative electrode and a positive electrode, respectively The first through hole is electrically connected to the second heat dissipation substrate in the second through hole; and a lens is disposed on the light emitting element and the connection substrate, and the lens has a plurality of protrusions, and the portion The first through hole and the second through hole are filled in to fix the lens. The light emitting device package structure according to claim 6, wherein the light emitting device is a flip chip LED chip. The light emitting device package structure according to claim 6, wherein the light emitting element is driven by an alternating current or a direct current. The light emitting device package structure according to claim 6, wherein the light emitting elements are serially connected to each other Connected. The light emitting device package structure according to claim 9, wherein the light emitting elements are connected to each other in series by the connection substrate. a connecting substrate for carrying a light-emitting component, the connecting substrate comprising: a first heat-dissipating substrate having at least a first through hole and a second through hole, wherein the first through hole and the second through hole respectively have At least one inclined sidewall, such that a diameter of the first through hole on the surface of the first heat dissipation substrate is different from an aperture size of the first through hole inside the first heat dissipation substrate, and the second through hole is at the first The aperture of the surface of the heat dissipation substrate is different from the aperture size of the second through hole inside the first heat dissipation substrate, wherein the first heat dissipation substrate has electrical conductivity; and a second heat dissipation substrate is at least partially filled with the first The first through hole and the second through hole of the heat dissipation substrate, and the second heat dissipation substrate in the first through hole and the second heat dissipation substrate in the second through hole are electrically disconnected from each other The heat dissipation coefficient of the first heat dissipation substrate and the second heat dissipation substrate is greater than 100 W/mk, and the second heat dissipation substrate has electrical conductivity; and an insulation layer disposed on the first heat dissipation substrate and the Between the second heat dissipation substrate, the The insulating layer is used to electrically isolate the first heat dissipation substrate from the second heat dissipation substrate. A light emitting device package structure comprising: the connection substrate according to claim 11; one or more light emitting elements disposed on the connection substrate, wherein the light emitting element The anode and the cathode are electrically connected to the first through hole and the second heat dissipation substrate in the second through hole respectively; and a lens is disposed on the light emitting element and the connecting substrate, and the lens is disposed on the connecting substrate And a plurality of protrusions partially filled into the first through hole and the second through hole for fixing the lens. The light emitting device package structure of claim 12, wherein the light emitting device is a flip chip LED chip. The light emitting device package structure of claim 12, wherein the light emitting element is driven by an alternating current or a direct current. The light emitting device package structure of claim 12, wherein the light emitting elements are connected to each other in series by the connection substrate.