TW201126776A - Solid-state lighting device and light source module - Google Patents

Abstract

The present invention relates to a solid-state lighting device capable of dissipating heat efficiently. The solid-state lighting device includes a solid-state lighting chip, a substrate, two conducting layers, and a heat sink. The substrate includes a first surface and a second surface opposite to the first surface. A groove is defined in the first surface to receive the solid-state lighting chip. The substrate further includes a through hole extending from the solid-state lighting chip to the second surface. The two conducting layers are electrically connected to the solid-state lighting chip and extend to the first surface of the substrate respectively, and separate from one another. The heat sink is filled in the hole and thermally contacts the solid-state lighting chip. In addition, a light source module including the solid-state lighting device is also related in the present invention.

Description

201126776 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a solid-state light-emitting element, and a light source module including the solid-state light-emitting element. [Prior Art] [0002] A Light Emitting Diode (LED) is a solid-state light-emitting element whose electrical, optical characteristics and lifetime are sensitive to temperature. Generally, higher temperatures result in low internal quantum effects and a much shorter lifetime; while semiconductor resistance decreases with increasing temperature, and slipping resistance will result in larger currents and more thermal energy, resulting in heat buildup. The occurrence of a phenomenon; this thermal destruction of the loop usually accelerates the destruction of the working efficiency of the light-emitting diode. As shown in FIG. 1, a typical light emitting diode 100 includes a package body 102, a light emitting diode chip 104 and a resin layer 106. The package body 102 is formed by injecting a plastic 1 022 onto a prefabricated metal frame 1 020. The LED substrate 104 is disposed on the metal frame 1 020 and electrically connected to the metal frame 1020. The resin layer 106 is electrically connected. The package body 102 is combined to seal the light emitting diode wafer 104. In operation, heat generated when the LED chip 104 emits light is dissipated via the metal frame 1 020. However, since the metal frame 1 020 is electrically connected to the light emitting diode wafer 104 as an electrode and used to dissipate the light emitting diode wafer 104, the thermal resistance of the light emitting diode 100 is increased on the one hand, thereby causing The overall heat dissipation performance of the light-emitting diode 100 is not good, and on the other hand, the thermal conductivity of the light-emitting diode 100 may be adversely affected. [0004] In view of the above, it is necessary to provide a solid-state light-emitting element with good heat dissipation performance 099101602 Form No. A0101 Page 4 / Total 30 Page 0992003133-0 201126776 [0005] [0006] 0007 [0007] A light source module for a solid state light emitting element. SUMMARY OF THE INVENTION A solid state light emitting device having good heat dissipation performance and a light source module including the solid state light emitting device will be described below by way of embodiments. A solid state light emitting device comprising a solid state light emitting chip, a substrate, two conductive layers, and a thermally conductive block. The substrate has a first surface and a second surface opposite to the first surface, the first surface defines a recess for receiving the solid-state light-emitting chip, and the substrate has a surface extending from the solid-state light-emitting chip to the second surface Through hole. The two conductive layers are electrically connected to the solid state light emitting chip and extend to the first surface of the substrate, respectively, and are isolated from each other. The thermally conductive block fills the via and forms thermal contact with the solid state light emitting wafer. And a light source module comprising at least one solid state light emitting element, a circuit board, and a heat sink. The solid state light emitting device comprises a solid state light emitting chip, a substrate, two conductive layers, and a thermally conductive block. The substrate has a first surface and a second surface opposite to the first surface, the first surface defines a recess for receiving the solid-state light-emitting chip, and the substrate has a solid-state light-emitting chip extending to the second surface Through hole in the surface. The two conductive layers are electrically connected to the solid state light emitting chip and extend to the first surface of the substrate, and are isolated from each other. The thermally conductive block fills the via and forms thermal contact with the solid state light emitting wafer. The circuit board is disposed adjacent to the first surface of the substrate and is in electrical contact with the two conductive layers, and the circuit board defines at least one optical through hole corresponding to the solid state light emitting chip, and the light emitted by the solid state light emitting chip can pass through the light through The holes are transmitted to the outside. The heat sink is located on a side of the substrate away from the circuit board and in thermal contact with the heat conducting block. 099101602 Form No. A0101 Page 5 / Total 30 Pages 0992003133-0 201126776 [0010] [0011] [0011] The solid-state light-emitting element has a groove and a through hole formed therein. The recess is configured to receive a solid-state light-emitting chip, the through-hole is filled with a heat-conducting block in thermal contact with the solid-state light-emitting chip, and the solid-state light-emitting chip extends to the two conductive layer pairs on the first surface by a bottom surface of the groove The power supply is such that the solid state light emitting element is thermally and electrically separated and has good heat dissipation performance. [Embodiment] Hereinafter, a detailed description of the embodiments of the present invention will be made in conjunction with the drawings. Referring to FIG. 2, a first embodiment of the present invention provides a solid state light emitting device 1 comprising a solid state light emitting wafer 11, a substrate 122, two conductive layers 120, a heat conducting block 15, and a light transmissive protective layer 17. The solid-state light-emitting chip 11 can be specifically an LED chip ij having an upper surface 110 and a lower surface 112 opposite to the upper surface 11 , and a positive electrode (not shown) and a first surface 110 are disposed on the upper surface 110 . Negative electrode (not shown). Specifically, the LED wafer 11 may include: a structure such as Ai.j.n Ga P(〇 X y (1 - x - y ) v

SxS Bu OSySl, x+ym or a threat such as AlInGaAs, an LED wafer containing phosphide or arsenide can emit visible light in the yellow to red wavelength range. Of course, the LED chip 11 may also be made of other materials such as a nitride semiconductor (InxA1yGa (bx_y)N, OSxU, x+y S 1 ). The substrate of the LED wafer 11 is an intrinsic semiconductor or an unintentionally doped semiconductor. The carrier concentration of the substrate is less than or equal to 5xl06cm-3, the lower the carrier concentration is, the lower the conductivity of the substrate is, so that the isolation current flows through the base 099101602 Form No. A0101 Page 6 / Total The effect of the bottom is 30 pages 0992003133-0 201126776, so the carrier concentration of the substrate is preferably less than or equal to 2 x 106 cm 3 . The substrate can be made of materials such as disaster spar, SiC, Si, ZnO, GaN, GaAs, GaP, AIN, etc., of course, the substrate can also be made of materials with better thermal conductivity and lower conductivity, such as diamonds. . [0012] The two conductive layers 120 are partially covered by the substrate 122 to support the substrate 122, respectively. The material of the substrate 122 may be liquid crystal polymer (LCP), or a thermoplastic resin such as phthalic acid resin, polybutylene terephthalate (PBT) or the like. Alternatively, the substrate 122 may be mixed with a white pigment material such as titanium oxide or aluminum oxide to increase its ability to withstand high temperatures while increasing its light reflection efficiency.

The base 122 has a first surface 1220 and a second surface 1222 opposite to the first surface 1220, and a side surface 1223 connecting the first and second surfaces 1220, 1222. The first surface 1 220 defines a recess 122A for receiving the solid-state light-emitting chip 11, and the base 122 has a bottom surface 1 224 corresponding to the recess 122A and a side surrounding the bottom surface 1224 and contacting the bottom surface. 1226. A through hole 122B is defined in the bottom surface 1224. The through hole 122B extends through the second surface 1222 and communicates with the groove 122A. It can be understood that the side 1226 of the substrate can be coated with a ref ive layer 13 to reflect the light emitted by the solid state light emitting wafer 11 out of the recess 122A. [0014] In this embodiment, the two conductive layers 120 are respectively bent. Specifically, the two conductive layers 120 extend from the bottom surface 1 224 of the recess 122A to the side surface 1223 of the base 122, and then Side 1 223 extends onto first surface 1 220 of substrate 122. The portion of the conductive layer 120 adjacent to the bottom surface 1224 of the recess 122A has a mounting surface 1200 exposed to the recess 122A. 099101602 Form No. A0101 Page 7 / Total 30 Page 0992003133-0 201126776 δ海女装面1200 s Xuan bottom 1224 is coplanar. In addition, the portion of the conductive layer i2 that covers the first surface 1220 has an end surface 12 0 2 exposed to the outside of the solid state light emitting device 10. It can be understood that the conductive layer 120 can also extend onto the first surface 1220 via other paths 'eg, extending from the bottom surface 1224 of the recess 122A along the side 1 226 of the recess 122A to the first surface 1220, or The bottom surface 1224 of the recess 122A extends to the interior of the base 122 and further extends to the first surface 1 220, which is not limited to the specific embodiment. The heat sink 15 is filled in the through hole 122B and has a contact surface 150 and a bottom surface 152 opposite to the contact surface 150. The through hole 122B may be a columnar through hole, such as a circular hole or a square hole. Correspondingly, the heat conducting block 15 may also be columnar, such as a circular or prismatic shape. In this embodiment, the heat conducting block 15 completely fills the through hole 122B, and the bottom surface 152 is coplanar with the second surface 1222 of the base 122. Preferably, the contact surface 150 of the heat conducting block 15 and the conductive layer 120 are mounted. Face 1200 is coplanar. [0015] The solid state light emitting wafer 11 is disposed in the recess 122A, and the heat conducting block 15 supports the solid state light emitting wafer 11. Specifically, the solid-state light-emitting wafer U is under the surface of the surface of the heat-conducting block 15 and is connected by using a thermal conductive adhesive such as Ag epoxy. The solid state light emitting wafer jj is in thermal contact with the thermally conductive bump 15. The solid-state light-emitting chip 11 and the heat-conducting block 15 may also be connected by a solder bonding process, in particular, a solder ball is disposed between the solid-state light-emitting chip 11 and the heat-conducting block 15 at a temperature of 230 〇C. The solder ball is smelted in the south furnace, and after cooling, the solid-state light-emitting chip 11 and the heat-conducting block 15 are connected together. It can be understood that the solid-state light-emitting chip 11 and the heat-conducting block 15 can also be connected by a eutectic process, specifically at 099101602, Form No. A0101, Page 8 / Total 30, 0992003133-0, 201126776. The solid-state light-emitting wafer 11 is pressed in an ultrasonic (u 11rason ic ) environment such that the solid-state light-emitting wafer 11 is bonded to the heat-conductive block 15 . The positive and negative electrodes of the solid state light-emitting wafer 11 are wire bonded to the mounting surface 1200 of the conductive layer 120. [0016] The light-transmissive protective layer 17 is used to fill the recess 122A to seal the solid-state light-emitting wafer 11. Specifically, the material of the light-transmitting protective layer 17 may be a resin, a silicone, an epoxy resin, a polymethyl methacrylate (PMMA), or a glass. In the embodiment, the light-transmissive protective layer 17 sufficiently fills the groove 122A and seals the bottom surface 1224 and the side surface 1226 of the groove. The filling height and the base 122 are A surface 1220 is flush. Further, the light-transmitting protective layer 17 may be filled with a light-converting substance such as phosphor powder or the like to convert the light emitted from the solid-state light-emitting wafer 11 into other color lights, and after being mixed and emitted. The phosphor powder may include red, yellow, and green phosphor powder, and the material may be Sulfides, Aluminates, Oxides, Siliconates, or Nitrides. )Wait. Specifically, the phosphor powder may be Ca2Al12〇i9:Mn, (Ca,

Sr,Ba)Al2〇4:Eu, Y3A15012Ce3+(YAG), Tb3Al5〇12: Ce3+(YAG), BaMgAl1〇〇i7:Eu2+(Mn2+),

Ca2Si5N8:Eu2 + , (Ca, Sr, Ba)S:Eu2 + , (Mg' Ca,Sr,Ba)2Si〇4: Eu2 +,(Mg,Ca,Sr,Ba)3Si2〇7: Eu2+, Ca8Mg( Si〇4)4Cl2: Eu2+, Y2〇2S: Eu3+, (Sr,

Ca, Ba) SiOyNz: Eu2 + , (Ca, Mg, Y) SiwAlx〇yNz: Eu2+, CdS, CdTe or CdSe, and the like. When working, the external power supply (not shown) is powered by the two conductive layers 12〇 to the solid state 099101602 Form No. A0101 0992003133-0 201126776. On the one hand, the light emitted by the solid-state light-emitting chip 11 is transmitted through the light-transmitting protective layer 17 and transmitted through the light-transmitting protective layer I7; the heat emitted from the solid-state light-emitting chip 11 can be conducted to the outside through the heat-conducting block 15 for heat dissipation. Since the two conductive layers 120 and the heat conducting block 丨5 are separated from each other, the path of conduction and heat conduction of the solid state light-emitting wafer 11 <is isolated from each other' does not interfere with each other. [0018] Referring to FIG. 3, a second embodiment of the present invention provides a solid state light emitting device 2, which is substantially the same as the solid state light emitting device 10 provided in the first embodiment, except that the height of the transparent protective layer 27 is filled. It is not flush with the first surface 2220 of the base 222, and is flush with the end surface 2202 of the conductive layer 22〇. The solid-state light-emitting element 20 can be combined with other external components (not shown), such as a light guide plate, etc., so that the light-transmissive protective layer 27 is in close contact with the external component. [0019] Referring to FIG. 4, a third embodiment of the present invention provides a solid state light emitting device 30 which is substantially the same as the solid state generating device 10 provided in the first embodiment, and does not have a ---: ::::; The light transmissive protective layer 37 seals the solid-state light-emitting chip 31 but does not seal the side surface 3226 of the recess 322A, and the light-transmitting protective layer 37 has a round crown shape. The heat conducting block 35 partially fills the through hole 322B of the base 322. The heat conducting block 35 forms a stepped surface away from the bottom surface 352 of the solid state light emitting chip 31 and the second surface 3222 of the base 322. [0020] 099101602 Referring to FIG. 5, a fourth embodiment of the present invention provides a solid state light emitting device 4A which is substantially the same as the solid state light emitting device 1A provided in the first embodiment, except that the substrate 422 is opened. The hole 422B has a T-shaped distribution. Specifically, the size of the through hole 422B adjacent to one end of the solid-state light-emitting chip 41 is larger than the size of one end away from the solid-state light-emitting chip 41. Correspondingly, the heat conducting block 45 0992003133-0 Form No. A0101 Page 10 / Total 30 pages 201126776 The shape of the through hole 422 配合 is sufficient to fill the through hole 422 Β, that is, the heat conducting block 45 is also distributed in a zigzag shape, which can be more stably The buckle is inserted into the through hole 422B of the base 422. [0021] Referring to FIG. 6, a fifth embodiment of the present invention provides a solid state light emitting device 50, which is substantially the same as the solid state light emitting device 10 provided in the first embodiment, except that the through hole 522B of the base 522 is provided. In an inverted T-shaped distribution, specifically, the through hole 522B is adjacent to the solid-state light-emitting chip 51. The size of the end is smaller than the size of the end of the solid-state light-emitting chip 51. Correspondingly, the heat conducting block 55 fills the through hole 5226 with the shape of the through hole 522B, that is, the heat conducting block 35 is also distributed in an inverted τ shape, and the heat conducting block 55 has a larger area away from one end of the solid state light emitting chip 51, which can be Thermal conduction is preferably performed. Further, the heat conducting block 55 extends away from one end of the solid state light emitting chip 51 to further extend the second surface 5222 of the base 522 such that the bottom surface 552 of the heat conducting block 55 forms a stepped surface with the first surface 5222. [0022] Referring to FIG. 7, a sixth embodiment of the present invention provides a solid state light emitting device 60, which is substantially the same as the solid state light emitting device 1A provided in the first embodiment, except that the through hole 622B is provided in the base 622. a stepped hole, comprising a first hole 622a adjacent to the solid state light emitting chip 61, a second hole 622b away from the solid state light emitting chip 51, and located between the first and second holes 622a, 622b and penetrating the first hole The third holes 622c of the second holes 622a, 622b, the first and second holes 622a, 622b are respectively larger in size than the third holes 622c. Preferably, the size of the second hole 622b is larger than the size of the first hole 622a. Correspondingly, the heat conducting block 65 fills the through hole 622B with the shape of the through hole 622B, that is, the heat conducting block 65 is also stepped. Further, the heat conducting block 65 is further extended away from one end of the solid state light emitting chip 61 and 099101602 Form No. A0101 Page 11 / Total 30 pages 0992003133-0 201126776 The second surface 6222 of the base 622 is protruded such that the bottom surface 652 of the heat conducting block 65 Forming a step surface with the first surface 6222 of the shai. In addition, the light-transmissive protective layer 67 seals the solid-state light-emitting chip 61 and fills the entire groove 622A, and further extends the end surface 6202 of the conductive layer 620 to form a circular crown shape. Referring to FIG. 8, the present invention further provides a light source module 7A. The light source module 70 can adopt any of the solid state light emitting elements 10 to 60 of the first to sixth embodiments. The light source module 70 will be described below by taking only the case of the solid state light emitting device 6 in the sixth embodiment as an example. [0024] The light source module 70 shown in FIG. 8 includes a solid state light emitting element 6A, a circuit board 72, and a heat sink 74. The solid state light emitting device 6 includes two conductive layers 620 and a portion of the substrate 622 covering the two conductive layers 620. [0025] The circuit board 72 has a third surface 720, and a fourth surface 720 opposite to the third surface 720. Surface 722. The circuit board 72 defines a light flux 724 corresponding to the transparent protective layer 67 inwardly from the third surface 720. During the aging, the circuit board 72 can be connected to the end surface 6202 of the conductive layer 620 by thermal reflow, and the transparent protective layer 67 penetrates the optical via 724 of the circuit board 72 and protrudes from the conductive layer 620. End face 6202. [0〇26] The heat sink 74 includes a base 740 and a plurality of heat sink fins 742 extending from the base 740 away from one end of the base 740. The susceptor 740 can be connected to the thermally conductive block 65 of the solid state light emitting device 60 by thermal reflow of solder balls. In this embodiment, the base 740 has a flat surface 744, and the solder ball is placed between the flat surface 744 and the bottom surface 652 of the heat conducting block 65. [0027] During operation, the circuit board 72 is powered by an external power source (not shown). The electric 099101602 form nickname A0101 page 12/total 30 page 0992003133-0 201126776 flows through two conductive layers 6 2 0 The solid-state light-emitting chip 61 $ t emits light from the solid-state light-emitting chip 61 through the light-transmitting protective layer 67; on the other hand, the solid-state light-emitting chip 6 emits light through the heat conducting block 65 to the heat sink 74 Carry out the dispersion & In terms of heat, the heat is transmitted [0028] Ο Since the two conductive layers 620 and the heat conducting block 65 are separated from each other, the path of the conductive and heat conduction of the solid hair stranded wafer 61 can be isolated from each other. Before the wafer 61 is powered to illuminate π, the heat generated by the solid-state wafer 61 can be dissipated through the heat-transfer block 65 to dissipate heat. The light source module 70 has better illumination at the same time. Better heat dissipation efficiency. [0029] Please refer to FIG. 9 'The present invention further provides a light source module 8 〇 comprising two solid-state light-emitting elements 50 ′ of a fifth embodiment, a circuit board 82 , and a heat sink 84 , wherein the heat sink 84 A pedestal 840 and a plurality of heat dissipation fins 842 are included. The light source module 80 is similar to the light source module 70 described above.

The difference is that the base 840 of the heat sink 84 defines a receiving slot 846 for receiving the heat conducting block 55. [0030] The number of the receiving slots 846 corresponds to the number of solid state light emitting elements 50, specifically two, and is disposed on the plane 844 of the base 840. In addition, the optical through hole 824 formed in the circuit board 82 cooperates with the opening of the recess 522 in the solid state light emitting element 50, so that the light emitted from the solid state light emitting chip 51 passes through the optical through hole 824 and exits to the outside. The heat receiving block 55 of the solid state light emitting device 50 protrudes from the bottom surface 552 of the base 522. Therefore, the two receiving grooves 846 can receive the portion of the corresponding heat conducting block 55 protruding from the bottom surface 552 therein, thereby increasing the The heat conducting block 55 and the heat sink 099101602 form number Α 0101 page 13 / total 30 pages 0992003133-0 201126776 84 contact area, and the heat sink 84 and the solid state light emitting element 50 are more firmly joined together. Preferably, the second surface 5222 of the base 522 is in contact with the plane 844 of the base 840. Referring to FIG. 10, the present invention further provides a light source module 90 including two solid-state light-emitting elements 30 of a third embodiment, a circuit board 92, and a heat sink 94, wherein the heat sink 94 includes A susceptor 940 and a plurality of heat dissipation fins 942. The light source module 90 is similar to the light source module 80 described above, except that the circuit board 92 is a flexible printed circuit board (FPCB) that is bent and adjacent to the solid state light emitting device. The first surface 3 2 2 0 and the side surface 3223 of the 3 2 2 are disposed, and the circuit board 92 is simultaneously in contact with the conductive layer 320 on the first surface 3220 and the side surface 3223. The substrate of the circuit board 92 may be a polyester (PET), a polyimide film (PI), a polyethylene naphthenic (PEN), a thin epoxy resin, or a glass fiber material (FR4). The susceptor 940 has a plurality of protrusions 948 formed by the plane 944 extending outwardly. The protrusion 948 extends to the through hole 322B of the solid state light emitting element #3〇 and is in contact with the heat conducting block 35, thereby enhancing the heat of the bee. Block 35 and heat sink 94: .丨...: contact area' and allows heat sink 94 to be more securely bonded to solid state light emitting element 3A. Preferably, the second surface 3222 of the substrate 322 is in contact with the plane 944 of the pedestal 940 so that it can be bonded together by an adhesive. [0033] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. 099101602 Form No. A0101 Page/Total 30 Pages 0992003133-0 201126776 [Simplified Schematic] [0034] FIG. 1 is a schematic cross-sectional view of a solid state light emitting device in the prior art. 2 is a schematic cross-sectional view showing a solid state light emitting device according to a first embodiment of the present invention. 3 is a schematic cross-sectional view showing a solid state light emitting device according to a second embodiment of the present invention. 4 is a schematic cross-sectional view showing a solid state light emitting device according to a third embodiment of the present invention. 5 is a schematic cross-sectional view showing a solid state light emitting device according to a fourth embodiment of the present invention. 6 is a schematic cross-sectional view showing a solid state light emitting device according to a fifth embodiment of the present invention.

7 is a schematic cross-sectional view showing a solid state light emitting device according to a sixth embodiment of the present invention. 8 is a schematic view showing the surface of a light source module using the solid-state light-emitting element shown in FIG. 7. 9 is a schematic cross-sectional view showing a light source module using the solid-state light-emitting element shown in FIG. 6. 10 is a schematic cross-sectional view of a light source module employing the solid state light emitting device of FIG. 4. [Main Component Symbol Description] [0044] Light Emitting Diode: 100 [0045] Package: 102 [0046] Light Emitting Diode Wafer: 104 [0047] Resin Layer: 106 [0048] Metal Frame: 1020 [0049] Plastic :1022 099101602 Form No. A0101 Page 15 / Total 30 Pages 0992003133-0 201126776 [0050] Solid state light emitting elements: 10, 20, 30, 40, 50, 60 [0051] Solid state light emitting chips: 11, 31, 41, 51, 61 [0052] Light reflecting layer: 13 [0053] Thermal conductive block: 15, 35, 45, 55, 65 [0054] Light-transmitting protective layer: 17, 27, 37, 67 [0055] Upper surface: 110 [0056] Surface: 112 [0057] Conductive layer: 120, 220, 620, 320 [0058] Base: 122, 222, 322, 422 '522 ' 622 [0059] Contact surface: 150 [0060] Bottom surface: 152, 1224, 352, 552, 652 [0061] Mounting surface: 1200 [0062] End face: 1 202, 2202, 6202 [0063] First surface: 1220, 2220, 3220 [0064] Second surface: 1 222, 3222, 5222, 6222 [0065] ] Side: 1 223, 1226, 3223

[0066] Grooves: 122A, 322A, 522A, 622A

[0067] Through holes: 122B, 322B, 422B, 522B, 622B

[0068] First hole: 622a 099101602 Form number A0101 Page 16 / Total 30 page 0992003133-0 201126776 [0069] [0074] [0073] [0075]

[0078] [0078] [0081] Ο second hole: 622b third hole: 622c light source module: 70, 80, 90 circuit board: 72, 82, 92 third surface: 720 Fourth surface: 722 Optical through hole: 724, 824 Heat sink: 74, 84, 94 Base: 740, 840, 940 Heat sink fin: 742, 842, 942 Plane: 744, 844, 944 Storage slot: 846 convex From: 948 099101602 Form No. A0101 Page 17 / Total 30 Pages 0992003133-0

Claims (1)

201126776 VII. Patent application scope: A solid-state light-emitting component, comprising: a solid-state light-emitting chip; a substrate having a first surface and a second surface opposite to the first surface, the first surface being opened-arranged a recess of the solid state light emitting chip, the substrate having a through hole extending from the solid state light emitting chip to the second surface; two conductive layers each electrically connected to the solid state light emitting chip and extending to a first surface of the substrate The two conductive layers are isolated from each other; and a thermally conductive block is filled in the via and in thermal contact with the gamma-emitting wafer. The solid-state light-emitting element according to claim 2, wherein the through hole is a columnar through hole. 3. The solid state light emitting device of claim 1, wherein the through hole is adjacent to one end of the solid state light emitting chip to a size larger than a dimension of one end of the solid state light emitting chip. 4. The solid state light-emitting device of claim 1, wherein the size of one end of the solid-state light-emitting chip and a distance from one end of the solid-state wafer are greater than between the two ends. Part of the size. The solid-state light-emitting device of claim 1, wherein the heat-conducting block further extends from the through-hole to protrude from a second surface of the substrate, the guide block being away from an end surface of the solid-state light-emitting chip and the first The two surfaces form a step surface. 6. The solid state light emitting device of claim J, wherein the heat conducting block partially fills the through hole, and the heat conducting block forms a stepped surface with the second surface away from the solid surface. The solid-state light-emitting element of claim 1, wherein the solid-state light-emitting chip comprises a light-emitting diode wafer. The solid-state light-emitting element according to claim 1 is the same. 8. The solid state light emitting device of claim 1, wherein the solid state light emitting wafer is wire bonded to the two conductive layers. 9. A light source module, comprising: at least one solid state light emitting element, the at least one solid state light emitting element comprising: a solid state light emitting chip, a substrate having a first surface and a second surface opposite the first surface Forming a recess for receiving the solid-state light-emitting chip on the first surface, the substrate having a through hole extending from the solid-state light-emitting chip to the second surface, two conductive layers, each conductive layer and the solid-state light-emitting chip Electrically connecting and extending to the first surface of the substrate, the two conductive layers are isolated from each other, and a heat conducting block filled in the through hole and in thermal contact with the solid state light emitting chip; a circuit board adjacent to the substrate a surface is disposed in electrical contact with the two conductive layers, and the circuit board defines at least one optical through hole corresponding to the solid state light emitting chip, and the light emitted by the solid state light emitting chip can be transmitted to the outside through the light through hole; And a heat dissipating device located on the side of the substrate away from the circuit board and in thermal contact with the heat conducting block. The light source module of claim 9, wherein the heat conducting block further extends from the through hole to protrude from a second surface of the substrate, the heat conducting block being away from an end surface of the solid state light emitting chip and the first The two surfaces form a step surface. The light source module of claim 10, wherein the heat dissipating device comprises at least one receiving groove corresponding to the heat conducting block, and a portion of the heat conducting block protruding from the second surface is received in the receiving groove . The light source module of claim 9, wherein the heat conducting block partially fills the through hole, and the heat conducting block is away from the solid state light emitting chip, wherein the heat conducting block partially fills the through hole. One of the end faces forms a stepped surface with the second surface. The light source module of claim 12, wherein the heat dissipating device has at least one protrusion that extends to the through hole of the solid state light emitting element and is in thermal contact with the heat conducting block. 099101602 Form number A0101 Page 20 of 30 0992003133-0