TWI537435B - Gravure roll and method of manufaturing the same - Google Patents

Description

Gravure roll and manufacturing method thereof

The present invention claims priority to Korean Patent Application No. 10-2011-0008483, filed on Jan. 27, 2011. This is incorporated herein by reference.

The present invention relates to a gravure roll and a method of manufacturing the same.

The technology used in direct pattern printing apparatuses has been developed to manufacture electronic devices such as displays and mobile devices. In a printing apparatus, a printing paste is filled in a pattern groove of a gravure roll by a doctor blade, and then the printing paste is transferred to a pattern. Above the substrate, a predetermined pattern is printed on the substrate.

A chrome layer formed as a surface enhanced coating layer is formed on a gravure roll used in a printing apparatus. However, the chrome plating layer is toxic and causes environmental pollution.

Embodiments of the present invention provide a gravure roll having a sufficient strength to replace a chrome plating layer without damaging the environment, and a method of manufacturing the same.

A gravure roll system according to an embodiment of the present invention includes: a base roll; a copper plating layer provided on the base roll and having a plurality of grooves formed on one surface thereof (grooves); and a nickel-phosphorus alloy layer (nickel-phosphorus (Ni-P) alloy layer) above the copper plating layer.

In the gravure roll according to the embodiment of the present invention, since the nickel-phosphorus alloy layer is directly formed by replacing a chrome plating layer, the gravure roll is not toxic, thereby avoiding environmental pollution. Moreover, it does not require an additional metal layer, which simplifies the manufacturing process and reduces manufacturing costs.

The gravure roll manufacturing method according to an embodiment of the present invention can provide a gravure roll having the above structure.

In the description of the embodiments, it is to be understood that when a layer (film), a region, a pattern, or a structure is referred to as another layer (film), another region, another electrode pad, or another pattern" Above/below or "above/below", the terms "above/below" and "above/below" include "directly" or "indirectly" in other layers (film), regions, electrode pads. Above the pattern, or one or more intermediate layers may also be present. Such a layer location has been illustrated by a diagram.

The thickness and size of each layer in the drawings may be exaggerated, omitted, or merely illustrated to ensure that the drawings are clear or convenient. In addition, the size of the component does not fully reflect the size of its entity.

Hereinafter, embodiments of the present invention will be described in detail in conjunction with the drawings.

First, a printing apparatus will be described in detail with reference to FIG. Figure 1 is a perspective view showing one of the printing devices.

Referring to FIG. 1, the printing apparatus includes: a gravure roll 100 having a groove 500 for accommodating a printing paste 110; and a doctor blade 200 adjacent to the gravure roll 100 for filling the printing paste 110 Into the trench 500. In addition, the printing apparatus may include: a blanket roll 300 that receives the printing paste 110 in the groove 500 of the gravure roll 100 and transfers the printing paste 110 to a substrate 400. Above.

In the above printing apparatus, the doctor blade 200 fills the printing paste 110 in the groove 500, and then the printing paste 110 is transferred to the cover roll 300, and then the printing paste 110 is transferred onto the substrate 400. To form a pattern 410.

Hereinafter, the gravure roll 100 of the printing apparatus will be described in detail with reference to FIG.

Figure 2 is a cross-sectional view of a gravure roll in accordance with a first embodiment of the present invention.

Referring to FIG. 2, the gravure roll 101 of the first embodiment of the present invention comprises: a base roll 10; a copper plating layer 20 provided on the base roll 10 and having grooves 20a; and a nickel-phosphorus alloy layer 30. Formed on the copper plating layer 20.

The base roller 10 may have a cylindrical shape to allow the base roller 10 to rotate, but the present invention is not limited thereto. For example, the base roller 10 may have a flat plate shape. In this case, the base roller 10 cannot be rotated. The base roll 10 can be formed using a variety of materials that are durable for repetitive printing processes. For example, the base roll 10 can be formed using a metal.

The copper plating layer 20 can be formed on the base roller by electroplating copper on the base roller 10. Above 10. The copper plating layer 20 can reinforce the hardness of the gravure roll 101 so that the gravure roll 101 can reach the hardness required for the gravure printing process. Further, a printed pattern can be formed by forming a gravure pattern over the copper plating layer 20.

A plurality of trenches 20a are formed on one surface of the copper plating layer 20. As described above, the printing paste 110 (see Fig. 1) is filled in the groove 20a for later printing. The thickness of the copper plating layer 20 may fall within the range of from about 50 μm to about 200 μm.

Then, a nickel-phosphorus alloy layer 30 is formed on the copper plating layer 20.

The nickel-phosphorus alloy layer 30 includes nickel (Ni) and phosphorus (P). The nickel-phosphorus alloy layer 30 has a hardness of about 700 Hv or more and has excellent corrosion-resistant and surface-glossing characteristics.

In detail, in the nickel-phosphorus alloy layer 30, the phosphorus content is from about 10% by weight to about 20% by weight. If the phosphorus content is less than 10% by weight, the nickel-phosphorus alloy layer 30 may not have a strength close to that of the conventional chrome plating layer, so that the nickel-phosphorus alloy layer 30 cannot be used as a surface-strengthening coating layer. On the contrary, if the content of phosphorus in the nickel-phosphorus alloy layer 30 is more than 20% by weight, the plating effect may be deteriorated due to the time required.

When the phosphorus content is about 15 wt% or more, the nickel-phosphorus alloy can exhibit an amorphous property and has stable chemical characteristics at a high hardness. Due to the amorphous state, other drugs cannot penetrate into the nickel-phosphorus alloy. In this regard, preferably, the phosphorus content should fall within the range of 15 wt% to 20 wt%. However, embodiments of the invention are not limited thereto. For example, the nickel-phosphorus alloy layer 30 may include tungsten (tungsten, W) in addition to nickel and phosphorus. In this case, the content of phosphorus falls within the range of 10 wt% to 20 wt%, and the content of tungsten falls within the range of 1 wt% to 20 wt%. If the nickel-phosphorus alloy layer 30 further includes tungsten, its corrosion resistance and hardness can be further improved. However, if the content of tungsten exceeds 20% by weight, the plating effect may be deteriorated due to the time required.

The nickel-phosphorus alloy layer 30 has a positive influence on the printing process. In detail, in the printing process, when the printing paste 110 is filled in the groove 20a of the gravure roll, the blade 200 (see FIG. 1) is movable and comes into contact with the surface of the gravure roll 101. When the contact frequency of the doctor blade 200 with the gravure roll 101 is increased, the surface of the gravure roll 101 may be damaged, thereby shortening the service life of the gravure roll 101. At this point, a nickel-phosphorus alloy layer 30 having a high strength is provided to reinforce the surface of the gravure roll 101. In addition, the nickel-phosphorus alloy layer 30 can replace the chrome plating layer which causes environmental pollution to avoid polluting the environment.

In addition, since the nickel-phosphorus alloy layer 30 is in direct contact with the copper plating layer 20, it is not necessary to additionally form a metal layer or a carbonated metal gradient layer on the nickel-phosphorus alloy layer 30 and the copper plating layer 20. Therefore, the thickness of the gravure roll 101 can be reduced. Further, the manufacturing steps and manufacturing costs of the gravure roll 101 can be further reduced.

The thickness of the nickel-phosphorus alloy layer 30 may fall within the range of from about 1 μm to about 200 μm. If the thickness of the nickel-phosphorus alloy layer 30 is less than 1 μm, the nickel-phosphorus alloy layer 30 may not be used. As a surface strengthening coating. Further, if the thickness of the nickel phosphorus alloy layer 30 is more than 200 μm, the nickel phosphorus alloy layer 30 may be delaminated due to internal stress. Further, if the thickness of the nickel-phosphorus alloy layer 30 is more than 200 μm, the depth and width required for the gravure roll 101 can be lowered, and further, when the gravure roll 101 is used for the printing process, the desired pattern may not be obtained.

Hereinafter, a gravure roll according to a second embodiment of the present invention will be described in detail with reference to Figs. For the sake of clarity and convenience of description, the same elements and structures as those described in the first embodiment may be omitted, and the description will be directed to the different parts.

3 is a cross-sectional view showing a gravure roll according to a second embodiment of the present invention; and FIG. 4 is an enlarged cross-sectional view showing a portion A of FIG.

Referring to Figures 3 and 4, in the gravure roll 102 according to the second embodiment of the present invention, a concavo-convex portion 20b is formed on the surface of the copper plating layer 20 provided on the base roll 10. The concavo-convex portion 20b enhances the strength of the contact force between the copper plating layer 20 and the nickel-phosphorus alloy layer 30 directly contacting the copper plating layer 20. In detail, due to the minute uneven portion 20b, the friction between the copper plating layer 20 and the nickel-phosphorus alloy layer 30 can be improved, so that the nickel-phosphorus alloy layer 30 can stably contact the copper plating layer 20 without being present. Additional metal layer. The surface roughness of the concavo-convex portion 20b falls within the range of 10 nm to 100 nm; and preferably, it falls within the range of 10 nm to 45 nm. If the surface roughness of the uneven portion 20b is less than 10 nm, the adhesion between the copper plating layer 20 and the nickel-phosphorus alloy layer 30 is lowered. If the surface of the concave and convex portion 20b is thick When the roughness exceeds 100 nm, an unnecessary pattern may be formed in the printing process.

Hereinafter, a method of manufacturing a gravure roll according to an embodiment of the present invention will be described in detail with reference to Figs.

5 to 9 are cross-sectional views showing a method of manufacturing a gravure roll, in accordance with an embodiment of the present invention.

First, as shown in Fig. 5, a base roll 10 for a gravure roll is provided.

Then, as shown in FIG. 6, copper is electroplated on the base roll 10 to form a copper plating layer 20.

As shown in FIG. 7, at least one trench 20a is formed over the copper plating layer. The trench 20a can be formed by a variety of different methods well known to those skilled in the art, such as etching or electronic engraving. In detail, the etching method is to apply a photoresist and then directly print it on a copper plate, followed by etching to form the trench 20a. The electronic engraving method is: a diamond engraving needle is mechanically operated according to a digital signal to form a groove 20a on the surface of the copper plating layer 20.

Next, as shown in FIG. 8, the uneven portion 20b is formed on the surface of the copper plating layer 20. The procedure of forming the uneven portion 20b can be omitted to provide the copper plating layer 20 having no uneven portion 20b, such as the gravure roll 101 (see Fig. 2) according to the first embodiment. The uneven portion 20b may be formed by plasma etching so that The uneven portion 20b is provided with a slight surface roughness. The plasma etching method may be performed chemically by surface diffusion of radicals; or by an ion bombardment using an electrode to physically perform the plasma etching method. This plasma etching method can be applied when a small and precise etching is required.

Thereafter, as shown in FIG. 9, a nickel-phosphorus alloy layer 30 is formed on the copper plating layer 20. The nickel-phosphorus alloy layer 30 may be formed by electroplating or electroless plating.

This plating method uses the principle of electrolysis. In order to electroplate the nickel-phosphorus alloy layer 30 according to the present embodiment, a phosphite-containing solution can be applied.

This electroless plating method uses a chemical reaction without using electricity. That is, a reducing agent is contained in a plating solution to coat the metal reduced by the reducing agent. In order to electroplate the nickel-phosphorus alloy layer 30 according to the present embodiment, hypophosphite may be applied.

Any reference to "an embodiment", "an embodiment", "an example embodiment" or the like in this specification means that a particular feature, structure or structure of the embodiment is included in at least one embodiment of the invention. characteristic. Such terms appear in many places in the text but do not necessarily refer to the same embodiment. In addition, descriptions of specific features, structures, or characteristics are considered to be within the scope of the skilled artisan. Other embodiments are implemented using such other features, structures, or characteristics.

While the invention has been described with respect to the embodiments of the embodiments of the present invention More particularly, various variations and modifications are possible in the component parts and/or arrangements of the claimed combinations. For those skilled in the art, alternative uses will be apparent in addition to variations and modifications in parts and/or configurations.

100, 101, 102‧‧‧ gravure rolls

110‧‧‧Printing paste

200‧‧‧ scraper

300‧‧‧ Cover Roller

400‧‧‧Substrate

410‧‧‧ pattern

500‧‧‧ trench

10‧‧‧Base roller

20‧‧‧ copper plating

20a‧‧‧ trench

20b‧‧‧ concave part

30‧‧‧Ni-phosphorus alloy layer

Part A‧‧‧

1 is a perspective view showing a printing apparatus; FIG. 2 is a cross-sectional view showing a gravure roll according to a first embodiment of the present invention; and FIG. 3 is a gravure roll according to a second embodiment of the present invention. FIG. 4 is an enlarged cross-sectional view showing a portion A of FIG. 3; and FIGS. 5 to 9 are cross-sectional views showing steps of a method for manufacturing a gravure roll according to an embodiment of the present invention.

100, 101, 102‧‧‧ gravure rolls

110‧‧‧Printing paste

200‧‧‧ scraper

300‧‧‧ Cover Roller

400‧‧‧Substrate

410‧‧‧ pattern

500‧‧‧ trench

Claims (7)

A gravure roll comprising: a base roll; a copper plating layer provided on the base roll and having a plurality of grooves formed on one surface thereof; and a nickel-phosphorus alloy layer on the copper plating layer Wherein the content of phosphorus falls within a range of 15% by weight to 20% by weight, wherein the nickel-phosphorus alloy is amorphous, wherein the surface of the copper plating layer is formed with a concavo-convex portion. The gravure roll of claim 1, wherein the nickel-phosphorus alloy layer comprises tungsten. The gravure roll of claim 2, wherein one of the tungsten content falls within the range of 1 wt% to 20 wt%. The gravure roll according to claim 1, wherein the copper plating layer has a thickness falling within a range of 50 μm to 200 μm. The gravure roll according to claim 1, wherein the nickel-phosphorus alloy layer has a thickness falling within a range of from 1 μm to 200 μm. The gravure roll according to claim 1, wherein a surface roughness of one of the copper plating layers falls within a range of 10 nm to 100 nm. The gravure roll according to claim 1, wherein one of the copper plating layers is The surface roughness is in the range of 10 nm to 45 nm.