JP6549408B2 - Printing plate and method for manufacturing the same - Google Patents

Description

  The present invention relates to a printing intaglio and a method of manufacturing the same.

  The printing intaglio is called intaglio printing because it uses a printing plate in which portions such as characters and patterns to be printed are recessed in the opposite manner to relief printing. Then, for example, a printing material such as silver ink is applied to the entire intaglio plate by an appropriate method so that the printing material such as silver ink is contained in the concave depression, and the printing material such as excess silver ink is scratched while wiping the surface with a squeegee. Then, the printing material such as the silver ink is pressed against the printing material such as the plastic film to print, leaving only the printing material such as the silver ink contained in the depression and the depression.

The conventional printing intaglio plate is processed by digging a concave recess, but in recent years, it has been required to machine the printing intaglio plate by electroforming.
When the printing intaglio was processed by electroforming, the intaglio surface having the concave depression was not smooth. In addition, when the groove line of the concave depression is thick, the plating is electrodeposited thicker than necessary.

  Furthermore, conventionally, regarding a printing intaglio plate, a gravure printing intaglio plate using a gravure printing plate cylinder in which a large number of concave depressions are dug on the surface of a roll-like plate cylinder has been common (for example, see Patent Document 1) .

JP, 2010-137413, A

  When the printing intaglio plate is processed by the conventional electroforming method, the edge of the groove line of the concave depression is raised, and the intaglio surface is not smooth, which is insufficient as a product. In addition, when there is a difference in the thickness of the groove line of the concave depression, the plating is laminated thickly so that all the groove lines are covered with the plating.

  The present invention was made to solve the problems as described above, and provides a printing intaglio plate whose cost is reduced by shortening the plating time and reducing the amount of plating used, and a method of manufacturing the same. It is.

In the printing intaglio according to the present invention, a large number of concave depressions formed by plating and having an opening on the printing surface side are formed, and the large number of concave depressions has a volume size according to the amount of printing material to be accommodated be one that is formed differently, the opening of a number of concave recesses, formed on the smooth surface of the opposite side of the base material and the printing surface a smooth surface at the time of plating, printing surface anti in contralateral plating growth surface side, a bottom center of the concave recess is communicated through holes and communicating with a larger volume, by installing an additional plating growth surface side opposite to the print carriages and the printing surface, printing a through hole It is used by closing it with a pedestal .

  In addition, the thickness of the through hole communicating with the center of the bottom of the concave recess having a large volume is formed small by growing thinly the plating growth surface side opposite to the printing surface.

  Further, the printing intaglio main body is formed by nickel plating, and a high hardness film is applied to the entire surface of the printing intaglio main body.

Further, in the method of manufacturing the printing intaglio according to the present invention, a resist layer of a portion corresponding to the concave recess is formed on the SUS base material, and the resist layer to be formed corresponds to the amount of printing material accommodated in the concave recess. And the step of making the size of the volume different, and the resist layer of the smaller volume of each resist layer is completely covered from above, but the resist layer of the larger volume does not cover the upper central portion Forming a plated layer in which a through hole is formed immediately above the upper central portion of the resist layer having a large volume by thinly plating it, a step of peeling the plated layer from the SUS base material, and a plated layer Each resist layer is removed from the surface, and a number of concave depressions are formed on the surface facing the SUS base material of the plating layer so that the volume size differs depending on the amount of printing material to be accommodated. , The larger volume And the step of communicating with the through hole at the center of the bottom of the concave recess.

  In addition, a step of applying a high hardness film to at least the printing surface side of the printing intaglio main body formed by nickel plating is added.

  According to the present invention, a large number of concave depressions formed by plating and having an opening on the printing surface side are formed, and the large number of concave depressions are formed to have different volume sizes according to the amount of printing material to be accommodated. The intaglio plate for printing, wherein the openings of a number of concave depressions are formed on the smooth surface side facing the base material at the time of plating formation, the smooth surface side being the printing surface, and the opposite side to the printing surface Since the plating growth side of the above is attached to a printing pedestal and used, the lead time can be shortened by shortening the plating time, and the cost can be reduced by reducing the amount of plating used.

It is principal part sectional drawing which shows the manufacturing method of the printing intaglio plate in Example 1 of this invention to process order. It is principal part sectional drawing which shows the manufacturing method of the printing intaglio plate in Example 2 of this invention to process order. It is principal part sectional drawing which shows the manufacturing method of the printing intaglio plate in Example 3 of this invention to process order.

Example 1
A method of producing the printing intaglio plate in Embodiment 1 of the present invention will be described with reference to FIG.
First, a resist having a thickness of about 10 μm is laminated on the SUS base material 1, the required exposure and development are performed, and a portion corresponding to a concave recess for accommodating a printing material such as silver ink on the SUS base material 1 Resist layers 2a to 2c are formed (see FIG. 1A). The resist layers 2a to 2c of the portion corresponding to the concave recess have different widths (thicknesses) of groove lines, for example, so that the size of the volume is different depending on the amount of printing material such as silver ink to be accommodated. There are three sizes of medium and small. Next, thick nickel plating is performed until all the resist layers 2a to 2c are completely covered from above, and the plated layer 3 is formed with a thickness of, for example, 150 μm to 200 μm (see FIG. 1B). After the formation of the plated layer 3 is completed, the plated layer 3 is peeled off from the SUS base material 1 (see FIG. 1 (c)). When the plating layer 3 is peeled off, there is no possibility of deformation because the thickness is sufficient. Next, when the resist layers 2a to 2c are removed, concave depressions 4a to 4c for containing a printing material such as silver ink having an opening on the surface facing the SUS base material 1 of the plated layer 3 are formed. It forms (refer FIG.1 (d)). The concave depressions 4a to 4c are, for example, three kinds of large, medium, and small in which the width (thickness) of the groove line is different so that the size of the volume is different depending on the amount of printing material such as silver ink to be stored. It has been sized. Finally, the opening forming surface side of the concave depressions 4a to 4c, which was the opposite side to the SUS base material 1 of the plating layer 3, is used as the printing surface, and the double-sided adhesive tape on the plating growth surface side opposite to the printing surface Affixing 5 and affixing the plating layer 3 to the printing base 6 using the double-sided adhesive tape 5 completes a printing intaglio.

Example 2
A method of manufacturing a printing intaglio plate in Embodiment 2 of the present invention will be described with reference to FIG.
First, a resist having a thickness of about 10 μm is laminated on the SUS base material 1, and the required exposure and development are performed, and a portion corresponding to a concave recess for printing material such as silver ink to enter on the SUS base material 1 Resist layers 2a to 2c are formed (see FIG. 2A). The resist layers 2a to 2c of the portion corresponding to the concave recess have different widths (thicknesses) of groove lines, for example, so that the size of the volume is different depending on the amount of printing material such as silver ink to be accommodated. There are three sizes of medium and small. Next, although the two types of resist layer 2c having a small width (thickness) of the groove line and the resist layer 2b in the groove line are completely covered from above, one type of the large resist layer 2a has the upper end central portion covered Nickel plating is applied so as to be thinner than in Example 1 so as not to occur, and a plated layer 31 is formed with a thickness of, for example, 30 μm to 100 μm (see FIG. 2B). As a result, the plating layer 31 immediately above the upper central portion of the large resist layer 2a is not completely covered, and the through holes 31a are formed there. After the formation of the plating layer 31, the plating layer 31 is peeled off from the SUS base material 1 (see FIG. 2C). When the plating layer 31 is peeled off from the SUS base material 1, it is preferable to appropriately set the thickness so as not to deform in advance. Next, when the resist layers 2a to 2c are removed, concave depressions 41a to 41c for receiving printing material such as silver ink having an opening on the surface facing the SUS base material 1 of the plating layer 31 are formed. (See FIG. 2 (d)). The concave depressions 41a to 41c are, for example, three stages of large, medium, and small, in which the width (thickness) of the groove line is different so that the size of the volume is different depending on the amount of printing material such as silver ink to be stored. It has been sized. The large concave recess 41a having a large volume is in communication with the through hole 31a at the center of the bottom. Finally, with the opening-forming surface side of the concave depressions 41a to 41c facing the SUS base material 1 of the plating layer 31 as the printing surface, the double-sided adhesive tape is provided on the plating growth surface side opposite to the printing surface. Affixing 5 and affixing the plating layer 3 to the printing base 6 using the double-sided adhesive tape 5 completes a printing intaglio. In the printing intaglio plate after completion, as shown in FIG. 2 (e), the tip of the through hole 31a communicating with the large concave recess 41a having a large volume and the bottom is closed by the printing base 6. There is no leakage of the printing material such as the large concave depression 41a having a large volume and the silver ink in the through hole 31a.

Example 3
A method of manufacturing a printing intaglio plate in Embodiment 3 of the present invention will be described with reference to FIG.
First, a resist having a thickness of about 10 μm is laminated on the SUS base material 1, and the required exposure and development are performed, and a portion corresponding to a concave recess for printing material such as silver ink to enter on the SUS base material 1 Resist layers 2a to 2c are formed (see FIG. 3A). The resist layers 2a to 2c of the portion corresponding to the concave recess have different widths (thicknesses) of groove lines, for example, so that the size of the volume is different depending on the amount of printing material such as silver ink to be accommodated. There are three sizes of medium and small. Next, although the two types of resist layer 2c having a small width (thickness) of the groove line and the resist layer 2b in the groove line are completely covered from above, one type of the large resist layer 2a has the upper end central portion covered Nickel plating is applied so as to be thinner than in Example 2 so as not to be possible, and a plated layer 32 is formed with a thickness of, for example, 20 μm to 70 μm (see FIG. 3B). As a result, the plating layer 32 immediately above the upper center portion of the large resist layer 2a is not completely covered, so that the through holes 32a having a smaller volume than the through holes 31a in the second embodiment are formed there. After the formation of the plated layer 32, the plated layer 32 is peeled off from the SUS base material 1 (see FIG. 3 (c)). When the plating layer 32 is peeled off from the SUS base material 1, it is preferable to apply some device to prevent deformation in advance. Next, when the resist layers 2a to 2c are removed, concave depressions 42a to 42c are formed on the surface facing the SUS base material 1 of the plating layer 32 for receiving printing material such as silver ink having an opening. (See FIG. 3 (d)). The concave depressions 42a to 42c are, for example, three stages of large, medium, and small, in which the width (thickness) of the groove line is different so that the size of the volume is different depending on the amount of printing material such as silver ink to be stored. It has been sized. The large concave recess 42a having a large volume communicates with the through hole 32a at the center of the bottom. Finally, with the openings forming surface side of the concave depressions 42a to 42c facing the SUS base material 1 of the plated layer 32 as the printing surface, the double-sided adhesive tape is provided on the plating growth surface side opposite to the printing surface. Affixing 5 and affixing the plating layer 3 to the printing base 6 using the double-sided adhesive tape 5 completes a printing intaglio. In the printing intaglio plate after completion, as shown in FIG. 3E, the tip of the through hole 32a communicating with the large concave recess 42a having a large volume and the bottom is closed by the printing base 6. There is no leakage of the printing material such as the large concave depression 42a having a large volume and the silver ink in the through hole 32a. The volume of the through hole 32a in communication with the large concave recess 42a having the large volume in the third embodiment is the volume of the through hole 31a in communication with the large concave recess 41a having the large volume in the second embodiment. I try to be smaller than. The reason is that if the volume of the through holes 32a is too large, there is a risk that the printing material such as silver ink may be excessively accumulated more than necessary.

Example 4
In the first embodiment, thick nickel plating is performed until all the resist layers 2a to 2c are completely covered from above, and the plating layer 3 is formed with a thickness of, for example, 150 μm to 200 μm (see FIG. 1B). . Further, in the second embodiment, although the two types of resist layer 2c having a small width (thickness) of the groove line and the resist layer 2b in the groove line are completely covered from above, one type of the large resist layer 2a is Nickel plating is applied thinner than in Example 1 so as not to cover the upper end central portion, and a plated layer 31 is formed with a thickness of, for example, 30 μm to 100 μm (see FIG. 2B). In the third embodiment, the two types of the resist layer 2c having a small groove line width (thickness) and the resist layer 2b in the groove line are completely covered from above, but one type of the large resist layer 2a is Nickel plating is performed thinner than in Example 2 so as not to cover the upper central portion, and a plated layer 32 is formed with a thickness of, for example, 20 μm to 70 μm (see FIG. 3B).
On the other hand, in the fourth embodiment, when the plated layers 3, 31, 32 grow to a height substantially equal to the upper surfaces of the resist layers 2a to 2c, the first-stage nickel plating process is interrupted and nickel plating is performed. The upper surface portion of each of the resist layers 2a to 2c which is not clogged is subjected to a conductive treatment with, for example, palladium, electroless nickel or the like, and thereafter, a second stage nickel plating treatment is performed. Thereby, the plating growth surface side on the opposite side to the printing surface can be formed thin.

Example 5
In the first to fourth embodiments, since the entire printing intaglio plate is formed by nickel plating, the squeegee applies pressure to the printing surface of the intaglio plate on which the concave recesses 4a to 4c, 41a to 41c, and 42a to 42c are formed. Because of the contact, the printing surface may be worn and the durability may be deteriorated. Therefore, in Example 5, the plating layers 3, 31 and 32 are formed to a height substantially equal to that of the upper surfaces of the resist layers 2a to 2c, for example, an electrolytic or electroless film of nickel-phosphorus, electroless nickel, etc. By applying a high hardness film, the printing surface of the intaglio plate on which the concave recesses 4a to 4c, 41a to 41c, and 42a to 42c are formed is made a high hardness film that is more resistant to wear than nickel plating, and contact is made while the squeegee applies pressure. However, the wear on the printing surface is small and the durability is improved. After that, the second step is to perform normal nickel plating.

Example 6
In the sixth embodiment, since the entire printing intaglio plate is formed by nickel plating, the squeegee contacts the printing surface of the intaglio plate on which the concave recesses 4a to 4c, 41a to 41c, and 42a to 42c are formed. Therefore, in order to prevent the printing surface from being abraded and the durability from being deteriorated, the finished printing intaglio plate according to the above-mentioned Examples 1 to 4 may be made of, for example, an electrolytic or electroless film of nickel-phosphorus or electroless nickel And soak in a plating bath, etc., to provide a high hardness film on the entire surface of the printing intaglio. As a result, the printing surface of the intaglio plate on which at least the concave depressions 4a to 4c, 41a to 41c, and 42a to 42c are formed is made a high hardness film that is more resistant to wear than nickel plating There is less wear on the surface and improved durability.

The main use of the intaglio printing plate according to the present invention is as a printing intaglio plate for low-resistance high-transparent conductive film for pattern-printing silver-based fine particles on a plastic film, a transparent electromagnetic shielding member and an electrode for film device A film or the like is manufactured.
By making the printing line width extremely thin (1 to 20 μm), it is possible to manufacture a further low resistance / high transparency conductive film device.
In addition, compared to photolithography, etc., it is also environmentally friendly and has a low running cost.

DESCRIPTION OF SYMBOLS 1 SUS base material 2a-2c Resist layer 3, 31, 32 Plated layer 4a-4c, 41a-41c, 42a-42c Concave hollow 31a, 32a Through-hole 5 Double-sided adhesive tape 6 Pedestal for printing

Claims (5)

A large number of concave depressions formed by plating and having openings on the printing surface side are formed, and the large number of concave depressions are printing intaglio plates formed to have different volume sizes according to the amount of printing material to be accommodated There,
The openings of the plurality of concave depressions are formed on the smooth surface side facing the base material at the time of plating formation, the smooth surface side is a printing surface, and the plating growth surface side opposite to the printing surface is large. The bottom center of the concave recess having a volume is in communication with the through hole, and the plating growth surface side opposite to the printing surface is attached to the printing base to close the through hole with the printing base for use. An intaglio printing plate characterized by By opposite grown thin plating growth surface side of the printing surface, intaglio according to claim 1, characterized in that the volume of through-holes communicating with the bottom center and the concave depression reduced form having a large volume . The printing intaglio according to claim 1 or 2 , wherein the printing intaglio main body is formed by nickel plating, and a high hardness film is applied to the entire surface of the printing intaglio main body. A printing intaglio plate is formed by plating and has a large number of concave depressions having openings on the printing surface side, and the large number of concave depressions are formed to have different volume sizes according to the amount of printing material to be accommodated A manufacturing method,
Forming a resist layer of a portion corresponding to the concave recess on a SUS base material, and making the resist layer to be formed different in volume size according to the amount of printing material accommodated in the concave recess;
Of the resist layers, the smaller volume resist layer is completely covered from the top, but the larger volume resist layer is thinly plated so that the upper center portion is not covered, the larger volume Forming a plated layer in which a through hole is formed immediately above the upper center portion of the resist layer;
Peeling the plating layer from the SUS base material;
Concave type formed by removing each resist layer from the plating layer and forming a different volume size on the surface facing the SUS base material of the plating layer according to the amount of printing material to be accommodated Forming a plurality of depressions, the larger depressions being in communication with the through hole at the center of the bottom thereof;
A method for producing a printing intaglio plate, comprising: 4. Symbol mounting intaglio method of manufacturing is characterized in that by adding a step of applying a high hardness coating on at least the printing surface of the intaglio body formed by nickel plating.

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