JP2016210134A - Printing intaglio and production method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printing intaglio capable of shortening a time of delivery by shortening a plating time, and reducing cost by reduction of a used amount of plating; and to provide a production method thereof.SOLUTION: Many recessed hollows 4a-4c formed by plating, and having each opening part on the printed surface side are formed, and many recessed hollows are formed so that the largeness of a volume is differentiated corresponding to the amount of a stored printing material. Each opening part of many recessed hollows is formed on the smooth surface side which is a facing side to a base metal 1 in a plating formation time, and the smooth surface side is used as a printing surface, and a plating growth surface side on the opposite side to the printing surface is fitted on a pedestal 6 for printing and used.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a printing intaglio and a method for producing the same.

  The intaglio for printing is called intaglio printing because it uses a plate surface in which characters, patterns, etc. to be printed are recessed in a concave shape opposite to the relief printing. Then, for example, attach a printing material such as silver ink to the entire intaglio in an appropriate manner so that the printing material such as silver ink enters the concave depression, and scrape off the printing material such as excess silver ink while wiping the surface with a squeegee. The printing material such as the silver ink is dropped and left in the concave depression, and the printing material such as the silver ink is pressed against a substrate such as a plastic film for printing.

Conventional printing intaglios have been processed by digging indents, but in recent years, it has been desired to process printing intaglios by electroforming.
When an intaglio for printing was processed by electroforming, the intaglio surface with the indentations was not smooth. Moreover, when the groove line of the concave depression was thick, the plating was electrodeposited thicker than necessary.

  Conventionally, when referring to a printing intaglio, a gravure printing intaglio using a gravure printing cylinder in which a large number of concave depressions are dug into the surface of a roll-shaped printing cylinder has been common (see, for example, Patent Document 1). .

JP 2010-137413 A

  When the intaglio for printing was processed by the conventional electroforming method, the edge of the groove line of the indentation was raised, and the intaglio surface was not smooth. Further, when there is a difference in the thickness of the groove line of the concave recess, the plating is laminated thick so that all the groove lines are covered with the plating.

  The present invention has been made to solve the above-described problems, and provides an intaglio for printing and a method for manufacturing the same, which shortens the delivery time by shortening the plating time and reduces the cost by reducing the amount of plating used. It is.

  In the intaglio plate for printing according to the present invention, a large number of concave depressions formed by plating and having openings on the printing surface side are formed, and the volume of the large number of concave depressions depends on the amount of printing material to be accommodated. It is formed differently, and a large number of concave recess openings are formed on the smooth surface side facing the base material at the time of plating formation, and the smooth surface side is the printing surface. The opposite side of the plating growth surface is attached to a printing base for use.

  In addition, a large number of concave depressions formed by plating and having openings on the printing surface side are formed, and the large number of concave depressions are formed so that the volume varies depending on the amount of printing material to be accommodated. There are a number of concave recess openings formed on the smooth surface side facing the base material at the time of plating formation, and the smooth surface side as the printing surface, on the plating growth surface side opposite to the printing surface, The center of the bottom of the concave recess having a large volume is communicated with the through hole, and the plated growth surface side opposite to the printing surface is attached to the printing pedestal so that the through hole is closed with the printing pedestal. is there.

  In addition, by thinly growing the plating growth surface side opposite to the printing surface, the volume of the through hole communicating with the center of the bottom of the concave recess having a large volume is formed.

  Further, the plating is made up of a first-stage plating layer that forms openings of a large number of concave depressions that become the printing surface, and a second-stage plating layer that forms a plating growth surface side opposite to the printing surface. It is formed by step plating.

  In addition, the first-stage plating layer that forms the openings of a number of concave depressions that will be the printing surface is made of a high-hardness film resistant to wear, and the second-stage plating layer that forms the plating growth surface side opposite to the printing surface is nickel. It is plated.

  Further, the printing intaglio body is formed by nickel plating, and a high hardness film is applied to the entire surface of the printing intaglio body.

  Further, in the method for producing a printing intaglio according to the present invention, a large number of concave depressions formed by plating and having openings on the printing surface side are formed, and the numerous concave depressions correspond to the amount of printing material to be accommodated. A method for producing an intaglio for printing formed with different volume sizes, wherein a resist layer corresponding to a concave depression is formed on a SUS base material, and the formed resist layer is accommodated in the concave depression. From the step of making the volume different according to the amount of the printing material, the step of forming a plating layer by plating thickly until all the resist layers are completely covered from above, and from the SUS base material The process of peeling the plating layer, and removing each resist layer from the plating layer, the surface of the plating layer facing the SUS base material has a volume that varies depending on the amount of printing material to be accommodated. Formed into It is obtained by a step of forming multiple concave depressions.

  Further, a step of forming a resist layer corresponding to the concave depression on the SUS base material, and the resist layer to be formed have a volume different depending on the amount of the printing material accommodated in the concave depression; Of each resist layer, the resist layer with the smaller volume is completely covered from above, but the resist layer with the larger volume is plated thinly so as not to cover the center of the upper end. Forming a plated layer having a through-hole formed immediately above the center of the upper end of the layer; removing the plated layer from the SUS base material; removing each resist layer from the plated layer; A large number of concave dents are formed on the surface opposite to the material so that the volume varies depending on the amount of printing material to be accommodated. Work to communicate with the through hole It is those with a door.

  The step of forming the plating layer is such that when the plating layer grows to a height that is approximately equal to the upper surface of each resist layer, the first plating process is interrupted and the upper surface of each resist layer that is not blocked by plating. After the conductive treatment is performed on the part, the second plating process is performed.

  In addition, the plating layer forming step is to form a plating hard surface on the opposite side of the printing surface by forming a high-hardness coating that is resistant to wear on the first-stage plating layer that forms the openings of a number of concave depressions that will be the printing surface. The second stage plating layer is nickel plated.

  In addition, a step of applying a high hardness film to at least the printing surface side of the printing intaglio body formed by nickel plating is added.

  According to the present invention, a large number of concave depressions formed by plating and having openings on the printing surface side are formed, and the large number of concave depressions are formed so as to have different volumes depending on the amount of printing material to be accommodated. The intaglio plate for printing is formed on the smooth surface side facing the base material at the time of plating formation, and the smooth surface side is the printing surface, and the opposite side of the printing surface Since the plating growth surface side is attached to the printing pedestal and used, the delivery time can be shortened by shortening the plating time, and the cost can be reduced by reducing the amount of plating used.

It is principal part sectional drawing which shows the manufacturing method of the printing intaglio in Example 1 of this invention in order of a process. It is principal part sectional drawing which shows the manufacturing method of the printing intaglio in Example 2 of this invention in order of a process. It is principal part sectional drawing which shows the manufacturing method of the intaglio for printing in Example 3 of this invention in order of a process.

Example 1.
A method for producing a printing intaglio according to Example 1 of the present invention will be described with reference to FIG.
First, a resist having a thickness of about 10 μm is laminated on the SUS base material 1, subjected to necessary exposure and development, and a portion corresponding to a concave recess for accommodating a printing material such as silver ink on the SUS base material 1. The resist layers 2a to 2c are formed (see FIG. 1A). The resist layers 2a to 2c corresponding to the concave depressions have different groove line widths (thicknesses) such that the volume varies depending on the amount of printing material such as silver ink to be accommodated. There are three sizes of medium and small. Next, nickel plating is performed thickly until all of the resist layers 2a to 2c are completely covered from above, and the plating layer 3 is formed with a thickness of, for example, 150 μm to 200 μm (see FIG. 1B). When the formation of the plating layer 3 is finished, the plating layer 3 is peeled from the SUS base material 1 (see FIG. 1C). When the plating layer 3 is peeled off, there is no deformation due to the sufficient thickness. Next, when the resist layers 2a to 2c are removed, concave depressions 4a to 4c for accommodating a printing material such as silver ink having an opening on the surface of the plating layer 3 facing the SUS base material 1 are formed. It is formed (see FIG. 1 (d)). The concave depressions 4a to 4c have three types of large, medium, and small groove line widths (thicknesses) that vary in volume according to the amount of printing material such as silver ink to be accommodated. It is sized. Finally, the opening forming surface side of the concave cavities 4a to 4c, which is the side facing the SUS base material 1 of the plating layer 3, is used as the printing surface, and, for example, a double-sided adhesive tape is provided on the plating growth surface side opposite to the printing surface. 5 is attached, and the plating layer 3 is attached to the printing pedestal 6 using the double-sided adhesive tape 5 to complete the printing intaglio.

Example 2
A method for producing a printing intaglio according to Embodiment 2 of the present invention will be described with reference to FIG.
First, a resist having a thickness of about 10 μm is laminated on the SUS base material 1 and necessary exposure and development are performed. A portion corresponding to a concave depression for entering a printing material such as silver ink on the SUS base material 1 is formed. Resist layers 2a to 2c are formed (see FIG. 2A). The resist layers 2a to 2c corresponding to the concave depressions have different groove line widths (thicknesses) such that the volume varies depending on the amount of printing material such as silver ink to be accommodated. There are three sizes of medium and small. Next, the two types of the resist layer 2c having a small groove line width (thickness) and the resist layer 2b in the middle are completely covered from above, but one type of the large resist layer 2a is covered at the upper center portion. In order to prevent this, nickel plating is performed thinner than in Example 1, and a plating layer 31 is formed with a thickness of, for example, 30 μm to 100 μm (see FIG. 2B). As a result, the plating layer 31 immediately above the center of the upper end of the large resist layer 2a is not completely covered, so that a through hole 31a is formed there. When the formation of the plating layer 31 is completed, the plating layer 31 is peeled from the SUS base material 1 (see FIG. 2C). When the plating layer 31 is peeled from the SUS base material 1, it is preferable to set the thickness appropriately so as not to be deformed in advance. Next, when the resist layers 2a to 2c are removed, concave dents 41a to 41c are formed for receiving a printing material such as silver ink having an opening on the surface of the plating layer 31 facing the SUS base material 1. (See FIG. 2D). The concave depressions 41a to 41c are, for example, large, medium, and small three stages having different groove line widths (thicknesses) so that the volume varies depending on the amount of printing material such as silver ink to be accommodated. It is sized. And the large concave hollow 41a which has a large volume is connected with the through-hole 31a in the center of the bottom part. Finally, the opening forming surface side of the concave dents 41a to 41c that is the facing side of the plating layer 31 to the SUS base material 1 is used as a printing surface, and a double-sided adhesive tape, for example, is formed on the plating growth surface side opposite to the printing surface. 5 is attached, and the plating layer 3 is attached to the printing pedestal 6 using the double-sided adhesive tape 5 to complete the printing intaglio. Since the intaglio for printing after completion is shown in FIG. 2 (e), the tip of the through hole 31a communicating with the large concave depression 41a having a large volume at the bottom is closed by the printing base 6. The large concave recess 41a having a large volume and the printing material such as silver ink in the through hole 31a do not leak.

Example 3
A method for producing a printing intaglio according to Embodiment 3 of the present invention will be described with reference to FIG.
First, a resist having a thickness of about 10 μm is laminated on the SUS base material 1 and necessary exposure and development are performed. A portion corresponding to a concave depression for entering a printing material such as silver ink on the SUS base material 1 is formed. Resist layers 2a to 2c are formed (see FIG. 3A). The resist layers 2a to 2c corresponding to the concave depressions have different groove line widths (thicknesses) such that the volume varies depending on the amount of printing material such as silver ink to be accommodated. There are three sizes of medium and small. Next, the two types of the resist layer 2c having a small groove line width (thickness) and the resist layer 2b in the middle are completely covered from above, but one type of the large resist layer 2a is covered at the upper center portion. In order to prevent this, nickel plating is performed thinner than in Example 2, and a plating layer 32 is formed with a thickness of, for example, 20 μm to 70 μm (see FIG. 3B). As a result, the plating layer 32 immediately above the center of the upper end of the large resist layer 2a is not completely covered, so that a through hole 32a having a smaller volume than the through hole 31a in the second embodiment is formed there. When the formation of the plating layer 32 is completed, the plating layer 32 is peeled from the SUS base material 1 (see FIG. 3C). When the plating layer 32 is peeled off from the SUS base material 1, it is preferable to make some arrangement so as not to deform in advance. Next, when the resist layers 2a to 2c are removed, concave dents 42a to 42c are formed for receiving a printing material such as silver ink having an opening on the surface of the plating layer 32 facing the SUS base material 1. (See FIG. 3D). The concave depressions 42a to 42c are, for example, large, medium, and small in three stages of different groove line widths (thicknesses) so that the volume varies depending on the amount of printing material such as silver ink to be accommodated. It is sized. The large concave recess 42a having a large volume communicates with the through hole 32a at the center of the bottom. Finally, the opening forming surface side of the concave cavities 42a to 42c that is the side facing the SUS base material 1 of the plating layer 32 is a printing surface, and a double-sided adhesive tape, for example, is formed on the plating growth surface side opposite to the printing surface. 5 is attached, and the plating layer 3 is attached to the printing pedestal 6 using the double-sided adhesive tape 5 to complete the printing intaglio. As shown in FIG. 3 (e), the completed printing intaglio has the leading end of the through-hole 32a communicating with the large concave recess 42a having a large volume at the bottom portion closed by the printing base 6. The large concave recess 42a having a large volume and the printing material such as silver ink in the through hole 32a do not leak. The volume of the through hole 32a communicating with the large concave dent 42a having a large volume in the third embodiment is the volume of the through hole 31a communicating with the large concave dent 41a having a large volume in the second embodiment. To make it smaller. The reason is that if the volume of the through-hole 32a is too large, the printing material such as silver ink may be accumulated excessively more than necessary.

Example 4
In Example 1 described above, nickel plating is performed thickly until all of the resist layers 2a to 2c are completely covered from above, and the plating layer 3 is formed with a thickness of, for example, 150 μm to 200 μm (see FIG. 1B). . In Example 2, two types of resist layer 2c having a small groove line width (thickness) and an inner resist layer 2b are completely covered from above, but one type of large resist layer 2a is Nickel plating is performed thinner than Example 1 so as not to cover the center of the upper end, and a plating layer 31 is formed with a thickness of, for example, 30 μm to 100 μm (see FIG. 2B). In Example 3, the resist layer 2c with a small groove line width (thickness) and the resist layer 2b in the middle are completely covered from above, but one type of the large resist layer 2a is Nickel plating is performed thinner than Example 2 so as not to cover the center of the upper end, and a plating layer 32 is formed with a thickness of 20 μm to 70 μm, for example (see FIG. 3B).
On the other hand, in Example 4, when the plating layers 3, 31, and 32 grow to a height that is substantially equal to the upper surface of each of the resist layers 2a to 2c, the first-stage nickel plating process is interrupted and nickel plating is performed. The upper surface of each resist layer 2a to 2c that is not covered with is subjected to a conductive treatment using, for example, palladium or electroless nickel, and then a second nickel plating treatment is performed. Thereby, the plating growth surface side opposite to the printing surface can be thinly formed.

Example 5 FIG.
In the above Examples 1 to 4, since the printing intaglio is entirely formed by nickel plating, the squeegee applies pressure to the printing surface of the intaglio in which the concave depressions 4a to 4c, 41a to 41c, and 42a to 42c are formed. Since they come into contact with each other, the printed surface may be worn out and the durability may be deteriorated. Therefore, in Example 5, the plating layers 3, 31, and 32 are made to a height substantially equal to the upper surface of each of the resist layers 2a to 2c, for example, nickel-phosphorus electroless or electroless coating, electroless nickel, etc. By applying a high hardness film, the printing surface of the intaglio plate on which the concave depressions 4a to 4c, 41a to 41c, and 42a to 42c are formed is a high hardness film that is more resistant to wear than nickel plating, and the squeegee is in contact with pressure. Even so, there is little wear on the printed surface, and durability is improved. Thereafter, the second stage is for performing normal nickel plating.

Example 6
In Example 6, since the entire printing intaglio was formed by nickel plating, the printing surface of the intaglio in which the concave depressions 4a to 4c, 41a to 41c, and 42a to 42c were formed was contacted while the squeegee applied pressure. Therefore, in order to prevent the printing surface from being worn out and the durability from being deteriorated, the completed printing intaglio according to Examples 1 to 4, for example, nickel-phosphorus electrolysis or electroless coating, electroless nickel A high hardness film is applied to the entire surface of the printing intaglio in a plating bath. As a result, the printing surface of the intaglio plate on which at least the concave depressions 4a to 4c, 41a to 41c, and 42a to 42c are formed has a high hardness film that is more resistant to abrasion than nickel plating, and printing is performed even when the squeegee is in contact with pressure. Surface wear is low and durability is improved.

The main use of the printing intaglio according to the present invention is as a printing intaglio for low-resistance and high-transparency conductive films that pattern-print silver-based fine particles on a plastic film. Films and the like are manufactured.
By setting the printing line width to an ultrafine wire (1 to 20 μm), it is possible to produce a further low resistance / highly transparent conductive film device.
In addition, compared to photolithography, etc., it is also a great feature that it is environmentally friendly and has low running costs.

DESCRIPTION OF SYMBOLS 1 SUS base material 2a-2c Resist layer 3, 31, 32 Plated layer 4a-4c, 41a-41c, 42a-42c Recessed depression 31a, 32a Through-hole 5 Double-sided adhesive tape 6 Printing base

Claims (11)

A large number of concave depressions formed by plating and having openings on the printing surface side are formed, and the large number of concave depressions are printing intaglio plates formed so that the volume varies depending on the amount of printing material to be accommodated. There,
The openings of the plurality of concave depressions are formed on the smooth surface side that faces the base material when forming the plating, and the smooth surface side is used as the printing surface, and the plating growth surface side opposite to the printing surface is printed. An intaglio for printing, which is mounted on a pedestal for use. A large number of concave depressions formed by plating and having openings on the printing surface side are formed, and the large number of concave depressions are printing intaglio plates formed so that the volume varies depending on the amount of printing material to be accommodated. There,
The openings of the plurality of concave depressions are formed on the smooth surface side that faces the base material at the time of plating formation, and the smooth surface side is set as a printing surface, and the plating growth surface side opposite to the printing surface is large. The center of the bottom of the concave recess having a volume is communicated with the through hole, and the plated growth surface side opposite to the printing surface is attached to the printing pedestal so that the through hole is closed with the printing pedestal for use. An intaglio for printing.   3. The intaglio for printing according to claim 2, wherein the volume of the through-hole communicating with the center of the bottom of the concave recess having a large volume is formed by thinly growing the plating growth surface side opposite to the printing surface. .   For the formation of plating, a two-step plating layer comprising a first-step plating layer for forming a plurality of concave recess openings serving as printing surfaces and a second-step plating layer for forming a plating growth surface side opposite to the printing surface. The intaglio plate for printing according to any one of claims 1 to 3, wherein the intaglio plate for printing is formed.   The first-stage plating layer that forms the openings of a large number of concave depressions that will be the printing surface is a high-hardness coating resistant to wear, and the second-stage plating layer that forms the plating growth surface side opposite to the printing surface is nickel plating The printing intaglio according to claim 4, wherein the intaglio is used.   The printing intaglio according to any one of claims 1 to 3, wherein the printing intaglio body is formed by nickel plating, and a high-hardness coating is applied to the entire surface of the printing intaglio body. A large number of concave dents formed by plating and having openings on the printing surface side are formed, and the large number of concave dents are intaglio printing plates formed so that the volume varies depending on the amount of printing material to be accommodated. A manufacturing method comprising:
Forming a portion of the resist layer corresponding to the concave depression on the SUS base material, and the step of making the volume of the resist layer different according to the amount of printing material accommodated in the concave depression;
Forming a plating layer by plating thickly until all of the resist layers are completely covered from above;
Peeling the plating layer from the SUS base material;
A concave mold formed by removing each resist layer from the plated layer and having a volume that varies depending on the amount of printing material to be accommodated on the surface of the plated layer facing the SUS base material. Forming a large number of depressions;
A method for producing an intaglio for printing, comprising: A large number of concave dents formed by plating and having openings on the printing surface side are formed, and the large number of concave dents are intaglio printing plates formed so that the volume varies depending on the amount of printing material to be accommodated. A manufacturing method comprising:
Forming a portion of the resist layer corresponding to the concave depression on the SUS base material, and the step of making the volume of the resist layer different according to the amount of printing material accommodated in the concave depression;
Of each of the resist layers, the resist layer with the smaller volume is completely covered from above, but the resist layer with the larger volume is thinly plated so as not to cover the center of the upper end. Forming a plating layer in which a through hole is formed immediately above the upper center portion of the resist layer; and
Peeling the plating layer from the SUS base material;
A concave mold formed by removing each resist layer from the plated layer and having a volume that varies depending on the amount of printing material to be accommodated on the surface of the plated layer facing the SUS base material. A step of forming a large number of dents, and the step of communicating with the through hole at the center of the bottom of the concave dent having a larger volume;
A method for producing an intaglio for printing, comprising:   In the process of forming the plating layer, when the plating layer grows to a height that is approximately equal to the upper surface of each resist layer, the first-stage plating process is interrupted, and the upper surface portion of each resist layer that is not blocked by plating is applied. The method for producing an intaglio for printing according to claim 7 or 8, wherein the second plating step is performed after the conductive treatment.   In the step of forming the plating layer, the first-stage plating layer that forms the openings of a large number of concave depressions to be the printing surface is formed into a high-hardness coating that is resistant to wear, and the plating growth surface side opposite to the printing surface is formed 2 The method for producing an intaglio for printing according to claim 7 or 8, wherein the step plating layer is nickel plating.   The method for producing an intaglio for printing according to claim 7 or 8, further comprising a step of applying a high hardness film to at least the printing surface side of the intaglio main body for printing formed by nickel plating.

Images