TWI532588B - To prevent the bubble generated by the adhesive tape and electronic components of the method - Google Patents

Description

Adhesive tape and electronic component adhesion preventing method

The invention relates to a method for attaching a tape to an electronic component, in particular to a method for preventing the generation of air bubbles at the adhesion between the tape and the electronic component.

The adhesive tape and the electronic component are adhered to a tape by a carrier plate having a plurality of accommodating spaces, and the adhesive layer of the tape is adjacent to the accommodating space, and the electronic component to be pasted is positioned and positioned. On a pedestal, the bonded carrier and the tape are further covered on the electronic component, so that the electronic component protrudes into the accommodating space of the carrier and adheres to the adhesive layer of the adhesive tape.

Wherein, when the electronic component is adhered to the adhesive layer of the adhesive tape, the air between the electronic component and the adhesive layer cannot completely escape, and some air is trapped between the electronic component and the adhesive layer to form a bubble, thereby causing unevenness and affecting. Follow-up process, so the bubble should be further eliminated. Generally, the roller or the scraper is used to scrape the bubble by manual operation, which is time-consuming and time-consuming and the bubble scraping effect is not good.

The main object of the present invention is to provide a method for preventing adhesion of an adhesive tape and an electronic component, thereby improving the problem that air bubbles are generated when the electronic component is adhered to the tape, and the manual scraping of the air bubble is laborious and time-consuming and the effect is not good. .

In order to achieve the foregoing object, the method for adhering the tape and the electronic component for preventing bubble generation comprises: a step of bonding the tape to the carrier, and a carrier having a plurality of accommodating spaces is aligned to the adhesive surface of the tape. a first vacuum adsorption step, the first chamber of the first pedestal is evacuated by a first vacuum adsorption device, and the first pedestal adsorbs the non-adhesive surface of the tape to adsorb the adhesive tape and the carrier; a placing step of placing the electronic component to be adhered to the tape in a second chamber of a second base; a pair of positioning steps to move the first base to the second base Displacement, the first base and the second base are aligned up and down, and then the first base moves along with the carrier plate and the second base to make the first chamber and the second chamber on both sides of the tape And a second vacuum adsorption step, the second base is connected to a second vacuum adsorption device and evacuates the second chamber of the second base, and the first vacuum adsorption device releases the First capacity of the first pedestal Vacuum suction state of the tape, the tape is automatically moved so that the electronic component and the second base is attached.

According to the above, the adhesive tape preventing the bubble generation and the electronic component adhesion method in the first vacuum adsorption step, the adhesive tape and the carrier plate are sucked up, and in the second vacuum adsorption step, the second chamber Vacuuming and releasing the vacuum adsorption state of the tape by the first chamber, so that the tape is automatically adhered to the electronic component due to the pressure difference between the first chamber and the second chamber, and the second chamber is evacuated, so the electronic component is The air between the tapes is extracted, so that no air remains between the tape and the electronic components during the bonding, which effectively prevents the generation of air bubbles, improves the laborious and time-consuming problem of manually scraping the air bubbles, and can facilitate the subsequent processes.

Referring to FIG. 1 , a preferred embodiment of a method for adhering a tape and an electronic component for preventing bubble generation according to the present invention comprises a step of bonding a tape to a carrier, a first vacuum adsorption step, a placing step, and a pair. For the step of the second vacuum and the second vacuum adsorption step, please refer to the adhesive module for performing the adhesive tape 50 and the electronic component as shown in FIG. 2 and FIG. 3 , the adhesive module includes a first base 10 and a second base. a first housing 10 is disposed on the first base 10, and the first base 10 is connected to a first vacuum adsorption device 12, and the second base 20 is provided with a second chamber 21, and The second base 20 is connected to a second vacuum adsorption device 22, and the second base 20 is provided with a matrix-arranged positioning portion 23 in the second chamber 21, wherein the first base 10 and the second base are The seat 20 is provided with a gas-tight strip 30 surrounding the first chamber 11 and the second chamber 21.

In the bonding step of the tape and the carrier, with reference to FIG. 3 and FIG. 4, a carrier 40 having a plurality of accommodating spaces 41 is aligned on the bonding surface 51 of a tape 50, and the tape 50 is on the opposite bonding surface. A non-adhesive surface 52 is formed on one side of the 51, and a part of the adhesive surface 51 of the adhesive tape 50 abuts the accommodating space 41 of the carrier 40.

In the first vacuum adsorption step, referring to FIG. 5, the first chamber 11 of the first susceptor 10 is evacuated by a first vacuum adsorption device 12, and the first susceptor 10 adsorbs the non-adhesive surface 52 of the adhesive tape 50. The adhesive tape 50 and the carrier 40 are adsorbed.

Next, the placing step is performed, and the electronic component 60 to be adhered to the tape 50 is placed on the positioning portion 23 of the second chamber 21 of the second susceptor 20.

Then, the alignment step is performed, and with reference to FIG. 6 and FIG. 7, the first base 10 and the second base 20 are relatively displaced by the moving device, so that the first base 10 and the second base are 20 is up and down, and then the first base 10 and the carrier 40 move toward the second base 20, so that the first chamber 11 and the second chamber 21 on both sides of the tape 50 are airtight, and The accommodating space 41 of the carrier 40 corresponds to the electronic component 60 of the second susceptor 20.

And then performing the second vacuum adsorption step and referring to FIG. 8 , the second susceptor 20 is connected to a second vacuum adsorption device 22 and vacuuming the second chamber 21 of the second pedestal 20 while the first vacuum The adsorption device 12 releases the vacuum adsorption state of the tape 50 by the first chamber 11 of the first susceptor 10, so that the adhesive surface 51 of the tape 50 adjacent to the accommodating space 41 automatically moves toward the electronic component 60 of the second susceptor 20 and After the adhesive tape 50 is pasted with the electronic component 60, the moving device can drive the first base 10 to be separated from the second base 20.

The first vacuum adsorption device 12 is provided with a plurality of first nozzles disposed on the first base 10, and the second vacuum adsorption device 22 is disposed on the second base 20 at a plurality of intervals. The second nozzle is evenly distributed to provide uniform vacuum adsorption.

In the second vacuum adsorption step, since the second chamber 21 is evacuated, the air between the tape 50 and the electronic component 60 is evacuated, and the vacuum adsorption state of the first chamber 11 is released, so that the first chamber is removed. The pressure of 11 is greater than the pressure of the second chamber 21, so that the tape 50 can be automatically moved toward the electronic component 60 as the air of the second chamber 21 is pulled away, so that the electronic component 60 can be adhered to the tape 50, and the second The chamber 21 is evacuated so that there is no air between the electronic component 60 and the tape 50, so that no bubbles are generated at the adhesion of the electronic component 60 to the tape 50.

In summary, the method of adhering the tape and the electronic component for preventing bubble generation effectively removes the air between the tape 50 and the electronic component 60 by switching the vacuum adsorption state of the first chamber 11 and the second chamber 21, thereby ensuring that the air between the tape 50 and the electronic component 60 is effectively removed. When the adhesive tape 50 is bonded to the electronic component 60, no air bubbles are generated, which saves the manual manual scraping of the air bubbles, and can facilitate the subsequent process.

10‧‧‧First base
11‧‧‧First room
12‧‧‧First vacuum adsorption device
20‧‧‧Second base
21‧‧‧Second room
22‧‧‧Second vacuum adsorption device
23‧‧‧ Positioning Department
30‧‧‧Airtight strip
40‧‧‧ Carrier Board
41‧‧‧ accommodating space
50‧‧‧ Tape
51‧‧‧Adhesive surface
52‧‧‧Non-adhesive surface
60‧‧‧Electronic components

Fig. 1 is a flow chart showing a method for adhering a tape and an electronic component for preventing bubble generation according to the present invention. Figure 2: Schematic diagram of an adhesive module for performing adhesive tape bonding to electronic components. Fig. 3 is a schematic view showing the unactuated method of adhering the tape and the electronic component for preventing bubble generation according to the present invention. Fig. 4 is a schematic view showing the bonding of the tape and the carrier sheet to the method for adhering the tape and the electronic component for preventing bubble generation. FIG. 5 is a schematic view showing the tape and the carrier plate of the first susceptor vacuum-adhesive bonding of the tape and the electronic component for preventing the generation of bubbles, and the placing of the electronic component on the second pedestal. FIG. 6 is a schematic view showing the alignment of the first pedestal and the second pedestal of the method for adhering the tape and the electronic component for preventing bubble generation according to the present invention. Fig. 7 is a schematic view showing the first pedestal and the second susceptor moving toward each other and the first chamber and the second chamber being airtight in the method for adhering the tape and the electronic component for preventing bubble generation. Fig. 8 is a schematic view showing a second vacuum adsorption step of the method of adhering the tape to the electronic component for preventing bubble generation.

Claims (3)

A method for adhering a tape and an electronic component for preventing bubble generation, comprising: a step of bonding a tape to a carrier, a carrier having a plurality of accommodating spaces being aligned to a bonding surface of a tape; a first vacuum In the adsorption step, the first chamber of the first pedestal is evacuated by a first vacuum adsorption device, and the first pedestal adsorbs the non-adhesive surface of the tape to adsorb the adhesive tape and the carrier; An electronic component adhered to the tape is placed in a second chamber of a second base; a pair of positioning steps to move the first base and the second base relative to each other to make the first The pedestal is aligned with the second pedestal, and then the first pedestal and the carrier are moved toward the second pedestal, so that the first chamber and the second chamber on both sides of the tape are in an airtight state; And a second vacuum adsorption step, the second base is connected to a second vacuum adsorption device and evacuates the second chamber of the second base, and the first vacuum adsorption device releases the first base The vacuum adsorption state of the tape to the tape allows the tape to automatically face Moving the second electronic component and bonded to the base. The method of adhering a tape and an electronic component for preventing bubble generation according to claim 1, wherein in the second vacuum adsorption step, the first vacuum adsorption device further increases the pressure of the first chamber. The method for adhering a tape and an electronic component for preventing bubble generation according to claim 1 or 2, wherein the first base and the second base are provided with a gas-tight adhesive surrounding the first chamber and the second chamber. article.