CN104861882A - Method for sticking adhesive tape and electronic element for preventing generation of air bubble - Google Patents
Method for sticking adhesive tape and electronic element for preventing generation of air bubble Download PDFInfo
- Publication number
- CN104861882A CN104861882A CN201410123108.XA CN201410123108A CN104861882A CN 104861882 A CN104861882 A CN 104861882A CN 201410123108 A CN201410123108 A CN 201410123108A CN 104861882 A CN104861882 A CN 104861882A
- Authority
- CN
- China
- Prior art keywords
- adhesive tape
- pedestal
- room
- electronic component
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 77
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000001179 sorption measurement Methods 0.000 claims abstract description 11
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 61
- 238000010521 absorption reaction Methods 0.000 claims description 14
- 230000004308 accommodation Effects 0.000 claims description 9
- 238000010030 laminating Methods 0.000 claims description 5
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 5
- 238000007790 scraping Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
A method for sticking adhesive tape and electronic element to prevent air bubble generation includes attaching a carrier plate on an adhesive tape in contraposition mode, vacuumizing the first chamber of the first base by the first vacuum adsorption device to adsorb non-sticking surface of adhesive tape, placing electronic element in the second chamber of the second base, contraposition and moving the first and second bases oppositely by the moving device to make the first and second chambers at two sides of adhesive tape be air-tight, vacuumizing the second chamber of the second base by the second vacuum adsorption device, and releasing vacuum adsorption state of the first vacuum adsorption device to adhesive tape to make adhesive surface of adhesive tape automatically move and stick electronic element.
Description
Technical field
The present invention relates to the method for attaching of a kind of adhesive tape and electronic component, particularly relate to a kind of method of attaching preventing the location for paste of adhesive tape and electronic component from producing bubble.
Background technology
The method of attaching of existing adhesive tape and electronic component first sticks on an adhesive tape by the support plate being equipped with multiple accommodation space, and the adhesive-layer of adhesive tape adjoins accommodation space, and the electronic units fix for pasting is arranged on a pedestal, support plate and the adhesive tape of bonding cover further and overlay on electronic component, make electronic component stretch into the accommodation space of support plate and be pasted onto the adhesive-layer of adhesive tape.
Wherein, when electronic component is pasted onto the adhesive-layer of adhesive tape, air between electronic component and adhesive-layer cannot be escaped completely, partial air is existed between electronic component and adhesive-layer by folder and forms bubble, cause unfairness and affect subsequent technique, so bubble will be eliminated further, general employing cylinder or scraper, striking off of bubble is carried out with manual mode of operation, quite time-consuming and bubble scraping effect is not good.
Summary of the invention
The technical problem to be solved in the present invention is: provide a kind of prevent bubble from producing adhesive tape and the method for attaching of electronic component, wish and design by this, improve current electronic component to be pasted onto adhesive tape and can to produce bubble, and bubble is adopted and is manually struck off the quite time-consuming and problem of poor effect.
Technical solution of the present invention is: provide a kind of prevent bubble from producing adhesive tape and the method for attaching of electronic component, it comprises the adhesion step of an adhesive tape and support plate, and a support plate contraposition with multiple accommodation space is fitted on the sticking veneer of an adhesive tape; One first vacuum suck step, vacuumizes with first room of one first vacuum absorption device to the first pedestal, and the first pedestal adsorbs the non-sticking veneer of this adhesive tape to adsorb adhesive tape and the support plate of laminating; One places step, by the electronic element storing for being pasted onto this adhesive tape in the second room of one second pedestal; One contraposition step, this first pedestal and this second pedestal is allowed to produce relative displacement with running gear, make this first pedestal and the upper and lower contraposition of this second pedestal, then this first pedestal moves in opposite directions together with support plate and this second pedestal, makes the first room of adhesive tape both sides and the second room be all airtight conditions; One second vacuum suck step, this second pedestal connects one second vacuum absorption device and vacuumizes the second room of this second pedestal, this first vacuum absorption device removes the first room of this first pedestal to the vacuum adsorption state of adhesive tape simultaneously, makes adhesive tape automatically move towards the electronic component of this second pedestal and fit.
Advantage of the present invention is: the method for attaching of this adhesive tape preventing bubble from producing and electronic component is in the first vacuum suck step, the adhesive tape of laminating and support plate are picked up, and in the second vacuum suck step, second room is vacuumized and removes the vacuum adsorption state of the first room to adhesive tape, make adhesive tape because of the pressure difference between the first room and the second room automatic adhesion electronic component, and the second room vacuumizes, so the air between electronic component and adhesive tape is drawn out of, so be deposited between adhesive tape and electronic component without air during laminating, effectively prevent bubble from producing, improve the time-consuming problem of in the past manually scraping bubble removing, and the carrying out of subsequent technique can be beneficial to.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the method for attaching of the present invention's adhesive tape of preventing bubble from producing and electronic component;
Fig. 2 is the schematic diagram of the stickup module that execution adhesive tape and electronic component are pasted;
Fig. 3 is the non-illustrative view of the method for attaching of the present invention's adhesive tape of preventing bubble from producing and electronic component;
Fig. 4 is the schematic diagram that the adhesive tape of the method for attaching of the present invention's adhesive tape of preventing bubble from producing and electronic component and support plate are fitted;
Fig. 5 is that the first base vacuum of the method for attaching of the present invention's adhesive tape of preventing bubble from producing and electronic component adsorbs the adhesive tape and support plate of fitting, and places the schematic diagram of electronic component at the second pedestal;
Fig. 6 is the first pedestal of method of attaching and the schematic diagram of the second pedestal contraposition of the present invention's adhesive tape of preventing bubble from producing and electronic component;
Fig. 7 is that the first pedestal of the method for attaching of the present invention's adhesive tape of preventing bubble from producing and electronic component and the second pedestal move in opposite directions and the first room and the second room are the schematic diagram of airtight conditions;
Fig. 8 is the schematic diagram of the second vacuum suck step of the method for attaching of the present invention's adhesive tape of preventing bubble from producing and electronic component.
Embodiment
With the following drawings and preferred embodiments of the present invention, the technique means that the present invention takes for reaching predetermined goal of the invention is set forth further.
Refer to Fig. 1, a kind of preferred embodiment of the adhesive tape preventing bubble from producing for the present invention and the method for attaching of electronic component, it comprises the adhesion step of an adhesive tape and support plate, one first vacuum suck step, one places step, one contraposition step and one second vacuum suck step, refer to Fig. 2, shown in Fig. 3 in order to perform the stickup module that adhesive tape 50 and electronic component are pasted, this stickup module includes one first pedestal 10 and one second pedestal 20, this first pedestal 10 is provided with one first room 11, and this first pedestal 10 connects one first vacuum absorption device 12, this second pedestal 20 is provided with one second room 21, and this second pedestal 20 connects one second vacuum absorption device 22, and the second pedestal 20 is provided with the location division 23 of arranged in the second room 21, wherein, at this first pedestal 10, second pedestal 20 is provided with around the first room 11, the air-tight rubber strip 30 of the second room 21.
In the adhesion step of adhesive tape and support plate, coordinate referring to Fig. 3, Fig. 4, support plate 40 contraposition by one with multiple accommodation space 41 is fitted on the sticking veneer 51 of an adhesive tape 50, this adhesive tape 50 forms a non-sticking veneer 52 in the side of relative sticking veneer 51, and the bonding partially face 51 of adhesive tape 50 adjoins the accommodation space 41 of support plate 40.
In this first vacuum suck step, coordinate referring to Fig. 5, vacuumize with first room 11 of one first vacuum absorption device 12 to the first pedestal 10, the first pedestal 10 adsorbs the non-sticking veneer 52 of adhesive tape 50 to adsorb adhesive tape 50 and the support plate 40 of laminating.
Then carry out this placement step, the electronic component 60 for being pasted onto this adhesive tape 50 is seated on the location division 23 of the second room 21 of one second pedestal 20.
Then this contraposition step is carried out, and coordinate referring to Fig. 6, Fig. 7, this first pedestal 10 is allowed to produce relative displacement with this second pedestal 20 with running gear, make this first pedestal 10 and this second pedestal about 20 contraposition, then this first pedestal 10 moves in opposite directions together with support plate 40 and this second pedestal 20, the first room 11 of adhesive tape 50 both sides and the second room 21 is made to be all airtight conditions, and the electronic component 60 of corresponding second pedestal 20 of the accommodation space 41 of support plate 40.
Then carry out this second vacuum suck step and coordinate referring to Fig. 8, this second pedestal 20 connects one second vacuum absorption device 22 and vacuumizes the second room 21 of this second pedestal 20, this first vacuum absorption device 12 removes the vacuum adsorption state of the first room 11 pairs of adhesive tapes 50 of this first pedestal 10 simultaneously, the sticking veneer 51 making adhesive tape 50 adjoin accommodation space 41 automatically moves towards the electronic component 60 of this second pedestal 20 and fits, after adhesive tape 50 and electronic component 60 are pasted, this running gear can drive this first pedestal 10 to depart from this second pedestal 20.
Wherein, this first vacuum absorption device 12 is provided with multiple spaced first suction nozzle on this first pedestal 10, and this second vacuum absorption device 22 is provided with multiple spaced second suction nozzle on this second pedestal 20, by evenly laying to provide uniform vacuum adsorption force.
In this second vacuum suck step, because the second room 21 vacuumizes, air between adhesive tape 50 and electronic component 60 is pulled out, the vacuum adsorption state of the first room 11 is removed again, make the pressure of the first room 11 greatly at the pressure of the second room 21, adhesive tape 50 can is pulled out along with the air of the second room 21 and automatically move towards electronic component 60, make electronic component 60 Pasting at this adhesive tape 50, and the second room 21 vacuumizes, electronic component 60 makes without air between electronic component 60 and adhesive tape 50, so can not produce bubble with the location for paste of adhesive tape 50.
In sum, the method of attaching of this adhesive tape preventing bubble from producing and electronic component is by the vacuum adsorption state of switching first room 11 and the second room 21, effectively detach the air between adhesive tape 50 and electronic component 60, bubble is not produced when guaranteeing that adhesive tape 50 and electronic component 60 bond, the operation of in the past manually scraping bubble removing can be saved, and the carrying out of subsequent technique can be beneficial to.
Certainly; the present invention also can have other various embodiments; when not deviating from the present invention's spirit and essence thereof; those of ordinary skill in the art are when making various corresponding change and distortion according to the present invention, but these change accordingly and are out of shape the protection domain that all should belong to the claim appended by the present invention.
Claims (3)
1. the adhesive tape preventing bubble from producing and a method of attaching for electronic component, it is characterized in that, the method for attaching of this adhesive tape preventing bubble from producing and electronic component comprises:
The adhesion step of one adhesive tape and support plate, a support plate contraposition with multiple accommodation space is fitted on the sticking veneer of an adhesive tape;
One first vacuum suck step, vacuumizes with first room of one first vacuum absorption device to the first pedestal, and the first pedestal adsorbs the non-sticking veneer of this adhesive tape to adsorb adhesive tape and the support plate of laminating;
One places step, by the electronic element storing for being pasted onto this adhesive tape in the second room of one second pedestal;
One contraposition step, this first pedestal and this second pedestal is allowed to produce relative displacement with running gear, make this first pedestal and the upper and lower contraposition of this second pedestal, then this first pedestal moves in opposite directions together with support plate and this second pedestal, makes the first room of adhesive tape both sides and the second room be all airtight conditions; And
One second vacuum suck step, this second pedestal connects one second vacuum absorption device and vacuumizes the second room of this second pedestal, this first vacuum absorption device removes the first room of this first pedestal to the vacuum adsorption state of adhesive tape simultaneously, makes adhesive tape automatically move towards the electronic component of this second pedestal and fit.
2. according to claim 1 prevent bubble from producing adhesive tape and the method for attaching of electronic component, it is characterized in that, in this second vacuum suck step, this first vacuum absorption device increases the pressure of this first room further.
3. according to claim 1 and 2 prevent bubble from producing adhesive tape and the method for attaching of electronic component, it is characterized in that, the first pedestal, the second pedestal are provided with the air-tight rubber strip around the first room, the second room.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103105993A TWI532588B (en) | 2014-02-24 | 2014-02-24 | To prevent the bubble generated by the adhesive tape and electronic components of the method |
| TW103105993 | 2014-02-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104861882A true CN104861882A (en) | 2015-08-26 |
| CN104861882B CN104861882B (en) | 2017-04-26 |
Family
ID=53908081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410123108.XA Expired - Fee Related CN104861882B (en) | 2014-02-24 | 2014-03-28 | Method for sticking adhesive tape and electronic element for preventing generation of air bubble |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104861882B (en) |
| TW (1) | TWI532588B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06274948A (en) * | 1993-03-24 | 1994-09-30 | Toshiba Corp | Device and method for sticking |
| JPH09198720A (en) * | 1996-01-12 | 1997-07-31 | Horon:Kk | Method for sticking together optical recording information medium and device therefor |
| TW516081B (en) * | 2001-01-15 | 2003-01-01 | Lintec Corp | Bonding apparatus and bonding method |
| CN1658981A (en) * | 2002-06-11 | 2005-08-24 | 3M创新有限公司 | Method of conforming an adherent film to a substrate by application of vacuum |
| CN101128556A (en) * | 2005-02-28 | 2008-02-20 | 西尔弗布鲁克研究有限公司 | Method for felting underlay |
| JP2010208305A (en) * | 2009-03-12 | 2010-09-24 | Sharp Corp | Laminated substrate, display device, manufacturing method of laminated substrate, and manufacturing method of display device |
| CN102385088A (en) * | 2010-09-03 | 2012-03-21 | 日东电工株式会社 | Method and apparatus for sequentially laminating optical film including polarizing film, to rectangular-shaped panel |
| CN102598091A (en) * | 2010-08-30 | 2012-07-18 | 信越工程株式会社 | Display panel production method and production system therefor |
-
2014
- 2014-02-24 TW TW103105993A patent/TWI532588B/en active
- 2014-03-28 CN CN201410123108.XA patent/CN104861882B/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06274948A (en) * | 1993-03-24 | 1994-09-30 | Toshiba Corp | Device and method for sticking |
| JPH09198720A (en) * | 1996-01-12 | 1997-07-31 | Horon:Kk | Method for sticking together optical recording information medium and device therefor |
| TW516081B (en) * | 2001-01-15 | 2003-01-01 | Lintec Corp | Bonding apparatus and bonding method |
| CN1658981A (en) * | 2002-06-11 | 2005-08-24 | 3M创新有限公司 | Method of conforming an adherent film to a substrate by application of vacuum |
| CN101128556A (en) * | 2005-02-28 | 2008-02-20 | 西尔弗布鲁克研究有限公司 | Method for felting underlay |
| JP2010208305A (en) * | 2009-03-12 | 2010-09-24 | Sharp Corp | Laminated substrate, display device, manufacturing method of laminated substrate, and manufacturing method of display device |
| CN102598091A (en) * | 2010-08-30 | 2012-07-18 | 信越工程株式会社 | Display panel production method and production system therefor |
| CN102385088A (en) * | 2010-09-03 | 2012-03-21 | 日东电工株式会社 | Method and apparatus for sequentially laminating optical film including polarizing film, to rectangular-shaped panel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104861882B (en) | 2017-04-26 |
| TW201532786A (en) | 2015-09-01 |
| TWI532588B (en) | 2016-05-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170426 Termination date: 20180328 |