CN104861882B - Method for sticking adhesive tape and electronic element for preventing generation of air bubble - Google Patents
Method for sticking adhesive tape and electronic element for preventing generation of air bubble Download PDFInfo
- Publication number
- CN104861882B CN104861882B CN201410123108.XA CN201410123108A CN104861882B CN 104861882 B CN104861882 B CN 104861882B CN 201410123108 A CN201410123108 A CN 201410123108A CN 104861882 B CN104861882 B CN 104861882B
- Authority
- CN
- China
- Prior art keywords
- adhesive tape
- pedestal
- room
- electronic component
- support plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 75
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000001179 sorption measurement Methods 0.000 claims abstract description 12
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 58
- 238000010521 absorption reaction Methods 0.000 claims description 14
- 230000004308 accommodation Effects 0.000 claims description 9
- 238000010030 laminating Methods 0.000 claims description 5
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 239000012790 adhesive layer Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000007790 scraping Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
Abstract
A method for sticking adhesive tape and electronic element to prevent air bubble generation includes attaching a carrier plate on an adhesive tape in contraposition mode, vacuumizing the first chamber of the first base by the first vacuum adsorption device to adsorb non-sticking surface of adhesive tape, placing electronic element in the second chamber of the second base, contraposition and moving the first and second bases oppositely by the moving device to make the first and second chambers at two sides of adhesive tape be air-tight, vacuumizing the second chamber of the second base by the second vacuum adsorption device, and releasing vacuum adsorption state of the first vacuum adsorption device to adhesive tape to make adhesive surface of adhesive tape automatically move and stick electronic element.
Description
Technical field
The present invention relates to the method for attaching of a kind of adhesive tape and electronic component, more particularly to one kind can prevent adhesive tape with electronics unit
The location for paste of part produces the method for attaching of bubble.
Background technology
Existing adhesive tape is first the support plate for being equipped with multiple accommodation spaces to be sticked in into a glue with the method for attaching of electronic component
Take, and the adjacent accommodation space of adhesive-layer of adhesive tape, and the electronic units fix for being intended to paste be arranged on a pedestal, bond
Support plate and adhesive tape further lid is overlayed on electronic component, electronic component is stretched into the accommodation space of support plate and is pasted onto adhesive tape
Adhesive-layer.
Wherein, when electronic component is pasted onto the adhesive-layer of adhesive tape, the air between electronic component and adhesive-layer cannot be complete
Escape, partial air is existed between electronic component and adhesive-layer by folder and forms bubble, is caused out-of-flatness and is affected subsequent technique,
So further eliminating in bubble, typically using cylinder or scraper, striking off for bubble is carried out with manual mode of operation, quite
It is time-consuming and bubble scraping effect is not good.
The content of the invention
The technical problem to be solved in the present invention is：The stickup side of a kind of adhesive tape for preventing bubble from producing and electronic component is provided
Method, uncommon thereby to design, the current electronic component of improvement is pasted onto adhesive tape can produce bubble, and bubble is adopted manually to strike off and quite taken a lot of work
Time-consuming and effect on driving birds is not good problem.
The present invention technical solution be：The stickup side of a kind of adhesive tape for preventing bubble from producing and electronic component is provided
Method, it includes the adhesion step of an adhesive tape and support plate, and one there is the support plate para-position of multiple accommodation spaces to be fitted in the viscous of an adhesive tape
On veneer；One first vac sorb step, with first room evacuation of one first vacuum absorption device to the first pedestal, first
Pedestal adsorbs the non-sticking veneer of the adhesive tape to adsorb the adhesive tape and support plate of laminating；One places step, is intended to be pasted onto the adhesive tape
Electronic element storing is in the second room of one second pedestal；One para-position step, with mobile device allow first pedestal with this
Two pedestals produce relative displacement, make first pedestal and the upper and lower para-position of the second pedestal, then first pedestal together with support plate with
Second pedestal is moved towards, and the first room and the second room for making adhesive tape both sides is all in airtight conditions；One second vac sorb
Step, second pedestal connects one second vacuum absorption device and to the second room evacuation of second pedestal, at the same this
One vacuum absorption device releases vacuum adsorption state of the first room of first pedestal to adhesive tape, make adhesive tape automatically towards this second
The electronic component of pedestal is moved and fitted.
It is an advantage of the invention that：This prevents the method for attaching of the adhesive tape of bubble generation and electronic component in the first vac sorb
In step, the adhesive tape of laminating and support plate are picked up, and in the second vac sorb step, to the second room evacuation and release the
Vacuum adsorption state of one room to adhesive tape, makes adhesive tape paste electricity automatically because of the pressure differential between the first room and the second room
Subcomponent, and the second room evacuation, so the air between electronic component and adhesive tape is extracted, so staying without air during laminating
Exist between adhesive tape and electronic component, effectively prevent bubble from producing, improve the time-consuming problem for manually scraping bubble removing in the past, and
The carrying out of subsequent technique can be beneficial to.
Describe the present invention below in conjunction with the drawings and specific embodiments, but it is not as a limitation of the invention.
Description of the drawings
Fig. 1 is the schematic flow sheet that the present invention prevents the adhesive tape that bubble is produced and the method for attaching of electronic component；
Fig. 2 is the schematic diagram for performing the stickup module that adhesive tape is pasted with electronic component；
Fig. 3 is the non-illustrative view that the present invention prevents the adhesive tape that bubble is produced and the method for attaching of electronic component；
Fig. 4 is that the present invention prevents the adhesive tape of bubble generation and showing that the adhesive tape of the method for attaching of electronic component is fitted with support plate
It is intended to；
Fig. 5 is the first base vacuum absorption patch that the present invention prevents the adhesive tape that bubble is produced and the method for attaching of electronic component
The adhesive tape and support plate of conjunction, and place schematic diagram of the electronic component in the second pedestal；
Fig. 6 is the first pedestal and the second pedestal that the present invention prevents the adhesive tape that bubble is produced and the method for attaching of electronic component
The schematic diagram of para-position；
Fig. 7 is the first pedestal and the second pedestal that the present invention prevents the adhesive tape that bubble is produced and the method for attaching of electronic component
Move towards and the schematic diagram of the first room and the second room in airtight conditions；
Fig. 8 is the second vac sorb step that the present invention prevents the adhesive tape that bubble is produced and the method for attaching of electronic component
Schematic diagram.
Specific embodiment
With the following drawings and preferred embodiments of the present invention, the present invention is expanded on further to reach predetermined goal of the invention institute
The technological means taken.
Fig. 1 is referred to, is a kind of preferable reality that the present invention prevents the adhesive tape that bubble is produced and the method for attaching of electronic component
Apply example, adhesion step that it includes an adhesive tape and support plate, one first vac sorb step, one place step, a para-position step and
One second vac sorb step, refers to the stickup module to perform adhesive tape 50 and electronic component stickup shown in Fig. 2, Fig. 3,
The stickup module includes one first pedestal 10 and one second pedestal 20, and first pedestal 10 is provided with one first room 11, with
And first pedestal 10 connects one first vacuum absorption device 12, second pedestal 20 is provided with one second room 21, and should
Second pedestal 20 connects one second vacuum absorption device 22, and the second pedestal 20 is provided with determining for matrix arrangement in the second room 21
Position portion 23, wherein, the gastight adhesive around the first room 11, the second room 21 is provided with first pedestal 10, the second pedestal 20
Bar 30.
In adhesive tape and the adhesion step of support plate, coordinate referring to Fig. 3, Fig. 4, the support plate 40 that there are multiple accommodation spaces 41 by
Para-position is fitted on the sticking veneer 51 of an adhesive tape 50, and the adhesive tape 50 forms a non-sticking veneer 52 in the side of relative sticking veneer 51,
And the bonding partially face 51 of adhesive tape 50 adjoins the accommodation space 41 of support plate 40.
In the first vac sorb step, coordinate referring to Fig. 5, with one first vacuum absorption device, 12 pairs of the first pedestals 10
The evacuation of the first room 11, the non-sticking veneer 52 of the absorption adhesive tape 50 of the first pedestal 10 is adsorbing the adhesive tape 50 and support plate of laminating
40。
Then the placement step is carried out, the electronic component 60 for being intended to be pasted onto the adhesive tape 50 is seated in one second pedestal 20
On the location division 23 of the second room 21.
Then carry out the para-position step, and coordinate referring to Fig. 6, Fig. 7, with mobile device allow first pedestal 10 with this second
Pedestal 20 produces relative displacement, makes first pedestal 10 and the second pedestal para-position about 20, then first pedestal 10 together with
Support plate 40 is moved towards with second pedestal 20, and the first room 11 and the second room 21 for making the both sides of adhesive tape 50 is all in airtight shape
State, and the electronic component 60 of second pedestal 20 of correspondence of accommodation space 41 of support plate 40.
Then carry out the second vac sorb step and coordinate referring to Fig. 8, second pedestal 20 connects one second vacuum and inhales
Adsorption device 22 and to the evacuation of the second room 21 of second pedestal 20, at the same first vacuum absorption device 12 release this first
Vacuum adsorption state of first room 11 of pedestal 10 to adhesive tape 50, make adhesive tape 50 adjoin accommodation space 41 sticking veneer 51 it is automatic
Electronic component 60 towards second pedestal 20 is moved and fitted, and after adhesive tape 50 and the stickup of electronic component 60, the mobile device can
Drive first pedestal 10 to depart from second pedestal 20.
Wherein, first vacuum absorption device 12 is provided with multiple spaced first suction nozzles on first pedestal 10,
And second vacuum absorption device 22 is provided with multiple spaced second suction nozzles on second pedestal 20, by uniform cloth
If to provide uniform vacuum adsorption force.
In the second vac sorb step, due to the evacuation of the second room 21, make between adhesive tape 50 and electronic component 60
Air be pulled out, and the vacuum adsorption state of the first room 11 release so that the pressure of the first room 11 is greatly in the second room
21 pressure, adhesive tape 50 can be moved towards electronic component 60 automatically as the air of the second room 21 is pulled out, and makes electronics unit
The Pasting of part 60 is in the adhesive tape 50, and the evacuation of the second room 21, make between electronic component 60 and adhesive tape 50 without air, so electric
Subcomponent 60 will not produce bubble with the location for paste of adhesive tape 50.
In sum, this prevent the method for attaching of adhesive tape and the electronic component that bubble produces by the first room of switching 11 with
The vacuum adsorption state of the second room 21, effectively detaches the air between adhesive tape 50 and electronic component 60, it is ensured that adhesive tape 50 and electricity
Subcomponent 60 does not produce bubble when bonding, and can save the operation for manually scraping bubble removing in the past, and can be beneficial to the carrying out of subsequent technique.
Certainly, the present invention can also have other various embodiments, ripe in the case of without departing substantially from spirit of the invention and its essence
Know those skilled in the art and work as and various corresponding changes and deformation, but these corresponding changes and change can be made according to the present invention
Shape should all belong to the protection domain of appended claims of the invention.
Claims (2)
1. a kind of method of attaching of the adhesive tape and the electronic component that prevent bubble from producing, it is characterised in that this prevents what bubble from producing
Adhesive tape is included with the method for attaching of electronic component：
The adhesion step of one adhesive tape and support plate, one there is the support plate para-position of multiple accommodation spaces to be fitted in the sticking veneer of an adhesive tape
On；
One first vac sorb step, with first room evacuation of one first vacuum absorption device to the first pedestal, the first base
Seat adsorbs the non-sticking veneer of the adhesive tape to adsorb the adhesive tape and support plate of laminating；
One places step, is intended to be pasted onto the electronic element storing of the adhesive tape in the second room of one second pedestal；
One para-position step, allows first pedestal to produce relative displacement with second pedestal with mobile device, make first pedestal with
The upper and lower para-position of second pedestal, then first pedestal move towards with second pedestal together with support plate, make the of adhesive tape both sides
One room and the second room are all in airtight conditions；And
One second vac sorb step, second pedestal connects one second vacuum absorption device and to the second appearance of second pedestal
Room evacuation, while first vacuum absorption device releases vacuum adsorption state of the first room of first pedestal to adhesive tape,
Adhesive tape is set to move and fit towards the electronic component of second pedestal automatically.
2. the method for attaching of the adhesive tape and the electronic component that prevent bubble from producing according to claim 1, it is characterised in that
First pedestal, the second pedestal are provided with the air-tight rubber strip around the first room, the second room.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103105993 | 2014-02-24 | ||
| TW103105993A TWI532588B (en) | 2014-02-24 | 2014-02-24 | To prevent the bubble generated by the adhesive tape and electronic components of the method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104861882A CN104861882A (en) | 2015-08-26 |
| CN104861882B true CN104861882B (en) | 2017-04-26 |
Family
ID=53908081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410123108.XA Expired - Fee Related CN104861882B (en) | 2014-02-24 | 2014-03-28 | Method for sticking adhesive tape and electronic element for preventing generation of air bubble |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104861882B (en) |
| TW (1) | TWI532588B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06274948A (en) * | 1993-03-24 | 1994-09-30 | Toshiba Corp | Device and method for sticking |
| JPH09198720A (en) * | 1996-01-12 | 1997-07-31 | Horon:Kk | Method for sticking together optical recording information medium and device therefor |
| TW516081B (en) * | 2001-01-15 | 2003-01-01 | Lintec Corp | Bonding apparatus and bonding method |
| CN1658981A (en) * | 2002-06-11 | 2005-08-24 | 3M创新有限公司 | Method of conforming an adherent film to a substrate by application of vacuum |
| CN101128556A (en) * | 2005-02-28 | 2008-02-20 | 西尔弗布鲁克研究有限公司 | Method for felting underlay |
| JP2010208305A (en) * | 2009-03-12 | 2010-09-24 | Sharp Corp | Laminated substrate, display device, manufacturing method of laminated substrate, and manufacturing method of display device |
| CN102385088A (en) * | 2010-09-03 | 2012-03-21 | 日东电工株式会社 | Method and apparatus for sequentially laminating optical film including polarizing film, to rectangular-shaped panel |
| CN102598091A (en) * | 2010-08-30 | 2012-07-18 | 信越工程株式会社 | Display panel production method and production system therefor |
-
2014
- 2014-02-24 TW TW103105993A patent/TWI532588B/en active
- 2014-03-28 CN CN201410123108.XA patent/CN104861882B/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06274948A (en) * | 1993-03-24 | 1994-09-30 | Toshiba Corp | Device and method for sticking |
| JPH09198720A (en) * | 1996-01-12 | 1997-07-31 | Horon:Kk | Method for sticking together optical recording information medium and device therefor |
| TW516081B (en) * | 2001-01-15 | 2003-01-01 | Lintec Corp | Bonding apparatus and bonding method |
| CN1658981A (en) * | 2002-06-11 | 2005-08-24 | 3M创新有限公司 | Method of conforming an adherent film to a substrate by application of vacuum |
| CN101128556A (en) * | 2005-02-28 | 2008-02-20 | 西尔弗布鲁克研究有限公司 | Method for felting underlay |
| JP2010208305A (en) * | 2009-03-12 | 2010-09-24 | Sharp Corp | Laminated substrate, display device, manufacturing method of laminated substrate, and manufacturing method of display device |
| CN102598091A (en) * | 2010-08-30 | 2012-07-18 | 信越工程株式会社 | Display panel production method and production system therefor |
| CN102385088A (en) * | 2010-09-03 | 2012-03-21 | 日东电工株式会社 | Method and apparatus for sequentially laminating optical film including polarizing film, to rectangular-shaped panel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104861882A (en) | 2015-08-26 |
| TW201532786A (en) | 2015-09-01 |
| TWI532588B (en) | 2016-05-11 |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170426 Termination date: 20180328 |