TWI524562B - Led lighting assemblies - Google Patents

Led lighting assemblies Download PDF

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Publication number
TWI524562B
TWI524562B TW099142764A TW99142764A TWI524562B TW I524562 B TWI524562 B TW I524562B TW 099142764 A TW099142764 A TW 099142764A TW 99142764 A TW99142764 A TW 99142764A TW I524562 B TWI524562 B TW I524562B
Authority
TW
Taiwan
Prior art keywords
power
matching
contact
contacts
housing
Prior art date
Application number
TW099142764A
Other languages
Chinese (zh)
Other versions
TW201131834A (en
Inventor
克里斯多福 喬治 戴莉
羅漢 納榮
馬修 愛德華 摩斯托勒
雷諾德 馬汀 韋伯
Original Assignee
太谷電子公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US12/637,356 priority Critical patent/US8342733B2/en
Application filed by 太谷電子公司 filed Critical 太谷電子公司
Publication of TW201131834A publication Critical patent/TW201131834A/en
Application granted granted Critical
Publication of TWI524562B publication Critical patent/TWI524562B/en

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCBs], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/72Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Description

LED lighting assembly

The subject matter of the present invention relates generally to solid state lighting, and more particularly to connectors for lighting assemblies.

Solid-state lighting systems utilize solid-state light sources, such as light-emitting diodes (LEDs), and are used to replace other lighting systems that use other types of light sources, such as white hot light or fluorescent light bulbs. Solid-state light sources offer advantages over these lamps, such as fast turn-on, fast cycle (on-off-on) time, long life, low power consumption, and narrow illumination bandwidth (providing the desired shade without the need for a filter) Wait. LED lighting systems typically include an LED package having a substrate with power leads on the substrate for connection to an LED wafer. There is a lens around the LED wafer, and the light from the LED passes through the lens.

The LED package generally has a power lead that is soldered to a pad on a printed circuit board (PCB) to create an electrical and mechanical connection to the PCB; the power leads are arranged at the bottom of the LED package substrate for such a connection. Use. Some conventional illumination systems use sockets to hold LED packages, wherein the sockets have power contacts that contact corresponding power leads on the LED package; power leads are typically located on the sides of the LED package substrate for such connections. Due to the heat generated by the LED package, heat sinks are required to dissipate heat from the LED package. So far, since the power leads are arranged along the bottom and/or sides of the substrate, the LED manufacturer has a problem in designing a thermal interface that can effectively dissipate the LED package. Some LED manufacturers produce LED packages with power leads on the top of the substrate so that the thermal interface can be located around the bottom and/or sides of the substrate; however, when the size of the LED package is reduced, a power lead can be connected The problem with the power conductor. A conventional LED package having such a configuration has a line soldered to a power supply lead, which is difficult, time consuming, and cannot be smoothly automated.

In addition, some conventional LED package systems incorporate multiple LED chips, such as for multi-color light effects, and each LED chip requires separate power leads; therefore, the power leads are made smaller, with many power supplies on top of the substrate. The leads match. It is very difficult and uneconomical to terminate the power conductor to these leads (e.g., by soldering).

Lighting systems still have the need to be effectively activated; lighting systems with LED packages also have the need for proper heat dissipation; lighting systems with LED packages have the need to be assembled in an efficient and cost-effective manner.

In one embodiment, an illumination assembly is provided for a light emitting diode (LED) package having an LED chip on top of a fixed substrate having a top on the fixed substrate a power lead arranged adjacent to a first edge of the fixed substrate; the fixed substrate is fixed to a base. The lighting assembly includes a power contact that defines a separable interface to contact a power lead on a matching substrate of the LED package and supply power to the LED wafer. The power contacts have a compliant beam extending to the detachable interface, the compliant beams being deflected when contacting the power leads such that the power contacts are biased toward the power leads. The power contacts terminate in corresponding power supply conductors opposite the separable interface. The lighting assembly also includes a dielectric housing that holds the power contacts, the housing having a securing feature to lock the housing to the base independently of the LED package.

In addition, there is provided an illumination assembly for an LED package having an LED chip on top of a fixed substrate having a power supply lead on the top of the fixed substrate, the arrangement being closely fixed to A first edge of the fixed substrate of the pedestal. The lighting assembly includes a power contact having a first matching portion and a second matching portion. The first matching portion defines a separable interface to contact a corresponding power supply lead on the matching substrate of the LED package and to supply power to the LED wafer; the second matching portion terminates to a corresponding power supply conductor opposite the separable interface. A dielectric housing holds the power contact and includes an upper portion that holds the first mating portion of the power contact and a lower portion that holds the second mating portion of the power contact. The upper portion is secured to a pedestal adjacent the LED package and the lower portion extends from the upper portion through an opening in the pedestal. The lower portion has a port configured to receive the power conductor to match the second matching portion of the power contact.

In addition, there is provided a lighting assembly for a light emitting diode (LED) package having an LED chip on top of a fixed substrate having a top on the top of the fixed substrate Power leads are arranged adjacent the first edge of the fixed substrate secured to a base. The lighting assembly includes a power contact having a first matching portion and a second matching portion. The first matching portion defines a separable interface to contact a corresponding power supply lead on the matching substrate of the LED package, and supplies power to the LED chip; the first matching portion has a compliant beam body extending to the separable interfaces, It deflects when it contacts the power leads, causing the power contacts to be biased toward the power leads. The second matching portion has Insulation Displacement Contacts (IDCs) to terminate to the corresponding power supply conductors of the power supply line. A dielectric housing holds the power contacts, the housing having a securing feature to lock the housing to the base independently of the LED package.

The first figure is a top perspective view of a lighting accessory 100 formed in accordance with an exemplary embodiment, and the second figure is an exploded view of the lighting accessory 100. The lighting accessory 100 includes an illumination ballast 102 and a lighting assembly 104. The illumination assembly 104 is housed in the illumination ballast 102 to produce a luminescent effect. Although the lighting accessory 100 is an accessory in the form of a light bulb, it should be understood that the lighting accessory 100 can have other configurations at the same time, such as a tubular configuration. The lighting accessory 100 can be used for residential, commercial or industrial use; the lighting accessory 100 can be used for general purpose lighting, or can also have a customized application or end use.

The lighting ballast 102 includes a power conductor 106 at one end thereof for receiving power from the power supply, and the lighting ballast 102 includes a frame 108 for holding the power conductor 106 and the lighting assembly 104. Power conductors 106 are electrically coupled to lighting assembly 104 to supply power to lighting assembly 104. The illumination ballast 102 includes a recess 110 that houses the illumination assembly 104. Optionally, the illumination ballast 102 includes a lens (not shown) attached to the top of the frame 108 that covers the illumination assembly 104. The light system is guided through the lens.

The lighting assembly 104 includes a base 112, a light emitting diode (LED) package 114 secured to the base 112, and a power connector 116 secured to the base 112 and a power supply connector 118 coupled to the power connector 116. Power supply connector 118 receives power from a power supply, such as from power supply conductor 106. The power supply connector 118 supplies power to the power connector 116, and the power connector 116 supplies power to the LED package 114.

The base 112 includes a top surface 120 and a bottom surface 122. The LED package 114 and the power connector 116 are secured to the top surface 120. In an exemplary embodiment, LED package 114 is detached from power connector 116 and secured to pedestal 112; for example, LED package 114 can be soldered to pedestal 112. After the LED package 114 is secured to the pedestal 112 in a separate assembly step, the power connector 116 is coupled to the LED package 114. The power connector 116 makes contact with the LED package 114 at a separable interface.

The susceptor 112 can be a heat sink, as appropriate. The LED package 114 and/or the power connector 116 are in thermal contact with the pedestal 112 such that the susceptor 112 can dissipate heat from the LED package 114 and/or the power connector 116. The susceptor 112 is a printed circuit board (PCB), as appropriate. The PCB includes a heat sink, such as one or more layers, defining a heat sink for dissipating heat from the LED package 114 and/or the power connector 116.

The third view is a top view of the LED package 114; the fourth view is a side view of the LED package 114. The LED package 114 includes a fixed substrate 124 having a top portion 126 and a bottom portion 128. The LED package 114 has one or more LED wafers 130 that are attached to the top 126 of the fixed substrate 124. Lens 131 covers LED wafer 130 and other circuitry and/or circuit components. A reflector (not shown) may be provided in addition to the lens 131, as appropriate.

There is also a power lead 132 on the top 126 of the fixed substrate 124 that is electrically connected to the corresponding LED wafer 130. The power lead 132 is a pad and/or a conductive trace extending over one or more of the layers of the fixed substrate 124. In the illustrated embodiment, there are three LED chips 130, each LED chip 130 corresponding to a different color of light (e.g., red, green, blue, etc.). Each of the LED chips 130 has two power leads 132 representing an anode power contact 134 and a cathode power contact 135, resulting in a total of six power leads 132 on the top 126. It should be understood that any number of LED wafers 130 and corresponding power leads 132 may be provided in other embodiments. When the power supply lead 132 is activated, the LED wafer 130 is activated to cause the LED package 114 to emit light. Different combinations of LED chips 130 can be activated to have different illumination effects.

In the particular embodiment described, the power leads 132 are only arranged on the top 126, not on the bottom 128 or on any of the edges 136. The power leads 132 are arranged in a row adjacent an edge 136 of the fixed substrate 124. However, in other embodiments, other arrangements are also possible. Because there are no power leads 132 on the edge 136, the fixed substrate 124 is relatively thin, reducing profile and/or placing the LED wafer 130 relatively close to the bottom 128. Since there is no power lead 132 on the bottom 128, a heat sink assembly 138 can be included in the entire (or substantially entire) bottom 128.

The heat dissipating component 138 is a heat dissipation layer, a heat dissipating grease, a heat dissipating epoxy resin, a heat dissipating pad, a solder paste, or any type of heat dissipating component. When the LED package 114 is fixed to the pedestal 112 (as shown in the first and second figures), the heat dissipation component 138 is the thermal interface of the LED package 114. The LED package 114 allows heat to be effectively dispersed through the heat sink assembly 138 to the susceptor 112 (which includes a heat sink at the heat sink assembly 138). In an exemplary embodiment, the heat sink assembly 138 covers the entire area of the bottom portion 128 that is vertically below the lens 131. The heat sink assembly 138 extends beyond the perimeter of the lens 131 and covers a greater portion of the fixed substrate 124, such as in a region vertically below the power leads 132.

The fifth figure is a top view of one example power supply connector 116 that matches the LED package 114 (shown in phantom), and the sixth view is an exploded view of the power connector 116. The power connector 116 includes a power contact 140 that is retained within a dielectric housing 142. The power contact 140 defines a separable interface 144 to contact the power leads 132 on the mating substrate 124 of the LED package 114. The power contact 140 supplies power to the LED package 114 and the corresponding LED chip 130 (as shown in the third and fourth figures). The power contact 140 includes a compliant beam body 146 that extends to the separable interface 144. When the power connector 116 mates with the LED package 114 and contacts the power lead 132, the compliant beam body 146 is deflected such that the power contact 140 is biased toward the power lead 132 to ensure electrical contact therebetween. Optionally, the conforming beam 146 forms a cantilever from the housing 142. The separable interfaces 144 of the power contacts 140 are arranged in a row on one side of the LED package 114 to contact the power leads 132 at the edge 136 of the fixed substrate 124 (also shown in Figure 6). In an exemplary embodiment, power contacts 140 are divided into two groups, each of which has a plurality of power contacts 140. One group defines an anode power contact that supplies a positive voltage to the corresponding power lead 132; the other group defines a cathode power contact that supplies a negative voltage to the corresponding power lead 132. Each anode power contact 140 is configured to contact a separate power lead 132, and each cathode power contact 140 is configured to contact a separate power lead 132.

The housing 142 includes a securing feature 148 to lock the housing 142 to the base 112 independently of the LED package 114. In the particular embodiment described, the securing feature 148 is represented by an ear having an opening that receives the locking member 150. In other embodiments, other types of securing features 148, such as pegs, latches, solder pads, and the like, can also be used.

The housing 142 includes an upper portion 152 that holds a first mating portion 154 (portion shown by a dashed line in the fifth figure) of each power contact 140; the housing 142 also includes a second match that holds the respective power contacts 140. One of the lower portions 156 of the portion 158 (the portion shown by the dashed line in the fifth figure). The upper portion 152 is secured to the pedestal 112 adjacent the LED package 114, and the upper portion 152 includes an opening 160 that receives the lens 131 of the LED package 114. The sides of the opening 160 are tapered such that the housing 142 does not block light emitted from the lens 131. The lower portion 156 extends from the upper portion 152 through the opening 162 in the base 112; thus, the lower portion 156 is exposed below the base 112 to, for example, a power supply connector 118 below the base 112 (as shown in the second figure) )match. Optionally, the lower portion 156 extends approximately perpendicular to the upper portion 152 such that the housing 142 is L-shaped. The second mating portion 158 of the power contact 140 is bent approximately 90 degrees to define a right angle contact. The second mating portion 158 extends along the body of the lower portion 156.

In an exemplary embodiment, the housing 142 includes a punch-out windows 164. The punch window portion 164 is for receiving a tool member (not shown) that removes a portion of the power contact 140. For example, in an exemplary embodiment, power contacts 140 are stamped and formed as part of a leadframe body, wherein each power contact 140 is integrally formed from a common sheet of metallic material. During manufacture of the housing 142, the power contacts 140 remain attached to the other; for example, the housing 142 is overmolded over the power contacts 140 by connecting the power contacts 140 to one another in an overmolding process The relative position of the power contacts 140 to each other and to the housing 142 can be precisely maintained. After the housing 142 is formed, the power contacts 140 need to be separated from one another to define separate power contacts 140. The tool members are inserted into the punch window portion 164, and the connectors connecting the power contacts 140 are removed, thereby allowing the power contacts 140 to be isolated from each other.

The seventh diagram is a bottom perspective view of the power connector 116, and the eighth diagram is a partial cross-sectional view of the power connector 116. The upper portion 152 of the housing 142 includes a balloon 170 that houses the LED package 114 (as shown in Figure 8). The size and shape of the balloon 170 is complementary to the size and shape of the LED package 114 to position the housing 142 relative to the LED package 114. For example, the edge of the fixed substrate 124 is bonded to the wall portion defining the capsule 170 to align the housing 142 with respect to the LED package 114. Thus, the separable interface 144 of the power contact 140 is properly aligned with the power lead 132 (as shown in Figure 8).

The lower portion 156 of the housing 142 includes a tongue 172 that opens at the bottom 174 of the housing 142. The second mating portion 158 is exposed within the port 172 and includes a mating interface 176 for matching the corresponding power conductor 178 of the power supply connector 118 (both shown in the eighth figure). In the particular embodiment, the lower portion 152 defines a card edge connector to receive the edge 180 of the power supply connector 118. Power supply connector 118 represents a PCB having a power pad structure that defines a power supply conductor 178. The second mating portion 158 engages with a corresponding power pad to define a power path to supply power to the power supply connector 118 to the power connector 116. Optionally, the second mating portion 158 is a compliant beam that is deflectable within the rake 172. The second matching portion 158 is biased toward the power conductor 178 to ensure good electrical contact therebetween.

The power contact 140 has a first mating end 182 and a second mating end 184. Optionally, the first matching ends 182 are clustered together to form more than one group. The first mating end 182 within each group is separated by a first spacing 186 to contact the power leads 132. The second mating ends 184 are arranged in a different pattern than the first mating ends 182; for example, the second mating portions 158 are parallel to one another and are equally spaced apart from the first spacing 186 by a second spacing 188. The size of the second matching portion 158 is different from that of the first matching portion 152. The first mating end 182 can include a projection or button that is curved to define a point of contact with a corresponding one of the power leads 132.

The ninth drawing is an upper perspective view of another power connector 216 fixed to the LED package 114, and the tenth is an exploded view of the power connector 216. The power connector 216 includes a power contact 240 that is retained within a dielectric housing 242. In an exemplary embodiment, the housing 242 is overmolded over the power contacts 240. The power contact 240 defines a separable interface 244 to contact the power leads 132 on the mating substrate 124 of the LED package 114. The power contact 240 supplies power to the LED package 114 and the corresponding LED wafer 130 (as shown in the third and fourth figures). Power contact 240 includes a compliant beam body 246 that extends to separable interface 244. The housing 242 includes a securing feature 248 to enable the housing 242 to be secured to the base 112 independently of the LED package 114. In the particular embodiment described, the base 112 is rectangular rather than circular.

The housing 242 is different in size and shape from the housing 142 (as shown in Figures 5 through 8). The housing 242 includes an upper portion 252 that retains the first mating portion 254 of each of the power contacts 240, and the housing 242 also includes a lower portion 256 that retains the second mating portion 258 of each of the power contacts 240. The upper portion 252 is secured to the pedestal 112 adjacent the LED package 114. Unlike the housing 142, the upper portion 252 does not surround the LED package 114, but is positioned on the edge 136 of the LED package 114 having the power leads 132. The lower portion 256 extends from the upper portion 252 through an opening 262 in the base 112 that is shaped differently than the housing 142 to, for example, mate with different types of power supply connectors 260. In the illustrated embodiment, power supply connector 260 is represented by a cable-retained plug that mates with lower portion 256 of housing 242. The lower portion 256 is exposed below the base 112 such that the power supply connector 260 can be mated with the lower portion 256 below the base 112.

The eleventh diagram is a bottom perspective view of the power connector 216. The upper portion 252 of the housing 242 includes a locating post 270 that positions the housing 242 relative to the base 112 (as shown in the first and second figures); the locating post 270 extends from the bottom 272 of the upper portion 252. The lower portion 256 also extends from the bottom 272 of the upper portion 252, the lower portion 256 includes a mouth 274, and the second mating portion 258 is exposed within the mouth 274. The second matching portion 258 includes a matching interface 276 that is configured to match a corresponding power supply conductor of the power supply connector 260 (as shown in the tenth figure). In the particular embodiment described, the lower portion 256 defines a slot for receiving the power supply connector 260. The second mating portion 258 is a pin or post that is received in the socket-type contact of the power supply connector 260. The pins are formed by rolling or folding the second mating portion 258 into an O-shape or a U-shape.

The twelfth figure is a bottom perspective view of another power connector 280. The power connector 280 is similar to the power connector 216, but the power connector 280 includes a fixed feature 282 that is different from the fixed feature 248 (shown in Figures 9 through 10). The fixed feature 282 is represented by a split cylinder latch that is configured to extend through the base 112 (as shown in the first and second figures). The latch engages the bottom of the base 112 to hold the power connector 280 to the base 112.

The thirteenth view is a side view of the power connector 216 mated with another power supply connector 290, and the fourteenth view is a side view of the power connector 216 and the power supply connector 290 in the mated state. The power supply connector 290 is represented by a board fixed head having the same form factor as the plug of the power supply connector 260, however, it is fixed by a board instead of a cable to the PCB 292. The PCB 292 is represented by a driver board for supplying power to the power connector 216 in accordance with a control mode. For example, PCB 292 supplies power to one or more of the three LED wafers based on a particular control mode or does not supply power to any of the LED wafers. This configuration constitutes a sandwich connection in which the PCBs 292 are arranged in parallel with the pedestal 112. When the power connector 216 is mated with the power supply connector 290, the pedestal 112 and the PCB 292 are close to each other with a low profile.

The fifteenth diagram is an exploded view of another power connector 316, and the sixteenth is an assembled view of the power connector 316. The power connector 316 includes a power contact 340 that is retained within the dielectric housing 342. In an exemplary embodiment, the housing 342 is overmolded over the power contacts 340. The power contact 340 defines a separable interface 344 for contacting the power leads 132 on the mating substrate 124 of the LED package 114. The power contact 340 supplies power to the LED package 114, which includes a compliant beam 346 that extends to the detachable interface 344. The housing 342 includes a securing feature 348 to lock the housing 342 to the base 112 independently of the LED package 114.

The housing 342 includes a mating tongue 352 along its outer surface, and the power contacts 340 are exposed to the surface 354 of the mating tongue 352. The power contact 340 extends between the first matching portion 356 and the second matching portion 358. The first mating portion 356 has a first mating end 360 that defines a separable interface 344 and is configured to engage the power lead 132. The second mating portion 358 has a second mating end 362 at the opposite end of the power contact 340, and the second mating portion 358 is exposed on the surface 354 of the mating tongue 352. The mating tongue 352 is configured to couple with a power supply connector 364 (which is represented by a card edge connector). Power supply connector 364 has matching contacts 366 that define power conductors. The power contacts 340 are configured to engage the corresponding mating contacts 366 when the card edge connectors are mated to the mating tongues 352.

Fig. 17 is a top view of the power connector 316 in the first manufacturing state, and Fig. 18 is a top view of the power connector 316 in the second manufacturing state. Housing 342 includes a perforated window portion 370 that is configured to receive a tooling (not shown) that can remove portions of power contacts 340. In an exemplary embodiment, power contacts 340 are stamped and formed as part of leadframe body 372, wherein each power contact 340 is integrally formed from a common sheet of metal material. During manufacture of the housing 342, the power contacts 340 remain attached to the other by the connector 374; during the first manufacturing state, the housing 342 is overmolded over the power contacts 340 by In the molding process, the power contacts 340 are connected to each other, that is, the relative positions of the power contacts 340 with each other and between the housing 342 and the housing 342 can be accurately maintained. After the housing 342 is formed, the power contacts 340 need to be separated from one another to define separate power contacts 340. During the second manufacturing state, the tool members are inserted into the punch window portion 370, and the connectors 374 that connect the power contacts 340 are removed, thereby allowing the power contacts 340 to be isolated from each other. The eighteenth diagram depicts power contacts 340 after the connectors 374 have been removed, which define separate power contacts 340.

The nineteenth figure illustrates another power connector 416 that is not mated with the LED package 114. The bottom of the power connector 416 is shown in FIG. 19, and the twentieth is an upper perspective view of the power connector 416 in a state of being matched with the LED package 114.

The power connector 416 is represented by a jumper connector having a power contact 440 that is retained within the dielectric housing 442. In an exemplary embodiment, the housing 442 includes a channel 444 formed therein for receiving a power contact 440 therein. Each power contact 440 has a first separable interface 446 at its first mating end 448 and a second separable interface 450 at its second mating end 452. The first separable interface 446 is positioned to contact the power leads 132 on the mating substrate 124 of the LED package 114, and the second separable interface 446 is positioned to contact the power conductor 454 on the pedestal 456. The pedestal 456 differs from the pedestal 112 (shown in the first and second figures) in that the pedestal 456 is a PCB having a power pad body as a representative of the power supply conductor 454 to supply power to the power connector 416. Power contact 440 supplies power from power conductor 454 to LED package 114. The power contacts 440 have compliant beam bodies at both mating ends 448, 452, and the housing 442 includes a securing feature 458 to enable the housing 442 to be secured to the pedestal 112 independently of the LED package 114. The fixed feature 458 is represented by an opening that houses a lock. Other types of securing features can also be used in other embodiments.

The housing 442 includes a bottom 462 that abuts against the base 456. The positioning post 464 extends from the bottom 462 and is received in a corresponding opening 466 in the base 456 to position the power connector 416 relative to the LED package 114. Positioning posts 464 are sized differently to orient housing 442 relative to base 456 and LED package 114, as appropriate. The openings 466 in the base 456 can also be of different sizes to accommodate corresponding positioning posts 464. The separable interfaces 446, 450 are exposed at the bottom 462 to engage the power leads 132 and the power conductor 454, respectively.

The twenty-first diagram is an exploded view of yet another power connector 516, and the twenty-second diagram is an upper perspective view of the power connector 516 in an assembled state with the lens 518 coupled thereto. The power connector 516 includes a power contact 540 that is retained within the dielectric housing 542, and the housing 542 includes a line slot 544 formed therein for receiving an individual power supply line. The power supply line is represented by a power conductor 546 that supplies power to the power connector 516.

Each power contact 540 has a first separable interface 548 and an insulating displacement contact (IDC) 550 at an opposite end thereof, the first separable interface 548 being positioned to contact the matching substrate 124 of the LED package 114. Power lead 132, IDC 550 is positioned to contact power conductor 546. For example, the power supply line is loaded into line slot 544 and terminated at IDC 550. The line slot 544 includes a clamp 552 that holds the power supply line in the line slot 544. The housing 542 includes a securing feature 558 to enable the housing 542 to be secured to the base 112 independently of the LED package 114.

The twenty-third figure is a perspective view of the upper portion of the other power connector 616 having one of the plug members 618 fixed thereto. The twenty-fourth view is an upper perspective view of the power connector 616 without the stuffer 618. The power connector 616 is similar to the power connector 516 (shown in Figures 21 through 22), and the stuffer 618 is used to simultaneously terminate the power supply line 620 to the IDCs 622 of the power connector 616. The IDCs 622 are integrally formed with the power contacts 640 and held by the housing 642.

100. . . Lighting accessories

102. . . Lighting ballast

104. . . Lighting assembly

106. . . Power conductor

108. . . framework

110. . . Groove

112. . . Pedestal

114. . . LED package

116. . . Power connector

118. . . Power supply connector

120. . . Top surface

122. . . Bottom surface

124. . . Fixed substrate

124. . . Matching substrate

126. . . top

128. . . bottom

130. . . LED chip

131. . . lens

132. . . Power lead

134. . . Anode power contact

135. . . Cathode power contact

136. . . edge

138. . . Heat sink

140. . . Power contact

142. . . Dielectric housing

144. . . Separable interface

146. . . Compliance beam

148. . . Fixed feature

150. . . Lock firmware

152. . . Upper part

154. . . First matching part

156. . . Lower part

158. . . Second matching part

160. . . Opening

162. . . Opening

164. . . Punching window

170. . . Capsule

172. . . Pass

174. . . bottom

176. . . Matching interface

178. . . Power conductor

180. . . edge

182. . . First matching end

184. . . Second matching end

186. . . First spacing

188. . . Second spacing

216. . . Power connector

240. . . Power contact

242. . . Dielectric housing

244. . . Separable interface

246. . . Compliance beam

248. . . Fixed feature

252. . . Upper part

254. . . First matching part

256. . . Lower part

258. . . Second matching part

260. . . Power supply connector

262. . . Opening

270. . . Positioning pile

272. . . bottom

274. . . Pass

276. . . Matching interface

280. . . Power connector

282. . . Fixed feature

290. . . Power supply connector

292. . . PCB/printed circuit board

316. . . Power connector

340. . . Power contact

342. . . Dielectric housing

344. . . Separable interface

346. . . Compliance beam

348. . . Fixed feature

352. . . Matching tongue

354. . . surface

356. . . First matching part

358. . . Second matching part

360. . . First matching end

362. . . Second matching end

364. . . Power supply connector

366. . . Matching joint

370. . . Punching window

372. . . Lead frame

374. . . Connector

416. . . Power connector

440. . . Power contact

442. . . Dielectric housing

444. . . aisle

446. . . First separable interface

448. . . First matching end

450. . . Second separable interface

452. . . Second matching end

454. . . Power conductor

456. . . Pedestal

458. . . Fixed feature

462. . . bottom

464. . . Positioning column

466. . . Opening

516. . . Power connector

518. . . lens

540. . . Power contact

542. . . Dielectric housing

544. . . Line slot

546. . . Power conductor

548. . . First separable interface

550. . . Insulation displacement contact

552. . . clamp

558. . . Fixed feature

616. . . Power connector

618. . . Packing

620. . . Power supply line

622. . . Insulation displacement contact

640. . . Power contact

642. . . case

The first figure is an upper perspective view of a lighting accessory formed in accordance with an exemplary embodiment.

The second figure is an exploded view of the lighting accessory shown in the first figure.

The third figure is a top view of the LED package for the lighting accessory shown in the first figure.

The fourth figure is a side view of the LED package shown in the third figure.

The fifth figure is a top view of the example power connector of the lighting assembly shown in the first figure when it is matched with the LED package shown in the third figure.

Figure 6 is an exploded view of the power connector shown in Figure 5.

The seventh figure is a bottom perspective view of the power connector shown in the fifth figure.

Figure 8 is a partial cross-sectional view of the power connector shown in Figure 5.

The ninth view is an upper perspective view of another power connector fixed to the LED package.

Figure 10 is an exploded view of the power connector shown in Figure 9.

Figure 11 is a bottom perspective view of the power connector shown in Figure IX.

Figure 12 is a bottom perspective view of another power connector.

Figure 13 is a side view of the power connector shown in Figure 9 when mated with a power supply connector.

Figure 14 is a side view of the power connector and power supply connector in a mated state.

Figure 15 is an exploded view of another power connector.

Figure 16 is a combination of the power connectors shown in Figure 15.

Figure 17 is a top view of the power connector shown in Fig. 15 in a first manufacturing state.

Figure 18 is a top view of the power connector shown in Figure 15 in a second manufacturing state.

Figure 19 illustrates another power connector that is not matched to the LED package.

Figure 20 is an upper perspective view of the power connector of Figure 19 in a mated state.

Figure 21 is an exploded view of another power connector.

The twenty-second figure is an upper perspective view of the power connector shown in Fig. 21, the power connector having a lens coupled thereto.

Figure 23 is a perspective view of the upper portion of another power connector having a tampon member fixed thereto.

Figure 24 is an upper perspective view of the power connector without the plug shown in Figure 23.

100. . . Lighting accessories

102. . . Lighting ballast

104. . . Lighting assembly

106. . . Power conductor

108. . . framework

110. . . Groove

112. . . Pedestal

114. . . LED package

116. . . Power connector

120. . . Top surface

Claims (13)

  1. An illumination assembly for a light-emitting diode (LED) package, the LED package having an LED chip on top of a fixed substrate, and having a plurality of power leads on top of the fixed substrate disposed adjacent to the fixed substrate At one of the first edges, the fixed substrate is fixed to a pedestal, and the illumination assembly comprises: a power contact, which defines a detachable interface to contact the power leads on the matching substrate of the LED package, And supplying power to the LED chip, the power contacts having a compliant beam extending to the detachable interfaces, the compliant beams being deflected when contacting the power leads such that the power contacts are Deviating to the power leads, the power contacts terminate in corresponding power supply conductors opposite the separable interfaces; and a dielectric housing holding the power contacts, the housing having a fixed feature The housing is locked to the base independently of the LED package.
  2. The component of claim 1, wherein the detachable interfaces of the power contacts are arranged in a row on one side of the LED package to contact the first edge of the fixed substrate. Power lead.
  3. The component of claim 1, wherein the power contacts are divided into first and second groups, each group having a plurality of power contacts, the first group defining an anode power contact, the supply thereof a positive voltage to the corresponding power lead, the second group defines a cathode power contact, which supplies a negative voltage to the corresponding power lead, and each anode power contact is configured To contact a separate power lead, each cathode power contact is configured to contact a separate power lead.
  4. The component of claim 1, wherein the LED package has a plurality of LED chips configured to emit a different color of light, the power leads being connected to a corresponding LED chip, wherein the power contacts are configured to A corresponding separate power supply lead is contacted, the power contacts being selectively activated by the corresponding power conductor to control one of the illumination components.
  5. The component of claim 1, wherein the power contacts have a first matching end and a second matching end, the first matching ends being separated by a first spacing to contact the power leads, The second matching end portion is separated from the second spacing of the first spacing.
  6. The assembly of claim 1, wherein the housing is overmolded to the power contacts, wherein portions of the contacts are exposed to match the power leads and the power conductors.
  7. The component of claim 1, wherein the power contacts are bent at right angles, defining a first matching portion and a second matching portion substantially perpendicular to the first matching portion, the second matching portion Extending through the pedestal to terminate the power conductors below the pedestal.
  8. The component of claim 1, wherein the base comprises a printed circuit board (PCB) having a power pad on a top surface, the LED package system being fixed to the top of the PCB adjacent to the power pad Surfacely, the housing is coupled to the base such that the power contacts contact the power leads and the power pads.
  9. The component of claim 1, wherein the power contacts each have a first matching portion and a second matching portion, the first matching portion defining a separable interface, the second matching portion having an insulation displacement Contacts (IDCs) to terminate the power conductor to the power supply line.
  10. The component of claim 1, further comprising a plug member removably coupled to the housing, the plug member accommodating a plurality of power supply lines, the lines defining the power supply conductors, The power contacts have an insulation displacement contact (IDC) to terminate the power conductors to the power supply lines.
  11. The component of claim 1, wherein the housing includes an upper portion and a lower portion, the upper portion holding a first matching portion of each power contact, the lower portion holding a second of each power contact a matching portion, the upper portion being locked to the base adjacent to the LED package, the lower portion extending from the upper portion through an opening in the base, the lower portion having a cornice having a second matching portion, the lower portion defining a card edge connector configured to receive an edge of a printed circuit board having a power pad defining the power conductors, the second matching portion The system is configured to engage a corresponding power pad.
  12. The component of claim 1, wherein the housing includes an upper portion and a lower portion, the upper portion holding a first matching portion of each power contact, the lower portion holding a second of each power contact a matching portion, the upper portion being locked to the base adjacent to the LED package, the lower portion extending from the upper portion through an opening in the base, the lower portion having a cornice having An exposed second matching portion configured to receive a plug therein, the plug having a mating contact defining the power conductors, the second mating portion configured to engage a corresponding mating contact.
  13. The assembly of claim 1, wherein the housing includes a mating tongue, the power contacts being exposed on a surface of the mating tongue, the mating tongue configured to couple to a card edge connection The card edge connector has matching contacts defining the power conductors, and when the card edge connector mates with the mating tongue, the power contacts are configured to engage corresponding mating contacts.
TW099142764A 2009-12-14 2010-12-08 Led lighting assemblies TWI524562B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/637,356 US8342733B2 (en) 2009-12-14 2009-12-14 LED lighting assemblies

Publications (2)

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TW201131834A TW201131834A (en) 2011-09-16
TWI524562B true TWI524562B (en) 2016-03-01

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TW099142764A TWI524562B (en) 2009-12-14 2010-12-08 Led lighting assemblies

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US (1) US8342733B2 (en)
EP (1) EP2333407B1 (en)
JP (1) JP5669188B2 (en)
KR (1) KR20110068871A (en)
CN (1) CN102121599B (en)
TW (1) TWI524562B (en)

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EP2333407B1 (en) 2013-10-30
US8342733B2 (en) 2013-01-01
JP2011124577A (en) 2011-06-23
EP2333407A1 (en) 2011-06-15
KR20110068871A (en) 2011-06-22
TW201131834A (en) 2011-09-16
CN102121599B (en) 2014-08-20
CN102121599A (en) 2011-07-13
JP5669188B2 (en) 2015-02-12
US20110140136A1 (en) 2011-06-16

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