TWI524562B - Led lighting assemblies - Google Patents
Led lighting assemblies Download PDFInfo
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- TWI524562B TWI524562B TW099142764A TW99142764A TWI524562B TW I524562 B TWI524562 B TW I524562B TW 099142764 A TW099142764 A TW 099142764A TW 99142764 A TW99142764 A TW 99142764A TW I524562 B TWI524562 B TW I524562B
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Description
本發明之標的概與固態照明有關,且更特別是與照明組件之連接器有關。The subject matter of the present invention relates generally to solid state lighting, and more particularly to connectors for lighting assemblies.
固態光之照明系統係利用固態光源,例如發光二極體(LEDs),且其係用以取代使用其他類型光源(例如白熱光或螢光燈泡)的其他照明系統。固態光源提供了優於這些燈的優勢,例如快速開啟、快速循環(開-關-開)時間、長使用壽命、低功率消耗、狹窄的發光帶寬(無須濾光器即可提供所需色光)等。LED照明系統一般包括了具有一基板之LED封裝體,在基板上具有電源引線以連接至一LED晶片。在LED晶片周圍有一鏡片,而LED發出的光係穿過該鏡片。Solid-state lighting systems utilize solid-state light sources, such as light-emitting diodes (LEDs), and are used to replace other lighting systems that use other types of light sources, such as white hot light or fluorescent light bulbs. Solid-state light sources offer advantages over these lamps, such as fast turn-on, fast cycle (on-off-on) time, long life, low power consumption, and narrow illumination bandwidth (providing the desired shade without the need for a filter) Wait. LED lighting systems typically include an LED package having a substrate with power leads on the substrate for connection to an LED wafer. There is a lens around the LED wafer, and the light from the LED passes through the lens.
LED封裝體一般具有電源引線,其係焊接至印刷電路板(PCB)上的墊片,以產生對PCB之電性及機械連接;電源引線係排列在LED封裝體基板的底部以供此種連接之用。部分習知發光系統係使用插座來固持LED封裝體,其中插座具有與LED封裝體上對應電源引線接觸之電源接點;電源引線一般係位於LED封裝體基板的側部上以供此種連接。由於LED封裝體所產生之熱,需要利用散熱片來進行LED封裝體之散熱。迄今為止,由於電源引線是沿著基板底部及/或側部而排列,因此LED製造者在設計可進行LED封裝體有效散熱之熱界面上大有問題。部分LED製造者生產在基板頂部具有電源引線之LED封裝體,以使熱界面可位於基板的底部及/或側部周圍;然而,當LED封裝體的尺寸降低,便會產生可使電源引線連接至電源導體的問題。具有這種配置的習知LED封裝體具有焊接至電源引線之線路,這種連接是困難、耗時且無法順利自動化的。The LED package generally has a power lead that is soldered to a pad on a printed circuit board (PCB) to create an electrical and mechanical connection to the PCB; the power leads are arranged at the bottom of the LED package substrate for such a connection. Use. Some conventional illumination systems use sockets to hold LED packages, wherein the sockets have power contacts that contact corresponding power leads on the LED package; power leads are typically located on the sides of the LED package substrate for such connections. Due to the heat generated by the LED package, heat sinks are required to dissipate heat from the LED package. So far, since the power leads are arranged along the bottom and/or sides of the substrate, the LED manufacturer has a problem in designing a thermal interface that can effectively dissipate the LED package. Some LED manufacturers produce LED packages with power leads on the top of the substrate so that the thermal interface can be located around the bottom and/or sides of the substrate; however, when the size of the LED package is reduced, a power lead can be connected The problem with the power conductor. A conventional LED package having such a configuration has a line soldered to a power supply lead, which is difficult, time consuming, and cannot be smoothly automated.
此外,部分習知LED封裝體係整合有多個LED晶片,例如用於多色光效果時,而各LED晶片需要分離的電源引線;因此,電源引線係製作的更小,以與基板頂部的許多電源引線相配。要使電源導體終止至這些引線(例如藉由焊接方式)是非常困難且不經濟的。In addition, some conventional LED package systems incorporate multiple LED chips, such as for multi-color light effects, and each LED chip requires separate power leads; therefore, the power leads are made smaller, with many power supplies on top of the substrate. The leads match. It is very difficult and uneconomical to terminate the power conductor to these leads (e.g., by soldering).
照明系統仍有可有效啟動之需求;具LED封裝體之照明系統也仍有具適當散熱之需求;具LED封裝體之發光系統有以有效率且具成本效益之方式加以組裝的需求。Lighting systems still have the need to be effectively activated; lighting systems with LED packages also have the need for proper heat dissipation; lighting systems with LED packages have the need to be assembled in an efficient and cost-effective manner.
在一具體實施例中,提供了一種照明組件供一發光二極體(LED)封裝體之用,該LED封裝體於一固定基板之頂部上具有一LED晶片,其於固定基板之頂部上具有一電源引線,該電源引線排列在靠近該固定基板之一第一邊緣處;該固定基板係固定至一基座。照明組件包括電源接點,其定義一可分離介面以接觸LED封裝體之匹配基板上的電源引線,並供應電源至LED晶片。該等電源接點具有一延伸至可分離介面之順應樑體,該等順應樑體在接觸電源引線時係偏斜,使得該電源接點偏向該電源引線。該等電源接點係終止於與可分離介面相對的對應電源導體。照明組件也包括一介電質殼體,其固持該等電源接點,該殼體具有一固定特徵部以使該殼體獨立於LED封裝體而鎖固至基座。In one embodiment, an illumination assembly is provided for a light emitting diode (LED) package having an LED chip on top of a fixed substrate having a top on the fixed substrate a power lead arranged adjacent to a first edge of the fixed substrate; the fixed substrate is fixed to a base. The lighting assembly includes a power contact that defines a separable interface to contact a power lead on a matching substrate of the LED package and supply power to the LED wafer. The power contacts have a compliant beam extending to the detachable interface, the compliant beams being deflected when contacting the power leads such that the power contacts are biased toward the power leads. The power contacts terminate in corresponding power supply conductors opposite the separable interface. The lighting assembly also includes a dielectric housing that holds the power contacts, the housing having a securing feature to lock the housing to the base independently of the LED package.
此外,提供了一種用於LED封裝體之照明組件,該LED封裝體具有一LED晶片於一固定基板的頂部上,該LED晶片在固定基板的頂部上具有一電源引線,其排列在靠近固定至一基座之固定基板的第一邊緣處。該照明組件包括一電源接點,其各具有一第一匹配部分與一第二匹配部分。該第一匹配部分定義一可分離介面以接觸LED封裝體之匹配基板上的對應電源引線,並對LED晶片供應電源;該第二匹配部分係終止至與該可分離介面相對之對應電源導體。一介電質殼體係固持電源接點,且包括固持該電源接點之第一匹配部分的一上部部分以及固持該電源接點之第二匹配部分的一下部部分。該上部部分係鎖固至與LED封裝體相鄰之基座,而該下部部分係從上部部分延伸通過基座中的一開口。下部部分具有一埠口,其係配置以容置電源導體,以與電源接點的第二匹配部分匹配。In addition, there is provided an illumination assembly for an LED package having an LED chip on top of a fixed substrate having a power supply lead on the top of the fixed substrate, the arrangement being closely fixed to A first edge of the fixed substrate of the pedestal. The lighting assembly includes a power contact having a first matching portion and a second matching portion. The first matching portion defines a separable interface to contact a corresponding power supply lead on the matching substrate of the LED package and to supply power to the LED wafer; the second matching portion terminates to a corresponding power supply conductor opposite the separable interface. A dielectric housing holds the power contact and includes an upper portion that holds the first mating portion of the power contact and a lower portion that holds the second mating portion of the power contact. The upper portion is secured to a pedestal adjacent the LED package and the lower portion extends from the upper portion through an opening in the pedestal. The lower portion has a port configured to receive the power conductor to match the second matching portion of the power contact.
除此之外,係提供了一種發光二極體(LED)封裝體之照明組件,該LED封裝體具有一LED晶片於一固定基板的頂部上,該LED晶片在該固定基板的頂部上具有一電源引線,其排列在靠近固定至一基座之固定基板的第一邊緣處。該照明組件包括一電源接點,其各具有一第一匹配部分與一第二匹配部分。該第一匹配部分定義一可分離介面以接觸LED封裝體之匹配基板上的對應電源引線,並對LED晶片供應電源;該第一匹配部分具有一延伸至該等可分離介面之順應樑體,其在接觸電源引線時係偏斜,使得電源接點偏向該電源引線。該第二匹配部分具有絕緣位移接點(Insulation Displacement Contacts,IDCs)以終止至電源供應線的對應電源導體。一介電質殼體係固持該等電源接點,該殼體具有一固定特徵部以使該殼體獨立於LED封裝體而鎖固至基座。In addition, there is provided a lighting assembly for a light emitting diode (LED) package having an LED chip on top of a fixed substrate having a top on the top of the fixed substrate Power leads are arranged adjacent the first edge of the fixed substrate secured to a base. The lighting assembly includes a power contact having a first matching portion and a second matching portion. The first matching portion defines a separable interface to contact a corresponding power supply lead on the matching substrate of the LED package, and supplies power to the LED chip; the first matching portion has a compliant beam body extending to the separable interfaces, It deflects when it contacts the power leads, causing the power contacts to be biased toward the power leads. The second matching portion has Insulation Displacement Contacts (IDCs) to terminate to the corresponding power supply conductors of the power supply line. A dielectric housing holds the power contacts, the housing having a securing feature to lock the housing to the base independently of the LED package.
第一圖為根據一示範具體實施例所形成之照明配件100的俯視立體圖,第二圖為照明配件100的分解圖。照明配件100包括一照明安定器102與一照明組件104。照明組件104係容置在照明安定器102中以產生發光效應。雖然所述之照明配件100係燈泡形式之配件,應知照明配件100也可同時具有其他的配置,例如管狀配置。照明配件100可用於住宅、商業或工業用途;照明配件100可用於一般目的之照明,或者是也可具有客製化應用或末端使用。The first figure is a top perspective view of a lighting accessory 100 formed in accordance with an exemplary embodiment, and the second figure is an exploded view of the lighting accessory 100. The lighting accessory 100 includes an illumination ballast 102 and a lighting assembly 104. The illumination assembly 104 is housed in the illumination ballast 102 to produce a luminescent effect. Although the lighting accessory 100 is an accessory in the form of a light bulb, it should be understood that the lighting accessory 100 can have other configurations at the same time, such as a tubular configuration. The lighting accessory 100 can be used for residential, commercial or industrial use; the lighting accessory 100 can be used for general purpose lighting, or can also have a customized application or end use.
照明安定器102於其用於接收電源供應器之電源的一端包括有電源導體106,照明安定器102包括一框體108,其用以固持電源導體106與照明組件104。電源導體106係電耦合至照明組件104,以對照明組件104供應電源。照明安定器102包括一凹槽110,其係容置照明組件104。視情況,照明安定器102係包括附接至框體108頂部之一鏡片(未示),其係覆蓋該照明組件104。光係被引導通過該鏡片。The lighting ballast 102 includes a power conductor 106 at one end thereof for receiving power from the power supply, and the lighting ballast 102 includes a frame 108 for holding the power conductor 106 and the lighting assembly 104. Power conductors 106 are electrically coupled to lighting assembly 104 to supply power to lighting assembly 104. The illumination ballast 102 includes a recess 110 that houses the illumination assembly 104. Optionally, the illumination ballast 102 includes a lens (not shown) attached to the top of the frame 108 that covers the illumination assembly 104. The light system is guided through the lens.
照明組件104包括基座112、固定至基座112之發光二極體(LED)封裝體114以及固定至基座112之電源連接器116和耦合至電源連接器116之電源供應連接器118。電源供應連接器118自電源供應器接收電源,例如從電源導體106。電源供應連接器118對電源連接器116供應電源,電源連接器116供應電源至LED封裝體114。The lighting assembly 104 includes a base 112, a light emitting diode (LED) package 114 secured to the base 112, and a power connector 116 secured to the base 112 and a power supply connector 118 coupled to the power connector 116. Power supply connector 118 receives power from a power supply, such as from power supply conductor 106. The power supply connector 118 supplies power to the power connector 116, and the power connector 116 supplies power to the LED package 114.
基座112包括一頂部表面120與一底部表面122。LED封裝體114與電源連接器116係固定至頂部表面120。在一示範具體實施例中,LED封裝體114係分離於電源連接器116而鎖固至基座112;舉例而言,LED封裝體114可焊接至基座112。在LED封裝體114以一分離組裝步驟固定至基座112後,電源連接器116係耦合至LED封裝體114。電源連接器116於一可分離介面處與LED封裝體114產生接觸。The base 112 includes a top surface 120 and a bottom surface 122. The LED package 114 and the power connector 116 are secured to the top surface 120. In an exemplary embodiment, LED package 114 is detached from power connector 116 and secured to pedestal 112; for example, LED package 114 can be soldered to pedestal 112. After the LED package 114 is secured to the pedestal 112 in a separate assembly step, the power connector 116 is coupled to the LED package 114. The power connector 116 makes contact with the LED package 114 at a separable interface.
視情況,基座112可為一散熱片(heat sink)。LED封裝體114及/或電源連接器116係與基座112熱接觸,使得基座112可進行LED封裝體114及/或電源連接器116之散熱。視情況,基座112係一印刷電路板(PCB)。PCB中包括一散熱片,例如一或多層膜層,其定義一散熱片以自LED封裝體114及/或電源連接器116散熱。The susceptor 112 can be a heat sink, as appropriate. The LED package 114 and/or the power connector 116 are in thermal contact with the pedestal 112 such that the susceptor 112 can dissipate heat from the LED package 114 and/or the power connector 116. The susceptor 112 is a printed circuit board (PCB), as appropriate. The PCB includes a heat sink, such as one or more layers, defining a heat sink for dissipating heat from the LED package 114 and/or the power connector 116.
第三圖為LED封裝體114之上視圖;第四圖為LED封裝體114之側視圖。LED封裝體114包括一固定基板124,其具有一頂部126與一底部128。LED封裝體114具有一或多個LED晶片130,其固定在固定基板124的頂部126上。鏡片131覆蓋LED晶片130與其他電路及/或電路組件。視情況,除鏡片131外尚可提供一反射器(未示)。The third view is a top view of the LED package 114; the fourth view is a side view of the LED package 114. The LED package 114 includes a fixed substrate 124 having a top portion 126 and a bottom portion 128. The LED package 114 has one or more LED wafers 130 that are attached to the top 126 of the fixed substrate 124. Lens 131 covers LED wafer 130 and other circuitry and/or circuit components. A reflector (not shown) may be provided in addition to the lens 131, as appropriate.
在固定基板124的頂部126上也具有電源引線132,其係電連接至對應的LED晶片130。電源引線132係墊體及/或延伸於固定基板124之一或多層膜層上的傳導線跡。在所述之具體實施例中,係有三個LED晶片130,各LED晶片130係對應至一不同色光(例如紅光、綠光、藍光等)。每一個LED晶片130都有兩個電源引線132,其代表陽極電源接點134與陰極電源接點135,總共在頂部126上產生六個電源引線132。應知在其他具體實施例中可提供任何數量的LED晶片130及對應的電源引線132。當電源引線132被啟動時,LED晶片130係被活化,使LED封裝體114發光。可啟動不同的LED晶片130之組合以具有不同的發光效果。There is also a power lead 132 on the top 126 of the fixed substrate 124 that is electrically connected to the corresponding LED wafer 130. The power lead 132 is a pad and/or a conductive trace extending over one or more of the layers of the fixed substrate 124. In the illustrated embodiment, there are three LED chips 130, each LED chip 130 corresponding to a different color of light (e.g., red, green, blue, etc.). Each of the LED chips 130 has two power leads 132 representing an anode power contact 134 and a cathode power contact 135, resulting in a total of six power leads 132 on the top 126. It should be understood that any number of LED wafers 130 and corresponding power leads 132 may be provided in other embodiments. When the power supply lead 132 is activated, the LED wafer 130 is activated to cause the LED package 114 to emit light. Different combinations of LED chips 130 can be activated to have different illumination effects.
在所述之具體實施例中,電源引線132係僅排列在頂部126上,而不位於底部128上或任何邊緣136上。電源引線132係於靠近固定基板124的一邊緣136處排列成列,然在其他具體實施例中,其他排列方式亦為可行。因為在邊緣136上沒有電源引線132,固定基板124係相對為薄,可降低輪廓(profile)及/或使LED晶片130相對靠近底部128。由於在底部128上沒有電源引線132,因此整個(或實質上整個)底部128中可包括一散熱組件138。In the particular embodiment described, the power leads 132 are only arranged on the top 126, not on the bottom 128 or on any of the edges 136. The power leads 132 are arranged in a row adjacent an edge 136 of the fixed substrate 124. However, in other embodiments, other arrangements are also possible. Because there are no power leads 132 on the edge 136, the fixed substrate 124 is relatively thin, reducing profile and/or placing the LED wafer 130 relatively close to the bottom 128. Since there is no power lead 132 on the bottom 128, a heat sink assembly 138 can be included in the entire (or substantially entire) bottom 128.
散熱組件138係散熱層、散熱脂、散熱環氧樹脂、散熱墊、焊錫膠、或任何類型之散熱組件。當LED封裝體114固定至基座112(如第一圖與第二圖所示)時,散熱組件138係LED封裝體114之熱界面。LED封裝體114可使熱有效分散通過散熱組件138而至基座112(其於散熱組件138處包括一散熱片)。在一示範具體實施例中,散熱組件138覆蓋了在鏡片131垂直下方之底部128的整個區域。散熱組件138係延伸超過鏡片131的周圍,並覆蓋更多部分的固定基板124,例如在電源引線132垂直下方之區域。The heat dissipating component 138 is a heat dissipation layer, a heat dissipating grease, a heat dissipating epoxy resin, a heat dissipating pad, a solder paste, or any type of heat dissipating component. When the LED package 114 is fixed to the pedestal 112 (as shown in the first and second figures), the heat dissipation component 138 is the thermal interface of the LED package 114. The LED package 114 allows heat to be effectively dispersed through the heat sink assembly 138 to the susceptor 112 (which includes a heat sink at the heat sink assembly 138). In an exemplary embodiment, the heat sink assembly 138 covers the entire area of the bottom portion 128 that is vertically below the lens 131. The heat sink assembly 138 extends beyond the perimeter of the lens 131 and covers a greater portion of the fixed substrate 124, such as in a region vertically below the power leads 132.
第五圖為與LED封裝體114(以虛線所示之部分)匹配之一示例電源連接器116的上視圖,第六圖為電源連接器116的分解圖。電源連接器116包括固持在一介電質殼體142內之電源接點140。電源接點140定義可分離介面144以接觸LED封裝體114之匹配基板124上的電源引線132。電源接點140供應電源至LED封裝體114及對應的LED晶片130(如第三圖與第四圖所示)。電源接點140包括延伸至可分離介面144之順應樑體146。當電源連接器116與LED封裝體114匹配以及在接觸電源引線132時,順應樑體146會偏斜,使得電源接點140會偏向電源引線132以確保其間之電性接觸。視情況,順應樑體146係從殼體142形成懸臂。電源接點140的可分離介面144係於LED封裝體114的一側上排列成列,以接觸固定基板124的邊緣136處的電源引線132(同時繪示於第六圖)。在一示範具體實施例中,電源接點140係分為兩個群組,其中每一個群組都具有複數個電源接點140。一個群組定義陽極電源接點,其供應正電壓至對應的電源引線132;另一個群組定義陰極電源接點,其供應負電壓至對應的電源引線132。各陽極電源接點140係配置以接觸一分離的電源引線132,且各陰極電源接點140係配置以接觸一分離的電源引線132。The fifth figure is a top view of one example power supply connector 116 that matches the LED package 114 (shown in phantom), and the sixth view is an exploded view of the power connector 116. The power connector 116 includes a power contact 140 that is retained within a dielectric housing 142. The power contact 140 defines a separable interface 144 to contact the power leads 132 on the mating substrate 124 of the LED package 114. The power contact 140 supplies power to the LED package 114 and the corresponding LED chip 130 (as shown in the third and fourth figures). The power contact 140 includes a compliant beam body 146 that extends to the separable interface 144. When the power connector 116 mates with the LED package 114 and contacts the power lead 132, the compliant beam body 146 is deflected such that the power contact 140 is biased toward the power lead 132 to ensure electrical contact therebetween. Optionally, the conforming beam 146 forms a cantilever from the housing 142. The separable interfaces 144 of the power contacts 140 are arranged in a row on one side of the LED package 114 to contact the power leads 132 at the edge 136 of the fixed substrate 124 (also shown in Figure 6). In an exemplary embodiment, power contacts 140 are divided into two groups, each of which has a plurality of power contacts 140. One group defines an anode power contact that supplies a positive voltage to the corresponding power lead 132; the other group defines a cathode power contact that supplies a negative voltage to the corresponding power lead 132. Each anode power contact 140 is configured to contact a separate power lead 132, and each cathode power contact 140 is configured to contact a separate power lead 132.
殼體142包括固定特徵部148以使殼體142獨立於LED封裝體114而鎖固至基座112。在所述之具體實施例中,固定特徵部148係由具有容置鎖固件150之開口的耳部所代表。在其他具體實施例中,也可使用其他類型的固定特徵部148,例如樁釘、閂鎖、焊錫墊等。The housing 142 includes a securing feature 148 to lock the housing 142 to the base 112 independently of the LED package 114. In the particular embodiment described, the securing feature 148 is represented by an ear having an opening that receives the locking member 150. In other embodiments, other types of securing features 148, such as pegs, latches, solder pads, and the like, can also be used.
殼體142包括了固持各電源接點140的第一匹配部分154(第五圖中以虛線所示的部分)之一上部部分152;殼體142也包括固持各電源接點140之第二匹配部分158(第五圖中以虛線所示的部分)之一下部部分156。上部部分152係鎖固至與LED封裝體114相鄰的基座112,上部部分152包括一開口160,其容置該LED封裝體114的鏡片131。開口160的側部係經削細,使得殼體142不會阻擋從鏡片131發出的光。下部部分156從上部部分152延伸通過基座112中的開口162;因此,下部部分156係暴露於基座112下方,以例如與基座112下方的電源供應連接器118(如第二圖所示)匹配。視情況,下部部分156係延伸而近似與上部部分152垂直,使殼體142呈L型。電源接點140的第二匹配部分158係彎折近90度以定義直角接觸。第二匹配部分158係沿著下部部分156的主體延伸。The housing 142 includes an upper portion 152 that holds a first mating portion 154 (portion shown by a dashed line in the fifth figure) of each power contact 140; the housing 142 also includes a second match that holds the respective power contacts 140. One of the lower portions 156 of the portion 158 (the portion shown by the dashed line in the fifth figure). The upper portion 152 is secured to the pedestal 112 adjacent the LED package 114, and the upper portion 152 includes an opening 160 that receives the lens 131 of the LED package 114. The sides of the opening 160 are tapered such that the housing 142 does not block light emitted from the lens 131. The lower portion 156 extends from the upper portion 152 through the opening 162 in the base 112; thus, the lower portion 156 is exposed below the base 112 to, for example, a power supply connector 118 below the base 112 (as shown in the second figure) )match. Optionally, the lower portion 156 extends approximately perpendicular to the upper portion 152 such that the housing 142 is L-shaped. The second mating portion 158 of the power contact 140 is bent approximately 90 degrees to define a right angle contact. The second mating portion 158 extends along the body of the lower portion 156.
在一示範具體實施例中,殼體142包括衝孔窗部(punch-out windows)164。衝孔窗部164用於容置工具件(未示),其移除部分電源接點140。舉例而言,在一示範具體實施例中,電源接點140係壓印而形成為引線框體的一部分,其中各電源接點140係由一共同金屬材料薄板一體成形。在殼體142製造期間,電源接點140保持附接至另一者;舉例而言,殼體142係超模壓於電源接點140上方,藉由在超模壓程序中使電源接點140彼此連接,即可精確維持電源接點140彼此之間、以及其與殼體142之間的相對位置。在殼體142形成之後,電源接點140需彼此分隔以定義分離的電源接點140。工具件係插置至衝孔窗部164中,且連接電源接點140之連接件係被移除,因此可使電源接點140彼此隔離。In an exemplary embodiment, the housing 142 includes a punch-out windows 164. The punch window portion 164 is for receiving a tool member (not shown) that removes a portion of the power contact 140. For example, in an exemplary embodiment, power contacts 140 are stamped and formed as part of a leadframe body, wherein each power contact 140 is integrally formed from a common sheet of metallic material. During manufacture of the housing 142, the power contacts 140 remain attached to the other; for example, the housing 142 is overmolded over the power contacts 140 by connecting the power contacts 140 to one another in an overmolding process The relative position of the power contacts 140 to each other and to the housing 142 can be precisely maintained. After the housing 142 is formed, the power contacts 140 need to be separated from one another to define separate power contacts 140. The tool members are inserted into the punch window portion 164, and the connectors connecting the power contacts 140 are removed, thereby allowing the power contacts 140 to be isolated from each other.
第七圖是電源連接器116之底部立體圖,第八圖是電源連接器116之部分截面圖。殼體142的上部部分152包括一囊體170,其容置LED封裝體114(如第八圖所示)。囊體170的大小和形狀係與LED封裝體114的大小和形狀互補,以使殼體142相對於LED封裝體114而定位。舉例而言,固定基板124的邊緣係與定義囊體170之壁部接合,以相對於LED封裝體114而標定殼體142。因此,電源接點140的可分離介面144係與電源引線132(如第八圖所示)適當對齊。The seventh diagram is a bottom perspective view of the power connector 116, and the eighth diagram is a partial cross-sectional view of the power connector 116. The upper portion 152 of the housing 142 includes a balloon 170 that houses the LED package 114 (as shown in Figure 8). The size and shape of the balloon 170 is complementary to the size and shape of the LED package 114 to position the housing 142 relative to the LED package 114. For example, the edge of the fixed substrate 124 is bonded to the wall portion defining the capsule 170 to align the housing 142 with respect to the LED package 114. Thus, the separable interface 144 of the power contact 140 is properly aligned with the power lead 132 (as shown in Figure 8).
殼體142的下部部分156包括一埠口172,其係開啟於殼體142的底部174處。第二匹配部分158係暴露於埠口172內,且包括用於匹配電源供應連接器118之對應電源導體178之匹配介面176(兩者皆示於第八圖中)。在所述具體實施例中,下部部分152定義一卡緣連接器以容置電源供應連接器118的邊緣180。電源供應連接器118代表具有電源墊體之PCB,其中該等電源墊體係定義了電源導體178。第二匹配部分158與對應的電源墊體接合以定義一電源路徑以將電源供應連接器118之電源供應至電源連接器116。視情況,第二匹配部分158為順應樑體,其可於埠口172內偏斜。第二匹配部分158係偏向電源導體178以確保其間的良好電性接觸。The lower portion 156 of the housing 142 includes a tongue 172 that opens at the bottom 174 of the housing 142. The second mating portion 158 is exposed within the port 172 and includes a mating interface 176 for matching the corresponding power conductor 178 of the power supply connector 118 (both shown in the eighth figure). In the particular embodiment, the lower portion 152 defines a card edge connector to receive the edge 180 of the power supply connector 118. Power supply connector 118 represents a PCB having a power pad structure that defines a power supply conductor 178. The second mating portion 158 engages with a corresponding power pad to define a power path to supply power to the power supply connector 118 to the power connector 116. Optionally, the second mating portion 158 is a compliant beam that is deflectable within the rake 172. The second matching portion 158 is biased toward the power conductor 178 to ensure good electrical contact therebetween.
電源接點140具有第一匹配端部182與第二匹配端部184。視情況,第一匹配端部182係叢聚在一起而成為一個以上的群組。各群組內的第一匹配端部182係分隔一第一間距186以接觸電源引線132。第二匹配端部184係排列為與第一匹配端部182不同之圖案;舉例而言,第二匹配部分158係彼此平行,並平均分隔與第一間距186不同之一第二間距188。第二匹配部分158的大小係與第一匹配部分152不同。第一匹配端部182可包括凸出部或鈕件,其經彎曲以定義與對應的電源引線132之一接觸點。The power contact 140 has a first mating end 182 and a second mating end 184. Optionally, the first matching ends 182 are clustered together to form more than one group. The first mating end 182 within each group is separated by a first spacing 186 to contact the power leads 132. The second mating ends 184 are arranged in a different pattern than the first mating ends 182; for example, the second mating portions 158 are parallel to one another and are equally spaced apart from the first spacing 186 by a second spacing 188. The size of the second matching portion 158 is different from that of the first matching portion 152. The first mating end 182 can include a projection or button that is curved to define a point of contact with a corresponding one of the power leads 132.
第九圖為固定至LED封裝體114之另一電源連接器216的上部立體圖,第十圖為電源連接器216之分解圖。電源連接器216包括固持在一介電質殼體242內之電源接點240。在一示範具體實施例中,殼體242係超模壓於電源接點240上方。電源接點240定義可分離介面244以接觸LED封裝體114之匹配基板124上的電源引線132。電源接點240供應電源至LED封裝體114及對應的LED晶片130(如第三圖與第四圖中所示)。電源接點240包括延伸至可分離介面244之順應樑體246。殼體242包括一固定特徵部248以使殼體242可獨立於LED封裝體114而鎖固至基座112。在所述之具體實施例中,基座112為矩形而非圓形。The ninth drawing is an upper perspective view of another power connector 216 fixed to the LED package 114, and the tenth is an exploded view of the power connector 216. The power connector 216 includes a power contact 240 that is retained within a dielectric housing 242. In an exemplary embodiment, the housing 242 is overmolded over the power contacts 240. The power contact 240 defines a separable interface 244 to contact the power leads 132 on the mating substrate 124 of the LED package 114. The power contact 240 supplies power to the LED package 114 and the corresponding LED wafer 130 (as shown in the third and fourth figures). Power contact 240 includes a compliant beam body 246 that extends to separable interface 244. The housing 242 includes a securing feature 248 to enable the housing 242 to be secured to the base 112 independently of the LED package 114. In the particular embodiment described, the base 112 is rectangular rather than circular.
殼體242的大小與形狀不同於殼體142(如第五圖至第八圖所示)。殼體242包括固持各電源接點240之第一匹配部分254的一上部部分252,殼體242也包括固持各電源接點240之第二匹配部分258的一下部部分256。該上部部分252係鎖固至與LED封裝體114相鄰之基座112。不同於殼體142,上部部分252並不環繞LED封裝體114,而是定位在LED封裝體114具有電源引線132的邊緣136上。下部部分256從上部部分252延伸通過基座112中的一開口262,下部部分256的形狀與殼體142不同,以例如與不同類型的電源供應連接器260匹配。在所述之具體實施例中,電源供應連接器260係由電纜固定之插頭所代表,其與殼體242的下部部分256匹配。下部部分256係暴露於基座112下方,使得電源供應連接器260可於基座112下方與下部部分256匹配。The housing 242 is different in size and shape from the housing 142 (as shown in Figures 5 through 8). The housing 242 includes an upper portion 252 that retains the first mating portion 254 of each of the power contacts 240, and the housing 242 also includes a lower portion 256 that retains the second mating portion 258 of each of the power contacts 240. The upper portion 252 is secured to the pedestal 112 adjacent the LED package 114. Unlike the housing 142, the upper portion 252 does not surround the LED package 114, but is positioned on the edge 136 of the LED package 114 having the power leads 132. The lower portion 256 extends from the upper portion 252 through an opening 262 in the base 112 that is shaped differently than the housing 142 to, for example, mate with different types of power supply connectors 260. In the illustrated embodiment, power supply connector 260 is represented by a cable-retained plug that mates with lower portion 256 of housing 242. The lower portion 256 is exposed below the base 112 such that the power supply connector 260 can be mated with the lower portion 256 below the base 112.
第十一圖為電源連接器216的底部立體圖。殼體242的上部部分252包括定位樁270,其使殼體242相對於基座112而定位(如第一圖與第二圖中所示);定位樁270從上部部分252的底部272延伸。下部部分256也從上部部分252的底部272延伸,下部部分256包括一埠口274,第二匹配部分258係暴露於埠口274內。第二匹配部分258包括匹配介面276,其係配置以與電源供應連接器260(如第十圖中所示)的對應電源導體匹配。在所述之具體實施例中,下部部分256定義一插槽,其用於容置電源供應連接器260。第二匹配部分258為接腳或柱體,其係容置在電源供應連接器260的插座型接點中。接腳係藉由將第二匹配部分258滾軋或折疊為O形或U形而形成。The eleventh diagram is a bottom perspective view of the power connector 216. The upper portion 252 of the housing 242 includes a locating post 270 that positions the housing 242 relative to the base 112 (as shown in the first and second figures); the locating post 270 extends from the bottom 272 of the upper portion 252. The lower portion 256 also extends from the bottom 272 of the upper portion 252, the lower portion 256 includes a mouth 274, and the second mating portion 258 is exposed within the mouth 274. The second matching portion 258 includes a matching interface 276 that is configured to match a corresponding power supply conductor of the power supply connector 260 (as shown in the tenth figure). In the particular embodiment described, the lower portion 256 defines a slot for receiving the power supply connector 260. The second mating portion 258 is a pin or post that is received in the socket-type contact of the power supply connector 260. The pins are formed by rolling or folding the second mating portion 258 into an O-shape or a U-shape.
第十二圖為另一電源連接器280的底部立體圖。電源連接器280係與電源連接器216類似,然電源連接器280包括了不同於固定特徵部248(如第九圖至第十圖所示)之固定特徵部282。固定特徵部282係以分歧柱體閂鎖為代表,其係配置以延伸通過基座112(如第一圖與第二圖所示)。閂鎖與基座112的底部接合,以對基座112固持電源連接器280。The twelfth figure is a bottom perspective view of another power connector 280. The power connector 280 is similar to the power connector 216, but the power connector 280 includes a fixed feature 282 that is different from the fixed feature 248 (shown in Figures 9 through 10). The fixed feature 282 is represented by a split cylinder latch that is configured to extend through the base 112 (as shown in the first and second figures). The latch engages the bottom of the base 112 to hold the power connector 280 to the base 112.
第十三圖為與另一電源供應連接器290匹配之電源連接器216的側視圖,第十四圖為在匹配狀態下電源連接器216及電源供應連接器290的側視圖。電源供應連接器290係以板固定頭部為代表,該頭部具有與電源供應連接器260之插頭相同的形狀因子,然而,其係以板(board)固定,而非電纜固定至PCB 292。PCB 292係以一驅動板為代表,其係用以根據一控制模式而供應電源至電源連接器216。舉例而言,PCB 292基於特定控制模式而對三個LED晶片的其中之一、一個以上的LED晶片供應電源或未對該LED晶片的任何一者供應電源。此配置構成了夾層式連接,其中PCB 292係排列為與基座112平行。當電源連接器216與電源供應連接器290匹配時,基座112和PCB 292係彼此靠近,而具有低輪廓。The thirteenth view is a side view of the power connector 216 mated with another power supply connector 290, and the fourteenth view is a side view of the power connector 216 and the power supply connector 290 in the mated state. The power supply connector 290 is represented by a board fixed head having the same form factor as the plug of the power supply connector 260, however, it is fixed by a board instead of a cable to the PCB 292. The PCB 292 is represented by a driver board for supplying power to the power connector 216 in accordance with a control mode. For example, PCB 292 supplies power to one or more of the three LED wafers based on a particular control mode or does not supply power to any of the LED wafers. This configuration constitutes a sandwich connection in which the PCBs 292 are arranged in parallel with the pedestal 112. When the power connector 216 is mated with the power supply connector 290, the pedestal 112 and the PCB 292 are close to each other with a low profile.
第十五圖是另一電源連接器316的分解圖,第十六圖是電源連接器316的組裝圖。電源連接器316包括固持在介電質殼體342內之電源接點340。在一示範具體實施例中,殼體342係超模壓於電源接點340上方。電源接點340定義了可分離介面344,用以接觸LED封裝體114之匹配基板124上的電源引線132。電源接點340供應電源至LED封裝體114,電源接點340包括了延伸至可分離介面344的順應樑體346。殼體342包括一固定特徵部348以使殼體342獨立於LED封裝體114而鎖固至基座112。The fifteenth diagram is an exploded view of another power connector 316, and the sixteenth is an assembled view of the power connector 316. The power connector 316 includes a power contact 340 that is retained within the dielectric housing 342. In an exemplary embodiment, the housing 342 is overmolded over the power contacts 340. The power contact 340 defines a separable interface 344 for contacting the power leads 132 on the mating substrate 124 of the LED package 114. The power contact 340 supplies power to the LED package 114, which includes a compliant beam 346 that extends to the detachable interface 344. The housing 342 includes a securing feature 348 to lock the housing 342 to the base 112 independently of the LED package 114.
殼體342沿其外表面包括一匹配舌部352,電源接點340係暴露於匹配舌部352之表面354上。電源接點340係延伸於第一匹配部分356與第二匹配部分358之間。第一匹配部分356具有一第一匹配端部360,其定義可分離介面344並配置以與電源引線132接合。第二匹配部分358在電源接點340的相對端部處具有一第二匹配端部362,第二匹配部分358係暴露於匹配舌部352的表面354上。匹配舌部352係配置以與電源供應連接器364(其以一卡緣連接器作為代表)耦合。電源供應連接器364具有定義電源導體之匹配接點366。電源接點340係配置於卡緣連接器匹配至匹配舌部352時接合對應的匹配接點366。The housing 342 includes a mating tongue 352 along its outer surface, and the power contacts 340 are exposed to the surface 354 of the mating tongue 352. The power contact 340 extends between the first matching portion 356 and the second matching portion 358. The first mating portion 356 has a first mating end 360 that defines a separable interface 344 and is configured to engage the power lead 132. The second mating portion 358 has a second mating end 362 at the opposite end of the power contact 340, and the second mating portion 358 is exposed on the surface 354 of the mating tongue 352. The mating tongue 352 is configured to couple with a power supply connector 364 (which is represented by a card edge connector). Power supply connector 364 has matching contacts 366 that define power conductors. The power contacts 340 are configured to engage the corresponding mating contacts 366 when the card edge connectors are mated to the mating tongues 352.
第十七圖為在第一製造狀態下之電源連接器316的上視圖,第十八圖為在第二製造狀態下之電源連接器316的上視圖。殼體342包括衝孔窗部370,衝孔窗部370係配置以接收一工具件(未示),其可移除部分的電源接點340。在一示範具體實施例中,電源接點340係壓印及形成為引線框體372的一部分,其中各電源接點340係從一共同金屬材料薄板一體成形。在殼體342製造期間,電源接點340係藉由連接件374而保持附接至另一者;在第一製造狀態期間,殼體342係超模壓於電源接點340上方,藉由在超模壓程序中使電源接點340彼此連接,即可精確維持電源接點340彼此之間以及其與殼體342之間的相對位置。在殼體342形成之後,電源接點340需彼此分隔以定義分離的電源接點340。在第二製造狀態期間,工具件係插置至衝孔窗部370中,且連接電源接點340之連接件374係被移除,因此可使電源接點340彼此隔離。第十八圖繪示了在已經移除連接件374之後的電源接點340,其定義了分離的電源接點340。Fig. 17 is a top view of the power connector 316 in the first manufacturing state, and Fig. 18 is a top view of the power connector 316 in the second manufacturing state. Housing 342 includes a perforated window portion 370 that is configured to receive a tooling (not shown) that can remove portions of power contacts 340. In an exemplary embodiment, power contacts 340 are stamped and formed as part of leadframe body 372, wherein each power contact 340 is integrally formed from a common sheet of metal material. During manufacture of the housing 342, the power contacts 340 remain attached to the other by the connector 374; during the first manufacturing state, the housing 342 is overmolded over the power contacts 340 by In the molding process, the power contacts 340 are connected to each other, that is, the relative positions of the power contacts 340 with each other and between the housing 342 and the housing 342 can be accurately maintained. After the housing 342 is formed, the power contacts 340 need to be separated from one another to define separate power contacts 340. During the second manufacturing state, the tool members are inserted into the punch window portion 370, and the connectors 374 that connect the power contacts 340 are removed, thereby allowing the power contacts 340 to be isolated from each other. The eighteenth diagram depicts power contacts 340 after the connectors 374 have been removed, which define separate power contacts 340.
第十九圖說明在未與LED封裝體114匹配下的另一電源連接器416。電源連接器416的底部係繪示於第十九圖中,第二十圖為電源連接器416在與LED封裝體114匹配狀態下的上部透視圖。The nineteenth figure illustrates another power connector 416 that is not mated with the LED package 114. The bottom of the power connector 416 is shown in FIG. 19, and the twentieth is an upper perspective view of the power connector 416 in a state of being matched with the LED package 114.
電源連接器416係以跨接連接器(jumper connector)做為代表,其具有固持於介電質殼體442內之電源接點440。在一示範具體實施例中,殼體442包括形成於其中之通道444,用於容置電源接點440於其中。各電源接點440於其第一匹配端部448處具有一第一可分離介面446且於其第二匹配端部452處具有一第二可分離介面450。第一可分離介面446係定位以接觸LED封裝體114之匹配基板124上的電源引線132,第二可分離介面446係定位以接觸基座456上的電源導體454。基座456與基座112(第一圖及第二圖所示)不同處在於基座456係一PCB,其具有電源墊體作為電源導體454的代表,以供應電源至電源連接器416。電源接點440從電源導體454供應電源至LED封裝體114。電源接點440在兩匹配端部448、452都具有順應樑體,殼體442包括一固定特徵部458以使殼體442可獨立於LED封裝體114而鎖固至基座112。固定特徵部458係以容置一鎖固件之開口作為代表。在其他具體實施例中也可使用其他類型的固定特徵部。The power connector 416 is represented by a jumper connector having a power contact 440 that is retained within the dielectric housing 442. In an exemplary embodiment, the housing 442 includes a channel 444 formed therein for receiving a power contact 440 therein. Each power contact 440 has a first separable interface 446 at its first mating end 448 and a second separable interface 450 at its second mating end 452. The first separable interface 446 is positioned to contact the power leads 132 on the mating substrate 124 of the LED package 114, and the second separable interface 446 is positioned to contact the power conductor 454 on the pedestal 456. The pedestal 456 differs from the pedestal 112 (shown in the first and second figures) in that the pedestal 456 is a PCB having a power pad body as a representative of the power supply conductor 454 to supply power to the power connector 416. Power contact 440 supplies power from power conductor 454 to LED package 114. The power contacts 440 have compliant beam bodies at both mating ends 448, 452, and the housing 442 includes a securing feature 458 to enable the housing 442 to be secured to the pedestal 112 independently of the LED package 114. The fixed feature 458 is represented by an opening that houses a lock. Other types of securing features can also be used in other embodiments.
殼體442包括抵靠在基座456上之底部462。定位柱464係從底部462延伸,並容置在基座456中的對應開口466中,以使電源連接器416相對於LED封裝體114而定位。視情況,定位柱464係具有不同大小,以使殼體442相對於基座456和LED封裝體114而定向。基座456中的開口466也可具有不同大小以容置對應的定位柱464。可分離介面446、450係暴露於底部462處,以分別接合電源引線132及電源導體454。The housing 442 includes a bottom 462 that abuts against the base 456. The positioning post 464 extends from the bottom 462 and is received in a corresponding opening 466 in the base 456 to position the power connector 416 relative to the LED package 114. Positioning posts 464 are sized differently to orient housing 442 relative to base 456 and LED package 114, as appropriate. The openings 466 in the base 456 can also be of different sizes to accommodate corresponding positioning posts 464. The separable interfaces 446, 450 are exposed at the bottom 462 to engage the power leads 132 and the power conductor 454, respectively.
第二十一圖為又一電源連接器516之分解圖,第二十二圖為電源連接器516在和與其耦合之鏡片518組裝狀態下的上部立體圖。電源連接器516包括固持在介電質殼體542內之電源接點540,殼體542包括形成於其中之線路狹槽544,用於容置個別的電源供應線路。該電源供應線路係以對電源連接器516供應電源之電源導體546作為代表。The twenty-first diagram is an exploded view of yet another power connector 516, and the twenty-second diagram is an upper perspective view of the power connector 516 in an assembled state with the lens 518 coupled thereto. The power connector 516 includes a power contact 540 that is retained within the dielectric housing 542, and the housing 542 includes a line slot 544 formed therein for receiving an individual power supply line. The power supply line is represented by a power conductor 546 that supplies power to the power connector 516.
各電源接點540具有一第一可分離介面548與在其相對端部之一絕緣位移接點(IDC)550,第一可分離介面548係定位以接觸LED封裝體114之匹配基板124上的電源引線132,IDC 550係定位以接觸電源導體546。舉例而言,電源供應線路係載入線路狹槽544中並終止於IDC 550。線路狹槽544包括夾鉗552,其使電源供應線路固持在線路狹槽544中。殼體542包括固定特徵部558,以使殼體542可獨立於LED封裝體114而鎖固至基座112。Each power contact 540 has a first separable interface 548 and an insulating displacement contact (IDC) 550 at an opposite end thereof, the first separable interface 548 being positioned to contact the matching substrate 124 of the LED package 114. Power lead 132, IDC 550 is positioned to contact power conductor 546. For example, the power supply line is loaded into line slot 544 and terminated at IDC 550. The line slot 544 includes a clamp 552 that holds the power supply line in the line slot 544. The housing 542 includes a securing feature 558 to enable the housing 542 to be secured to the base 112 independently of the LED package 114.
第二十三圖為另一電源連接器616之上部立體圖,其具有與其固定之一填塞件618。第二十四圖為電源連接器616在不含填塞件618時之上部立體圖。電源連接器616與電源連接器516(第二十一圖至第二十二圖所示)類似,然填塞件618係用於同時終止電源供應線路620至電源連接器616的IDCs 622。IDCs 622係與電源接點640一體成形,並由殼體642予以固持。The twenty-third figure is a perspective view of the upper portion of the other power connector 616 having one of the plug members 618 fixed thereto. The twenty-fourth view is an upper perspective view of the power connector 616 without the stuffer 618. The power connector 616 is similar to the power connector 516 (shown in Figures 21 through 22), and the stuffer 618 is used to simultaneously terminate the power supply line 620 to the IDCs 622 of the power connector 616. The IDCs 622 are integrally formed with the power contacts 640 and held by the housing 642.
100...照明配件100. . . Lighting accessories
102...照明安定器102. . . Lighting ballast
104...照明組件104. . . Lighting assembly
106...電源導體106. . . Power conductor
108...框體108. . . framework
110...凹槽110. . . Groove
112...基座112. . . Pedestal
114...LED封裝體114. . . LED package
116...電源連接器116. . . Power connector
118...電源供應連接器118. . . Power supply connector
120...頂部表面120. . . Top surface
122...底部表面122. . . Bottom surface
124...固定基板124. . . Fixed substrate
124...匹配基板124. . . Matching substrate
126...頂部126. . . top
128...底部128. . . bottom
130...LED晶片130. . . LED chip
131...鏡片131. . . lens
132...電源引線132. . . Power lead
134...陽極電源接點134. . . Anode power contact
135...陰極電源接點135. . . Cathode power contact
136...邊緣136. . . edge
138...散熱組件138. . . Heat sink
140...電源接點140. . . Power contact
142...介電質殼體142. . . Dielectric housing
144...可分離介面144. . . Separable interface
146...順應樑體146. . . Compliance beam
148...固定特徵部148. . . Fixed feature
150...鎖固件150. . . Lock firmware
152...上部部分152. . . Upper part
154...第一匹配部分154. . . First matching part
156...下部部分156. . . Lower part
158...第二匹配部分158. . . Second matching part
160...開口160. . . Opening
162...開口162. . . Opening
164...衝孔窗部164. . . Punching window
170...囊體170. . . Capsule
172...埠口172. . . Pass
174...底部174. . . bottom
176...匹配介面176. . . Matching interface
178...電源導體178. . . Power conductor
180...邊緣180. . . edge
182...第一匹配端部182. . . First matching end
184...第二匹配端部184. . . Second matching end
186...第一間距186. . . First spacing
188...第二間距188. . . Second spacing
216...電源連接器216. . . Power connector
240...電源接點240. . . Power contact
242...介電質殼體242. . . Dielectric housing
244...可分離介面244. . . Separable interface
246...順應樑體246. . . Compliance beam
248...固定特徵部248. . . Fixed feature
252...上部部分252. . . Upper part
254...第一匹配部分254. . . First matching part
256...下部部分256. . . Lower part
258...第二匹配部分258. . . Second matching part
260...電源供應連接器260. . . Power supply connector
262...開口262. . . Opening
270...定位樁270. . . Positioning pile
272...底部272. . . bottom
274...埠口274. . . Pass
276...匹配介面276. . . Matching interface
280...電源連接器280. . . Power connector
282...固定特徵部282. . . Fixed feature
290...電源供應連接器290. . . Power supply connector
292...PCB/印刷電路板292. . . PCB/printed circuit board
316...電源連接器316. . . Power connector
340...電源接點340. . . Power contact
342...介電質殼體342. . . Dielectric housing
344...可分離介面344. . . Separable interface
346...順應樑體346. . . Compliance beam
348...固定特徵部348. . . Fixed feature
352...匹配舌部352. . . Matching tongue
354...表面354. . . surface
356...第一匹配部分356. . . First matching part
358...第二匹配部分358. . . Second matching part
360...第一匹配端部360. . . First matching end
362...第二匹配端部362. . . Second matching end
364...電源供應連接器364. . . Power supply connector
366...匹配接點366. . . Matching joint
370...衝孔窗部370. . . Punching window
372...引線框體372. . . Lead frame
374...連接件374. . . Connector
416...電源連接器416. . . Power connector
440...電源接點440. . . Power contact
442...介電質殼體442. . . Dielectric housing
444...通道444. . . aisle
446...第一可分離介面446. . . First separable interface
448...第一匹配端部448. . . First matching end
450...第二可分離介面450. . . Second separable interface
452...第二匹配端部452. . . Second matching end
454...電源導體454. . . Power conductor
456...基座456. . . Pedestal
458...固定特徵部458. . . Fixed feature
462...底部462. . . bottom
464...定位柱464. . . Positioning column
466...開口466. . . Opening
516...電源連接器516. . . Power connector
518...鏡片518. . . lens
540...電源接點540. . . Power contact
542...介電質殼體542. . . Dielectric housing
544...線路狹槽544. . . Line slot
546...電源導體546. . . Power conductor
548...第一可分離介面548. . . First separable interface
550...絕緣位移接點550. . . Insulation displacement contact
552...夾鉗552. . . clamp
558...固定特徵部558. . . Fixed feature
616...電源連接器616. . . Power connector
618...填塞件618. . . Packing
620...電源供應線路620. . . Power supply line
622...絕緣位移接點622. . . Insulation displacement contact
640...電源接點640. . . Power contact
642...殼體642. . . case
第一圖為根據一示範具體實施例所形成之照明配件的上部立體圖。The first figure is an upper perspective view of a lighting accessory formed in accordance with an exemplary embodiment.
第二圖為第一圖所示之照明配件的分解圖。The second figure is an exploded view of the lighting accessory shown in the first figure.
第三圖為用於第一圖所示之照明配件的LED封裝體的上視圖。The third figure is a top view of the LED package for the lighting accessory shown in the first figure.
第四圖為第三圖所示之LED封裝體的側視圖。The fourth figure is a side view of the LED package shown in the third figure.
第五圖為第一圖所示之照明配件之示例電源連接器與第三圖所示之LED封裝體匹配時的上視圖。The fifth figure is a top view of the example power connector of the lighting assembly shown in the first figure when it is matched with the LED package shown in the third figure.
第六圖為第五圖所示之電源連接器的分解圖。Figure 6 is an exploded view of the power connector shown in Figure 5.
第七圖為第五圖所示之電源連接器的底部立體圖。The seventh figure is a bottom perspective view of the power connector shown in the fifth figure.
第八圖為第五圖所示之電源連接器的部分截面圖。Figure 8 is a partial cross-sectional view of the power connector shown in Figure 5.
第九圖為固定至LED封裝體之另一電源連接器的上部立體圖。The ninth view is an upper perspective view of another power connector fixed to the LED package.
第十圖為第九圖所示之電源連接器的分解圖。Figure 10 is an exploded view of the power connector shown in Figure 9.
第十一圖為第九圖所示之電源連接器的底部立體圖。Figure 11 is a bottom perspective view of the power connector shown in Figure IX.
第十二圖為另一電源連接器之底部立體圖。Figure 12 is a bottom perspective view of another power connector.
第十三圖為第九圖所示之電源連接器與一電源供應連接器匹配時的側視圖。Figure 13 is a side view of the power connector shown in Figure 9 when mated with a power supply connector.
第十四圖為在匹配狀態下之電源連接器與電源供應連接器的側視圖。Figure 14 is a side view of the power connector and power supply connector in a mated state.
第十五圖為另一電源連接器的分解圖。Figure 15 is an exploded view of another power connector.
第十六圖為第十五圖所示之電源連接器的組合圖。Figure 16 is a combination of the power connectors shown in Figure 15.
第十七圖為第十五圖所示之電源連接器在第一製造狀態下的上視圖。Figure 17 is a top view of the power connector shown in Fig. 15 in a first manufacturing state.
第十八圖為第十五圖所示之電源連接器在第二製造狀態下的上視圖。Figure 18 is a top view of the power connector shown in Figure 15 in a second manufacturing state.
第十九圖說明了未與LED封裝體匹配之另一電源連接器。Figure 19 illustrates another power connector that is not matched to the LED package.
第二十圖為第十九圖之電源連接器在匹配狀態下的上部立體圖。Figure 20 is an upper perspective view of the power connector of Figure 19 in a mated state.
第二十一圖為另外一個電源連接器的分解圖。Figure 21 is an exploded view of another power connector.
第二十二圖為第二十一圖所示之電源連接器的上部立體圖,該電源連接器具有與其耦合之一鏡片。The twenty-second figure is an upper perspective view of the power connector shown in Fig. 21, the power connector having a lens coupled thereto.
第二十三圖為另一個電源連接器之上部立體圖,其具有與其固定之填塞件。Figure 23 is a perspective view of the upper portion of another power connector having a tampon member fixed thereto.
第二十四圖為第二十三圖所示之不含填塞件之電源連接器的上部立體圖。Figure 24 is an upper perspective view of the power connector without the plug shown in Figure 23.
100...照明配件100. . . Lighting accessories
102...照明安定器102. . . Lighting ballast
104...照明組件104. . . Lighting assembly
106...電源導體106. . . Power conductor
108...框體108. . . framework
110...凹槽110. . . Groove
112...基座112. . . Pedestal
114...LED封裝體114. . . LED package
116...電源連接器116. . . Power connector
120...頂部表面120. . . Top surface
Claims (13)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US12/637,356 US8342733B2 (en) | 2009-12-14 | 2009-12-14 | LED lighting assemblies |
Publications (2)
Publication Number | Publication Date |
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TW201131834A TW201131834A (en) | 2011-09-16 |
TWI524562B true TWI524562B (en) | 2016-03-01 |
Family
ID=43733349
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW099142764A TWI524562B (en) | 2009-12-14 | 2010-12-08 | Led lighting assemblies |
Country Status (6)
Country | Link |
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US (1) | US8342733B2 (en) |
EP (1) | EP2333407B1 (en) |
JP (1) | JP5669188B2 (en) |
KR (1) | KR20110068871A (en) |
CN (1) | CN102121599B (en) |
TW (1) | TWI524562B (en) |
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EP2333407B1 (en) | 2013-10-30 |
JP2011124577A (en) | 2011-06-23 |
TW201131834A (en) | 2011-09-16 |
JP5669188B2 (en) | 2015-02-12 |
US20110140136A1 (en) | 2011-06-16 |
US8342733B2 (en) | 2013-01-01 |
KR20110068871A (en) | 2011-06-22 |
CN102121599A (en) | 2011-07-13 |
EP2333407A1 (en) | 2011-06-15 |
CN102121599B (en) | 2014-08-20 |
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