TWI520812B - 化學機械平面化墊體及其製造方法、以及拋光一基板之方法 - Google Patents

化學機械平面化墊體及其製造方法、以及拋光一基板之方法 Download PDF

Info

Publication number
TWI520812B
TWI520812B TW099100071A TW99100071A TWI520812B TW I520812 B TWI520812 B TW I520812B TW 099100071 A TW099100071 A TW 099100071A TW 99100071 A TW99100071 A TW 99100071A TW I520812 B TWI520812 B TW I520812B
Authority
TW
Taiwan
Prior art keywords
component
water
fiber
fabric
insoluble
Prior art date
Application number
TW099100071A
Other languages
English (en)
Chinese (zh)
Other versions
TW201032952A (en
Inventor
保羅 利菲瑞
亞奴普 馬修
吳光偉
史考特 新 喬
奧斯卡Ｋ 許
大衛 亞當 威爾斯
約翰 艾立克 奧迪伯
馬克Ｃ 金
Original Assignee
音諾帕德股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 音諾帕德股份有限公司 filed Critical 音諾帕德股份有限公司
Publication of TW201032952A publication Critical patent/TW201032952A/zh
Application granted granted Critical
Publication of TWI520812B publication Critical patent/TWI520812B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
TW099100071A 2009-01-05 2010-01-05 化學機械平面化墊體及其製造方法、以及拋光一基板之方法 TWI520812B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14254409P 2009-01-05 2009-01-05

Publications (2)

Publication Number Publication Date
TW201032952A TW201032952A (en) 2010-09-16
TWI520812B true TWI520812B (zh) 2016-02-11

Family

ID=42310236

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099100071A TWI520812B (zh) 2009-01-05 2010-01-05 化學機械平面化墊體及其製造方法、以及拋光一基板之方法

Country Status (8)

Country Link
US (2) US8790165B2 (https=)
EP (1) EP2389275A1 (https=)
JP (1) JP5587337B2 (https=)
KR (1) KR101674564B1 (https=)
CN (1) CN102271867B (https=)
SG (1) SG172850A1 (https=)
TW (1) TWI520812B (https=)
WO (1) WO2010078566A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012138705A2 (en) * 2011-04-05 2012-10-11 Universal Photonics, Inc. A self-conditioning polishing pad and a method of making the same
US9050697B2 (en) 2012-03-20 2015-06-09 Jh Rhodes Company, Inc. Self-conditioning polishing pad and a method of making the same
WO2014039575A1 (en) * 2012-09-06 2014-03-13 Hydration Systems, Llc Phase inversion membrane and method for manufacturing same using soluble fibers
JP6408410B2 (ja) * 2015-03-30 2018-10-17 日本碍子株式会社 成形体の製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4257687B2 (ja) 1999-01-11 2009-04-22 株式会社トクヤマ 研磨剤および研磨方法
US6533645B2 (en) 2000-01-18 2003-03-18 Applied Materials, Inc. Substrate polishing article
US6656019B1 (en) * 2000-06-29 2003-12-02 International Business Machines Corporation Grooved polishing pads and methods of use
US6964604B2 (en) * 2000-06-23 2005-11-15 International Business Machines Corporation Fiber embedded polishing pad
US6709981B2 (en) * 2000-08-16 2004-03-23 Memc Electronic Materials, Inc. Method and apparatus for processing a semiconductor wafer using novel final polishing method
JP2002154040A (ja) * 2000-11-20 2002-05-28 Ikegami Kanagata Kogyo Kk 回転工具
US7267607B2 (en) 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
JP4039214B2 (ja) 2002-11-05 2008-01-30 Ｊｓｒ株式会社 研磨パッド
JP2004343090A (ja) * 2003-04-22 2004-12-02 Jsr Corp 研磨パッドおよび半導体ウェハの研磨方法
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
TWI292730B (en) 2003-07-01 2008-01-21 Applied Materials Inc Method and apparatus for electrochemical mechanical processing
US7384871B2 (en) * 2004-07-01 2008-06-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing compositions and methods relating thereto
US8075372B2 (en) 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
WO2008093850A1 (ja) * 2007-02-01 2008-08-07 Kuraray Co., Ltd. 研磨パッド及び研磨パッドの製造方法
JP5289787B2 (ja) 2007-02-01 2013-09-11 株式会社クラレ 研磨パッド及び研磨パッドの製造方法

Also Published As

Publication number Publication date
TW201032952A (en) 2010-09-16
JP5587337B2 (ja) 2014-09-10
CN102271867B (zh) 2015-07-01
US20100221983A1 (en) 2010-09-02
CN102271867A (zh) 2011-12-07
WO2010078566A1 (en) 2010-07-08
US8790165B2 (en) 2014-07-29
JP2012514857A (ja) 2012-06-28
US20140311043A1 (en) 2014-10-23
KR20110111298A (ko) 2011-10-10
SG172850A1 (en) 2011-08-29
US9796063B2 (en) 2017-10-24
EP2389275A1 (en) 2011-11-30
KR101674564B1 (ko) 2016-11-09

Similar Documents

Publication Publication Date Title
JP5749420B2 (ja) 制御された細孔径を有する微孔質ｃｍｐ材料の製造方法
JP5460316B2 (ja) パッド表面上にマイクロ溝を有する研磨パッド
TW425331B (en) Polishing pads for a semiconductor substrate
TWI295946B (en) Transparent microporous materials for cmp
JP5543494B2 (ja) パターン化された構造ドメインを含む化学機械平坦化パッド
TWI234505B (en) Transparent microporous materials for CMP
US6953388B2 (en) Polishing pad, and method and apparatus for polishing
CN101022918B (zh) 抛光垫和制造抛光垫的方法
TWI520812B (zh) 化學機械平面化墊體及其製造方法、以及拋光一基板之方法
TW201006854A (en) Chemical mechanical polishing pad
KR20230005760A (ko) Cmp 폴리싱 패드
TWI638019B (zh) 從基板移除基體材料層之方法及適合此方法之化學機械拋光劑
CN113442056B (zh) 一种抛光垫及其制备方法、半导体器件的制造方法
JPWO2018012468A1 (ja) 研磨体およびその製造方法
JP5777816B2 (ja) 支持パッド用ポリウレタン樹脂組成物及びこれを用いたポリウレタン支持パッド
JP2001315056A (ja) 研磨用パッドおよびそれを用いた研磨装置及び研磨方法
CN113977453B (zh) 提高抛光平坦度的化学机械抛光垫及其应用
JP2002158197A (ja) 研磨用パッドおよびそれを用いた研磨装置ならびに研磨方法
JP2004311817A (ja) 研磨パッドとそれを用いた研磨方法
JP2025056988A (ja) 研磨パッドおよび研磨装置
CN102317036B (zh) Cmp垫中的三维网状结构
TW201402272A (zh) 製造化學機械平坦化墊的方法