TWI520288B - 半導體結構及其封裝構造 - Google Patents

半導體結構及其封裝構造 Download PDF

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Publication number
TWI520288B
TWI520288B TW100135984A TW100135984A TWI520288B TW I520288 B TWI520288 B TW I520288B TW 100135984 A TW100135984 A TW 100135984A TW 100135984 A TW100135984 A TW 100135984A TW I520288 B TWI520288 B TW I520288B
Authority
TW
Taiwan
Prior art keywords
barrier layer
organic barrier
copper
semiconductor package
layer
Prior art date
Application number
TW100135984A
Other languages
English (en)
Chinese (zh)
Other versions
TW201316470A (zh
Inventor
施政宏
林淑真
謝永偉
葉潤宇
Original Assignee
頎邦科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 頎邦科技股份有限公司 filed Critical 頎邦科技股份有限公司
Priority to TW100135984A priority Critical patent/TWI520288B/zh
Priority to JP2012138131A priority patent/JP2013080899A/ja
Priority to KR1020120083793A priority patent/KR101350289B1/ko
Priority to SG2012069571A priority patent/SG189617A1/en
Publication of TW201316470A publication Critical patent/TW201316470A/zh
Application granted granted Critical
Publication of TWI520288B publication Critical patent/TWI520288B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW100135984A 2011-10-04 2011-10-04 半導體結構及其封裝構造 TWI520288B (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW100135984A TWI520288B (zh) 2011-10-04 2011-10-04 半導體結構及其封裝構造
JP2012138131A JP2013080899A (ja) 2011-10-04 2012-06-19 半導体装置及びそれを利用した半導体パッケージ
KR1020120083793A KR101350289B1 (ko) 2011-10-04 2012-07-31 반도체 구조 및 반도체 패키지 구조
SG2012069571A SG189617A1 (en) 2011-10-04 2012-09-19 Package structure and semiconductor structure thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100135984A TWI520288B (zh) 2011-10-04 2011-10-04 半導體結構及其封裝構造

Publications (2)

Publication Number Publication Date
TW201316470A TW201316470A (zh) 2013-04-16
TWI520288B true TWI520288B (zh) 2016-02-01

Family

ID=48437946

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100135984A TWI520288B (zh) 2011-10-04 2011-10-04 半導體結構及其封裝構造

Country Status (4)

Country Link
JP (1) JP2013080899A (ko)
KR (1) KR101350289B1 (ko)
SG (1) SG189617A1 (ko)
TW (1) TWI520288B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI467757B (zh) * 2013-08-02 2015-01-01 Chipbond Technology Corp 半導體結構

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6084855A (ja) * 1983-10-17 1985-05-14 Hitachi Ltd 半導体装置
JPH06151502A (ja) * 1992-11-06 1994-05-31 Seiko Instr Inc 半導体素子のフリップチップ実装方法
KR100196291B1 (ko) * 1996-10-05 1999-06-15 윤종용 요철 형상의 범프 구조를 이용한 반도체 칩과 기판 간의 접속 구조
JP3070514B2 (ja) * 1997-04-28 2000-07-31 日本電気株式会社 突起電極を有する半導体装置、半導体装置の実装方法およびその実装構造
JP4663165B2 (ja) * 2001-06-27 2011-03-30 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
MY134318A (en) * 2003-04-02 2007-12-31 Freescale Semiconductor Inc Integrated circuit die having a copper contact and method therefor
JP4444022B2 (ja) * 2004-06-30 2010-03-31 富士通マイクロエレクトロニクス株式会社 半導体装置の製造方法
KR20100006104A (ko) * 2008-07-08 2010-01-18 삼성전자주식회사 반도체 패키지
JP5324322B2 (ja) * 2009-06-02 2013-10-23 住友電気工業株式会社 接続方法、接続構造および電子機器

Also Published As

Publication number Publication date
TW201316470A (zh) 2013-04-16
SG189617A1 (en) 2013-05-31
JP2013080899A (ja) 2013-05-02
KR20130036701A (ko) 2013-04-12
KR101350289B1 (ko) 2014-01-10

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