TWI519777B - Processing device, processing system and coordinate correction method - Google Patents

Processing device, processing system and coordinate correction method Download PDF

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Publication number
TWI519777B
TWI519777B TW100113161A TW100113161A TWI519777B TW I519777 B TWI519777 B TW I519777B TW 100113161 A TW100113161 A TW 100113161A TW 100113161 A TW100113161 A TW 100113161A TW I519777 B TWI519777 B TW I519777B
Authority
TW
Taiwan
Prior art keywords
inspection
measurement
substrate
coordinates
sample
Prior art date
Application number
TW100113161A
Other languages
English (en)
Chinese (zh)
Other versions
TW201207382A (en
Inventor
菅義明
Original Assignee
奧林巴斯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 奧林巴斯股份有限公司 filed Critical 奧林巴斯股份有限公司
Publication of TW201207382A publication Critical patent/TW201207382A/zh
Application granted granted Critical
Publication of TWI519777B publication Critical patent/TWI519777B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/004—Measuring arrangements characterised by the use of mechanical techniques for measuring coordinates of points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H10P72/0606—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
TW100113161A 2010-04-30 2011-04-15 Processing device, processing system and coordinate correction method TWI519777B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010105475A JP5663192B2 (ja) 2010-04-30 2010-04-30 処理装置、座標補正方法および座標補正プログラム

Publications (2)

Publication Number Publication Date
TW201207382A TW201207382A (en) 2012-02-16
TWI519777B true TWI519777B (zh) 2016-02-01

Family

ID=44887797

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100113161A TWI519777B (zh) 2010-04-30 2011-04-15 Processing device, processing system and coordinate correction method

Country Status (4)

Country Link
JP (1) JP5663192B2 (enExample)
KR (1) KR20110121571A (enExample)
CN (1) CN102237262A (enExample)
TW (1) TWI519777B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103075970B (zh) * 2012-12-27 2015-07-01 深圳市华星光电技术有限公司 测长装置直交度补偿方法及使用该方法的测长装置
US9080865B2 (en) 2012-12-27 2015-07-14 Shenzhen China Star Optoelectronics Technology Co., Ltd Orthogonality compensation method for length measurement device and length measurement device using same
CN103292709B (zh) * 2013-05-24 2015-09-09 深圳市华星光电技术有限公司 测长机日常检测与自动补正方法
JP5808454B1 (ja) 2014-04-25 2015-11-10 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、プログラムおよび記録媒体
CN105047581A (zh) * 2014-04-25 2015-11-11 株式会社日立国际电气 衬底处理装置及半导体器件的制造方法
CN106814307B (zh) * 2017-01-10 2020-05-12 深圳鼎缘电子科技有限公司 一种腔体滤波器自动调试方法及系统
CN108226179B (zh) * 2018-01-10 2021-01-22 京东方科技集团股份有限公司 自动光学检测设备的校准方法及自动修复系统
CN110111383B (zh) * 2018-05-08 2022-03-18 广东聚华印刷显示技术有限公司 玻璃基板的偏移校正方法、装置和系统
CN112666164B (zh) * 2020-11-23 2023-06-16 上海新时达机器人有限公司 针对多品类混线生产控制柜的机器人视觉检测方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002107137A (ja) * 2000-09-29 2002-04-10 Toshiba Corp 検査ステージの制御方法
JP3903889B2 (ja) * 2001-09-13 2007-04-11 株式会社日立製作所 欠陥検査方法及びその装置並びに撮像方法及びその装置
US7127098B2 (en) * 2001-09-13 2006-10-24 Hitachi, Ltd. Image detection method and its apparatus and defect detection method and its apparatus
JP4207689B2 (ja) * 2003-07-15 2009-01-14 株式会社ニコン 位置ずれ測定装置
JP2005310833A (ja) * 2004-04-16 2005-11-04 Olympus Corp 基板検査装置および方法
CN100547757C (zh) * 2006-11-07 2009-10-07 中芯国际集成电路制造(上海)有限公司 一种新型晶圆定位偏移纠正方法
JP2009300230A (ja) * 2008-06-12 2009-12-24 Olympus Corp 位置合わせを行う装置、方法、およびプログラム、ならびに基準モデルを作成する装置、方法、およびプログラム

Also Published As

Publication number Publication date
JP5663192B2 (ja) 2015-02-04
CN102237262A (zh) 2011-11-09
TW201207382A (en) 2012-02-16
KR20110121571A (ko) 2011-11-07
JP2011232298A (ja) 2011-11-17

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