TWI517767B - Copper foil, copper clad laminate, flexible wiring board and three-dimensional molded body - Google Patents

Copper foil, copper clad laminate, flexible wiring board and three-dimensional molded body Download PDF

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Publication number
TWI517767B
TWI517767B TW102107464A TW102107464A TWI517767B TW I517767 B TWI517767 B TW I517767B TW 102107464 A TW102107464 A TW 102107464A TW 102107464 A TW102107464 A TW 102107464A TW I517767 B TWI517767 B TW I517767B
Authority
TW
Taiwan
Prior art keywords
copper foil
copper
resin layer
clad laminate
layer
Prior art date
Application number
TW102107464A
Other languages
English (en)
Chinese (zh)
Other versions
TW201352082A (zh
Inventor
Kazuki Kammuri
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW201352082A publication Critical patent/TW201352082A/zh
Application granted granted Critical
Publication of TWI517767B publication Critical patent/TWI517767B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C2202/00—Physical properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Metal Rolling (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW102107464A 2012-03-29 2013-03-04 Copper foil, copper clad laminate, flexible wiring board and three-dimensional molded body TWI517767B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012075877A JP5546571B2 (ja) 2012-03-29 2012-03-29 銅箔、銅張積層体、フレキシブル配線板及び立体成型体

Publications (2)

Publication Number Publication Date
TW201352082A TW201352082A (zh) 2013-12-16
TWI517767B true TWI517767B (zh) 2016-01-11

Family

ID=49361273

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102107464A TWI517767B (zh) 2012-03-29 2013-03-04 Copper foil, copper clad laminate, flexible wiring board and three-dimensional molded body

Country Status (4)

Country Link
JP (1) JP5546571B2 (ja)
KR (1) KR101539839B1 (ja)
CN (1) CN103358618B (ja)
TW (1) TWI517767B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110042353B (zh) * 2019-04-04 2020-11-27 内蒙古科技大学 一种纳米叠层铝基复合材料及制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62188296A (ja) * 1986-02-13 1987-08-17 セイコーエプソン株式会社 回路基板の立体構造
JPH04228553A (ja) * 1990-06-22 1992-08-18 Hitachi Cable Ltd 耐屈曲性圧延銅箔
JP3178279B2 (ja) * 1994-11-18 2001-06-18 宇部興産株式会社 接着剤付きポリイミドフィルムおよび積層体
JP5263525B2 (ja) * 2006-06-23 2013-08-14 日本碍子株式会社 銅基圧延合金の製造方法
KR101690491B1 (ko) * 2009-12-25 2016-12-28 신닛테츠 수미킨 가가쿠 가부시키가이샤 가요성 회로기판 및 가요성 회로기판의 굴곡부 구조
JP5094834B2 (ja) * 2009-12-28 2012-12-12 Ｊｘ日鉱日石金属株式会社 銅箔の製造方法、銅箔及び銅張積層板
JP2011153360A (ja) * 2010-01-28 2011-08-11 Jx Nippon Mining & Metals Corp 両面銅張積層板用圧延銅合金箔、及びそれを用いた両面銅張積層板の製造方法
JP5189683B2 (ja) * 2011-03-24 2013-04-24 Ｊｘ日鉱日石金属株式会社 圧延銅合金箔
JP2013143440A (ja) * 2012-01-10 2013-07-22 Sekisui Chem Co Ltd 金属ベース基板

Also Published As

Publication number Publication date
TW201352082A (zh) 2013-12-16
KR20130111340A (ko) 2013-10-10
CN103358618B (zh) 2015-04-22
JP5546571B2 (ja) 2014-07-09
JP2013207145A (ja) 2013-10-07
KR101539839B1 (ko) 2015-07-27
CN103358618A (zh) 2013-10-23

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