TWI511230B - A detection machine with a mask - Google Patents
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- TWI511230B TWI511230B TW101100343A TW101100343A TWI511230B TW I511230 B TWI511230 B TW I511230B TW 101100343 A TW101100343 A TW 101100343A TW 101100343 A TW101100343 A TW 101100343A TW I511230 B TWI511230 B TW I511230B
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Description
一種具有遮罩的檢測機台,尤其是一種由待測電子元件上方施加正壓,藉以在沒有實質接觸下,提供充分下壓力而確保檢測可靠性的具有遮罩的檢測機台。A masking inspection machine, in particular, a masked inspection machine that applies a positive pressure above the electronic component to be tested, thereby providing sufficient downforce to ensure detection reliability without substantial contact.
一般而言電子元件如光電或半導體元件等,在製造或組裝使用過程中,都需要經過檢測,以驗證其各種電氣性質,常見的一種自動化檢測方式,是讓待測電子元件電性連接至檢測機台上的檢測裝置,通電致能或輸入訊號,以確認上述產品的運作情況。為確保通電致能或輸入訊號的可靠性,檢測機台多在檢測裝置部分設置有下壓的機械臂,藉由施加壓力,迫使待測電子元件與機台上的電極良好導接;甚至針對受測期間產生的高溫,額外設置導熱接觸的裝置,以確保其運作環境的溫度不致過高而損及元件本身。In general, electronic components, such as optoelectronic or semiconductor components, need to be tested during manufacturing or assembly to verify their various electrical properties. A common automated detection method is to electrically connect the electronic components to be tested to the test. The detection device on the machine, power on or input signal to confirm the operation of the above products. In order to ensure the reliability of the power-on or the input signal, the detecting machine is provided with a pressing arm in the detecting device portion, and by applying pressure, the electronic component to be tested is forced to be well connected with the electrode on the machine; During the high temperature generated during the test, additional thermal contact devices are provided to ensure that the temperature of the operating environment is not too high and damages the components themselves.
但以CCD與LED元件為例,機械手臂的下壓固然確保待測元件與機台之間的導電與導熱接合,卻也提高刮傷CCD與LED元件表面的風險,作為影像擷取的CCD元件,一旦表面產生刮損,將對光線捕捉造成影響。至於LED元件的透光包覆罩,則除保護功能外,通常還需負責決定LED元件發光的光場分布,若產生刮痕,便會影響出光;尤其當光能傳遞受阻時,可能會被刮痕所吸收而轉換為熱能殘留。因此,刮損處較其他平滑處更容易升溫,長久使用下,透光包覆罩可能受熱應力而破裂,使元件損壞。However, taking CCD and LED components as an example, the pressing of the mechanical arm ensures the conductive and thermal conduction between the device under test and the machine, but also increases the risk of scratching the surface of the CCD and the LED component, as a CCD component for image capture. Once the surface is scratched, it will affect the light trapping. As for the light-transmissive cover of the LED component, in addition to the protection function, it is usually responsible for determining the light field distribution of the LED component. If a scratch occurs, the light will be affected; especially when the light energy transmission is blocked, it may be The scratch is absorbed and converted into heat energy residue. Therefore, the scratch is more likely to heat up than other smooth places. For long-term use, the light-transmissive cover may be broken by thermal stress and damage the components.
因此,如上述CCD類光學感測的電子元件、LED類的發光電子元件、或是尚未被封裝的裸晶元件的檢測方式,一方面受限於光學感測類的電子元件受光表面不能留有瑕疵,發光類電子元件的透光保護罩本身又涉及出光的光場分布而不能受壓,裸晶元件更無法容許直接對極其細緻的電路表面施壓。但矛盾地,進行上述檢測時,無論電性連接或導熱連接都需要完全緊密貼合,一旦待測電子元件的電極與檢測機台的電極間留有些許空隙,空氣同時是電與熱的不良導體,極易導致待測元件運作失常,進而被檢測機台誤認是瑕疵品,或者因導熱效果不彰,在檢測的過程中就因高溫積蓄而致燒毀。Therefore, as described above, the CCD-based optical sensing electronic component, the LED-based luminescent electronic component, or the un-packaged bare-crystal component is limited in that the optical sensing-type electronic component cannot be left on the light receiving surface. In other words, the light-transmitting protective cover of the illuminating electronic component itself involves the distribution of the light field of the light and cannot be pressed, and the bare-crystal component is more incapable of directly applying pressure to the extremely fine circuit surface. Contradictoryly, when performing the above test, the electrical connection or the thermal connection needs to be completely tightly attached. Once there is a slight gap between the electrode of the electronic component to be tested and the electrode of the detection machine, the air is both poor in electricity and heat. The conductor can easily lead to malfunction of the device under test, and it is misidentified by the inspection machine, or it is burnt due to the high temperature accumulation during the detection process due to the inconsistent heat conduction effect.
另考量如尚未分割的LED晶圓,在製作加工過程中因數次溫度變化,可能產生約5微米的不平整翹曲,使得點測裝置在導電接觸至各晶粒時,因高度落差而接觸不良,進而影響整體檢測的精準度。因此電子業界採用一種檢測機台,於機台檢測埠的表面設有通氣孔洞,並搭配真空幫浦向下吸引,將晶圓吸附在機台檢測埠的表面上,讓位於晶圓下方的電極與檢測埠導電接觸,讓待測晶圓的共同電極導電連接至檢測機台上的電極。Another consideration is that if the LED wafer has not been divided, the temperature change of the factor during the manufacturing process may result in uneven warping of about 5 micrometers, so that the spotting device has poor contact due to the height drop when the conductive device contacts the respective crystal grains. , which in turn affects the accuracy of the overall detection. Therefore, the electronics industry adopts a detection machine. The surface of the machine is equipped with a vent hole on the surface of the machine. The vacuum pump is used to draw downward, and the wafer is adsorbed on the surface of the machine to detect the surface of the crucible. The electrode is in conductive contact with the detecting port, and the common electrode of the wafer to be tested is electrically connected to the electrode on the detecting machine.
此種以吸附方式固定及導接的設計,主要是將待測物下方氣壓排除,讓待測物上方的氣壓施加於待測物上,從而達到固定與迫緊的效果;由於施加於待測物的各方向上的氣壓均為一大氣壓,也就是在非接觸狀況下,所能施加的最大下壓力就僅只限於一個大氣壓力,使得此種結構對於待測物的壓制迫緊效果受到侷限,且當待測物不平整達一定程度、或接觸端部有較大彈性時,仍然不能確保待測物與測試機台之電極間的導電接觸以及導熱接觸效果。加以,為提供接近一個大氣壓力的下壓力,下方負責抽吸 的真空幫浦必須增強吸引力度,提高真空度,將大幅提升機台的成本。The design of fixing and guiding by adsorption is mainly to remove the air pressure under the object to be tested, so that the air pressure above the object to be tested is applied to the object to be tested, thereby achieving the effect of fixing and pressing; The air pressure in all directions of the object is one atmosphere, that is, in the non-contact condition, the maximum downward pressure that can be applied is limited to only one atmospheric pressure, so that the pressing effect of the structure on the object to be tested is limited. Moreover, when the object to be tested is not flattened to a certain extent, or the contact end has greater elasticity, the conductive contact between the test object and the electrode of the test machine and the heat conduction contact effect are still not ensured. In order to provide a downward pressure close to an atmospheric pressure, the lower part is responsible for suction The vacuum pump must increase the attractiveness and increase the vacuum, which will greatly increase the cost of the machine.
因此,本發明提供一種非接觸式的下壓設計,避免下壓迫緊過程中對於待測元件的損傷風險,並且仍能確保迫緊下壓的效果,提供測試過程中的良好導電接觸與導熱接觸,完全解決以往的兩難問題,提供一種全面自動化的檢測機台。Therefore, the present invention provides a non-contact down-press design that avoids the risk of damage to the component to be tested during the pressing process, and still ensures the effect of pressing down, providing good conductive contact and thermal contact during the test. Completely solve the dilemma of the past and provide a fully automated inspection machine.
本發明的一個目的在提供一種以空氣壓力取代實體按壓、減少檢測過程之待測物壞損機率的檢測機台。SUMMARY OF THE INVENTION An object of the present invention is to provide a detecting machine that replaces physical pressing with air pressure and reduces the probability of damage of the test object during the detecting process.
本發明的另一個目的在提供一種提供待測元件與檢測機台間有效導電及導熱連接的檢測機台,確保檢測精度、且提升檢測速率。Another object of the present invention is to provide a detecting machine for providing effective electrical conduction and thermal conduction connection between an element to be tested and a detecting machine, thereby ensuring detection accuracy and increasing the detection rate.
本發明的再一個目的是提供一種非接觸式下壓、且下壓力可以調節至超過一個大氣壓力的檢測機台,提供可調節的檢測環境,增加檢測彈性。It is still another object of the present invention to provide a non-contact down-pressing machine that can be adjusted to a pressure greater than one atmosphere, providing an adjustable detection environment and increased detection flexibility.
本發明的又一個目的是透過下壓力,減少真空幫浦所需要抽吸的強度,甚至不需真空幫浦,即可提供充分導接與導熱的檢測機台,降低整體機台成本。Still another object of the present invention is to reduce the strength of the vacuum pumping required by the downforce, and even to provide a sufficient conductivity and heat conduction detecting machine without the need of a vacuum pump, thereby reducing the overall machine cost.
一種具有遮罩的檢測機台,供通氣導接至一個氣壓增減裝置、且用以檢測至少一個電子元件,該檢測機台包括:一個基座;一個設置於該基座上、具有至少一個通氣孔之承載裝置;至少一組對應上述至少一個通氣孔而設置於該承載裝置、並供電性連接上述電子元件的檢測裝置;一組設置於該基座上、形成有一個對應上述至少一組檢測裝置的開口、且與該基座共同形成一個氣密封閉空間的遮罩;其中,該遮罩及/或該基座更形成有至 少一個遠離上述通氣孔、且通氣連接該氣壓增減裝置、使得該氣密封閉空間內形成正壓的加壓孔。A masking detection machine for ventilating to a gas pressure increasing and lowering device and for detecting at least one electronic component, the testing machine comprising: a base; one disposed on the base and having at least one a venting port bearing device; at least one set of detecting devices corresponding to the at least one venting hole and disposed on the carrying device and electrically connecting the electronic components; one set on the pedestal and one corresponding to the at least one group Detecting an opening of the device and forming a mask with a hermetically sealed space together with the base; wherein the mask and/or the base are further formed to One of the pressure holes that is away from the vent hole and is ventilated to the air pressure increasing and lowering device to form a positive pressure in the hermetically sealed space.
透過上述的遮罩設計,本發明一方面利用氣壓提供壓力,不須實體接觸待測物。因此解決習知技術檢測過程中的待測物刮傷、損壞問題,使檢測更為穩定、安全,提升檢測良率。Through the above-described mask design, the present invention utilizes air pressure to provide pressure without physical contact with the object to be tested. Therefore, the problem of scratching and damage of the object to be tested during the detection process of the prior art is solved, so that the detection is more stable and safe, and the detection yield is improved.
有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之較佳實施例的詳細說明中,將可清楚的呈現。The foregoing and other objects, features, and advantages of the invention are set forth in the <RTIgt;
本發明第一較佳實施例如圖1所示,具有遮罩的檢測機台1包括一個基座10,基座10上設有一組用以承載待測元件的承載裝置11,以及與承載裝置11對應的至少一組釋例為檢測點的檢測裝置12,另有一組包覆上述釋例為檢測點的檢測裝置12、並設置於承載裝置11之上的遮罩13。其中,遮罩13與基座10氣密接合,共同形成一個氣密的封閉空間131。而承載裝置11則主要用以隔絕待測物及基座10作為絕緣之用,另外可作為待測物於測試過程中之導熱、散熱。A first preferred embodiment of the present invention, as shown in FIG. 1, a masking machine 1 includes a base 10 having a set of carrying devices 11 for carrying components to be tested, and a carrying device 11 Corresponding at least one set of detections is a detection device 12 for detecting points, and a set of masks 13 covering the detection device 12 of the above-mentioned release as a detection point and disposed on the carrier device 11. The mask 13 and the base 10 are hermetically joined to form an airtight enclosed space 131. The carrying device 11 is mainly used for isolating the object to be tested and the susceptor 10 for insulation, and can also be used as the object to be tested for heat conduction and heat dissipation during the test.
如圖2所示,設置於基座10上的承載裝置11中,形成有例如五組通氣孔110,分別經由承載裝置11及基座10,構成連通至外部,在本例中,上述的通氣孔110經由通氣管(未標號)連接到一組釋例為真空泵浦、用以產生負壓的氣壓增減裝置15,藉以強制空氣從通氣孔110向下流出,故當電子元件2遮蔽於通氣孔110上方的時候,通氣孔110處將因吸力而形成負壓。基座10上另設有例如五組釋例為檢測點的檢測裝置12,在本例中,檢 測裝置12對應於設置於承載裝置11上的各通氣孔110,釋例為檢測點的檢測裝置12在本例中是設置於每一個通氣孔110周遭的一對致能電極用之檢測點。且為便於說明起見,在本例中的待測的電子元件2是例釋為LED元件。As shown in FIG. 2, in the carrier device 11 provided on the susceptor 10, for example, five sets of vent holes 110 are formed, which are respectively connected to the outside via the carrier device 11 and the susceptor 10, and in the present example, the above-mentioned pass The air hole 110 is connected to a group of air pressure increasing and lowering devices 15 for vacuum pumping to generate a negative pressure via a vent pipe (not labeled), thereby forcing air to flow downward from the vent hole 110, so that the electronic component 2 is shielded from the passage. When the air hole 110 is above, a negative pressure is formed at the vent hole 110 due to suction. The base 10 is further provided with, for example, five sets of detecting means 12 for detecting points, in this case, inspecting The measuring device 12 corresponds to each of the vent holes 110 provided on the carrying device 11, and the detecting device 12, which is a detecting point in the present example, is a detecting point for a pair of enabling electrodes disposed around each of the vent holes 110 in this example. For convenience of explanation, the electronic component 2 to be tested in this example is an example of an LED component.
當待測的電子元件2在檢測機台1上進行檢測時,每顆LED元件均置放於承載裝置11之上,且分別對應例如一組通氣孔110,氣壓增減裝置15從通氣孔110將空氣抽出,使電子元件2因空氣吸力而被負壓定位於檢測裝置12上,並與作為致能電極之檢測點的檢測裝置12成對進行電性連接。為降低機台成本,本案的氣壓增減裝置15所需的抽吸效果不必要求達到高真空,僅需達成一般的真空度即可,甚至各以一個通氣孔110對應各待測物,並就此將電子元件2初步定位於檢測裝置12處。When the electronic component 2 to be tested is detected on the detecting machine 1, each LED component is placed on the carrying device 11 and corresponding to, for example, a group of vent holes 110, and the air pressure increasing and decreasing device 15 is vented from the venting hole 110. The air is extracted, and the electronic component 2 is positioned under negative pressure by the air suction on the detecting device 12, and is electrically connected in pairs with the detecting device 12 as a detecting point of the enabling electrode. In order to reduce the cost of the machine, the suction effect required by the air pressure increasing and decreasing device 15 of the present invention does not need to achieve a high vacuum, and only a general vacuum degree is required, and even one vent hole 110 corresponds to each object to be tested, and thus The electronic component 2 is initially positioned at the detecting device 12.
本實施例的遮罩13請一併參考圖3、圖4,在圖式的下方形成有一個開口130,使得遮罩13可以罩蓋在基座10上,並且包覆各釋例為檢測點的檢測裝置12。遮罩13與基座10之間必須保持氣密,使得兩者共同圍繞出一個氣密封閉空間131。在本案中,基座10或遮罩13上設置有加壓孔14,用以注入空氣加壓,在本例中的加壓孔14是形成在遮罩13上,加壓孔14延伸有通氣管,藉以通氣連接至釋例為氣壓源的氣壓增減裝置;藉此,在氣密封閉空間131之施加例如五大氣壓的的正壓。For the mask 13 of the present embodiment, please refer to FIG. 3 and FIG. 4 together. An opening 130 is formed under the drawing, so that the mask 13 can be covered on the base 10, and each cover is covered as a detection point. Detection device 12. The mask 13 and the base 10 must be kept airtight so that they together surround a hermetic closed space 131. In the present case, the base 10 or the cover 13 is provided with a pressurizing hole 14 for injecting air into the air. In this example, the pressurizing hole 14 is formed on the mask 13, and the pressurizing hole 14 is extended. The air pipe is connected to the air pressure increasing and lowering device which is an air pressure source by the ventilating; thereby, a positive pressure of, for example, five atmospheres is applied to the airtight closed space 131.
由於氣密封閉空間131中的壓力達到五大氣壓,將迫使遠本受吸引而定位於檢測位置的電子元件2,更加緊密地貼合至檢測裝置12處,徹底消除兩者之間的間隙,藉以確保致能電源及訊號的傳遞,讓本例中的LED元件被正確接受測試,從而將該待測物之受測後的訊號由檢測裝置12輸出至 外部儀器或顯示設備,避免任何誤判。Since the pressure in the hermetic closed space 131 reaches five atmospheres, the electronic component 2, which is attracted to the remote position and is positioned at the detection position, is more closely attached to the detecting device 12, thereby completely eliminating the gap between the two. Ensure that the power source and signal are transmitted, so that the LED component in this example is correctly tested, so that the measured signal of the object to be tested is output from the detecting device 12 to External instruments or display devices to avoid any false positives.
本發明第二較佳實施例改良上述的遮罩,如圖5所示,更形成有一個透光區132’。使用者可由遮罩13’的外側對內部檢測工作進行確認,省去掀開遮罩13’的動作。由於本發明運作時遮罩13’之內部處於高氣壓的狀態,若掀開遮蓋13’進行檢測,必須先紓壓,確認完畢再重新增壓;不但麻煩且浪費檢測的時間。透過透光區132’之設計,好處在於一來不必紓壓便可立即做確認,二來不須打擾、中斷檢測的進行。當然,熟知本領域技術者可輕易推知,本發明之遮罩13’之透光區132’,不一定限縮在某一部份;也可以是整個遮罩13’皆為透明化之設計。The second preferred embodiment of the present invention improves the above-described mask, and as shown in Fig. 5, a light transmitting region 132' is further formed. The user can confirm the internal detection work from the outside of the mask 13', eliminating the need to open the mask 13'. Since the inside of the mask 13' is in a state of high air pressure during operation of the present invention, if the cover 13' is opened for detection, it must be pressed first, and then re-pressurized after confirmation; not only troublesome but also wastes the time of detection. Through the design of the light-transmissive area 132', the advantage is that the confirmation can be made immediately without having to press the pressure, and the detection is not interrupted or interrupted. Of course, those skilled in the art can easily infer that the transparent region 132' of the mask 13' of the present invention is not necessarily limited to a certain portion; or the entire mask 13' may be transparent.
本發明第三較佳實施例則主要如圖6所示,承載裝置釋包括有一組溫控單元111”,在本例中,是以一組具有導熱接觸點的溫控平台為例,而例如作為待測電子元件2”的CCD在受壓迫緊密貼合檢測裝置12”時,CCD的底部也直接接觸溫控單元111”的一個導熱接點。檢測機台因此可以依照操作者的設計,將待測元件保持在例如攝氏零度的低溫狀態、或例如攝氏六十度的特定溫度,藉以確認待測元件在該種操作溫度下的電氣性質及光電特性,增加檢測機台的應用彈性。The third preferred embodiment of the present invention is mainly shown in FIG. 6. The carrier device includes a set of temperature control units 111". In this example, a set of temperature control platforms having thermal contact points is taken as an example, for example. When the CCD as the electronic component 2" to be tested is pressed against the detecting device 12", the bottom of the CCD also directly contacts a heat conducting contact of the temperature control unit 111". The inspection machine can thus maintain the component to be tested at a low temperature of, for example, zero degrees Celsius, or a specific temperature of, for example, sixty degrees Celsius, in accordance with the operator's design, thereby confirming the electrical properties and photoelectricity of the device under test at the operating temperature. Features, increase the application flexibility of the inspection machine.
當然,熟悉本技術領域的人士可以輕易理解,上述溫控單元亦可更簡化,因此本發明第四較佳實施例如圖7所示,溫控單元是以單純的導熱單元19'''形式設置,在每一組致能電極的檢測點處,均設置有例如導熱性佳的材料或結構設計如金屬墊片,藉此組合成本例中的導熱單元19'''。例如以高亮度LED元件作為待測電子元件2時,在檢測過程中所散發的熱,可輕易藉由導熱材料而直接傳導至散熱鰭片(圖未示),避免操作過程中的高溫 損及待測元件本身、減短其壽命、或導致發光性能劣化。Of course, those skilled in the art can easily understand that the above temperature control unit can be further simplified. Therefore, the fourth preferred embodiment of the present invention is as shown in FIG. 7, and the temperature control unit is provided in the form of a simple heat conduction unit 19''. At the detection points of each set of enabling electrodes, for example, a material having a good thermal conductivity or a structural design such as a metal spacer is provided, thereby combining the heat conducting units 19"' in the cost example. For example, when a high-brightness LED component is used as the electronic component 2 to be tested, heat emitted during the detection process can be easily conducted to the heat dissipation fins (not shown) by the heat conductive material to avoid high temperature during operation. Damage to the component under test itself, shorten its lifetime, or cause degradation of luminescence properties.
此外,如圖8所示,本例中的氣壓增減裝置15'''包括一組壓力計151'''、氣壓源152'''、及一個氣壓閥150''',一方面配合連接至承載裝置11'''上的加壓孔14''',以向氣密封閉空間131'''中輸入空氣而形成正壓,另方面也可導接至形成在承載裝置11'''上的多個通氣孔110'''而形成負壓。其中對應於加壓孔14'''的氣管處,更搭配設置有一調節閥150''',用以控制空氣單向流通,配合壓力計151'''連通於氣密封閉空間131''',藉以在氣密封閉空間131'''內壓力減小時,容許來自氣壓源152'''的氣體持續經過調節閥150'''而補充進入氣密封閉空間131''',以保持其中的正壓在預定範圍。當然,熟知本領域技術者可輕易推知,本發明可完全不提供向下之吸力,其中的氣壓增減裝置15'''僅為一個幫浦,單純向氣密封閉空間131'''中提供正壓。並將通氣孔110'''連通至氣密封閉空間131'''外,就可以使上述通氣孔處相對上述的氣密封閉空間131'''內之正壓形成相對負壓狀態。In addition, as shown in FIG. 8, the air pressure increasing and lowering device 15''' in this example includes a set of pressure gauges 151"', a pneumatic source 152"', and a pneumatic valve 150'''. The pressure hole 14 ′′′ on the carrying device 11 ′′′ is configured to input positive air into the airtight closed space 131 ′′′, and may also be connected to the bearing device 11 ′′′ A plurality of vent holes 110''' are formed to form a negative pressure. Wherein the air pipe corresponding to the pressing hole 14 ′′′ is further provided with a regulating valve 150 ′′′ for controlling the one-way circulation of the air, and the pressure gauge 151 ′′′ is connected to the airtight closed space 131 ′′′ By allowing the gas from the air pressure source 152"' to continue to pass through the regulating valve 150"' to be replenished into the hermetic closed space 131"' to maintain the pressure therein. The positive pressure is within the predetermined range. Of course, those skilled in the art can easily infer that the present invention can provide no downward suction at all, wherein the air pressure increasing and lowering device 15"" is only a pump, and is simply provided in the hermetically sealed space 131"". Positive pressure. And connecting the vent hole 110"' to the outside of the hermetic closed space 131"", the vent hole can be formed in a relatively negative pressure state with respect to the positive pressure in the above-mentioned hermetic closed space 131"".
惟以上所述者,僅本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明書內容所作簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。However, the above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications according to the scope of the present invention and the description of the invention are still It is within the scope of the patent of the present invention.
1‧‧‧檢測機台1‧‧‧Testing machine
10‧‧‧基座10‧‧‧ Pedestal
11、11'''‧‧‧承載裝置11, 11'''‧‧‧ Carrying device
110、110'''‧‧‧通氣孔110, 110'''‧‧‧ Vents
111"‧‧‧溫控單元111"‧‧‧temperature control unit
12、12"‧‧‧檢測裝置12, 12"‧‧‧Detection device
13、13’‧‧‧遮罩13, 13’‧‧‧ mask
130‧‧‧開口130‧‧‧ openings
131、131'''‧‧‧氣密封閉空間131,131'''‧‧‧ ‧ hermetic closed space
132’‧‧‧透光區132'‧‧‧Lighting area
14、14'''‧‧‧加壓孔14, 14'''‧‧‧ Pressurized hole
15、15'''‧‧‧氣壓增減裝置15, 15'''‧‧‧ Air pressure increase and decrease device
150'''‧‧‧調節閥150'''‧‧‧Control Valve
151'''‧‧‧壓力計151'''‧‧‧ Pressure gauge
152'''‧‧‧氣壓源152'''‧‧‧ Air pressure source
19'''‧‧‧導熱單元19'''‧‧‧ Thermal Conductive Unit
2、2”、2'''‧‧‧電子元件2, 2", 2'''‧‧‧ Electronic components
圖1為本發明之檢測機台第一較佳實施例的側視圖;圖2為圖1實施例的基座與承載裝置的剖面側視圖,用以說明負壓定位之運作;圖3為圖1實施例遮罩的立體圖; 圖4為圖1實施例的剖面側視圖,用以說明氣密封閉空間之運作;圖5為本發明第二較佳實施例的剖面側視圖,用以說明遮罩透光區的結構關係;圖6為本發明第三較佳實施例的側視圖,用以說明溫控單元;圖7為本發明第四較佳實施例的側視圖,用以說明導熱單元之運作;圖8係圖7實施例的氣壓輸入控制裝置之示意圖。1 is a side elevational view of a first preferred embodiment of the testing machine of the present invention; FIG. 2 is a cross-sectional side view of the base and the carrying device of the embodiment of FIG. 1 for illustrating the operation of negative pressure positioning; FIG. 1 is a perspective view of a mask; Figure 4 is a cross-sectional side view of the embodiment of Figure 1 for illustrating the operation of the hermetic closed space; Figure 5 is a cross-sectional side view of the second preferred embodiment of the present invention for illustrating the structural relationship of the transparent region of the mask; Figure 6 is a side elevational view of a third preferred embodiment of the present invention for explaining a temperature control unit; Figure 7 is a side elevational view of the fourth preferred embodiment of the present invention for explaining the operation of the heat conducting unit; Figure 8 is Figure 7 A schematic diagram of a pneumatic input control device of an embodiment.
1‧‧‧檢測機台1‧‧‧Testing machine
12‧‧‧檢測裝置12‧‧‧Detection device
131‧‧‧氣密封閉空間131‧‧‧Seal sealed space
13‧‧‧遮罩13‧‧‧ mask
10‧‧‧基座10‧‧‧ Pedestal
11‧‧‧承載裝置11‧‧‧ Carrying device
Claims (9)
Priority Applications (1)
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TW101100343A TWI511230B (en) | 2012-01-04 | 2012-01-04 | A detection machine with a mask |
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TW101100343A TWI511230B (en) | 2012-01-04 | 2012-01-04 | A detection machine with a mask |
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TWI511230B true TWI511230B (en) | 2015-12-01 |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US20010035953A1 (en) * | 2000-05-01 | 2001-11-01 | Masaya Morita | Fluid dispenser and lens inspection device |
US20030224539A1 (en) * | 2002-04-03 | 2003-12-04 | Klaus Breitschwerdt | Method for etching a semiconductor element, its use for etching end point detection and a device for carrying it out |
US20050083496A1 (en) * | 2003-08-29 | 2005-04-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010035953A1 (en) * | 2000-05-01 | 2001-11-01 | Masaya Morita | Fluid dispenser and lens inspection device |
US20030224539A1 (en) * | 2002-04-03 | 2003-12-04 | Klaus Breitschwerdt | Method for etching a semiconductor element, its use for etching end point detection and a device for carrying it out |
US20050083496A1 (en) * | 2003-08-29 | 2005-04-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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