TWI509253B - 探針台 - Google Patents

探針台 Download PDF

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Publication number
TWI509253B
TWI509253B TW100113859A TW100113859A TWI509253B TW I509253 B TWI509253 B TW I509253B TW 100113859 A TW100113859 A TW 100113859A TW 100113859 A TW100113859 A TW 100113859A TW I509253 B TWI509253 B TW I509253B
Authority
TW
Taiwan
Prior art keywords
dry gas
cooling
heater
fixture
probe station
Prior art date
Application number
TW100113859A
Other languages
English (en)
Chinese (zh)
Other versions
TW201243340A (en
Inventor
Si Yong Choi
Ki Uk Choi
Woo Yeol Kim
Original Assignee
Semes Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semes Co Ltd filed Critical Semes Co Ltd
Publication of TW201243340A publication Critical patent/TW201243340A/zh
Application granted granted Critical
Publication of TWI509253B publication Critical patent/TWI509253B/zh

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2601Apparatus or methods therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW100113859A 2011-04-18 2011-04-21 探針台 TWI509253B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110035699A KR101227718B1 (ko) 2011-04-18 2011-04-18 프로브 스테이션

Publications (2)

Publication Number Publication Date
TW201243340A TW201243340A (en) 2012-11-01
TWI509253B true TWI509253B (zh) 2015-11-21

Family

ID=47285765

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100113859A TWI509253B (zh) 2011-04-18 2011-04-21 探針台

Country Status (2)

Country Link
KR (1) KR101227718B1 (ko)
TW (1) TWI509253B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101634452B1 (ko) * 2014-10-24 2016-06-29 세메스 주식회사 프로브 카드를 이용한 웨이퍼 검사용 척 구조물
KR102012797B1 (ko) * 2018-03-05 2019-08-21 주식회사 쎄믹스 열풍을 이용한 프로브 카드 예열이 가능한 웨이퍼 프로버
CN111106040B (zh) * 2019-12-06 2022-06-10 福建省福联集成电路有限公司 精准控制金属下沉的设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200949990A (en) * 2008-03-25 2009-12-01 Applied Materials Inc Temperature measurement and control of wafer support in thermal processing chamber
KR20100071241A (ko) * 2008-12-19 2010-06-29 세크론 주식회사 프로브 스테이션용 스테이지 유닛 및 이를 포함하는 웨이퍼검사 장치
TW201030172A (en) * 2008-09-30 2010-08-16 Tokyo Electron Ltd Method for depositing silicon nitride film, computer-readable storage medium, and plasma cvd device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101013520B1 (ko) * 2010-11-24 2011-02-10 주식회사 넥스트솔루션 테스트 핸들러 챔버 급속온도 제어장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200949990A (en) * 2008-03-25 2009-12-01 Applied Materials Inc Temperature measurement and control of wafer support in thermal processing chamber
TW201030172A (en) * 2008-09-30 2010-08-16 Tokyo Electron Ltd Method for depositing silicon nitride film, computer-readable storage medium, and plasma cvd device
KR20100071241A (ko) * 2008-12-19 2010-06-29 세크론 주식회사 프로브 스테이션용 스테이지 유닛 및 이를 포함하는 웨이퍼검사 장치

Also Published As

Publication number Publication date
TW201243340A (en) 2012-11-01
KR20120118241A (ko) 2012-10-26
KR101227718B1 (ko) 2013-01-29

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