TWI509253B - 探針台 - Google Patents
探針台 Download PDFInfo
- Publication number
- TWI509253B TWI509253B TW100113859A TW100113859A TWI509253B TW I509253 B TWI509253 B TW I509253B TW 100113859 A TW100113859 A TW 100113859A TW 100113859 A TW100113859 A TW 100113859A TW I509253 B TWI509253 B TW I509253B
- Authority
- TW
- Taiwan
- Prior art keywords
- dry gas
- cooling
- heater
- fixture
- probe station
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110035699A KR101227718B1 (ko) | 2011-04-18 | 2011-04-18 | 프로브 스테이션 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201243340A TW201243340A (en) | 2012-11-01 |
TWI509253B true TWI509253B (zh) | 2015-11-21 |
Family
ID=47285765
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100113859A TWI509253B (zh) | 2011-04-18 | 2011-04-21 | 探針台 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101227718B1 (ko) |
TW (1) | TWI509253B (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101634452B1 (ko) * | 2014-10-24 | 2016-06-29 | 세메스 주식회사 | 프로브 카드를 이용한 웨이퍼 검사용 척 구조물 |
KR102012797B1 (ko) * | 2018-03-05 | 2019-08-21 | 주식회사 쎄믹스 | 열풍을 이용한 프로브 카드 예열이 가능한 웨이퍼 프로버 |
CN111106040B (zh) * | 2019-12-06 | 2022-06-10 | 福建省福联集成电路有限公司 | 精准控制金属下沉的设备 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200949990A (en) * | 2008-03-25 | 2009-12-01 | Applied Materials Inc | Temperature measurement and control of wafer support in thermal processing chamber |
KR20100071241A (ko) * | 2008-12-19 | 2010-06-29 | 세크론 주식회사 | 프로브 스테이션용 스테이지 유닛 및 이를 포함하는 웨이퍼검사 장치 |
TW201030172A (en) * | 2008-09-30 | 2010-08-16 | Tokyo Electron Ltd | Method for depositing silicon nitride film, computer-readable storage medium, and plasma cvd device |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101013520B1 (ko) * | 2010-11-24 | 2011-02-10 | 주식회사 넥스트솔루션 | 테스트 핸들러 챔버 급속온도 제어장치 |
-
2011
- 2011-04-18 KR KR1020110035699A patent/KR101227718B1/ko active IP Right Grant
- 2011-04-21 TW TW100113859A patent/TWI509253B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200949990A (en) * | 2008-03-25 | 2009-12-01 | Applied Materials Inc | Temperature measurement and control of wafer support in thermal processing chamber |
TW201030172A (en) * | 2008-09-30 | 2010-08-16 | Tokyo Electron Ltd | Method for depositing silicon nitride film, computer-readable storage medium, and plasma cvd device |
KR20100071241A (ko) * | 2008-12-19 | 2010-06-29 | 세크론 주식회사 | 프로브 스테이션용 스테이지 유닛 및 이를 포함하는 웨이퍼검사 장치 |
Also Published As
Publication number | Publication date |
---|---|
TW201243340A (en) | 2012-11-01 |
KR20120118241A (ko) | 2012-10-26 |
KR101227718B1 (ko) | 2013-01-29 |
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