TWI509090B - Copper alloy plate, and with its high current with electronic components and thermal electronic components - Google Patents

Copper alloy plate, and with its high current with electronic components and thermal electronic components Download PDF

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Publication number
TWI509090B
TWI509090B TW103125661A TW103125661A TWI509090B TW I509090 B TWI509090 B TW I509090B TW 103125661 A TW103125661 A TW 103125661A TW 103125661 A TW103125661 A TW 103125661A TW I509090 B TWI509090 B TW I509090B
Authority
TW
Taiwan
Prior art keywords
copper alloy
mass
annealing
electronic components
rolling
Prior art date
Application number
TW103125661A
Other languages
English (en)
Chinese (zh)
Other versions
TW201512429A (zh
Inventor
Akihiro Kakitani
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW201512429A publication Critical patent/TW201512429A/zh
Application granted granted Critical
Publication of TWI509090B publication Critical patent/TWI509090B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
TW103125661A 2013-09-25 2014-07-28 Copper alloy plate, and with its high current with electronic components and thermal electronic components TWI509090B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013199026A JP5470499B1 (ja) 2013-09-25 2013-09-25 銅合金板、並びに、それを備える大電流用電子部品及び放熱用電子部品

Publications (2)

Publication Number Publication Date
TW201512429A TW201512429A (zh) 2015-04-01
TWI509090B true TWI509090B (zh) 2015-11-21

Family

ID=50749768

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103125661A TWI509090B (zh) 2013-09-25 2014-07-28 Copper alloy plate, and with its high current with electronic components and thermal electronic components

Country Status (4)

Country Link
JP (1) JP5470499B1 (ja)
KR (1) KR101613357B1 (ja)
CN (1) CN104451241B (ja)
TW (1) TWI509090B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105088010B (zh) * 2015-08-31 2017-08-25 河南科技大学 一种高强高导稀土铜锆合金及其制备方法
JP2017057476A (ja) 2015-09-18 2017-03-23 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法
TW202035722A (zh) * 2019-03-25 2020-10-01 日商Ｊｘ金屬股份有限公司 銅合金板、通電用電子零件及散熱用電子零件

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200422410A (en) * 2002-09-13 2004-11-01 Olin Corp Age-hardening copper-base alloy and processing
JP2010248592A (ja) * 2009-04-17 2010-11-04 Hitachi Cable Ltd 銅合金の製造方法及び銅合金

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5370840A (en) * 1992-11-04 1994-12-06 Olin Corporation Copper alloy having high strength and high electrical conductivity
CN100345988C (zh) * 2005-12-13 2007-10-31 江苏科技大学 高强度铜合金导电丝材及生产方法
JP4157899B2 (ja) * 2006-11-17 2008-10-01 株式会社神戸製鋼所 曲げ加工性に優れた高強度銅合金板
CN101956094B (zh) * 2010-10-15 2011-11-30 哈尔滨工业大学深圳研究生院 一种高强高导弥散强化铜合金的制备方法
JP6222885B2 (ja) * 2011-11-10 2017-11-01 Ｊｘ金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金
JP2013117060A (ja) * 2011-12-05 2013-06-13 Jx Nippon Mining & Metals Corp 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系合金

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200422410A (en) * 2002-09-13 2004-11-01 Olin Corp Age-hardening copper-base alloy and processing
JP2010248592A (ja) * 2009-04-17 2010-11-04 Hitachi Cable Ltd 銅合金の製造方法及び銅合金

Also Published As

Publication number Publication date
CN104451241B (zh) 2017-06-20
JP5470499B1 (ja) 2014-04-16
KR101613357B1 (ko) 2016-04-18
JP2015063741A (ja) 2015-04-09
CN104451241A (zh) 2015-03-25
TW201512429A (zh) 2015-04-01
KR20150034078A (ko) 2015-04-02

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