TWI504010B - 在矽晶圓的前側上形成柵極電極之方法 - Google Patents

在矽晶圓的前側上形成柵極電極之方法 Download PDF

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Publication number
TWI504010B
TWI504010B TW099116178A TW99116178A TWI504010B TW I504010 B TWI504010 B TW I504010B TW 099116178 A TW099116178 A TW 099116178A TW 99116178 A TW99116178 A TW 99116178A TW I504010 B TWI504010 B TW I504010B
Authority
TW
Taiwan
Prior art keywords
metal paste
inorganic
silver
glass frit
paste
Prior art date
Application number
TW099116178A
Other languages
English (en)
Chinese (zh)
Other versions
TW201110397A (en
Inventor
David Kent Anderson
Russell David Anderson
Kenneth Warren Hang
Shih Ming Kao
Giovanna Laudisio
Cheng Nan Lin
Chun Kwei Wu
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of TW201110397A publication Critical patent/TW201110397A/zh
Application granted granted Critical
Publication of TWI504010B publication Critical patent/TWI504010B/zh

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F10/00Individual photovoltaic cells, e.g. solar cells
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/20Electrodes
    • H10F77/206Electrodes for devices having potential barriers
    • H10F77/211Electrodes for devices having potential barriers for photovoltaic cells
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02Frit compositions, i.e. in a powdered or comminuted form
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/10Frit compositions, i.e. in a powdered or comminuted form containing lead
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14Conductive material dispersed in non-conductive inorganic material
    • H01B1/16Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/20Electrodes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Photovoltaic Devices (AREA)
TW099116178A 2009-05-20 2010-05-20 在矽晶圓的前側上形成柵極電極之方法 TWI504010B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17989109P 2009-05-20 2009-05-20

Publications (2)

Publication Number Publication Date
TW201110397A TW201110397A (en) 2011-03-16
TWI504010B true TWI504010B (zh) 2015-10-11

Family

ID=42271962

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099116178A TWI504010B (zh) 2009-05-20 2010-05-20 在矽晶圓的前側上形成柵極電極之方法

Country Status (7)

Country Link
US (1) US8372679B2 (enExample)
EP (1) EP2433306A1 (enExample)
JP (1) JP2012527782A (enExample)
KR (1) KR101322142B1 (enExample)
CN (1) CN102428568A (enExample)
TW (1) TWI504010B (enExample)
WO (1) WO2010135535A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201044414A (en) * 2009-03-30 2010-12-16 Du Pont Metal pastes and use thereof in the production of silicon solar cells
CN102479883A (zh) * 2009-11-27 2012-05-30 无锡尚德太阳能电力有限公司 太阳电池正面电极的形成方法
US20110240124A1 (en) * 2010-03-30 2011-10-06 E.I. Du Pont De Nemours And Company Metal pastes and use thereof in the production of silicon solar cells
CN102947942B (zh) * 2010-06-18 2015-12-16 弗劳恩霍弗实用研究促进协会 制造光伏太阳能电池的金属接触结构的方法
CN102655030B (zh) * 2011-03-02 2015-07-15 韩国电子通信研究院 导电组合物、含其的硅太阳能电池、及其制造方法
US20130061918A1 (en) * 2011-03-03 2013-03-14 E. I. Dupont De Nemours And Company Process for the formation of a silver back electrode of a passivated emitter and rear contact silicon solar cell
KR101103501B1 (ko) * 2011-05-30 2012-01-09 한화케미칼 주식회사 태양전지 및 이의 제조방법
DE102011056632A1 (de) 2011-12-19 2013-06-20 Schott Solar Ag Verfahren zum Ausbilden einer Frontseitenmetallisierung einer Solarzelle sowie Solarzelle
WO2013105750A1 (ko) * 2012-01-10 2013-07-18 주식회사 젠스엔지니어링 전도성 페이스트를 전극으로 사용하는 실리콘 태양전지 모듈 및 그 제조 방법
KR101363344B1 (ko) 2012-01-10 2014-02-19 주식회사 젠스엔지니어링 전도성 페이스트를 전극으로 사용하는 실리콘 태양전지 모듈 및 그 제조 방법.
US20130183795A1 (en) * 2012-01-16 2013-07-18 E I Du Pont De Nemours And Company Solar cell back side electrode
JP5977540B2 (ja) * 2012-03-05 2016-08-24 シャープ株式会社 太陽電池の製造方法、製造装置及び太陽電池
JP6219913B2 (ja) * 2014-11-28 2017-10-25 エルジー エレクトロニクス インコーポレイティド 太陽電池及びその製造方法
CN112002772B (zh) * 2020-08-28 2022-03-08 晶科能源股份有限公司 太阳能电池栅线结构和光伏组件
CN114628252B (zh) * 2022-03-09 2024-10-25 通威太阳能(安徽)有限公司 硅片的碱抛光方法、perc电池及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009041182A1 (ja) * 2007-09-27 2009-04-02 Murata Manufacturing Co., Ltd. Ag電極ペースト、太陽電池セルおよびその製造方法

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DE68918565T2 (de) * 1988-06-10 1995-03-09 Mobil Solar Energy Corp Verfahren zur herstellung von sonnenzellenkontakten.
JP2744847B2 (ja) * 1991-06-11 1998-04-28 エイエスイー・アメリカス・インコーポレーテッド 改良された太陽電池及びその製造方法
US5178685A (en) * 1991-06-11 1993-01-12 Mobil Solar Energy Corporation Method for forming solar cell contacts and interconnecting solar cells
JP4121928B2 (ja) * 2003-10-08 2008-07-23 シャープ株式会社 太陽電池の製造方法
US7462304B2 (en) * 2005-04-14 2008-12-09 E.I. Du Pont De Nemours And Company Conductive compositions used in the manufacture of semiconductor device
ES2611937T3 (es) * 2006-08-31 2017-05-11 Shin-Etsu Handotai Co., Ltd. Sustrato semiconductor, procedimiento de formación de electrodo, y procedimiento de fabricación de célula solar
EP2104147B1 (en) * 2006-12-26 2015-04-15 Kyocera Corporation Solar cell element and solar cell element manufacturing method
CN102593243A (zh) * 2007-08-31 2012-07-18 费罗公司 用于太阳能电池的分层触点结构
US8759144B2 (en) 2007-11-02 2014-06-24 Alliance For Sustainable Energy, Llc Fabrication of contacts for silicon solar cells including printing burn through layers

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009041182A1 (ja) * 2007-09-27 2009-04-02 Murata Manufacturing Co., Ltd. Ag電極ペースト、太陽電池セルおよびその製造方法

Also Published As

Publication number Publication date
KR20120014211A (ko) 2012-02-16
US8372679B2 (en) 2013-02-12
TW201110397A (en) 2011-03-16
JP2012527782A (ja) 2012-11-08
US20100294361A1 (en) 2010-11-25
KR101322142B1 (ko) 2013-10-28
CN102428568A (zh) 2012-04-25
EP2433306A1 (en) 2012-03-28
WO2010135535A1 (en) 2010-11-25

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