TWI499771B - System and Method for Semiconductor Packaging Detection - Google Patents

System and Method for Semiconductor Packaging Detection Download PDF

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Publication number
TWI499771B
TWI499771B TW098120780A TW98120780A TWI499771B TW I499771 B TWI499771 B TW I499771B TW 098120780 A TW098120780 A TW 098120780A TW 98120780 A TW98120780 A TW 98120780A TW I499771 B TWI499771 B TW I499771B
Authority
TW
Taiwan
Prior art keywords
image
semiconductor device
light
plane
reflective
Prior art date
Application number
TW098120780A
Other languages
English (en)
Chinese (zh)
Other versions
TW201005285A (en
Inventor
Ajharali Amanullah
Han-Cheng Ge
Lee Kwang Heng
Archwamety Albert
Original Assignee
Semiconductor Tech & Instr Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Tech & Instr Inc filed Critical Semiconductor Tech & Instr Inc
Publication of TW201005285A publication Critical patent/TW201005285A/zh
Application granted granted Critical
Publication of TWI499771B publication Critical patent/TWI499771B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW098120780A 2008-06-23 2009-06-22 System and Method for Semiconductor Packaging Detection TWI499771B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200804752-4A SG157977A1 (en) 2008-06-23 2008-06-23 System and method for inspection of semiconductor packages

Publications (2)

Publication Number Publication Date
TW201005285A TW201005285A (en) 2010-02-01
TWI499771B true TWI499771B (zh) 2015-09-11

Family

ID=41509581

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098120780A TWI499771B (zh) 2008-06-23 2009-06-22 System and Method for Semiconductor Packaging Detection

Country Status (6)

Country Link
KR (1) KR101698006B1 (ko)
CN (1) CN101672802B (ko)
CH (1) CH699122B1 (ko)
MY (1) MY148191A (ko)
SG (1) SG157977A1 (ko)
TW (1) TWI499771B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102192909A (zh) * 2010-03-12 2011-09-21 深圳市先阳软件技术有限公司 一种电池极片的激光切割质量检测系统
JP6491425B2 (ja) * 2014-05-21 2019-03-27 Ｔｏｗａ株式会社 電子部品パッケージ側面撮影装置
KR20180010492A (ko) * 2016-07-21 2018-01-31 (주)제이티 비전검사모듈 및 그를 가지는 소자핸들러
CN107677678A (zh) * 2017-09-20 2018-02-09 广州视源电子科技股份有限公司 基于自动路径规划的外观检测方法和装置
CN107688029A (zh) * 2017-09-20 2018-02-13 广州视源电子科技股份有限公司 外观检测方法和装置
CN109100366A (zh) * 2018-08-10 2018-12-28 武汉盛为芯科技有限公司 半导体激光器芯片端面外观的检测系统及方法
KR102350544B1 (ko) * 2020-10-14 2022-01-17 주식회사 지엠지 반도체 패키징 검사공정용 광학모듈
WO2024128766A1 (ko) * 2022-12-12 2024-06-20 주식회사 엘지에너지솔루션 배터리 검사 장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6567161B1 (en) * 2000-11-28 2003-05-20 Asti Holdings Limited Three dimensional lead inspection system
US7315364B2 (en) * 2004-10-25 2008-01-01 Applied Materials, Israel, Ltd. System for inspecting a surface employing configurable multi angle illumination modes

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1273224A (en) * 1985-03-14 1990-08-28 Timothy R. Pryor Panel surface flaw inspection
DE3712513A1 (de) * 1987-04-13 1988-11-03 Roth Electric Gmbh Verfahren und vorrichtung zur erkennung von oberflaechenfehlern
IL99823A0 (en) * 1990-11-16 1992-08-18 Orbot Instr Ltd Optical inspection method and apparatus
DE10122917A1 (de) * 2001-05-11 2002-11-14 Byk Gardner Gmbh Vorrichtung und Verfahren zur Bestimmung der Eigenschaften von reflektierenden Körpern
US20030086083A1 (en) * 2001-11-01 2003-05-08 Martin Ebert Optical metrology tool with dual camera path for simultaneous high and low magnification imaging
JP3789097B2 (ja) * 2002-02-21 2006-06-21 光洋機械工業株式会社 被検査物の外周検査方法および外周検査装置
US6809808B2 (en) * 2002-03-22 2004-10-26 Applied Materials, Inc. Wafer defect detection system with traveling lens multi-beam scanner

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6567161B1 (en) * 2000-11-28 2003-05-20 Asti Holdings Limited Three dimensional lead inspection system
US7315364B2 (en) * 2004-10-25 2008-01-01 Applied Materials, Israel, Ltd. System for inspecting a surface employing configurable multi angle illumination modes

Also Published As

Publication number Publication date
CH699122B1 (fr) 2015-05-15
CH699122A2 (fr) 2010-01-15
TW201005285A (en) 2010-02-01
CN101672802B (zh) 2014-07-16
CN101672802A (zh) 2010-03-17
MY148191A (en) 2013-03-15
KR101698006B1 (ko) 2017-02-01
KR20090133097A (ko) 2009-12-31
SG157977A1 (en) 2010-01-29

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