MY148191A - System and method for inspection of semiconductor packages - Google Patents
System and method for inspection of semiconductor packagesInfo
- Publication number
- MY148191A MY148191A MYPI20092564A MYPI20092564A MY148191A MY 148191 A MY148191 A MY 148191A MY PI20092564 A MYPI20092564 A MY PI20092564A MY PI20092564 A MYPI20092564 A MY PI20092564A MY 148191 A MY148191 A MY 148191A
- Authority
- MY
- Malaysia
- Prior art keywords
- camera
- semiconductor package
- inspection
- semiconductor packages
- assembly
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SG200804752-4A SG157977A1 (en) | 2008-06-23 | 2008-06-23 | System and method for inspection of semiconductor packages |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY148191A true MY148191A (en) | 2013-03-15 |
Family
ID=41509581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI20092564A MY148191A (en) | 2008-06-23 | 2009-06-19 | System and method for inspection of semiconductor packages |
Country Status (6)
| Country | Link |
|---|---|
| KR (1) | KR101698006B1 (ko) |
| CN (1) | CN101672802B (ko) |
| CH (1) | CH699122B1 (ko) |
| MY (1) | MY148191A (ko) |
| SG (1) | SG157977A1 (ko) |
| TW (1) | TWI499771B (ko) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102192909A (zh) * | 2010-03-12 | 2011-09-21 | 深圳市先阳软件技术有限公司 | 一种电池极片的激光切割质量检测系统 |
| JP6491425B2 (ja) * | 2014-05-21 | 2019-03-27 | Ｔｏｗａ株式会社 | 電子部品パッケージ側面撮影装置 |
| KR20180010492A (ko) * | 2016-07-21 | 2018-01-31 | (주)제이티 | 비전검사모듈 및 그를 가지는 소자핸들러 |
| CN107688029A (zh) * | 2017-09-20 | 2018-02-13 | 广州视源电子科技股份有限公司 | 外观检测方法和装置 |
| CN107677678A (zh) * | 2017-09-20 | 2018-02-09 | 广州视源电子科技股份有限公司 | 基于自动路径规划的外观检测方法和装置 |
| CN109100366A (zh) * | 2018-08-10 | 2018-12-28 | 武汉盛为芯科技有限公司 | 半导体激光器芯片端面外观的检测系统及方法 |
| CN110806410A (zh) * | 2019-12-09 | 2020-02-18 | 泉州师范学院 | 对半导体晶粒天面与侧面同时进行检测的光学装置及方法 |
| KR102350544B1 (ko) * | 2020-10-14 | 2022-01-17 | 주식회사 지엠지 | 반도체 패키징 검사공정용 광학모듈 |
| WO2024128766A1 (ko) * | 2022-12-12 | 2024-06-20 | 주식회사 엘지에너지솔루션 | 배터리 검사 장치 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1273224A (en) * | 1985-03-14 | 1990-08-28 | Timothy R. Pryor | Panel surface flaw inspection |
| DE3712513A1 (de) * | 1987-04-13 | 1988-11-03 | Roth Electric Gmbh | Verfahren und vorrichtung zur erkennung von oberflaechenfehlern |
| IL99823A0 (en) * | 1990-11-16 | 1992-08-18 | Orbot Instr Ltd | Optical inspection method and apparatus |
| US6567161B1 (en) * | 2000-11-28 | 2003-05-20 | Asti Holdings Limited | Three dimensional lead inspection system |
| DE10122917A1 (de) | 2001-05-11 | 2002-11-14 | Byk Gardner Gmbh | Vorrichtung und Verfahren zur Bestimmung der Eigenschaften von reflektierenden Körpern |
| US20030086083A1 (en) * | 2001-11-01 | 2003-05-08 | Martin Ebert | Optical metrology tool with dual camera path for simultaneous high and low magnification imaging |
| JP3789097B2 (ja) | 2002-02-21 | 2006-06-21 | 光洋機械工業株式会社 | 被検査物の外周検査方法および外周検査装置 |
| US6809808B2 (en) * | 2002-03-22 | 2004-10-26 | Applied Materials, Inc. | Wafer defect detection system with traveling lens multi-beam scanner |
| US7315364B2 (en) * | 2004-10-25 | 2008-01-01 | Applied Materials, Israel, Ltd. | System for inspecting a surface employing configurable multi angle illumination modes |
-
2008
- 2008-06-23 SG SG200804752-4A patent/SG157977A1/en unknown
-
2009
- 2009-06-19 CH CH00963/09A patent/CH699122B1/fr not_active Application Discontinuation
- 2009-06-19 MY MYPI20092564A patent/MY148191A/en unknown
- 2009-06-22 TW TW098120780A patent/TWI499771B/zh active
- 2009-06-23 KR KR1020090055915A patent/KR101698006B1/ko active IP Right Grant
- 2009-06-23 CN CN200910205728.7A patent/CN101672802B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI499771B (zh) | 2015-09-11 |
| CN101672802A (zh) | 2010-03-17 |
| KR101698006B1 (ko) | 2017-02-01 |
| KR20090133097A (ko) | 2009-12-31 |
| SG157977A1 (en) | 2010-01-29 |
| CN101672802B (zh) | 2014-07-16 |
| TW201005285A (en) | 2010-02-01 |
| CH699122B1 (fr) | 2015-05-15 |
| CH699122A2 (fr) | 2010-01-15 |
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