TWI499617B - Photoresist polyimide composition, the main agent, the preparation of its main agent and the preparation of polyimide solder film - Google Patents

Description

Photosensitive polyimine composition, main component thereof, preparation method thereof and polyimine solder resist film obtained thereby

The present invention relates to a photo-sensitive polyimide composition, and more particularly to a photo-sensitive polyimide composition suitable for use in a flexible circuit board. The present invention further relates to a main component of the photo-sensitive polyimide composition and a process for producing the same. The present invention is also directed to a polyimide film solder mask made of the photo-sensitive polyimide composition.

A film made of an epoxy resin-based photo-sensitive solder resist composition for general flexible circuit boards is difficult to apply to high-density circuits due to defects such as solder resistance, mechanical strength, and insufficient flame resistance. Flexible circuit board.

Taiwan Patent Publication No. I320514 provides a negative-type photo-sensitive composition, except that the photo-sensitive film made of the negative-type photo-sensitive composition requires a higher hard-bake temperature (about 230 ° C) in addition to An ethanol solution containing tetramethylazanium hydroxide (TMAH) is used as a developer, but an ethanol solution containing tetramethylammonium hydroxide is not a developer used in current circuit board processes. After the development, the thickness of the photo-sensitive film made of the negative-type photo-sensitive composition is only 3 μm, which is not suitable as a solder mask for the circuit board.

Taiwan Patent Publication No. I320514 provides a negative light Resist composition, except that the film made of the negative photoresist composition has a disadvantage of being difficult to develop in addition to a high hard baking temperature (about 230 ° C) (development conditions: ethanol containing TMAH) After the solution was developed for 90 seconds, it was rinsed again with ethanol for 30 seconds). Further, the film made of the negative photoresist composition requires a high exposure energy (1000 mJ/cm 2 ); and after development, the film is made of the negative photoresist composition. It has a high dielectric constant and dielectric loss, and is difficult to apply to a flexible circuit board of a high-density circuit.

Taiwan Patent Publication No. I374158 provides a photosensitive polyimine which is a photosensitive polyimide, but does not mention the relevant development conditions and electrical properties, heat resistance, flexibility and chemical resistance. The nature, and according to its content, it should be a film body, and it needs to be pressed on the circuit board by a bonding machine during use, which has the problems of poor bonding and storage stability.

Therefore, the prior art has not provided a photo-sensitive composition capable of producing a film having both a low-baked temperature, a low exposure energy, and a film suitable for a weakly alkaline developer, and it is difficult to avoid oxidation of the line, shorten the process time, and protect the environment; The developed film of the technology has high dielectric constant, high dielectric loss and poor flame resistance, solder resistance and mechanical properties, so the prior art photo-sensing composition and the film produced thereof have not been able to conform to the film. The need for flexible boards for high density circuits.

In view of the above disadvantages of the prior art, it is an object of the present invention to provide a photo-sensitive polyimide composition, a main component thereof, a process for preparing the same, and a polyimide film which is obtained by the present invention.

In order to achieve the above object of the invention, the technical means adopted by the present invention is a method for preparing a main component of the photo-sensitive polyimide composition, The step comprises: reacting a long carbon chain aliphatic diamine monomer, another diamine monomer, a mono-anhydride monomer, and a monoanhydride monomer in an aprotic solvent to obtain a poly-proline acid; Amidizing the polyamic acid to obtain a solution of a polyimine containing a soluble polyimine; and grafting a grafting monomer onto the soluble polyimide of the polyimine solution to obtain the The main component of the photo-sensitive polyimide composition; wherein the two ends of the main carbon chain of the grafting monomer have a double bond and an epoxy group, respectively.

According to the preparation method of the main agent of the present invention, the long carbon chain aliphatic diamine monomer may be an aliphatic carbon having a main carbon chain of 6 to 40 carbon atoms such as hexamethylenediamine, octanediamine, decanediamine or decanediamine. Amine monomer.

According to the preparation method of the main agent of the present invention, the step of grafting the grafting monomer on the soluble polyimine of the polyimine solution to obtain the main component of the photo-sensitive polyimide composition further comprises: grafting the Grafting a monomer onto the soluble polyimine of the polyimine solution to obtain a solution containing the modified soluble polyimine; and mixing the solution containing the modified soluble polyimine with a solution A crosslinking agent to obtain a main component of the photo-sensitive polyimide composition.

By the use of the crosslinking agent, crosslinking of the main agent hardening agent of the photo-sensitive polyimide composition after exposure to ultraviolet light can be increased, so that the exposed region is not easily dissolved by the developer.

Preferably, the modified soluble polyimine containing the modified one is mixed And a solution of the crosslinking agent to obtain a main component of the photo-sensitive polyimide composition, the crosslinking agent is selected from the group consisting of trimethylolpropane trimethacrylate Trimethylolpropane triacrylate monomer, pentaerythritol triacrylate, 1,6-Hexanediol diacrylate, dipentylerythritol hexaacrylate, bile Tri(propylene glycol diacrylate) and combinations thereof.

Preferably, the modified soluble polyfluorene is mixed in the step of mixing the solution containing the modified soluble polyimine with the crosslinking agent to obtain a main component of the photo-sensitive polyimide composition. The weight of the cross-linking is between 10 and 40 weight units based on the weight of the imine.

According to the preparation method of the main agent of the present invention, in the step of grafting the grafting monomer on the soluble polyimine of the polyimine solution to obtain the main component of the photo-sensitive polyimide composition, the grafting The single system is selected from the group consisting of glycidyl methacrylate, allyl glycidyl ether, and combinations thereof.

According to the preparation method of the main agent of the present invention, in the step of grafting the grafting monomer on the soluble polyimine of the polyimine solution to obtain the main component of the photo-sensitive polyimide composition, The weight of the grafted monomer is between 5 and 15 weight units based on the weight of the soluble polyimine contained in the polyimide solution.

According to the preparation method of the main agent of the present invention, the long carbon chain aliphatic diamine monomer, the other diamine monomer, the dianhydride monomer and the monoanhydride In the step of reacting in the aprotic solvent to obtain the poly-proline, the other diamine monosystem is selected from the group consisting of: metelene bis (anthranilic) Acid)), 3,5-diaminobenzoic acid, 1,3-bis(3-aminophenoxyl)benzene, 4 , 4'-diaminodiphenyl ether (4,4'-oxydianiline), 2,2'-bis[4-(4-aminophenoxyphenyl)]propane (2,2-bis[4-(4 -aminophenoxy)phenyl]propane), 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane, 2,2'- Bis(difluoromethyl)benzidine and combinations thereof; the dianhydride monosystem is selected from the group consisting of 4,4'-oxygen 4,4'-oxydiphthalic dianhydride, 3,3',4,4'-benzophenone tetracarboxylic dianhydride, 3 , 3',4,4'-biphenyltetracarboxylic dianhydride, bicyclo[2.2.2]oct-7-ene-2,3,5,6 -tetracarboxylic dianhydride (bicyclo[2.2.2]oct-7-ene- 2,3,5,6-tetracarboxylic acid dianhydride), 4,4'-(hexafluoroisopropylidene) diphthalic anhydride, and combinations thereof. The monoanhydride single system comprises 1,2,4-benzenetricarboxylic anhydride; the aprotic solvent is selected from the group consisting of N-methylpyrrolidone (n- Methyl-2-pyrrolidone), dimethylacetamide, dimethylformamide (dimethylformamide), dimethyl sulfoxide, 1,4-butyrolactone, and combinations thereof.

According to the preparation method of the main agent of the present invention, the long carbon chain aliphatic diamine monomer, the other diamine monomer, the dianhydride monomer and the monoanhydride monomer are reacted in the aprotic solvent. In the step of polylysine, the total number of moles of the long carbon chain aliphatic diamine monomer and the other diamine monomer is based on the total amount of the dianhydride monomer and the monoanhydride monomer. 0.85 to 0.95 m.

In order to achieve the above object, the technical means adopted by the present invention is a main component of the photo-sensitive polyimide composition, which is a main component of the photo-sensitive polyimide composition as described above. Made by.

According to the main agent of the present invention, the solid content of the main agent is between 55 and 60 weight percent based on the total weight of the main agent, and the viscosity of the main agent is between 65,000 and 75,000 cps. Between (centipoise).

In order to achieve the foregoing object, the technical means adopted by the present invention is to make the photo-sensitive polyimide composition comprising: a main component of the photo-sensitive polyimide composition as described above; and a hardening The hardener comprises a photoinitiator. According to the photo-sensitive polyimide composition of the present invention, the hardener comprises a modifier. In order to increase the crosslink density of the main agent, the heat resistance and chemical resistance of the product are improved.

Preferably, the modifier of the hardener is selected from the group consisting of 1,3-phenylene-bis-oxazoline, epoxy, and Its combination.

Preferably, the photoinitiator of the hardener is selected from the group consisting of phenylbis(2,4,6-trimethylbenzyl)phosphine oxide (phenyl bis(2,4,6-) Trimethylphenyl methyl)phosphine oxide), 2-phenylbenzyl-2-dimethylamine-1-(4-morpholinebenzyl)butanone (2-Benzyl-2-(dimethylamino)-1-[4-( 4-morpholinyl)phenyl]-1-butanone) and combinations thereof.

Preferably, the weight ratio of the main agent to the hardener is between 7:3 and 4:1.

In order to achieve the aforementioned object of the invention, the technical means adopted by the present invention is to make the polyimide anti-solder solder mask, which is made of the photo-sensitive polyimide composition described above, and is dielectrically coated. The constant is below 3 and the dielectric loss is below 0.02.

The main component of the photo-sensitive polyimide composition of the present invention is a long-carbon chain aliphatic diamine monomer and a graft monomer having a double bond and an epoxy group at both ends of the main carbon chain, respectively. The main agent prepared by the method and the hardener containing the photoinitiator can be screen-printed to obtain a photo-sensitive polyimide film on the copper foil; the photo-sensitive polyimide film can be 500mj /cm ² exposure energy exposure, the photo-sensitive polyimide film can be developed after exposure using a weakly alkaline developer, and the photo-sensitive polyimide film is developed after the polyimide anti-solder The film system has a low dielectric constant, low dielectric loss, good flame resistance, good solder resistance and pencil hardness. Therefore, the photo-sensitive polyimide composition of the present invention and the obtained polyimide film of the polyimide film can meet the requirements of a flexible circuit board of a high-density circuit.

Example 1 Preparation of a main component of a photo-sensitive polyimide composition Prepare

First, in a 1000 ml glass reactor, 67.89 g of the long carbon chain aliphatic diamine monomer and 116.28 g of another diamine monomer are dissolved in an aprotic solvent at 70 ° C to obtain a first solution; dissolving 120 g of the dianhydride monomer in the first solution at 70 ° C for 2 hours to obtain a second solution; and stirring 31.59 g of the monoanhydride monomer at 70 ° C It was dissolved in the second solution under 2 hours to obtain a poly-proline. In this embodiment, the long carbon chain aliphatic diamine monomer has a 36 carbon number aliphatic diamine monomer as a main carbon chain, and the other diamine monomer is methylene bis-aminobenzoic acid. The protic solvent is N-methylpyrrolidone, the dianhydride monomer is 4,4′-oxydiphthalic anhydride, the monoanhydride monomer is 1,2,4-benzenetricarboxylic anhydride, and the long carbon chain The total number of moles of the aliphatic diamine monomer and the other diamine monomer: the total number of moles of the dianhydride monomer and the monoanhydride monomer is 1:0.9.

Then, 1.68 g of triphenylphosphine (TPP) and 80 g of toluene were mixed with the polyamic acid to form a pre-reaction solution; the pre-reaction solution was stirred at 150 ° C for 3 hours, at 160 The amidoximation reaction was carried out by stirring at ° C for 1 hour and at 170 ° C for 1 hour to obtain a polyimine solution containing soluble polyimine. Among them, triphenylphosphine is a catalyst and toluene is an azeotropic agent.

Thereafter, after adding 3.36 g of triphenylphosphine and 1.68 g of hydroquinone to the polyimine solution containing soluble polyimine, the solution of the polyimine containing the soluble polyimine is held. Stirring at 95 ° C for 0.5 hour to obtain a mixed solution; then, after slowly adding 36.67 g of glycidyl methacrylate to the mixed solution, The mixed solution was stirred at a temperature of 95 ° C for 4 hours, and then cooled to graft glycidyl methacrylate onto the soluble polyimine, thereby obtaining a solution containing the modified soluble polyimine. Here, the weight of the glycidyl methacrylate monomer is 10 weight units based on the weight of the soluble polyimine contained in the polyimine solution. Moreover, by the use of hydroquinone, the glycidyl methacrylate can be prevented from cross-linking with the soluble polyimine to form a gel.

Finally, 8.4 g of aerosolized ceria, 2.1 g of colorant, 1.05 g of triphenylphosphine, 64 g of crosslinker, 5 g of defoamer and 420 g of modified material were added with a chain of Taro mixer. The solution of the soluble polyimine was stirred and mixed for 10 minutes to obtain a mixture; the mixture was dispersed by a three-roller to obtain a main agent having a solid content of about 57% and a viscosity of about 70,000 centipoise. Wherein the crosslinking agent is a trimethylolpropane trimethacrylate monomer, and the weight of the crosslinking agent is 25 weight units based on the weight of the modified soluble polyimide.

Example 2 Preparation of Hardener for Photosensitive Polyimine Composition

31.5 g of the modifier and 42 g of the photoinitiator were dissolved in 137 g of N-methylpyrrolidone in a chain Taro mixer and stirred for 5 minutes to obtain a hardener. In the present embodiment, the modifier is 1,3-phenylenebisoxazoline, and the photoinitiator is phenylbis(2,4,6-trimethylbenzyl)phosphine oxide.

Example 3 Application of Photosensitive Polyimine Composition

The main agent of the photo-sensitive polyimide composition of Example 1 and the hardener of the photo-sensitive polyimide composition of Example 2 were used in a weight of 7:3. The ratio is mixed to obtain a photo-sensitive polyimide pigment ink having a solid content of about 51% and a viscosity of about 15,000 cps.

The photo-sensitive polyimide ink was printed on a 0.5 oz/ft ² copper foil by screen printing, and the hot air oven was baked at a pre-baking temperature of 70 ° C. After 10 minutes of the inductive polyimide pigment ink, a photo-sensitive polyimide film was formed on the copper foil, and the thickness of the photo-sensitive polyimide film was 20 μm.

Laying a negative film on the side of the photo-sensitive polyimide film away from the side of the copper foil, using an unfiltered mercury arc lamp to have a light having an energy of 500 millijoules per square centimeter (mj/cm ² ). The light-sensitive polyimide film is exposed to light having a energy of 500 mj/cm ² corresponding to 5 to 7 steps of a 21-step energy meter (Stouffer 21-step tablet).

Using an aqueous solution containing 1 volume percent of sodium carbonate as a developer, an ultrasonic oscillator was used to develop the exposed photo-sensitive polyimide film at a temperature of 30 ° C for a development time of 90 seconds; After 30 seconds of the photo-sensitive polyimide film, the washed photo-sensitive polyimide film was blown dry with an air gun.

Finally, a hot air circulating oven was used to bake the dried photo-sensitive polyimide film at a hard baking temperature of 160 ° C for 60 minutes to obtain a polyimide film on the copper foil. The thickness of the solder resist film was 19 μm, and the polyimide film solder mask was observed under an optical microscope, and a line width and a line pitch with a resolution of 50 μm were observed.

It can be seen from the above that the photo-sensitive polyimide ink prepared by the main agent of Example 1 and the hardener of Example 2 can be printed on the copper foil by screen printing, and therefore, the light sensitivity of the present invention. Polyimine composition Suitable for circuit boards.

In addition, the photo-sensitive polyimide film made of the photo-sensitive polyimide composition has a light energy and a baking temperature of 500 mj/cm ² and 160 ° C, respectively, which are far below 1000 mj/cm ^{2 .} And at 230 ° C, the photo-sensitive polyimide film made of the photo-sensitive polyimide composition can save the energy cost of the circuit board process.

Further, in the present embodiment, the photo-sensitive polyimide film prepared by the photo-sensitive polyimide composition is developed by using an aqueous solution of 1 volume percent of sodium carbonate after exposure, and it is shown that a weakly alkaline developer can be used. Developing, while the weakly alkaline developer is a commonly used developer for the circuit board process, the photo-sensitive polyimide film made of the photo-sensitive polyimide composition does not need to be developed by a non-circuit board process after exposure. A specific type of developer other than the agent can be developed.

Test example 1

The volume resistivity, surface resistance, dielectric constant (Dk), dielectric loss (Df), breakdown voltage, pencil hardness, solder resistance, flame resistance, acid resistance, and polyimide resistance of the polyimide film of Example 3 were measured. Alkali resistance and solvent resistance. The test results are shown in Table 1. .

Volume resistance: measured according to IPC-TM-650 2.5.17.

Surface resistance: measured according to IPC-TM-650 2.5.17.

Crash voltage: measured according to IPC-TM-650 2.5.6.

Dielectric constant and dielectric loss: measured according to IPC-TM-650 2.5.5.3.

Pencil hardness: measured according to IPC-TM650 2.4.27.2

Solderability A: According to IPC-TM-650 2.4.13 measurement, pre Heat and float soldering at 260 ° C for 10 seconds; if not foaming, delamination or wrinkling, pass.

Solderability B: Preheat and float soldering at 300 ° C for 30 seconds according to IPC-TM-650 2.4.13; pass if not blistering, delamination or wrinkling.

Flammability: According to UL 94 measurement, the VTM-0 rating is passed.

Acid resistance: Soaked in a 10 volume percent hydrochloric acid solution for 10 minutes, passed without bulging, falling off and discoloration.

Alkali resistance: Soaked in a 10% by weight sodium hydroxide solution for 10 minutes, passed without bulging, falling off and discoloration.

Solvent resistance, soaked in isopropyl alcohol solution and methyl ethyl ketone solution for 10 minutes, passed without bulging, falling off and discoloration.

Test example 2

In this test example, the photo-sensitive polyimide pigment ink of Example 3 was coated on one side of a 1/2 mil thick polyimide film to form a photo-sensitive polyimide film. The photo-sensitive polyimide film of the test example is hardened into a polyimide anti-weld solder mask, and the polyimide film having a thickness of 1/2 mil is obtained and the polyimine is prevented. A test piece consisting of a solder mask.

The test piece was folded in half to form a bent portion, and a weight code of 200 gram was pressed onto the bent portion to examine whether the polyimide film solder resist film was cracked at the bent portion. If there is no crack, it means that the polyimide anti-weld solder mask has good resistance to breakage. The results of the measurements are shown in Table 1.

As shown in Table 1, the photo-sensitive polyimide ink prepared by the main agent of Example 1 and the hardener of Example 2 was screen-printed, exposed, and The polybenzazole solder mask prepared after hard baking and development has a dielectric constant of less than 3 and a dielectric loss of less than 0.02. It can be inferred that the polyimide film can be applied to high frequency. Electronic equipment.

As shown in Table 1, the polyimide film of the main agent of Example 1 and the hardener of Example 2 can pass the UL 94 test standard VTM-0 grade, and can pass the solder resist and acid resistance. Test of properties, alkali resistance and solvent resistance, showing the polyimide of the main agent of Example 1 and the hardener of Example 2, the polyimide film with good chemical properties .

As shown in Table 1, the polyimide film of the main agent of Example 1 and the hardener of Example 2 was tested for resistance to breakage without cracking, indicating that it had good resistance to breakage.

In summary, the photo-sensitive polyimine composition of the present invention is composed of a long carbon chain aliphatic diamine monomer and a monomer having a double bond and an epoxy group at both ends of the main carbon chain. The main agent prepared by the method for preparing the main agent and the hardener containing the photoinitiator can be printed by screen printing to obtain a photo-sensitive polyimide film; the photo-sensitive polyimide film can be 500 mj/cm. ² exposure energy exposure, the photo-sensitive polyimide film can be developed after exposure using a weakly alkaline developer, and the photo-sensitive polyimide film is developed after the polyimide film solder mask system It has low dielectric constant, low dielectric loss, good resistance to breakage, good flame resistance, good solder resistance and pencil hardness. Therefore, the photo-sensitive polyimide composition of the present invention, the photo-sensitive polyimide film and the polyimide film of the present invention can meet the requirements of a flexible circuit board of a high-density circuit. .

Claims (20)

The invention relates to a method for preparing a main component of a photo-sensitive polyimide composition, comprising the steps of: a long carbon chain aliphatic diamine monomer, another diamine monomer, a mono-anhydride monomer and a monoanhydride monomer; Reacting in an aprotic solvent to obtain a poly-proline; amidating the polyamic acid to obtain a solution of a polyimine containing a soluble polyimine; and grafting a grafting monomer thereto a polyimine solution of the polyimine solution to obtain a main component of the photo-sensitive polyimide composition; wherein the two ends of the main carbon chain of the graft monomer have a double bond and an epoxy Group. The method for producing a main component of the photo-sensitive polyimide composition according to claim 1, wherein the long carbon chain aliphatic diamine monomer, the other diamine monomer, the dianhydride monomer, and the The monoanhydride monomer is reacted in the aprotic solvent to obtain the polydiamine acid. The long carbon chain aliphatic diamine monomer is an aliphatic diamine monomer having a main chain having a carbon number of 6 to 40. The method for preparing a main component of the photo-sensitive polyimide composition according to claim 1, wherein the grafting monomer is grafted on the soluble polyimine of the polyimine solution to obtain the photo-sensitive polyfluorene. The step of the main component of the imine composition further comprises: grafting the grafting monomer onto the soluble polyimine of the polyimine solution to obtain a solution containing the modified soluble polyimine; and mixing The solution containing the modified soluble polyimine is crosslinked with a solution a step of obtaining a main component of the photo-sensitive polyimide composition. The method for producing a main component of a photo-sensitive polyimide composition according to claim 3, wherein a solution containing the modified soluble polyimine and the crosslinking agent are mixed to obtain the photo-sensitive polyazide. In the step of the main component of the amine composition, the crosslinking agent is selected from the group consisting of trimethylolpropane trimethacrylate monomer, pentaerythritol triacrylate, and 1,6-hexanediol. Diacrylate, polydipentaerythritol hexaacrylate, tripropylene glycol diacrylate, and combinations thereof. The method for producing a main component of a photo-sensitive polyimide composition according to claim 3, wherein a solution containing the modified soluble polyimine and the crosslinking agent are mixed to obtain the photo-sensitive polyazide. In the step of the main component of the amine composition, the weight of the crosslinking agent is between 10 and 40 weight units based on the weight of the modified soluble polyimide. The method for preparing a main component of the photo-sensitive polyimide composition according to any one of claims 1 to 5, wherein the grafting monomer is grafted onto the soluble polyimine of the polyimine solution, In the step of obtaining a main component of the photo-sensitive polyimide composition, the graft system is selected from the group consisting of glycidyl methacrylate, allyl glycidyl ether, and combinations thereof. The method for preparing a main component of the photo-sensitive polyimide composition according to any one of claims 1 to 5, grafting the grafting monomer onto the soluble polyimine of the polyimine solution to obtain the In the step of the main component of the photo-sensitive polyimide composition, the weight of the graft monomer is between 5 and 15 weight units based on the weight of the soluble polyimine contained in the polyimide solution. . The photo-sensitive polyimine group according to any one of claims 1 to 5 a method for preparing a main component of the product, wherein the long carbon chain aliphatic diamine monomer, the other diamine monomer, the dianhydride monomer, and the monoanhydride monomer are reacted in the aprotic solvent to obtain the poly In the step of proline, the other diamine monosystem is selected from the group consisting of methylene bis-aminobenzoic acid, 3,5-diaminobenzoic acid, and 1,3-double (3) -aminophenoxy)benzene, 4,4'-diaminodiphenyl ether, 2,2'-bis[4-(4-aminophenoxyphenyl)]propane, 2,2-bis(3-amino 4-Hydroxyphenyl)hexafluoropropane, 2,2'-bis(trifluoromethyl)diaminobiphenyl, and combinations thereof. The method for preparing a main component of the photo-sensitive polyimide composition according to any one of claims 1 to 5, wherein the long carbon chain aliphatic diamine monomer, the other diamine monomer, the dianhydride In the step of reacting the monomer and the monoanhydride monomer in the aprotic solvent to obtain the poly-proline, the dianhydride single system is selected from the group consisting of: 4, 4'-oxygen double Phthalic anhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, bicyclo [2.2.2] octane 7-ene-2,3,5,6-tetracarboxylic dianhydride, 4,4'-(hexafluoroisopropene) dicarboxylic anhydride, and combinations thereof. The method for preparing a main component of the photo-sensitive polyimide composition according to any one of claims 1 to 5, wherein the long carbon chain aliphatic diamine monomer, the other diamine monomer, the dianhydride In the step of reacting the monomer and the monoanhydride monomer in the aprotic solvent to obtain the polyamic acid, the monoanhydride single system comprises 1,2,4-benzenetricarboxylic anhydride. The method for preparing a main component of the photo-sensitive polyimide composition according to any one of claims 1 to 5, wherein the long carbon chain aliphatic diamine monomer, the other diamine monomer, the dianhydride In the step of reacting the monomer and the monoanhydride monomer in the aprotic solvent to obtain the polyproline, the aprotic solvent is selected from the group consisting of N-methylpyrrolidone and dimethyl. Acetamine, Dimethylformamide, dimethylhydrazine, 1,4-butyrolactone, and combinations thereof. The method for preparing a main component of the photo-sensitive polyimide composition according to any one of claims 1 to 5, wherein the long carbon chain aliphatic diamine monomer, the other diamine monomer, the dianhydride The monomer and the monoanhydride monomer are reacted in the aprotic solvent to obtain the total number of moles of the long carbon chain aliphatic diamine monomer and the other diamine monomer in the step of obtaining the polyaminic acid The total amount of the dianhydride monomer and the monoanhydride monomer is from 0.85 to 0.95 moles. A main component of a photo-sensitive polyimide composition, which is produced by the method for producing a main component of the photo-sensitive polyimide composition according to any one of claims 1 to 12. The main component of the photo-sensitive polyimide composition according to claim 13, wherein the solid content of the main agent is between 55 and 60% by weight based on the total weight of the main agent, and the main agent The viscosity is between 65,000 and 75,000 centipoise. A photoinductive polyimide composition comprising: a main component of the photoinductive polyimide composition according to claim 13 or 14; and a hardener comprising a photoinitiator. The photo-sensitive polyimide composition according to claim 15, wherein the hardener comprises a modifier. The photo-sensitive polyimide composition according to claim 16, wherein the modifier of the hardener is selected from the group consisting of 1,3-phenylenebisoxazoline, epoxy resin and combination. The photoinductive polyimide composition according to any one of claims 15 to 17, wherein the photoinitiator of the hardener is selected from the group consisting of Group: phenylbis(2,4,6-trimethylbenzyl)phosphine oxide, 2-phenylbenzyl-2-dimethylamine-1-(4-morpholiniumbenzyl)butanone and combination. The photo-sensitive polyimide composition according to any one of claims 15 to 17, wherein the weight ratio of the main agent to the hardener is between 7:3 and 4:1. A polyimide film of a polyimide, which is produced by the photoinductive polyimide composition described in claims 15 to 19, having a dielectric constant of less than 3 and a dielectric loss of less than 0.02.