TWI497579B - Scribing device - Google Patents
Scribing device Download PDFInfo
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- TWI497579B TWI497579B TW101114269A TW101114269A TWI497579B TW I497579 B TWI497579 B TW I497579B TW 101114269 A TW101114269 A TW 101114269A TW 101114269 A TW101114269 A TW 101114269A TW I497579 B TWI497579 B TW I497579B
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
本發明係關於一種同時對貼合有2片脆性材料基板之貼合基板等之兩表面進行劃線之劃線裝置。The present invention relates to a scribing apparatus for scribing both surfaces of a bonded substrate or the like to which two sheets of a brittle material substrate are bonded.
液晶顯示裝置等液晶面板成為貼合有2片玻璃板之結構。於自貼合有2片玻璃板之貼合基板切割出液晶面板之情形時，必需於貼合基板之上表面及下表面形成劃線。因此，作為用以同時對兩表面劃線之劃線裝置，已知專利文獻1之劃線裝置。其係藉由使於前端具有劃線輪之一對劃線頭沿與貼合基板之面平行之方向移動而對貼合基板之兩表面進行劃線者。A liquid crystal panel such as a liquid crystal display device has a structure in which two glass plates are bonded together. When the liquid crystal panel is cut out from a bonded substrate in which two glass plates are bonded to each other, it is necessary to form a scribe line on the upper surface and the lower surface of the bonded substrate. Therefore, as the scribing device for scribing the both surfaces at the same time, the scribing device of Patent Document 1 is known. The two surfaces of the bonded substrate are scribed by moving one of the scribing wheels at the tip end to move the scribing head in a direction parallel to the surface of the bonded substrate.
[專利文獻1]國際公開WO 2009/157440號公報[Patent Document 1] International Publication WO 2009/157440
於以先前之劃線裝置進行劃線時，首先，最初使於前端具有劃線輪之一對劃線頭接近貼合基板之上下兩表面，且於劃線開始位置待機。此時，於存在貼合基板之板厚資料之輸入錯誤或操作錯誤之情形時，存在上下之劃線輪之刃尖碰撞而使刃尖受到損傷之缺陷。於劃線輪上產生有損傷之情形時，存在之後無法正常地進行劃線而導致於切割出之液晶面板等產生不合格品之問題。When scribing with a conventional scribing device, first, one of the scribing wheels is provided at the tip end to approach the upper and lower surfaces of the substrate with respect to the scribing head, and stands by at the scribing start position. At this time, when there is an input error or an operation error in the sheet thickness data of the bonded substrate, there is a defect that the blade edge of the upper and lower scribing wheels collides and the blade tip is damaged. When there is a damage in the scribing wheel, there is a problem that the scribing cannot be performed normally after the scribing, and the defective liquid crystal panel or the like is generated.
本發明係著眼於該先前之問題而完成者，其目的在於，於同時對貼合基板之兩表面進行劃線之劃線裝置中，即便存在基板之板厚資料之輸入錯誤或操作錯誤等，亦可不使劃線輪相互接觸，從而可提前防止切斷後之貼合基板中之不合格品之產生。The present invention has been made in view of the above problems, and an object thereof is to provide an scribe line device for scribing both surfaces of a bonded substrate at the same time, even if there is an input error or an operation error of the thickness information of the substrate. Alternatively, the scribing wheels may not be brought into contact with each other, so that the occurrence of defective products in the bonded substrate after the cutting may be prevented in advance.
為解決該課題，本發明之劃線裝置包括；第1劃線頭，其自上方對脆性材料之貼合基板之第1面劃線；及第2劃線頭，其自下方對上述貼合基板之第2面劃線；且藉由使上述第1、第2劃線頭及上述貼合基板之至少一者與上述貼合基板之面平行地相對移動，而同時自上述貼合基板之兩表面進行劃線，且上述第1劃線頭包括：第1劃線輪，其朝上述貼合基板之第1面配置且旋轉自如；及第1凸部，其隔著上述第1劃線輪且於劃線時之相對平行移動方向之前後配置成一對；並且上述第1凸部之前端於與上述貼合基板之面垂直之方向上，位於較上述第1劃線輪之前端更靠上方僅第1距離處，上述第2劃線頭包括：第2劃線輪，其朝上述貼合基板之第2面配置且旋轉自如；及第2凸部，其隔著上述第2劃線輪且於劃線時之相對平行移動方向之前後配置成一對；並且上述第2凸部之前端於與上述貼合基板之面垂直之方向上，位於較上述第2劃線輪之前端更靠下方僅第2距離處，且將上述第1距離及第2距離均設為未達成為劃線對象之上述貼合基板之厚度之1/2。In order to solve the problem, the scribing apparatus of the present invention includes: a first scribing head that scribes a first surface of a bonding substrate of a brittle material from above; and a second scribing head that is attached to the above from below The second surface of the substrate is scribed; and at least one of the first and second scribe lines and the bonded substrate are relatively moved in parallel with the surface of the bonded substrate, and simultaneously bonded from the substrate The two first surfaces are scribed, and the first scribing head includes a first scribing wheel that is disposed to be rotatable toward the first surface of the bonded substrate, and a first convex portion that is interposed with the first scribing line The wheel is disposed in a pair before and after the parallel movement direction in the line, and the front end of the first protrusion is located further in a direction perpendicular to the surface of the bonded substrate, and is located closer to the front end of the first scribing wheel The first second scribing head includes a second scribing wheel that is disposed to be rotatable on a second surface of the bonded substrate, and a second convex portion that is interposed between the second scribing line The wheel is disposed in a pair before and after the relatively parallel moving direction at the time of scribing; and the front end of the second convex portion In a direction perpendicular to the surface of the bonded substrate, the second distance is lower than the front end of the second scribing wheel, and the first distance and the second distance are both not determined to be crossed. One half of the thickness of the above bonded substrate.
此處，上述第1劃線頭之第1凸部亦可設為具有與上述第 1劃線輪之旋轉軸平行之旋轉軸之輥。Here, the first convex portion of the first scribing head may be configured to have the above 1 Roller of the rotating shaft parallel to the axis of rotation of the scribing wheel.
此處，上述第2劃線頭之第2凸部亦可設為具有與上述第2劃線輪之旋轉軸平行之旋轉軸之輥。Here, the second convex portion of the second scribing head may be a roller having a rotation axis parallel to the rotation axis of the second scribing wheel.
此處，上述第1、第2凸部亦可包括具有較上述貼合基板低之剛性且可彈性變形之構件。Here, the first and second convex portions may include a member having a lower rigidity than the bonded substrate and being elastically deformable.
根據具有所述特徵之本發明，於同時對貼合基板之兩表面劃線之劃線裝置中，於劃線輪之劃線方向之前後設置凸部，由於按照基板之厚度設定與貼合基板之面垂直之方向上之自凸部至劃線輪為止之第1、第2距離，故而即便存在基板之板厚資料之輸入錯誤或操作錯誤，劃線輪亦不會相互接觸。因此，可防止劃線輪之損傷，從而可提前防止於切斷後之貼合基板中產生不合格品。According to the present invention having the above feature, in the scribing device for scribing both surfaces of the bonded substrate, the convex portion is provided before the scribing direction of the scribing wheel, and the substrate is set and bonded according to the thickness of the substrate. Since the surface is perpendicular to the first and second distances from the convex portion to the scribing wheel, the scribing wheels do not contact each other even if there is an input error or an operation error of the thickness information of the substrate. Therefore, it is possible to prevent the damage of the scribing wheel, and it is possible to prevent the occurrence of defective products in the bonded substrate after the cutting.
圖1A、圖1B係自側面觀察本實施形態之劃線裝置之概略圖。如該等圖所示，左右一對支柱10a、10b安裝於基座11及塊體12a、12b上。於該支柱間之上部平行地設置有可動導引支柱13a、13b，於下方平行地設置有可動導引支柱14a、14b。可動導引支柱13a、13b及14a、14b各自使橫滑動構件15、16分別沿x軸方向(左右方向)移動。於橫滑動構件15、16上且於z軸方向(上下方向)上分別設置有用以使劃線頭移動之縱滑動構件17、18。於縱滑動構件17之下端部設置有劃線頭19。於縱滑動構件18之上端部設置有劃線頭20。劃線頭19、20係於其前端保持劃線輪者。1A and 1B are schematic views of the scribing apparatus of the embodiment as seen from the side. As shown in the figures, the pair of left and right legs 10a, 10b are attached to the base 11 and the blocks 12a, 12b. The movable guide stays 13a and 13b are provided in parallel with the upper part between the pillars, and the movable guide pillars 14a and 14b are provided in parallel below. Each of the movable guide stays 13a, 13b and 14a, 14b moves the horizontal slide members 15 and 16 in the x-axis direction (left-right direction). Vertical sliding members 17, 18 for moving the scribing head are provided on the lateral sliding members 15, 16 in the z-axis direction (up-and-down direction). A scribing head 19 is provided at a lower end portion of the vertical sliding member 17. A scribing head 20 is provided at an upper end portion of the vertical sliding member 18. The scribing heads 19, 20 are attached to the front end of the scribing wheel.
此處，劃線頭19係第1劃線頭，劃線頭20係第2劃線頭。又，縱滑動構件17、18構成使該等劃線頭向相互接近或離開之方向移動之移動部，可動導引支柱13a、13b、14a、14b及橫滑動構件15、16構成使劃線頭19、20沿x軸方向移動之移動部。Here, the scribing head 19 is a first scribing head, and the scribing head 20 is a second scribing head. Further, the vertical sliding members 17 and 18 constitute a moving portion for moving the scribing heads toward or away from each other, and the movable guiding stays 13a, 13b, 14a, 14b and the lateral sliding members 15 and 16 constitute a scribing head. 19, 20 The moving part that moves in the x-axis direction.
圖2係詳細地表示該上下劃線頭19、20之圖，省略表示周邊之構件。於本實施形態中，於上側之劃線頭19之下端，劃線輪22係以其旋轉軸22a為中心旋轉自如地設置。於劃線輪22之行進方向(x軸方向)之前後設置有一對輥23、24。輥23、24分別包括與劃線輪22之旋轉軸22a平行之旋轉軸23a、24a，且係旋轉自如地被保持之第1凸部。Fig. 2 is a view showing the upper and lower scribe lines 19 and 20 in detail, and the members showing the periphery are omitted. In the present embodiment, the scribing wheel 22 is rotatably provided around the rotation shaft 22a at the lower end of the upper scribing head 19. A pair of rollers 23, 24 are provided before and after the traveling direction (x-axis direction) of the scribing wheel 22. Each of the rollers 23 and 24 includes a rotation shaft 23a and 24a parallel to the rotation shaft 22a of the scribing wheel 22, and is rotatably held by the first projection.
下方之劃線頭20亦同樣地，於其上端部，劃線輪32以旋轉軸32a為中心旋轉自如地設置。於劃線輪32之行進方向(x軸方向)之前後設置有一對輥33、34。輥33、34分別包括與劃線輪32之旋轉軸32a平行之旋轉軸33a、34a，且係旋轉自如地被保持之第2凸部。Similarly to the scribing head 20 in the lower direction, the scribing wheel 32 is rotatably provided around the rotating shaft 32a at the upper end portion thereof. A pair of rollers 33, 34 are provided before and after the traveling direction (x-axis direction) of the scribing wheel 32. Each of the rollers 33 and 34 includes a rotation shaft 33a and 34a parallel to the rotation shaft 32a of the scribing wheel 32, and is rotatably held by the second projection.
此處，劃線輪22之下端構成為較左右輥23、24之下端略靠下方。將劃線輪22之下端與左右輥23、24之下端於z軸方向上之間隔設為第1距離d1。Here, the lower end of the scribing wheel 22 is formed slightly below the lower ends of the left and right rolls 23, 24. The interval between the lower end of the scribing wheel 22 and the lower ends of the left and right rolls 23 and 24 in the z-axis direction is defined as the first distance d1.
關於下方之劃線頭20，劃線輪32之上端構成為較設置為左右一對之輥33、34之上端略靠上方。將劃線輪32之上端與左右輥33、34之上端於z軸方向上之間隔設為第2距離d2。第2距離d2亦可與d1不同，但此處，設為與上側之劃線頭19之第1距離d1相同(d1=d2=d)。Regarding the scribing head 20 below, the upper end of the scribing wheel 32 is configured to be slightly above the upper ends of the rollers 33 and 34 which are disposed to be left and right. The distance between the upper end of the scribing wheel 32 and the upper ends of the left and right rolls 33 and 34 in the z-axis direction is defined as the second distance d2. The second distance d2 may be different from d1, but here, it is the same as the first distance d1 of the upper scribing head 19 (d1=d2=d).
此處，若將應劃線之貼合基板之厚度設為T，則距離d設定為滿足以下不等式d<T/2………(1)之值。該值d例如設為0.5 mm。再者，於距離d1、d2不同之情形時，任一距離均設為未達厚度T之1/2。Here, when the thickness of the bonded substrate to be scribed is T, the distance d is set to a value satisfying the following inequality d<T/2 (1). This value d is set, for example, to 0.5 mm. Furthermore, in the case where the distances d1 and d2 are different, any distance is set to less than 1/2 of the thickness T.
左右輥23、24、33、34可使用具有較成為劃線對象之脆性材料基板低之剛性且可彈性變形之材料，例如聚縮醛、氯乙烯、聚乙基酮等合成樹脂材料或硬質橡膠材料等。The left and right rolls 23, 24, 33, and 34 can be made of a material having a lower rigidity and elastic deformation than a brittle material substrate which is a scribing target, for example, a synthetic resin material such as polyacetal, vinyl chloride or polyethyl ketone or a hard rubber. Materials, etc.
接著，對使用具有該一對劃線頭之劃線裝置對貼合基板劃線時之動作進行說明。首先，使劃線頭19、20沿x軸方向移動至上下輥23及33與貼合基板40對向之位置。其次，如圖3所示，使縱滑動構件17朝下方向移動，使縱滑動構件18朝上方向移動，從而使劃線頭19、20接近貼合基板40。此時，以劃線輪22之下端位置成為較貼合基板40之上表面略靠下方、且劃線輪32之上端位置較貼合基板40之下表面略靠上方之方式，設定劃線輪22之下端及劃線輪32之上端於z軸方向上之位置。於該狀態下如圖4A、圖4B所示，使橫滑動構件15、16沿可動導引支柱13a、13b、14a、14b於x軸方向上移動。如此一來，劃線輪22、23移動至貼合基板40上，進而藉由使其沿x軸方向移動，而同時對貼合基板40之上下兩表面劃線。而且，若至橫滑動構件15、16到達貼合基板40之右端為止而結束劃線，則結束上下各1條劃線。Next, an operation of scribing the bonded substrate using the scribing device having the pair of scribing heads will be described. First, the scribing heads 19 and 20 are moved in the x-axis direction to a position where the upper and lower rolls 23 and 33 oppose the bonded substrate 40. Next, as shown in FIG. 3, the vertical sliding member 17 is moved downward, and the vertical sliding member 18 is moved upward, so that the scribing heads 19 and 20 are brought close to the bonded substrate 40. At this time, the position of the lower end of the scribing wheel 22 is slightly lower than the upper surface of the bonding substrate 40, and the position of the upper end of the scribing wheel 32 is slightly above the lower surface of the substrate 40, and the scribing wheel is set. The lower end of 22 and the upper end of the scribing wheel 32 are located in the z-axis direction. In this state, as shown in FIGS. 4A and 4B, the lateral sliding members 15 and 16 are moved in the x-axis direction along the movable guiding stays 13a, 13b, 14a, and 14b. As a result, the scribing wheels 22 and 23 are moved to the bonding substrate 40, and by moving them in the x-axis direction, the upper and lower surfaces of the bonding substrate 40 are simultaneously scribed. When the horizontal sliding members 15 and 16 reach the right end of the bonded substrate 40 and the scribing is completed, one of the upper and lower scribe lines is completed.
此處，由於貼合基板40之厚度T、及劃線輪之前端與輥 之前端之距離d之間滿足上述不等式(1)，故而即便於因板厚資料之輸入錯誤或操作錯誤而導致劃線頭19及劃線頭20較特定位置而過於接近之情形時，如圖5所示輥23、33先接觸貼合基板40，故而亦可防止劃線輪22、32彼此之接觸。藉此，可防止劃線輪22、32之刃尖之損傷。Here, due to the thickness T of the bonded substrate 40, and the front end of the scribing wheel and the roller When the distance d between the front ends satisfies the above inequality (1), even if the scribe head 19 and the scribe head 20 are too close to a specific position due to an input error or an operation error of the plate thickness data, The rollers 23 and 33 shown in Fig. 5 contact the bonded substrate 40 first, so that the scribing wheels 22 and 32 can be prevented from coming into contact with each other. Thereby, damage to the blade tips of the scribing wheels 22, 32 can be prevented.
又，如圖6所示，於對貼合基板40之劃線結束時，迅速使劃線頭19上升，並且使劃線頭20下降而使其等相互離開。然而，此時若延遲其等離開之時機，則存在劃線輪22、32彼此如以虛線所示般靠近之情況。於該情形時，由於設置於後方之輥24、34先接觸貼合基板40，故而亦可防止劃線輪22、32彼此之接觸。Further, as shown in FIG. 6, when the scribing of the bonded substrate 40 is completed, the scribing head 19 is quickly raised, and the scribing head 20 is lowered to be separated from each other. However, at this time, if the timing of the departure is delayed, there is a case where the scribing wheels 22, 32 are close to each other as indicated by a broken line. In this case, since the rollers 24 and 34 provided at the rear contact the bonding substrate 40 first, the scribing wheels 22 and 32 can be prevented from coming into contact with each other.
於沿反方向進行劃線之情形時，輥23、33與輥24、34之功能顛倒過來，於最初之設定時能夠以輥24、34防止劃線輪22、32之接觸，於劃線之結束時能夠以輥23、33防止劃線輪22、32之接觸。In the case of scribing in the opposite direction, the functions of the rollers 23, 33 and the rollers 24, 34 are reversed, and the contacts of the scribing wheels 22, 32 can be prevented by the rollers 24, 34 at the initial setting, in the scribing At the end, the contacts of the scribing wheels 22, 32 can be prevented by the rollers 23, 33.
再者，本實施形態中係於劃線輪之左右設置一對輥，但亦可僅設置突起部而代替輥23、24、33、34，且使該突起部之前端與劃線輪之前端之位置關係滿足上述式(1)。即便於該情形時，因於劃線輪接觸之前突起部與貼合基板接觸，故而亦可防止劃線輪之接觸。Further, in the present embodiment, a pair of rollers are provided on the right and left sides of the scribing wheel, but only the protrusions may be provided instead of the rollers 23, 24, 33, and 34, and the front end of the protrusion and the front end of the scribing wheel may be provided. The positional relationship satisfies the above formula (1). That is, in this case, since the protruding portion comes into contact with the bonded substrate before the scribing wheel contacts, the contact of the scribing wheel can be prevented.
又，實施形態中係於劃線輪之左右設置一對輥，代替此，圖7表示劃線頭19之變形例之自下方觀察之圖。如該變形例般，亦可配置具有與劃線輪22之旋轉軸平行之旋轉軸且左右各有一對之4個輥53a、53b及54a、54b。下方之 劃線頭20亦相同。Further, in the embodiment, a pair of rollers are provided on the right and left sides of the scribing wheel. Instead of this, FIG. 7 shows a view of a modification of the scribing head 19 as viewed from below. As in this modification, a pair of four rollers 53a, 53b, 54a, and 54b having a pair of rotating shafts parallel to the rotation axis of the scribing wheel 22 and having a pair of left and right sides may be disposed. Below The scribing head 20 is also the same.
又，亦可設置高度調整機構，以可根據成為劃線對象之貼合基板之厚度T而使輥23、24於z軸方向上之位置、輥33、34於z軸方向上之位置、及圖7之變形例之輥53a~54b之位置上下移動。如此，可防止劃線輪直接干擾各種厚度之貼合基板。Further, a height adjustment mechanism may be provided to position the rollers 23 and 24 in the z-axis direction, the positions of the rollers 33 and 34 in the z-axis direction, and the position of the rollers 33 and 34 in accordance with the thickness T of the bonded substrate to be scribing. The positions of the rollers 53a to 54b in the modification of Fig. 7 are moved up and down. In this way, the scribing wheel can be prevented from directly interfering with the bonded substrates of various thicknesses.
再者，於本實施形態中，以貼合有2片脆性材料基板之貼合脆性材料基板為對象進行了說明。其中包括例如使玻璃基板相互貼合之電漿顯示面板、有機EL(Electro Luminescence，電致發光)顯示面板等平板顯示面板、及對矽基板、藍寶石基板等貼合玻璃基板之半導體基板等。Further, in the present embodiment, a bonded brittle material substrate to which two brittle material substrates are bonded is described. For example, a plasma display panel in which glass substrates are bonded to each other, a flat display panel such as an organic EL (Electro Luminescence) display panel, and a semiconductor substrate in which a glass substrate is bonded to a tantalum substrate or a sapphire substrate or the like can be used.
本發明可適用於自上下同時對貼合基板劃線之劃線裝置。The present invention is applicable to a scribing device for scribing a substrate to be bonded from the top to the bottom.
10a、10b‧‧‧支柱10a, 10b‧‧ ‧ pillar
13a、13b‧‧‧可動導引支柱13a, 13b‧‧‧ movable guide pillar
14a、14b‧‧‧可動導引支柱14a, 14b‧‧‧ movable guide pillar
15‧‧‧橫滑動構件15‧‧‧Transverse sliding members
16‧‧‧橫滑動構件16‧‧‧Transverse sliding members
17‧‧‧縱滑動構件17‧‧‧Longitudinal sliding members
18‧‧‧縱滑動構件18‧‧‧Longitudinal sliding members
19‧‧‧劃線頭19‧‧‧ Scribe head
20‧‧‧劃線頭20‧‧‧Drawing head
22‧‧‧劃線輪22‧‧‧marking wheel
22a‧‧‧旋轉軸22a‧‧‧Rotary axis
23‧‧‧輥23‧‧‧ Roll
23a‧‧‧旋轉軸23a‧‧‧Rotary axis
24‧‧‧輥24‧‧‧ Roll
24a‧‧‧旋轉軸24a‧‧‧Rotary axis
32‧‧‧劃線輪32‧‧‧marking wheel
32a‧‧‧旋轉軸32a‧‧‧Rotary axis
33‧‧‧輥33‧‧‧roll
33a‧‧‧旋轉軸33a‧‧‧Rotary axis
34‧‧‧輥34‧‧‧ Roll
34a‧‧‧旋轉軸34a‧‧‧Rotary axis
40‧‧‧貼合基板40‧‧‧Fixed substrate
53a、53b‧‧‧輥53a, 53b‧‧‧ Roll
54a、54b‧‧‧輥54a, 54b‧‧‧ Roll
T‧‧‧厚度T‧‧‧ thickness
圖1A係本發明之實施形態之劃線裝置之側視圖。Fig. 1A is a side view of a scribing apparatus according to an embodiment of the present invention.
圖1B係本發明之實施形態之劃線裝置之側視圖。Fig. 1B is a side view of a scribing apparatus according to an embodiment of the present invention.
圖2係表示本實施形態之上下劃線頭之圖。Fig. 2 is a view showing the underlined head on the upper embodiment.
圖3係表示劃線前之劃線頭之位置之圖。Fig. 3 is a view showing the position of the scribing head before scribing.
圖4A係表示本實施形態之劃線裝置之劃線時之動作之圖。Fig. 4A is a view showing the operation of the scribing device of the embodiment when scribing.
圖4B係表示本實施形態之劃線裝置之劃線時之動作之圖。Fig. 4B is a view showing an operation at the time of scribing of the scribing device of the embodiment.
圖5係表示於劃線前劃線頭之輥接觸於脆性材料基板之 狀態之圖。Figure 5 is a view showing that the roller of the scribing head is in contact with the substrate of the brittle material. State diagram.
圖6係表示劃線結束時之劃線頭及輥之動作之圖。Fig. 6 is a view showing the operation of the scribing head and the roller at the end of scribing.
圖7係表示本發明之實施形態之劃線頭及輥之變形例之圖。Fig. 7 is a view showing a modification of the scribing head and the roller according to the embodiment of the present invention.
19‧‧‧劃線頭19‧‧‧ Scribe head
20‧‧‧劃線頭20‧‧‧Drawing head
22‧‧‧劃線輪22‧‧‧marking wheel
22a‧‧‧旋轉軸22a‧‧‧Rotary axis
23‧‧‧輥23‧‧‧ Roll
23a‧‧‧旋轉軸23a‧‧‧Rotary axis
24‧‧‧輥24‧‧‧ Roll
24a‧‧‧旋轉軸24a‧‧‧Rotary axis
32‧‧‧劃線輪32‧‧‧marking wheel
32a‧‧‧旋轉軸32a‧‧‧Rotary axis
33‧‧‧輥33‧‧‧roll
33a‧‧‧旋轉軸33a‧‧‧Rotary axis
34‧‧‧輥34‧‧‧ Roll
34a‧‧‧旋轉軸34a‧‧‧Rotary axis
40‧‧‧貼合基板40‧‧‧Fixed substrate
T‧‧‧厚度T‧‧‧ thickness
Claims (5)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011115691A JP5348430B2 (en) | 2011-05-24 | 2011-05-24 | Scribing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201248711A TW201248711A (en) | 2012-12-01 |
| TWI497579B true TWI497579B (en) | 2015-08-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101114269A TWI497579B (en) | 2011-05-24 | 2012-04-20 | Scribing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5348430B2 (en) |
| KR (1) | KR101341383B1 (en) |
| CN (1) | CN102795767B (en) |
| TW (1) | TWI497579B (en) |
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| JP6439313B2 (en) | 2014-08-07 | 2018-12-19 | 三星ダイヤモンド工業株式会社 | Scribing method and scribing apparatus |
| JP6435698B2 (en) * | 2014-08-07 | 2018-12-12 | 三星ダイヤモンド工業株式会社 | Scribing equipment |
| JP6384264B2 (en) | 2014-10-20 | 2018-09-05 | 三星ダイヤモンド工業株式会社 | Scribing method and scribing apparatus |
| JP6384265B2 (en) | 2014-10-20 | 2018-09-05 | 三星ダイヤモンド工業株式会社 | Scribing method and scribing apparatus |
| JP6471491B2 (en) * | 2014-12-24 | 2019-02-20 | 三星ダイヤモンド工業株式会社 | Scribing method |
| KR101648010B1 (en) * | 2015-03-03 | 2016-08-17 | 한국미쯔보시다이아몬드공업(주) | Scribing method |
| JP6402940B2 (en) * | 2015-10-09 | 2018-10-10 | 三星ダイヤモンド工業株式会社 | Scribing equipment |
| KR20190049441A (en) | 2017-10-31 | 2019-05-09 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Scribing method and dividing method |
| JP2021167257A (en) | 2020-04-09 | 2021-10-21 | 三星ダイヤモンド工業株式会社 | Scribing method and scribing device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200408061A (en) * | 2002-07-02 | 2004-05-16 | Mitsuboshi Diamond Ind Co Ltd | Substrate slicing system for sealed substrates and the substrate slicing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002057192A1 (en) * | 2001-01-17 | 2002-07-25 | Mitsuboshi Diamond Industrial Co., Ltd. | Separator and separating system |
| JP2007261885A (en) * | 2006-03-29 | 2007-10-11 | Lemi Ltd | Cleaving method of piled glass |
| JP2007229758A (en) * | 2006-02-28 | 2007-09-13 | Fukami Seisakusho:Kk | Laser beam machining system |
| TW200906746A (en) * | 2007-08-10 | 2009-02-16 | Mitsuboshi Diamond Ind Co Ltd | Scribing head, scribing device, and scribing method |
| TW201008887A (en) * | 2008-06-25 | 2010-03-01 | Mitsuboshi Diamond Ind Co Ltd | Scribing apparatus |
-
2011
- 2011-05-24 JP JP2011115691A patent/JP5348430B2/en not_active Expired - Fee Related
-
2012
- 2012-04-02 KR KR1020120033811A patent/KR101341383B1/en active IP Right Grant
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200408061A (en) * | 2002-07-02 | 2004-05-16 | Mitsuboshi Diamond Ind Co Ltd | Substrate slicing system for sealed substrates and the substrate slicing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102795767B (en) | 2015-03-18 |
| KR101341383B1 (en) | 2013-12-13 |
| CN102795767A (en) | 2012-11-28 |
| TW201248711A (en) | 2012-12-01 |
| KR20120131094A (en) | 2012-12-04 |
| JP5348430B2 (en) | 2013-11-20 |
| JP2012240902A (en) | 2012-12-10 |
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