TWI497086B - Test System and Method of Semiconductor Packaging Component with Open Circuit Test - Google Patents

Description

Semiconductor package component test system and method with open circuit test

The present invention relates to a semiconductor package component testing system and method with open circuit testing, and more particularly to a testing method and system suitable for performing open circuit testing between a semiconductor package component and a test device, and performing functional testing on the semiconductor package component.

In the semiconductor packaging and testing industry, most of the semiconductor package components are functionally tested before they are assembled into the circuit board, or system level testing (SLT). The main purpose of the semiconductor package components is to test whether the semiconductor package components can be normal. Operate to ensure the integrity of its functions.

Most of the common functional tests use the public board directly, that is, the public board published by the synchronous certification when the semiconductor package component is published as a test center, and the semiconductor package component to be tested is tested by the test program built in the public board. Among them, the semiconductor package member to be tested must be manually placed on the test socket on the public board by the operator, and then the public board utility is executed for testing. However, the manual processing method is inevitably caused by the operator's experience, proficiency, or mental state, etc., or it is inevitable that the semiconductor package member is damaged due to careless handling of the semiconductor package member.

In addition, since the public board is used as a test device, it is usually only capable of performing a single test function, that is, a function test, and cannot perform other test or debug functions. That is to say, when the detection result is a failure, the system usually directly determines that the semiconductor package member is a defective product, and does not further detect whether the device is faulty, the contact at the contact is poor, or whether the semiconductor package member is a defective product. Accordingly, there are often cases of misjudgment, which leads to a decrease in the accuracy of the test and even a loss of semiconductor package components.

Therefore, it can be seen that an open circuit test capable of detecting the conduction state between the semiconductor package component and the test device, and a test method for the functional test (system level test, SLT) and the test system thereof are actually industrial circles. Urgent needs.

The main object of the present invention is to provide a semiconductor package member test system and method with an open circuit test, which can perform an open circuit test before the functional test of the semiconductor package member to further screen the semiconductor package member that cannot pass the open circuit test. It can also detect and eliminate the bad contact between the semiconductor package component and the test socket contact, and also confirm whether the communication program between the public board module and the main controller is working properly to improve the test accuracy and reduce system errors. The delays in debugging and troubleshooting can avoid the total problems caused by traditional human operations.

To achieve the above object, a method for testing a semiconductor package member with an open circuit test includes the following steps: First, providing a semiconductor package member to a test socket of a male module, and a public board A test program is stored in the module, and the public board module is electrically connected to a main controller by a communication module; further, the main controller controls the public board module to open the semiconductor package component by using the communication module Testing; then, the main controller sends a start signal to the public board module, the public board module executes a test program to perform functional testing on the semiconductor package component; and the public board module transmits a test result to the main controller, the main control The semiconductor package components are classified according to the test results.

Preferably, the open circuit testing step of the present invention may include: first, the main controller sends a test signal to the public board module; then, the public board module tests whether the contact between the semiconductor package component and the test socket is turned on or not; The public board module sends a confirmation signal to the main controller. In the step of testing whether the contact between the semiconductor package component and the test socket is turned on or not, the public board module can respectively input a detection signal to each contact point of the test socket, and detect the response signal of each contact point to It is judged whether the contact between the semiconductor package member and the test stand is turned on or not. Accordingly, the open circuit test of the present invention can determine the open condition of each contact by inputting a specific signal to each contact and detecting the feedback signal of the feedback.

In addition, in the open circuit test, when the public board module receives the test signal, the public board module stops all ongoing tests. In other words, whether the public board module is in an idle state, is performing a functional test, or is performing an open circuit test, the public board module stops all tests and restarts the open circuit test when the public board module receives the test signal. In addition, an operating system can be operated in the public board module of the present invention, and the operating system can be in a constant starting state, that is, the operating system is not closed after each open circuit test and functional test, so as to perform the next semiconductor package member. Test.

Moreover, in order to achieve the object of the present invention, a semiconductor package component testing system with an open circuit test includes a main controller and a test classification device, the main controller is an electrical connection test classification device, and the test classification device includes A feeding unit, a male board module, a plurality of discharging units, a communication module, and a transfer device. Wherein, the feeding unit is mounted with the semiconductor package component to be tested, the public board module comprises a test seat and a storage unit, and the storage unit stores a test program; the plurality of discharge units are mounted and tested and classified. The semiconductor package component; the communication module is electrically connected between the public board module and the main controller; the transfer device is a test seat for transferring the semiconductor package component on the feeding unit, the public board module, and the plurality Between the discharge units. Wherein, the transfer device obtains the semiconductor package component from the feeding unit and then transfers it to the test socket on the public board module; the main controller controls the public board module to open circuit test the semiconductor package component through the communication module; the main controller Sending a start signal to the public board module, the public board module executes a test program to perform functional test on the semiconductor package component; the public board module transmits a test result to the main controller, and the main controller performs the semiconductor package component according to the test result. Sorting and controlling the transfer device to transfer the semiconductor package member to the plurality of discharge units.

Preferably, the invention has an open circuit test semiconductor package component test system, wherein the open circuit test means that the main controller sends a test signal to the public board module, and the public board module tests the contact between the semiconductor package component and the test socket. Whether the public board module sends a confirmation signal to the main controller. The public board module inputs a detection signal to each contact of the test socket, and detects the response signal of each contact to determine whether the contact between the semiconductor package component and the test socket is conductive.

Moreover, the storage unit of the public board module of the present invention stores an operating system, and the operating system can be operated in the public board module. Additionally, the semiconductor package component of the present invention can be a stacked package wafer.

2‧‧‧ public board module

21‧‧‧ test seat

22‧‧‧ storage unit

210‧‧‧Contacts

3‧‧‧Communication module

4‧‧‧Test classification device

41‧‧‧Feeding unit

42‧‧‧Drawing unit

43‧‧‧Transfer device

5‧‧‧Master controller

As‧‧‧Start signal

C‧‧‧Semiconductor package components

Cr‧‧‧ classification results

Cs‧‧‧Confirmation signal

Cp‧‧‧ communication program

Rs‧‧‧ test results

Ts‧‧‧ test signal

Tp‧‧‧ test program

OS‧‧‧ operating system

1 is a system architecture diagram of a preferred embodiment of the present invention.

2 is a schematic view of a preferred embodiment of the present invention.

3 is a flow chart of a test in accordance with a preferred embodiment of the present invention.

Prior to the detailed description of the semiconductor package member test system and method of the present invention having an open circuit test, it is to be noted that in the following description, like elements will be denoted by the same reference numerals.

Please refer to FIG. 1 and FIG. 2 together. FIG. 1 is a system architecture diagram of a semiconductor package component testing system with open circuit test according to the present invention. FIG. 2 is a comparison diagram of a semiconductor package component testing system with open circuit testing according to the present invention. A schematic of a preferred embodiment. As shown in the figure, the present invention provides a test system for a semiconductor package member having an open circuit test, which mainly includes a main controller 5 and a test classification device 4, and the main controller 5 is electrically connected to the test classification device 4. Furthermore, the test classification device 4 includes a feeding unit 41, a male board module 2, a three discharging unit 42, a communication module 3, and a transfer device 43. The feeding unit 41 is used to mount the semiconductor package member C to be tested.

Furthermore, the public board module 2 includes a test stand 21 and a storage unit 22, and the storage unit 22 stores a test program Tp and a pass. The program program Cp and an operating system OS, and the public board module 2 constantly runs the operating system OS. However, the operating system OS referred to herein is a common Linux operating system or a Windows operating system, such as Windows 2000 and Windows XP; the public board module 2 refers to the publicly issued certification of the semiconductor package component C. The test program Tp refers to the built-in test program of the public board module 2; and the communication program Cp is used to make an information connection between the main controller 5 and the public board module 2.

In addition, as shown in the figure, the three discharge units 42 include a good product and a defective product carrying unit for mounting the semiconductor package member C which has been tested and classified. Moreover, the communication module 3 is electrically connected between the public board module 2 and the main controller 5. The communication module 3 used in this embodiment is a general-purpose input/output connection interface (General Purpose I/O, GPIO). ), but not limited to this, it can also be RS232, or other equivalent connection interface.

Furthermore, the transfer device 43 is used to transfer the semiconductor package member C between the supply unit 41, the test holder 21 on the male module 2, and a plurality of discharge units 42. Moreover, when the transfer device 43 places the semiconductor package member C in the test holder 21 and performs the test, the transfer device 43 simultaneously functions as a crimping mechanism to abut against the semiconductor package member C so as to be surely connected to the test holder 21. Electrical contact. Of course, only one transfer device 43 is shown in the drawings of the present embodiment, but the present invention is not limited to a single transfer device 43, and may also include a plurality of transfer units for being responsible for local transfer tasks, respectively. Further, in the present embodiment, the semiconductor package member C is a stacked package wafer.

Please refer to FIG. 3 again. FIG. 3 is a test flow chart of a preferred embodiment of the present invention. As shown in the figure, when the main controller 5 starts the test (Step S105), the transfer device 43 of the test sorting device 4 transfers the semiconductor package member C to the test socket 21 on the common plate module 2, and crimps the semiconductor package member C to make it positive with the test stand 21. The contact 210 is electrically contacted, that is, step S205.

Then, when the main controller 5 starts the connection (step S110), the main controller 5 establishes an information connection with the public module 2 in the test classification device 4 via the communication module 3 and the communication program Cp, that is, step S210. The communication program Cp can be pre-written and stored in the storage unit 22.

Then, when the main controller 5 starts the open circuit test (step S115), the main controller 5 sends a test signal Ts to the public board module 2, and the public board module 2 tests the contact 210 between the semiconductor package member C and the test seat 21. Turn on or not. That is, the public board module 2 inputs a detection signal to each of the contacts 210 of the test socket 21, and detects the response signal of each contact 210 to determine the junction 210 between the semiconductor package member C and the test socket 21. Turns on or off, step S215. If all the conduction is confirmed, the public board module 2 will send a confirmation signal Cs to the main controller 5; however, if an error condition occurs after the open circuit test, a general debugging procedure, such as the test classification device 4, and/or The main controller 5 will send a warning signal for the on-site operator to handle. And/or according to a predetermined rule, the semiconductor package member C that has not reached the threshold (open circuit test) is re-introduced into the detecting device, and the detecting device that meets the predetermined rule retests the threshold that has not reached the pass threshold (open circuit test). The semiconductor package member C can prevent the original detecting device from being misjudged due to the detection error. It is particularly worth mentioning that in this embodiment, when the public board module 2 receives the test signal, the public board module 2 will stop all ongoing tests. In other words, regardless of whether the public board module 2 is in an idle state, Perform a functional test or an open circuit test. When the public board module 2 receives the test signal Ts, the public board module stops all tests and restarts the open circuit test.

When the main controller 5 receives the confirmation signal Cs, the function test is started (step S120), at which time the main controller 5 sends an activation signal As to the public board module 2, and the operating system in the public board module 2 The OS actively executes the test program Tp to perform a functional test on the semiconductor package member C, that is, step S225. After the test program Tp is executed, that is, after the function test is completed, the public board module 2 will actively return the test result Rs to the main controller 5. However, in the present embodiment, the operating system OS is in a constant startup state, that is, after each open circuit test and functional test, the operating system is not turned off to perform the test of the next semiconductor package member C.

Further, when the main controller 5 receives the test result Rs, it classifies the semiconductor package member C according to the test result Rs, and transmits the classification result Cr to the test classification device 4, that is, step S125. On the other hand, when the test classification device 4 receives the classification result Cr, the transfer device 43 is caused to transfer the semiconductor package member C to the corresponding discharge unit 42, that is, step S225. Finally, the main controller 5 ends the connection (step S130) and ends the test, that is, the public board module 3 ends the connection with the main controller 5, that is, step S230.

It can be seen from the above that the semiconductor package test system and method with open circuit test provided by the present invention at least includes the following effects: (1) Before performing functional test on the semiconductor package member, an open circuit test is performed first to further filter through the open circuit. Tested semiconductor package component; (2). By open circuit test, it can detect and eliminate the bad contact between the semiconductor package component and the test socket contact, so as to improve the test accuracy, and reduce the delay of debugging and troubleshooting after the system error, and It can avoid the total problem caused by traditional human operation; and (3) adopt a fully automated test process, and each step of each step is closely monitored. Once a step is mistaken, it will be alerted and recorded, and the field operator can Easily troubleshoot the cause.

The above-mentioned embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.

Claims (9)

A method for testing a semiconductor package member with an open circuit test, comprising the steps of: (A) providing a semiconductor package member to a test socket of a public board module, wherein the public board module stores a test program, the public board mold The group is electrically connected to a main controller by a communication module; (B) the main controller sends a test signal to the public board module, and the communication module controls the public board module to the semiconductor The package component is tested for open circuit; when the public board module receives the test signal, the public board module stops all ongoing tests; (C) the main controller sends a start signal to the public board module, the public The board module executes the test program to perform functional testing on the semiconductor package member; and (D) the public board module transmits a test result to the main controller, and the main controller and the semiconductor package member according to the test result sort. The method for testing a semiconductor package member with an open circuit test according to claim 1, wherein the step (B) comprises: (B1) the main controller sends the test signal to the public board module; (B2) The public board module tests whether the connection between the semiconductor package component and the test socket is turned on; and (B3) the public board module sends a confirmation signal to the main controller. The method for testing a semiconductor package member having an open circuit test according to the second aspect of the invention, wherein in the step (B2), the public module is respectively inputting a detection signal to each contact of the test socket. And detecting A response signal of each contact to determine whether the junction of the semiconductor package member and the test socket is conductive. The method for testing a semiconductor package member with an open circuit test according to claim 1, wherein the operating system is operated in the public module, and the operating system is in the step (A) to the step (D) Constant startup state. A semiconductor package component testing system with an open circuit test, comprising a main controller and a test classification device, the main controller is electrically connected to the test classification device, the test classification device comprises: a feeding unit, Mounting a semiconductor package member to be tested; a public board module comprising a test socket and a storage unit, the storage unit storing a test program; and a plurality of discharge units mounted on the test and classified a semiconductor package member; a communication module electrically connected between the common plate module and the main controller; and a transfer device for transferring the semiconductor package member to the supply unit, The test socket on the public board module and the plurality of discharge units; wherein the transfer device transfers the semiconductor package component from the feeding unit to the test socket on the public board module The main controller sends a test signal to the public board module, and the communication module controls the public board module to perform an open circuit test on the semiconductor package component; the main controller sends a start Signal to the public board module, the male plate The module executes the test program to perform functional testing on the semiconductor package component; the public board module transmits a test result to the main controller, and the main controller classifies the semiconductor package component according to the test result, and controls the The transfer device transfers the semiconductor package member to the plurality of discharge units; wherein when the public board module receives the test signal, the public board module stops all ongoing tests. The semiconductor package component testing system with an open circuit test according to claim 5, wherein the open circuit test means that the main controller sends a test signal to the public board module, and the public board module tests the semiconductor package. The contact between the component and the test socket is turned on, and the public board module sends a confirmation signal to the main controller. The semiconductor package component testing system with an open circuit test according to claim 6, wherein the public module inputs a detection signal to each contact of the test socket, and detects the response of each contact. a signal to determine whether the junction of the semiconductor package component and the test socket is conductive. The semiconductor package component testing system with an open circuit test according to claim 5, wherein the storage unit of the public board module stores an operating system, and the operating system is operated in the public board module. The semiconductor package component testing system with open circuit test according to claim 5, wherein the semiconductor package component is a stacked package wafer.