TWI492841B - 具有複合鍍膜的板材及採用該板材的可擕式電子裝置 - Google Patents

具有複合鍍膜的板材及採用該板材的可擕式電子裝置 Download PDF

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TWI492841B
TWI492841B TW099142476A TW99142476A TWI492841B TW I492841 B TWI492841 B TW I492841B TW 099142476 A TW099142476 A TW 099142476A TW 99142476 A TW99142476 A TW 99142476A TW I492841 B TWI492841 B TW I492841B
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film layer
metal
optical film
board
electronic device
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TW099142476A
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TW201223747A (en
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Chao Tsang Wei
Ga-Lane Chen
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Hon Hai Prec Ind Co Ltd
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Priority to US13/026,276 priority patent/US20120141828A1/en
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0279—Improving the user comfort or ergonomics
    • H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12611—Oxide-containing component

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Signal Processing (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Telephone Set Structure (AREA)

Description

具有複合鍍膜的板材及採用該板材的可擕式電子裝置
本發明涉及一種板材，尤其涉及一種具有複合鍍膜的板材及一種採用該板材的可擕式電子裝置。
現今社會，移動電話的使用越來越廣泛，使得電磁波輻射的污染越來越大，電磁波不僅會影響產品本身的正常運作，還可能造成人體之傷害。當不需要之電壓或電流存在且嚴重影響裝置之功(性)能時稱發生電磁波干擾(Electromagnetic Interference簡稱EMI)，所有改變或克服此種干擾之方法稱之為電磁波干擾控制(或反制)（EMI control，簡稱EMIC）。
以目前來說，最普遍的防範外界電磁波干擾的方法係增加電子產品外包裝對電磁波的遮蔽能力。具有高導電能力的金屬對電磁波具有極佳的吸收效果及反射效果。手機外觀件採用鍍金屬材質可以有效的遮蔽電磁波，克服電磁干擾。然而當手機外觀件的幾個部分採用金屬材質時，因人體也係導體，所以當手持手機進行通訊時，手掌很有可能把這幾部份金屬材質聯通起來，導致電磁波被遮蔽通訊不良。
有鑒於此，提供一種用於既能遮蔽電磁波，又能防止收訊不良的具有複合鍍層的板材及一種採用該板材的可擕式電子裝置實屬必要。
一種具有複合鍍膜的板材，包括一金屬基材、一金屬薄膜層及一絕緣的透明光學薄膜層。所述金屬薄膜層形成於所述金屬基材表面，所述光學薄膜層形成於所述金屬薄膜層表面。所述金屬薄膜層用於消除所述光學薄膜層因薄膜干涉而產生的薄層色。
一種可擕式電子裝置，包括外觀件，所述外觀件採用所述具有複合鍍層的板材製成。
較於先前技術，本發明所述板材的基材為金屬材質，故可以有效能遮蔽電磁波；另，所述板材的光學薄膜層為絕緣材質，故能防止收訊不良；同時，所述金屬薄膜層還可以消除所述金屬薄膜層及所述光學薄膜層因薄膜干涉而產生的薄層色，故還能保持板材的金屬外觀；本發明所述之可擕式電子裝置採用了所述具有複合鍍層的板材，故可以有效遮蔽電磁波，防止收訊不良，並且還能保持金屬外觀。
下面將結合附圖對本技術方案提供之具有複合鍍膜的板材及採用該板材的可擕式電子裝置作進一步之詳細說明。
請參閱圖1，本技術方案第一實施例提供一種具有複合鍍膜的板材10，包括一金屬基材12、一金屬薄膜層14及一光學薄膜層16。所述金屬薄膜層14形成於所述金屬基材12表面，所述光學薄膜層16形成於所述金屬薄膜層14表面。
所述金屬基材12可以係純金屬，如Ni、Cu、Cr、Co、Ag或Au等，也可以係合金，如不銹鋼、鋁合金、鎂合金、鋅合金等，在本實施例中，所述金屬基材12為SUB304號不銹鋼材質。
所述金屬薄膜層14為純金屬鍍層，如Al、Ni、Cu、Cr、Co、Ag或Au等。優選所述金屬薄膜層14的形成方式為真空鍍，如濺鍍、蒸鍍或離子鍍，以形成特定厚度的鍍層。
所述光學薄膜層16為透明的絕緣材料，例如為二氧化鈦、五氧化二鉭、五氧化二鈮、三氧化二鋁、二氧化矽或二氧化鋯等，在本實施例中，所述光學薄膜層16為二氧化矽。所述光學薄膜層16的形成方式可以為真空鍍，如濺鍍、蒸鍍或離子鍍。
所述金屬薄膜層14用於消除所述光學薄膜層16因薄膜干涉而產生的薄層色。亦即，為保持所述金屬基材12的金屬本色，可以運用薄膜干涉原理計算調整所述金屬薄膜層14及所述光學薄膜層16的厚度，得到表面顏色與所述金屬基材12顏色相同或接近的所述板材10。
將物體的顏色用L-亮度，a-紅綠色，b-黃藍色來表示，在本實施例中，量测得到所述金屬基材12(SUB304號不銹鋼)顏色的(L, a, b) 值為(85.75,2.67,6.5)，將所述金屬基材12的表面鍍厚度為2200 nm的材質為二氧化矽的光學薄膜层16，得到所述板材10顏色的(L, a, b) 值為(80.01,2.56,6.57)，可看出除了L值外, 所述板材10顏色的a, b值與所述金屬基材12基本相同。在所述金屬基材12表面先鍍3 nm厚度的材質為鋁的金屬薄膜層14，然後在金屬薄膜層14鍍2200 nm厚度的材質為二氧化矽的光學薄膜層16，得到所述板材10顏色的(L, a, b) 值為(85.37,2.65,6.57)，可以看出, 所述板材10顏色的L, a, b值與所述金屬基材12的L, a, b值對應相同或相近。
在本實施例中，為使所述板材10的顏色與所述金屬基材12(SUB304號不銹鋼)的顏色基本相同，優選所述金屬薄膜層14為2-7nm，所述光學薄膜層16的厚度為2100-2300nm。
可以理解，當所述金屬基材12為其他金屬或者合金時，同樣可以運用薄膜干涉原理調整所述金屬薄膜層14及所述光學薄膜層16的厚度，得到表面顏色與所述金屬基材12顏色接近或相同的所述板材10。
請參閱圖2，本技術方案第二實施例提供一種可擕式電子裝置20，所述可擕式電子裝置20包括外觀件22，所述外觀件22採用上述第一實施例揭示的具有複合鍍層的板材10製成，在本實施例中，所述可擕式電子裝置20為手機，所述外觀件22為所述可擕式電子裝置20的外殼。
相較於先前技術，本發明所述板材10的金屬基材12為金屬材質，故可有效遮蔽電磁波；另，所述光學薄膜層16為絕緣材質，故能防止收訊不良；同時，所述金屬薄膜層14可以消除所述光學薄膜層16因薄膜干涉而產生的薄層色，故還能保持所述金屬基材12的原有的金屬色澤外觀；本發明所述之可擕式電子裝置20採用了所述具有複合鍍層的板材10，故可以有效遮蔽電磁波，防止收訊不良，並且還能保持金屬外觀。
10．．．板材
12．．．金屬基材
14．．．金屬薄膜層
16．．．光學薄膜層
20．．．可擕式電子裝置
22．．．外觀件
圖1係本發明第一實施例之具有複合鍍膜的板材的結構示意圖。
圖2係本發明第二實施例之可擕式電子裝置的示意圖。
10．．．板材
12．．．金屬基材
14．．．金屬薄膜層
16．．．光學薄膜層

Claims (5)

  1. 一種具有複合鍍膜的板材，包括：一金屬基材、一金屬薄膜層及一絕緣的透明光學薄膜層，所述金屬薄膜層形成於所述金屬基材表面，所述光學薄膜層形成於所述金屬薄膜層表面，所述金屬薄膜層用於消除所述光學薄膜層因薄膜干涉而產生的薄層色，其中，所述金屬基材的材質為SUB304號不銹鋼，所述光學薄膜層的材質為二氧化矽，所述光學薄膜層的厚度範圍為2100-2300nm。
  2. 如申請專利範圍第1項所述之具有複合鍍膜的板材，其中，所述金屬薄膜層的材質為Al、Ni、Cu、Cr、Co、Ag或Au。
  3. 如申請專利範圍第1項所述之具有複合鍍膜的板材，其中，所述光學薄膜層的材質為二氧化鈦、五氧化二鉭、五氧化二鈮、三氧化二鋁、二氧化矽或二氧化鋯。
  4. 如申請專利範圍第1項所述之具有複合鍍膜的板材，其中，所述金屬薄膜層的厚度範圍為2-7nm。
  5. 一種可擕式電子裝置，包括外觀件，所述外觀件採用如申請專利範圍第1至4任一項所述之具有複合鍍層的板材製成。
TW099142476A 2010-12-06 2010-12-06 具有複合鍍膜的板材及採用該板材的可擕式電子裝置 TWI492841B (zh)

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TW099142476A TWI492841B (zh) 2010-12-06 2010-12-06 具有複合鍍膜的板材及採用該板材的可擕式電子裝置
US13/026,276 US20120141828A1 (en) 2010-12-06 2011-02-13 Film structure and portable electronic device employing same

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CN111010838B (zh) * 2019-12-11 2021-01-29 维沃移动通信有限公司 壳体的制造方法、壳体以及电子设备
CN111212538B (zh) * 2020-02-03 2021-05-07 Oppo广东移动通信有限公司 壳体加工方法、壳体及电子设备
CN113817987B (zh) * 2020-06-19 2023-04-18 华为技术有限公司 一种电子设备的后盖的加工方法及电子设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4533605A (en) * 1980-09-09 1985-08-06 Westinghouse Electric Corp. Article such as jewelry or a wristwatch component having composite multi-film protective coating

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* Cited by examiner, † Cited by third party
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CN102111972B (zh) * 2009-12-29 2015-07-29 深圳富泰宏精密工业有限公司 电子装置壳体

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4533605A (en) * 1980-09-09 1985-08-06 Westinghouse Electric Corp. Article such as jewelry or a wristwatch component having composite multi-film protective coating

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