TWI490889B - Method for manufacturing alloy chip resistor - Google Patents

Description

Alloy wafer resistor manufacturing method

The invention relates to a method for manufacturing an alloy wafer resistor, in particular to a method for manufacturing an alloy wafer resistor by laser cutting or stamping with laser cutting to improve the yield of the alloy wafer resistor.

According to the alloy chip resistors, which have stable characteristics at higher power and ultra-low resistance values, they are often used in high-precision current detectors, which is also the trend of resistors. Moreover, although the alloy wafer resistor has the above advantages, it has the disadvantage that the resistance accuracy is difficult to control. Therefore, in the process of the alloy chip resistor, there is usually a step of trimming and trimming to improve the alloy. The accuracy of the resistance of the chip resistor.

The formation of the resistance of the alloy chip resistor is mainly based on the following formula: , where: R, representing the resistance value, the market demand tolerance is mainly ±1%.

l , represents the length of the conductor, and creates a conductor path in the body by stamping/etching, and produces a product with different resistance values by the difference of the conductor paths.

A, representing the cross-sectional area, because the alloy sheet is produced by rolling, the sheet itself has machining tolerances, and the general tolerance is within ±0.01~±0.03mm.

ρ, which represents the resistivity, the resistivity of each batch of alloy plate material will vary slightly due to the difference in smelting.

According to the above formula and description, the resistivity, cross-sectional area and conductor path of the alloy sheet are all variable in the production process. Under the influence of the cross-variation of various variables, the distribution of the resistance value of the finished product is too large to concentrate or deviate from the target. The value, plus the market demand is mainly based on the tolerance of ±1% of the alloy chip resistor products, the excessively dispersed resistance value can not meet the demand, but also reduce the product yield. Therefore, how to improve the concentration of resistance values and meet the target value through the control of process management and processing technology has become a topic of research in the industry.

At present, the production mode of alloy chip resistors can be roughly divided into two modes:

1, no repair resistance (short process / low yield):

1.1 The resistance value is determined directly by the stamping/etching process, and no repair processing is performed any more. The stamping/etching conditions are verified by multiple tests to obtain better process conditions (conductor paths). The electrical average process yield of this process is about 40-60%.

1.2 Unrepaired process can also obtain a short process / high yield mode, resistance formula: R Among them, the ρ resistivity and the A cross-sectional area (thickness) are fixed in the production process of the alloy raw materials, and the producer of the alloy resistance has been unable to make any adjustment to these two variables. Only resistance producer through its ability to process high-precision processing mode / high degree of stability, control conductor length l, timely adjustment of the length of the conductor, and ρ A changes to fit, thereby enabling the convergence value R, this program It is also the goal that the present invention is committed to.

2, repair resistance (long process / high yield): alloy sheet is set at the initial R value of about -10% of the target value, and then repaired process segmentation or single grinding / cutting / cutting ... Correction of the resistance value (changing the cross-sectional area, that is, making the cross-sectional area smaller, so that the resistance value is increased), so that the resistance value of the alloy wafer resistor after the repair process is satisfactory. The electrical yield of this process can be increased to more than 80%. However, in this repair process, it is necessary to increase the number of processes such as breaking unilateral, group resistance measurement, classification, etc. in advance, resulting in prolonged process time and increased expenditure on equipment, manpower, consumables, and the like.

Nowadays, the present inventors have developed a method for manufacturing an alloy wafer resistor in view of the lack of the prior art, so that the alloy wafer resistor can meet the industrial requirements in terms of resistance accuracy and product yield.

The main object of the present invention is to provide a method for manufacturing an alloy wafer resistor, which is mainly for adjusting the length of the conductor path in a timely manner in the production process, in order to cope with the relevant variables. Change, to achieve the purpose of increasing the concentration and yield of resistance values.

The above main object and effect of the present invention are achieved by the following specific technical means: a method for manufacturing an alloy wafer resistor, comprising the steps of: (a) selecting an alloy plate material according to a desired characteristic; Cutting a pattern of a conductor path conforming to the required resistance value according to the required resistance value, and then cutting a plurality of individual semi-finished products of the alloy chip resistor according to the cutting pattern by using a laser cutting process to make the alloy The middle section of the individual semi-finished product of the chip resistor is a resistive body region, and the two ends of the individual semi-finished products of the alloy chip resistor are an exposed conductor region and a joint region connecting the adjacent semi-finished products of the adjacent alloy chip resistors to form a continuous layer on the alloy plate. Alloy wafer resistor semi-finished matrix or alloy wafer resistor semi-finished strip; (c) the body region of the individual semi-finished product of the alloy wafer resistor is covered with an insulator; (d) exposed conductor region at both ends of the alloy wafer resistor, by electroplating Copper metal is plated to form a conductive copper terminal electrode; (e) the original alloy wafer resistor matrix or alloy is further moldd by a mold The bar is stamped or cut to form a plurality of individual alloy die resistors (see the third figure); (f) finally, the conductive copper end of each individual alloy die resistor is plated with a conductive metal to form an electrode. That is, it becomes a finished product of an alloy wafer resistor.

In a preferred embodiment of the method of fabricating an alloy wafer resistor as described above, the alloy plate is selected from one of a nickel-chromium alloy, a nickel-chromium-aluminum alloy, a copper-nickel alloy, an iron-chromium-aluminum alloy, or a manganese-copper alloy.

In a preferred embodiment of the method for manufacturing an alloy wafer resistor as described above, at least one sample is sampled on the alloy plate to be cut before the step (b), and the resistance value of the sample is first measured, and the sample is measured according to the sample. The value is programmed to adjust the length of the laser cut shape or cut line.

In a preferred embodiment of the method for manufacturing an alloy wafer resistor as described above, the conductive metal is one or more selected from the group consisting of nickel, tin or silver and laminated.

In a preferred embodiment of the method for fabricating an alloy wafer resistor as described above, the insulating system coated in the body region of the individual semi-finished product of the alloy wafer resistor is formed by one of molding, painting, exposure and development.

The above-mentioned main object and effect of the present invention can also be achieved by the following specific technical means: a method for manufacturing an alloy wafer resistor, comprising the steps of: (a) selecting an alloy plate material according to a desired characteristic; According to the required resistance value, a cutting pattern is pre-designed, and the outer shape of the alloy wafer resistor is first punched out by the mold, so that a plurality of individual semi-finished products of the alloy chip resistor are obtained on the alloy plate, so that the alloy chip resistor is an individual semi-finished product. The middle section is the resistive body region, and the ends of the individual semi-finished products of the alloy chip resistor are exposed conductor regions and connecting phases a joining region of the individual semi-finished product of the alloy wafer resistor to form a continuous alloy wafer resistor semi-finished matrix or alloy chip resistor semi-finished strip on the alloy plate; (c) a middle-resistance body of the individual semi-finished product of the alloy chip resistor a region, wherein the conductor path is cut by a laser cutting process; (d) an insulator is coated on the body region of the individual semi-finished product of the alloy chip resistor; (e) the exposed conductor region is exposed at both ends of the alloy wafer resistor, and is plated by electroplating Copper metal to form a conductive copper terminal electrode; (f) stamping or cutting the original alloy wafer resistor matrix or alloy wafer resistor strip in a mold to form an alloy wafer resistor individual; (g) Conducting an individual of the alloy wafer resistor individual The copper terminal is plated with a conductive metal to form an electrode of the alloy wafer resistor, thereby completing the finished product fabrication process of the alloy wafer resistor.

In a preferred embodiment of the method of manufacturing an alloy resistor as described above, the alloy sheet is selected from one of a nickel-chromium alloy, a nickel-chromium-aluminum alloy, a copper-nickel alloy, an iron-chromium-aluminum alloy, or a manganese-copper alloy.

In a preferred embodiment of the method of manufacturing an alloy resistor as described above, the conductive metal is selected from one or more of copper, nickel, tin, and silver and is laminated.

In a preferred embodiment of the alloy resistance manufacturing method as described above, at least one sample is sampled on the alloy plate to be cut before the step (b), and the resistance of the sample is first measured. The value is adjusted according to the sample measurement to adjust the length of the laser cutting shape or the cutting line.

(1)‧‧‧ alloy plate

(2) ‧‧‧ alloy wafer resistors individual semi-finished products

(21)‧‧‧Resistive body area

(22) ‧‧‧Exposed conductor area

(23)‧‧‧ Linked area

(L)‧‧‧Conductor path

(A)‧‧‧ alloy wafer resistor semi-finished matrix or alloy wafer resistor semi-finished strip

(B)‧‧‧ alloy wafer resistors

First FIG.: Flow chart of steps of a method for manufacturing an alloy wafer resistor according to a preferred embodiment of the present invention

Second Figure: Schematic diagram of a preferred embodiment of the present invention after performing step (b)

Third Figure: Schematic diagram of a preferred embodiment of the present invention after performing step (f)

Fourth: Flow chart of steps of a method for manufacturing an alloy wafer resistor according to a second preferred embodiment of the present invention

Figure 5 is a schematic view of the second preferred embodiment of the present invention after the implementation of step (b)

Figure 6 is a schematic view of the second preferred embodiment of the present invention after performing step (c)

Figure 7 is a schematic view of the second preferred embodiment of the present invention after performing step (g)

In order to make the technical content, the purpose of the invention and the effects achieved by the invention have A more complete and clear disclosure will be described in detail below, and please refer to the drawings and drawings of the drawings: please refer to the first figure, which is a flow of steps of a preferred embodiment of the present invention. Figure.

The alloy resistance manufacturing method of a preferred embodiment of the present invention comprises the following steps: (a) selecting a nickel-chromium alloy, a nickel-chromium-aluminum alloy, a copper-nickel alloy, an iron-chromium-aluminum alloy or An alloy plate of one of the manganese-copper alloys (1); (b) a cutting pattern of a conductor path conforming to the required resistance value is pre-designed according to the required resistance value, and then the laser cutting process is performed on the alloy plate according to the cutting pattern Cutting out a plurality of individual semi-finished products of alloy die resistors (2) (please refer to the second figure together), so that the middle section of the individual semi-finished product (2) of the alloy chip resistor is a resistive body region (21), the alloy chip resistor individual The two ends of the semi-finished product (2) are an exposed conductor region (22) and a joint region (23) connecting the adjacent semi-finished products (2) of the alloy chip resistor to form a continuous alloy chip resistor on the alloy plate (1). a semi-finished product matrix or an alloy wafer resistor semi-finished product strip (A); (c) a package formed by injection molding, painting or exposure development, etc. at the resistive body region (21) of the individual semi-finished product (2) of the alloy wafer resistor Overlying insulator; (d) in alloy crystal Piece resistor individual semi-finished product (2) exposed conductor area at both ends Field (22), electroplated with copper metal to form a conductive copper terminal electrode of the alloy wafer resistor (B); (e) stamping or cutting the original alloy wafer resistor matrix or alloy wafer resistor strip with a mold To form a plurality of alloy die resistor individual; (f) a conductive copper terminal electrode at each end of the alloy chip resistor, electroplated with a conductive metal such as nickel, tin or silver to form a plurality of alloy wafers Resistors (B) finished products (please refer to the third figure together).

In addition, at least one sample may be sampled on the alloy plate to be cut before mass cutting in step (b), and the resistance value of the sample may be measured first, and the laser cutting may be controlled/adjusted according to the sample measurement value. The length of the shape or cutting line makes the resistance of the finished product closer to the preset value. Wherein, if the resistance value of the sample is lower than the target resistance value, the cutting line is extended, the conductor path (L) is lengthened, and the resistance value is increased, and conversely, the conductor path (L) is shortened so that the resistance value is lowered.

Please refer to the second figure, which is a flow chart of the steps of the second preferred embodiment of the present invention.

The alloy resistance manufacturing method of the second preferred embodiment of the present invention comprises the following steps: (a) selecting a nickel-chromium alloy, a nickel-chromium-aluminum alloy, a copper-nickel alloy, an iron-chromium-alloy or a material of the alloy plate (1) of one of the manganese-copper alloys; (b) a pre-designed conductor path conforming to the required resistance value according to the required resistance value To cut the pattern, first stamp out the shape of the resistor product (please refer to the fifth figure together) to obtain a plurality of individual semi-finished products of the alloy chip resistor (2) on the alloy plate (1), so that the alloy wafer The middle section of the resistor individual semi-finished product (2) is a resistive body region (21), and the two ends of the individual semi-finished product (2) of the alloy wafer resistor are an exposed conductor region (22) and an adjacent semi-finished product of the adjacent alloy die resistor ( 2) a joining region (23) for forming a continuous alloy wafer resistor semi-finished matrix or alloy wafer resistor semi-finished strip (A) on the alloy sheet (1); (c) an individual semi-finished product of the alloy wafer resistor (2) a resistive body region (21) of the middle section, according to the cutting pattern, cutting at least one conductor path (L) conforming to the required resistance value by a laser cutting process (please refer to the sixth figure); (d) the alloy Forming a coated insulator by means of injection molding, painting or exposure development, etc. in the resistive body region (21) of the individual semi-finished product of the wafer resistor; (e) exposing at both ends of the individual semi-finished product (2) of the alloy wafer resistor Conductor area (22), plated with copper gold To form a conductive copper terminal electrode of the alloy wafer resistor (B); (f) stamping or cutting the original alloy wafer resistor semi-finished matrix or the alloy wafer resistor semi-finished strip (A) by a mold to form a plurality of alloy wafers Resistor (B) individual; (g) Conductive copper terminal electrode at each end of the alloy chip resistor, electroplated with a conductive metal such as nickel, tin or silver to form a plurality of alloy chip resistors (B) finished product (please refer to the seventh picture together).

In addition, before step (b) a large number of cutting, at least one sample is sampled on the alloy plate to be cut, and the resistance value of the sample is first measured, and the laser cutting shape or cutting line is controlled/adjusted according to the sample measurement value. The length of time. Wherein, if the resistance value of the sample is lower than the target resistance value, the cutting line is extended, the conductor path (L) is lengthened, and the resistance value is increased, and conversely, the conductor path (L) is shortened so that the resistance value is lowered.

The above is only a part of the embodiments of the present invention, and is not intended to limit the present invention. It is intended to be included in the scope of the present invention.

In summary, the embodiments of the present invention can achieve the expected use efficiency, and the specific technical means disclosed therein have not been seen in similar products, nor have they been disclosed before the application, and have completely complied with the patent law. The regulations and requirements, the application for invention patents in accordance with the law, and the application for review, and the grant of patents, are truly sensible.

Claims (6)

An alloy wafer resistor manufacturing method comprises the steps of: (a) selecting an alloy plate material according to a desired characteristic; (a1) sampling at least one sample on the alloy plate, and measuring the resistance of the sample first. Value, if the resistance value of the sample is lower than the target resistance value, the cutting line is extended, the conductor path is lengthened, and the resistance value is increased, and vice versa, the conductor path is shortened so that the resistance value is decreased, and then the sample measurement value is used. The program controls/adjusts the length of the laser cutting shape or the cutting line to achieve the concentration of the final product resistance; (b) pre-designs a cutting pattern conforming to the conductor path of the required resistance according to the required resistance value to the laser The cutting process cuts a plurality of individual semi-finished alloy resistors on the alloy plate, so that the middle portion of the semi-finished product of the alloy resistor is a resistive body region, and the ends of the semi-finished product of the alloy resistor are exposed conductor regions and the adjacent alloy resistors are connected a joint region of the semi-finished product to form a continuous alloy resistance semi-finished matrix or alloy resistance semi-finished strip on the alloy plate; (c) the alloy resistance individual Forming, coating or exposing one of the finished body regions to form an insulator; (d) exposing the conductor region at both ends of the alloy resistor semi-finished product, electroplating copper metal to form alloy resistance Conductive copper terminal electrode; (e) stamping or cutting the original alloy resistance semi-finished product matrix or the alloy resistance semi-finished product strip by a mold to form a plurality of alloy resistance semi-finished products; (f) plating at the conductive copper end of the alloy resistance semi-finished product at both ends Conductive metal is applied to form an electrode of the finished alloy resistor. The method for manufacturing an alloy wafer resistor according to claim 1, wherein the alloy plate is one selected from the group consisting of a nickel-chromium alloy, a nickel-chromium-aluminum alloy, a copper-nickel alloy, an iron-chromium-aluminum alloy, and a manganese-copper alloy. The method of manufacturing an alloy wafer resistor according to claim 1 or 2, wherein the conductive metal is selected from one or more of nickel, tin, and silver and laminated. An alloy wafer resistor manufacturing method comprises the steps of: (a) selecting an alloy plate material according to a desired characteristic; (a1) sampling at least one sample on the alloy plate, and measuring the resistance of the sample first. Value, if the resistance value of the sample is lower than the target resistance value, the cutting line is extended, the conductor path is lengthened, and the resistance value is increased, and vice versa, the conductor path is shortened so that the resistance value is decreased, and then the sample measurement value is used. The program controls/adjusts the length of the laser cutting shape or the cutting line to achieve the purpose of concentration concentration of the final product; (b) pre-designs a cutting pattern conforming to the conductor path of the required resistance according to the required resistance value, first adopting the mold Stamping out the shape of the alloy wafer resistor for the purpose The plurality of alloy wafer resistor individual semi-finished products are obtained on the alloy plate, wherein the middle portion of the individual semi-finished products of the alloy chip resistor is a resistive body region, and the ends of the individual semi-finished products of the alloy chip resistor are exposed conductor regions and the adjacent alloy wafers are connected a joint region of the individual semi-finished products of the resistor to form a continuous alloy chip resistor semi-finished matrix or an alloy chip resistor semi-finished strip on the alloy plate; (c) a middle-resistance body region of the individual semi-finished product of the alloy chip resistor, and then The shot cutting process cuts the conductor path in accordance with the required resistance; (d) the insulator body of the individual semi-finished product of the alloy chip resistor is coated with an insulator by injection molding, coating or exposure development; (e) the alloy wafer resistor An exposed conductor region at both ends of the individual semi-finished product, plated with copper metal to form a conductive copper terminal electrode of the alloy resistance semi-finished product; (f) stamping or cutting the original alloy wafer resistor matrix or the alloy wafer resistor strip with a mold, To form a plurality of alloy wafer resistor semi-finished products; (g) semi-finished alloy resistors Copper termination at both ends of the conductive bodies, galvanically plated with a conductive metal to form an alloy electrode resistance of the finished product. The method for manufacturing an alloy wafer resistor according to claim 4, wherein the alloy plate is selected from the group consisting of a nickel-chromium alloy, a nickel-chromium-aluminum alloy, a copper-nickel alloy, and an iron. One of chrome aluminum alloy or manganese copper alloy. The method of manufacturing an alloy wafer resistor according to claim 4, wherein the conductive metal is selected from one or more of nickel, tin, and silver and laminated.