TWI486421B - 雙面膠及其製備方法 - Google Patents

雙面膠及其製備方法 Download PDF

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TWI486421B
TWI486421B TW101144204A TW101144204A TWI486421B TW I486421 B TWI486421 B TW I486421B TW 101144204 A TW101144204 A TW 101144204A TW 101144204 A TW101144204 A TW 101144204A TW I486421 B TWI486421 B TW I486421B
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adhesive layer
substrate
double
micrometers
sided tape
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TW201420711A (zh
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Da Wei Lin
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Hon Hai Prec Ind Co Ltd
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/18—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet characterized by perforations in the adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2421/00—Presence of unspecified rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/006—Presence of halogenated polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y10T428/24331—Composite web or sheet including nonapertured component
    • Y10T428/24339—Keyed
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Description

雙面膠及其製備方法
本發明涉及一種雙面膠，尤其係涉及一種雙面膠及其製備方法。
先前之雙面膠通常包括一基板及形成於基板二側面之膠層。使用時，雙面膠位於二待黏接於一起之物體之間以固定二物體。然，由於基板通常由強度較大之PET材料製成，膠層無法滲透基板，當受到較大拉力作用時，膠層容易與基板脫離，從而降低雙面膠之黏接強度，影響黏接品質。
鑒於上述內容，有必要提供一種黏接強度較大之雙面膠及其製備方法。
一種雙面膠，其包括基板、形成於該基板一表面之第一膠層及形成於該基板另一表面之第二膠層。該基板上開設有複數通孔，第一膠層和第二膠層之至少一種填充該複數通孔以使第一膠層及第二膠層相連接。
一種雙面膠之製備方法，其包括以下步驟：
提供一基板；
提供一滾輪，藉由滾輪滾壓以在該基板上形成複數通孔；
藉由轉印方法在該基板之一側面上形成第一膠層；及
藉由轉印方法在該基板之另一側面上形成第二膠層，第一膠層和第二膠層之至少一種填充該複數通孔以使第一膠層及第二膠層相連接。
本發明之雙面膠之基板上開設有複數通孔，第一膠層和第二膠層之至少一種填充該複數通孔，從而使得第一膠層及第二膠層固化後形成一整體，以提高雙面膠之黏接強度。
請參閱圖1，本發明實施方式之雙面膠100包括一基板10、第一膠層30及第二膠層50。基板10上開設有複數通孔12，第一膠層30及第二膠層50塗覆於基板10相對之二表面上，第一膠層30和第二膠層50之至少一種填充該複數通孔12以使第一膠層30及第二膠層50相連接。
基板10由塑膠製成，該塑膠可為聚對苯二甲酸乙二酯（polyethylene terephthalate, PET）、聚乙烯（polyethylene，PE）、聚氯乙烯（Polyvinylchlorid，PVC）及聚醯亞胺（polyimide，PI）等聚合物及其改性物中之至少一種。基板10之厚度為12微米至50微米，通孔12之孔徑為1微米至100微米，通孔12之間之間距為10微米至100微米。通孔12可為圓形、多邊形、橢圓形、或其他形狀。可理解，通孔12可等間距設置，通孔12之間之間距也可不相等。
第一膠層30和第二膠層50可由相同之材料製成，也可由不同之材料製成。第一膠層30或第二膠層50均可選自丙烯酸樹脂、矽膠及橡膠材料及其改性物中之至少一種。第一膠層30或第二膠層50之厚度為10微米至100微米。
實施例一
雙面膠100之基板10由苯二甲酸乙二酯製成，基板10之厚度為12微米，通孔12為直徑為1微米之圓形孔，相鄰之通孔12之間之距離相等，且間距為10微米。第一膠層30及第三膠層50均由丙烯酸樹脂製成，第一膠層30及第三膠層50之厚度均為10微米。
實施例二
雙面膠100之基板10由苯二甲酸乙二酯製成，基板10之厚度為50微米，通孔12為直徑為100微米之圓形孔，相鄰之通孔12之間之距離相等，且間距為100微米。第一膠層30及第三膠層50均由丙烯酸樹脂製成，第一膠層30及第三膠層50之厚度均為100微米。
實施例三
雙面膠100之基板10由苯二甲酸乙二酯製成，基板10之厚度為20微米，通孔12為直徑為30微米之圓形孔，相鄰之通孔12之間之距離相等，且間距為20微米。第一膠層30及第三膠層50均由丙烯酸樹脂製成，第一膠層30及第三膠層50之厚度均為20微米。
實施例四
雙面膠100之基板10由苯二甲酸乙二酯製成，基板10之厚度為20微米，通孔12為直徑為30微米之圓形孔，相鄰之通孔12之間之距離相等，且間距為40微米。第一膠層30及第三膠層50均由丙烯酸樹脂製成，第一膠層30及第三膠層50之厚度均為30微米。
實施例五
雙面膠100之基板10由苯二甲酸乙二酯製成，基板10之厚度為20微米，通孔12為直徑為30微米之圓形孔，相鄰之通孔12之間之距離相等，且間距為40微米。第一膠層30及第三膠層50均由丙烯酸樹脂製成，第一膠層30及第三膠層50之厚度均為30微米。
實施例六
雙面膠100之基板10由聚乙烯製成，基板10之厚度為20微米，通孔12為邊長為30微米之方形孔，通孔12之間之間距隨機分佈，且控制在10微米至100微米之間。第一膠層30及第三膠層50均由丙烯酸樹脂製成，第一膠層30及第三膠層50之厚度均為30微米。
請參閱圖2，本發明實施方式之雙面膠100之製備方法包括以下步驟：
S201：提供一基板10。本實施方式中，基板10為苯二甲酸乙二酯材料製成，基板10之厚度為12微米，通孔12為直徑為1微米之圓形孔，相鄰之通孔12之間之距離相等，且間距為10微米。
S202：提供一滾輪，藉由滾輪滾壓以在基板10上形成複數通孔12。本實施方式中，通孔12為直徑為1微米之圓形孔，相鄰之通孔12之間之距離相等，且間距為10微米。
S203：藉由轉印方法在基板10之一側面上形成第一膠層30。本實施方式中，第一膠層30由丙烯酸樹脂製成，第一膠層30之厚度為10微米。
S204：藉由轉印方法在基板10之另一側面上形成第二膠層50。本實施方式中，第二膠層50由丙烯酸樹脂製成，第二膠層50之厚度為10微米，最終使第一膠層30和第二膠層50之至少一種填充複數通孔12，以將第一膠層30和第二膠層50連接起來。
本發明之雙面膠100之基板10上開設有複數通孔12，從而使得第一膠層30與第二膠層50能夠藉由通孔12相互連接，第一膠層30及第二膠層50固化後形成一整體，從而提高雙面膠100之黏接強度。
綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟，以上該者僅為本發明之較佳實施方式，本發明之範圍並不以上述實施方式為限，舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。
100．．．雙面膠
10．．．基板
12．．．通孔
30．．．第一膠層
50．．．第二膠層
圖1係本發明實施方式之雙面膠之結構示意圖。
圖2係圖1所示雙面膠之製備方法之流程圖。
100．．．雙面膠
10．．．基板
12．．．通孔
30．．．第一膠層
50．．．第二膠層

Claims (10)

  1. 一種雙面膠，其包括基板、形成於該基板一表面之第一膠層及形成於該基板另一表面之第二膠層，其改良在於：該基板上開設有複數通孔，第一膠層和第二膠層之至少一種填充該複數通孔以使第一膠層及第二膠層相連接。
  2. 如申請專利範圍第1項所述之雙面膠，其中形成該基板之材料為聚對苯二甲酸乙二酯、聚乙烯、聚氯乙烯及聚醯亞胺中之至少一種。
  3. 如申請專利範圍第1項所述之雙面膠，其中形成該第一膠層之材料為丙烯酸樹脂、矽膠及橡膠中之至少一種。
  4. 如申請專利範圍第1項所述之雙面膠，其中形成該第二膠層之材料為丙烯酸樹脂、矽膠及橡膠中之至少一種。
  5. 如申請專利範圍第1項所述之雙面膠，其中該基板之厚度為12微米至50微米。
  6. 如申請專利範圍第1項所述之雙面膠，其中該第一膠層或第二膠層之厚度為10微米至100微米。
  7. 如申請專利範圍第1項所述之雙面膠，其中該通孔之直徑為1微米至100微米，該通孔之間之間距為10微米至100微米。
  8. 一種雙面膠之製備方法，其包括以下步驟：
    提供一基板；
    提供一滾輪，藉由滾輪滾壓以在該基板上形成複數通孔；
    藉由轉印方法在該基板之一側面上形成第一膠層；及
    藉由轉印方法在該基板之另一側面上形成第二膠層，第一膠層和第二膠層之至少一種填充該複數通孔以使第一膠層及第二膠層相連接。
  9. 如申請專利範圍第8項所述之雙面膠之製備方法，其中形成該基板之材料為聚對苯二甲酸乙二酯、聚乙烯、聚氯乙烯及聚醯亞胺中之至少一種。
  10. 如申請專利範圍第8項所述之雙面膠之製備方法，其中該通孔之直徑為1微米至100微米，該通孔之間之間距為10微米至100微米。
TW101144204A 2012-11-26 2012-11-26 雙面膠及其製備方法 TWI486421B (zh)

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CN104657707B (zh) * 2015-01-30 2018-03-20 业成光电（深圳）有限公司 指纹识别装置及其制作方法
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