TWI486233B - 用於化學機械研磨漿液之注入的方法及裝置 - Google Patents

用於化學機械研磨漿液之注入的方法及裝置 Download PDF

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Publication number
TWI486233B
TWI486233B TW098136878A TW98136878A TWI486233B TW I486233 B TWI486233 B TW I486233B TW 098136878 A TW098136878 A TW 098136878A TW 98136878 A TW98136878 A TW 98136878A TW I486233 B TWI486233 B TW I486233B
Authority
TW
Taiwan
Prior art keywords
injector
slurry
polishing pad
pad
wafer
Prior art date
Application number
TW098136878A
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English (en)
Chinese (zh)
Other versions
TW201034794A (en
Inventor
李奧納德 波魯奇
亞拉 菲利波西安
亞沙 山普諾
席安 譚
Original Assignee
亞拉卡有限公司
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Publication date
Application filed by 亞拉卡有限公司 filed Critical 亞拉卡有限公司
Publication of TW201034794A publication Critical patent/TW201034794A/zh
Application granted granted Critical
Publication of TWI486233B publication Critical patent/TWI486233B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW098136878A 2008-10-31 2009-10-30 用於化學機械研磨漿液之注入的方法及裝置 TWI486233B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/262,579 US8197306B2 (en) 2008-10-31 2008-10-31 Method and device for the injection of CMP slurry

Publications (2)

Publication Number Publication Date
TW201034794A TW201034794A (en) 2010-10-01
TWI486233B true TWI486233B (zh) 2015-06-01

Family

ID=40139596

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098136878A TWI486233B (zh) 2008-10-31 2009-10-30 用於化學機械研磨漿液之注入的方法及裝置

Country Status (5)

Country Link
US (1) US8197306B2 (enExample)
JP (1) JP5574597B2 (enExample)
KR (1) KR101394745B1 (enExample)
GB (1) GB2464995A (enExample)
TW (1) TWI486233B (enExample)

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KR101710425B1 (ko) * 2015-06-02 2017-03-08 주식회사 케이씨텍 슬러리 공급 유닛 및 이를 구비하는 화학 기계적 기판 연마장치
US11077536B2 (en) 2016-06-24 2021-08-03 Applied Materials, Inc. Slurry distribution device for chemical mechanical polishing
KR102070705B1 (ko) * 2018-02-13 2020-01-29 에스케이실트론 주식회사 웨이퍼 랩핑 장치의 정반 홈파기 장치
KR102835295B1 (ko) 2020-03-06 2025-07-18 가부시키가이샤 에바라 세이사꾸쇼 연마 장치, 처리 시스템 및 연마 방법
WO2024049719A2 (en) * 2022-08-29 2024-03-07 Rajeev Bajaj Advanced fluid delivery
CN116713555B (zh) * 2023-06-09 2026-06-02 西安航天动力机械有限公司 一种固体发动机壳体外部件角焊缝cmt+p焊接方法
CN117260475B (zh) * 2023-11-09 2025-10-17 中国十七冶集团有限公司 一种用于二衬台车模板打磨设备及使用方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4272241A1 (en) 2021-02-16 2023-11-08 Araca Incorporated Chemical mechanical planarization slurry processing techniques and systems and methods for polishing substrate using the same

Also Published As

Publication number Publication date
GB0820451D0 (en) 2008-12-17
US8197306B2 (en) 2012-06-12
KR101394745B1 (ko) 2014-05-26
KR20100048830A (ko) 2010-05-11
JP2010114398A (ja) 2010-05-20
JP5574597B2 (ja) 2014-08-20
GB2464995A (en) 2010-05-05
TW201034794A (en) 2010-10-01
US20100112911A1 (en) 2010-05-06

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