TWI484602B - 薄膜封裝裝置 - Google Patents
薄膜封裝裝置 Download PDFInfo
- Publication number
- TWI484602B TWI484602B TW102105512A TW102105512A TWI484602B TW I484602 B TWI484602 B TW I484602B TW 102105512 A TW102105512 A TW 102105512A TW 102105512 A TW102105512 A TW 102105512A TW I484602 B TWI484602 B TW I484602B
- Authority
- TW
- Taiwan
- Prior art keywords
- head
- door
- opening portion
- nozzle
- disposed
- Prior art date
Links
- 239000010409 thin film Substances 0.000 title claims description 18
- 238000005538 encapsulation Methods 0.000 title description 5
- 239000000178 monomer Substances 0.000 claims description 20
- 239000010408 film Substances 0.000 claims description 14
- 238000004806 packaging method and process Methods 0.000 claims description 12
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Coating Apparatus (AREA)
- Containers And Plastic Fillers For Packaging (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120015366A KR101325489B1 (ko) | 2012-02-15 | 2012-02-15 | 박막 봉지 장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201334128A TW201334128A (zh) | 2013-08-16 |
| TWI484602B true TWI484602B (zh) | 2015-05-11 |
Family
ID=48984456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102105512A TWI484602B (zh) | 2012-02-15 | 2013-02-18 | 薄膜封裝裝置 |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR101325489B1 (ko) |
| CN (1) | CN104205405B (ko) |
| TW (1) | TWI484602B (ko) |
| WO (1) | WO2013122391A1 (ko) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6189806B1 (en) * | 1998-09-24 | 2001-02-20 | Leybold Systems Gmbh | Metallizing device for vacuum metallizing |
| JP2005113240A (ja) * | 2003-10-09 | 2005-04-28 | Kodak Kk | 蒸発装置 |
| KR20080029198A (ko) * | 2006-09-28 | 2008-04-03 | (주)리드 | 기판 처리 장치 및 방법 |
| TW201115806A (en) * | 2009-05-11 | 2011-05-01 | Snu Precision Co Ltd | Substrate processing system |
| TW201130129A (en) * | 2010-01-14 | 2011-09-01 | Samsung Mobile Display Co Ltd | Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR980007938A (ko) * | 1996-06-29 | 1998-03-30 | 배순훈 | 전자부품 자동장착기 노즐헤드부의 로터 로킹장치 |
| KR100430104B1 (ko) * | 2001-09-18 | 2004-05-03 | 디지웨이브 테크놀러지스 주식회사 | 선형 증착과 간접 가열을 이용한 진공증착장치 및 그증착방법 |
-
2012
- 2012-02-15 KR KR1020120015366A patent/KR101325489B1/ko active IP Right Grant
-
2013
- 2013-02-14 CN CN201380009667.1A patent/CN104205405B/zh not_active Expired - Fee Related
- 2013-02-14 WO PCT/KR2013/001139 patent/WO2013122391A1/ko active Application Filing
- 2013-02-18 TW TW102105512A patent/TWI484602B/zh not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6189806B1 (en) * | 1998-09-24 | 2001-02-20 | Leybold Systems Gmbh | Metallizing device for vacuum metallizing |
| JP2005113240A (ja) * | 2003-10-09 | 2005-04-28 | Kodak Kk | 蒸発装置 |
| KR20080029198A (ko) * | 2006-09-28 | 2008-04-03 | (주)리드 | 기판 처리 장치 및 방법 |
| TW201115806A (en) * | 2009-05-11 | 2011-05-01 | Snu Precision Co Ltd | Substrate processing system |
| TW201130129A (en) * | 2010-01-14 | 2011-09-01 | Samsung Mobile Display Co Ltd | Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130094037A (ko) | 2013-08-23 |
| CN104205405B (zh) | 2016-10-26 |
| KR101325489B1 (ko) | 2013-11-07 |
| CN104205405A (zh) | 2014-12-10 |
| TW201334128A (zh) | 2013-08-16 |
| WO2013122391A1 (ko) | 2013-08-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |