TWI478259B - 用於終點偵測之二維光譜特徵追蹤 - Google Patents

用於終點偵測之二維光譜特徵追蹤 Download PDF

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Publication number
TWI478259B
TWI478259B TW100123536A TW100123536A TWI478259B TW I478259 B TWI478259 B TW I478259B TW 100123536 A TW100123536 A TW 100123536A TW 100123536 A TW100123536 A TW 100123536A TW I478259 B TWI478259 B TW I478259B
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TW
Taiwan
Prior art keywords
substrate
layer
spectral
grinding
spectrum
Prior art date
Application number
TW100123536A
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English (en)
Chinese (zh)
Other versions
TW201220415A (en
Inventor
大衛傑弗瑞杜魯
胡曉源
朱志澤
李哈利Ｑ
Original Assignee
應用材料股份有限公司
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Publication date
Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TW201220415A publication Critical patent/TW201220415A/zh
Application granted granted Critical
Publication of TWI478259B publication Critical patent/TWI478259B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW100123536A 2010-07-23 2011-07-04 用於終點偵測之二維光譜特徵追蹤 TWI478259B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US36712510P 2010-07-23 2010-07-23

Publications (2)

Publication Number Publication Date
TW201220415A TW201220415A (en) 2012-05-16
TWI478259B true TWI478259B (zh) 2015-03-21

Family

ID=45494016

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100123536A TWI478259B (zh) 2010-07-23 2011-07-04 用於終點偵測之二維光譜特徵追蹤

Country Status (5)

Country Link
US (1) US8814631B2 (cg-RX-API-DMAC10.html)
JP (1) JP2013541827A (cg-RX-API-DMAC10.html)
KR (1) KR101484696B1 (cg-RX-API-DMAC10.html)
TW (1) TWI478259B (cg-RX-API-DMAC10.html)
WO (1) WO2012012530A2 (cg-RX-API-DMAC10.html)

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US8747189B2 (en) * 2011-04-26 2014-06-10 Applied Materials, Inc. Method of controlling polishing
US8657646B2 (en) * 2011-05-09 2014-02-25 Applied Materials, Inc. Endpoint detection using spectrum feature trajectories
US8563335B1 (en) * 2012-04-23 2013-10-22 Applied Materials, Inc. Method of controlling polishing using in-situ optical monitoring and fourier transform
US9248544B2 (en) 2012-07-18 2016-02-02 Applied Materials, Inc. Endpoint detection during polishing using integrated differential intensity
CN103624673B (zh) * 2012-08-21 2016-04-20 中芯国际集成电路制造(上海)有限公司 化学机械抛光装置及化学机械抛光的方法
US9221147B2 (en) * 2012-10-23 2015-12-29 Applied Materials, Inc. Endpointing with selective spectral monitoring
TWI675721B (zh) * 2013-07-11 2019-11-01 日商荏原製作所股份有限公司 研磨裝置及研磨狀態監視方法
JP6033751B2 (ja) * 2013-10-07 2016-11-30 株式会社荏原製作所 研磨方法
JP6595987B2 (ja) * 2014-04-22 2019-10-23 株式会社荏原製作所 研磨方法
US9352440B2 (en) * 2014-04-30 2016-05-31 Applied Materials, Inc. Serial feature tracking for endpoint detection
TWI743176B (zh) 2016-08-26 2021-10-21 美商應用材料股份有限公司 獲得代表在基板上的層的厚度的測量的方法，及量測系統和電腦程式產品
US10427272B2 (en) * 2016-09-21 2019-10-01 Applied Materials, Inc. Endpoint detection with compensation for filtering
JP6989317B2 (ja) 2017-08-04 2022-01-05 キオクシア株式会社 研磨装置、研磨方法、およびプログラム
US12236573B2 (en) * 2020-12-03 2025-02-25 Battelle Memorial Institute Optical end-pointing for integrated circuit delayering; systems and methods using the same
JP7714670B2 (ja) 2021-03-04 2025-07-29 アプライド マテリアルズ インコーポレイテッド 基板画像の処理に基づいたピクセルおよび領域の膜不均一分類
US20240189958A1 (en) * 2022-12-07 2024-06-13 Illinois Tool Works Inc. Systems and methods to detect rotation of a vibratory polisher

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US6191864B1 (en) * 1996-05-16 2001-02-20 Micron Technology, Inc. Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers
US6618130B2 (en) * 2001-08-28 2003-09-09 Speedfam-Ipec Corporation Method and apparatus for optical endpoint detection during chemical mechanical polishing
US20050026542A1 (en) * 2003-07-31 2005-02-03 Tezer Battal Detection system for chemical-mechanical planarization tool
US20070042675A1 (en) * 2005-08-22 2007-02-22 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
US20080099443A1 (en) * 2006-10-31 2008-05-01 Applied Materials, Inc. Peak-based endpointing for chemical mechanical polishing
US20100093260A1 (en) * 2008-10-10 2010-04-15 Ebara Corporation Method of making diagram for use in selection of wavelength of light for polishing endpoint detection, method and apparatus for selecting wavelength of light for polishing endpoint detection, polishing endpoint detection method, polishing endpoint detection apparatus, and polishing monitoring method
US20100124870A1 (en) * 2008-11-14 2010-05-20 Applied Materials, Inc. Semi-Quantitative Thickness Determination

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JP2001287159A (ja) * 2000-04-05 2001-10-16 Nikon Corp 表面状態測定方法及び測定装置及び研磨装置及び半導体デバイス製造方法
US6605405B2 (en) 2000-07-26 2003-08-12 Canon Kabushiki Kaisha Electrophotographic method and electrophotographic apparatus
JP3946470B2 (ja) * 2001-03-12 2007-07-18 株式会社デンソー 半導体層の膜厚測定方法及び半導体基板の製造方法
JP2002359217A (ja) 2001-05-31 2002-12-13 Omron Corp 研磨終点検出方法およびその装置
JP5534672B2 (ja) * 2005-08-22 2014-07-02 アプライド マテリアルズ インコーポレイテッド 化学機械的研磨のスペクトルに基づく監視のための装置および方法
JP5274105B2 (ja) * 2008-05-26 2013-08-28 株式会社東京精密 研磨終点検出方法
JP4739393B2 (ja) * 2008-11-11 2011-08-03 株式会社荏原製作所 研磨終点検知用の光の波長選択に用いられるダイヤグラムの作成方法、光の波長選択方法、研磨終点検出方法、研磨終点検出装置、および研磨装置
JP2010093147A (ja) * 2008-10-10 2010-04-22 Ebara Corp 研磨進捗監視方法および研磨装置
KR101861834B1 (ko) 2009-11-03 2018-05-28 어플라이드 머티어리얼스, 인코포레이티드 시간에 대한 스펙트럼들 등고선 플롯들의 피크 위치를 이용한 종료점 방법
US8834229B2 (en) 2010-05-05 2014-09-16 Applied Materials, Inc. Dynamically tracking spectrum features for endpoint detection
US8930013B2 (en) 2010-06-28 2015-01-06 Applied Materials, Inc. Adaptively tracking spectrum features for endpoint detection
JP5612945B2 (ja) * 2010-07-23 2014-10-22 株式会社荏原製作所 基板の研磨の進捗を監視する方法および研磨装置
US8535115B2 (en) * 2011-01-28 2013-09-17 Applied Materials, Inc. Gathering spectra from multiple optical heads
US8657646B2 (en) * 2011-05-09 2014-02-25 Applied Materials, Inc. Endpoint detection using spectrum feature trajectories
US9233450B2 (en) * 2011-08-23 2016-01-12 Applied Materials, Inc. Optical detection of metal layer clearance
US9168630B2 (en) * 2012-04-23 2015-10-27 Applied Materials, Inc. User-input functions for data sequences in polishing endpoint detection
US9289875B2 (en) * 2012-04-25 2016-03-22 Applied Materials, Inc. Feed forward and feed-back techniques for in-situ process control

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6191864B1 (en) * 1996-05-16 2001-02-20 Micron Technology, Inc. Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers
US6618130B2 (en) * 2001-08-28 2003-09-09 Speedfam-Ipec Corporation Method and apparatus for optical endpoint detection during chemical mechanical polishing
US20050026542A1 (en) * 2003-07-31 2005-02-03 Tezer Battal Detection system for chemical-mechanical planarization tool
US20070042675A1 (en) * 2005-08-22 2007-02-22 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
US20080099443A1 (en) * 2006-10-31 2008-05-01 Applied Materials, Inc. Peak-based endpointing for chemical mechanical polishing
US20100093260A1 (en) * 2008-10-10 2010-04-15 Ebara Corporation Method of making diagram for use in selection of wavelength of light for polishing endpoint detection, method and apparatus for selecting wavelength of light for polishing endpoint detection, polishing endpoint detection method, polishing endpoint detection apparatus, and polishing monitoring method
US20100124870A1 (en) * 2008-11-14 2010-05-20 Applied Materials, Inc. Semi-Quantitative Thickness Determination

Also Published As

Publication number Publication date
JP2013541827A (ja) 2013-11-14
US20120021672A1 (en) 2012-01-26
KR101484696B1 (ko) 2015-01-21
US8814631B2 (en) 2014-08-26
TW201220415A (en) 2012-05-16
WO2012012530A3 (en) 2013-08-01
KR20130093099A (ko) 2013-08-21
WO2012012530A2 (en) 2012-01-26

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