TWI477767B - - Google Patents
Info
- Publication number
- TWI477767B TWI477767B TW101142895A TW101142895A TWI477767B TW I477767 B TWI477767 B TW I477767B TW 101142895 A TW101142895 A TW 101142895A TW 101142895 A TW101142895 A TW 101142895A TW I477767 B TWI477767 B TW I477767B
- Authority
- TW
- Taiwan
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101142895A TW201421013A (zh) | 2012-11-16 | 2012-11-16 | 電子元件檢查分類設備 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101142895A TW201421013A (zh) | 2012-11-16 | 2012-11-16 | 電子元件檢查分類設備 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201421013A TW201421013A (zh) | 2014-06-01 |
TWI477767B true TWI477767B (ja) | 2015-03-21 |
Family
ID=51393355
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101142895A TW201421013A (zh) | 2012-11-16 | 2012-11-16 | 電子元件檢查分類設備 |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW201421013A (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016156715A (ja) * | 2015-02-25 | 2016-09-01 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
TWI585393B (zh) * | 2015-10-30 | 2017-06-01 | 由田新技股份有限公司 | 料件檢查系統及料件檢查方法 |
CN106226329A (zh) * | 2016-09-08 | 2016-12-14 | 连云港康达智精密技术有限公司 | 手机镜头外观检查机 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003234361A (ja) * | 2002-02-07 | 2003-08-22 | Mitsui High Tec Inc | 半導体装置の検査方法及び設備 |
JP2007188975A (ja) * | 2006-01-11 | 2007-07-26 | Sony Corp | 欠陥検査装置及び欠陥検査方法 |
WO2008126955A1 (en) * | 2007-04-13 | 2008-10-23 | Jt Corporation | Apparatus for inspecting semiconductor device |
TW200846653A (en) * | 2007-02-06 | 2008-12-01 | Hanmi Semiconductor Co Ltd | Vision system for sawing & placement equipment |
TW201033600A (en) * | 2008-12-17 | 2010-09-16 | Rokko Ventures Pte Ltd | System and processing of a substrate |
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2012
- 2012-11-16 TW TW101142895A patent/TW201421013A/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003234361A (ja) * | 2002-02-07 | 2003-08-22 | Mitsui High Tec Inc | 半導体装置の検査方法及び設備 |
JP2007188975A (ja) * | 2006-01-11 | 2007-07-26 | Sony Corp | 欠陥検査装置及び欠陥検査方法 |
TW200846653A (en) * | 2007-02-06 | 2008-12-01 | Hanmi Semiconductor Co Ltd | Vision system for sawing & placement equipment |
WO2008126955A1 (en) * | 2007-04-13 | 2008-10-23 | Jt Corporation | Apparatus for inspecting semiconductor device |
TW201033600A (en) * | 2008-12-17 | 2010-09-16 | Rokko Ventures Pte Ltd | System and processing of a substrate |
Also Published As
Publication number | Publication date |
---|---|
TW201421013A (zh) | 2014-06-01 |