TWI477767B - - Google Patents

Info

Publication number
TWI477767B
TWI477767B TW101142895A TW101142895A TWI477767B TW I477767 B TWI477767 B TW I477767B TW 101142895 A TW101142895 A TW 101142895A TW 101142895 A TW101142895 A TW 101142895A TW I477767 B TWI477767 B TW I477767B
Authority
TW
Taiwan
Application number
TW101142895A
Other languages
Chinese (zh)
Other versions
TW201421013A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW101142895A priority Critical patent/TW201421013A/zh
Publication of TW201421013A publication Critical patent/TW201421013A/zh
Application granted granted Critical
Publication of TWI477767B publication Critical patent/TWI477767B/zh

Links

TW101142895A 2012-11-16 2012-11-16 電子元件檢查分類設備 TW201421013A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW101142895A TW201421013A (zh) 2012-11-16 2012-11-16 電子元件檢查分類設備

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101142895A TW201421013A (zh) 2012-11-16 2012-11-16 電子元件檢查分類設備

Publications (2)

Publication Number Publication Date
TW201421013A TW201421013A (zh) 2014-06-01
TWI477767B true TWI477767B (ja) 2015-03-21

Family

ID=51393355

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101142895A TW201421013A (zh) 2012-11-16 2012-11-16 電子元件檢查分類設備

Country Status (1)

Country Link
TW (1) TW201421013A (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016156715A (ja) * 2015-02-25 2016-09-01 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
TWI585393B (zh) * 2015-10-30 2017-06-01 由田新技股份有限公司 料件檢查系統及料件檢查方法
CN106226329A (zh) * 2016-09-08 2016-12-14 连云港康达智精密技术有限公司 手机镜头外观检查机

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003234361A (ja) * 2002-02-07 2003-08-22 Mitsui High Tec Inc 半導体装置の検査方法及び設備
JP2007188975A (ja) * 2006-01-11 2007-07-26 Sony Corp 欠陥検査装置及び欠陥検査方法
WO2008126955A1 (en) * 2007-04-13 2008-10-23 Jt Corporation Apparatus for inspecting semiconductor device
TW200846653A (en) * 2007-02-06 2008-12-01 Hanmi Semiconductor Co Ltd Vision system for sawing & placement equipment
TW201033600A (en) * 2008-12-17 2010-09-16 Rokko Ventures Pte Ltd System and processing of a substrate

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003234361A (ja) * 2002-02-07 2003-08-22 Mitsui High Tec Inc 半導体装置の検査方法及び設備
JP2007188975A (ja) * 2006-01-11 2007-07-26 Sony Corp 欠陥検査装置及び欠陥検査方法
TW200846653A (en) * 2007-02-06 2008-12-01 Hanmi Semiconductor Co Ltd Vision system for sawing & placement equipment
WO2008126955A1 (en) * 2007-04-13 2008-10-23 Jt Corporation Apparatus for inspecting semiconductor device
TW201033600A (en) * 2008-12-17 2010-09-16 Rokko Ventures Pte Ltd System and processing of a substrate

Also Published As

Publication number Publication date
TW201421013A (zh) 2014-06-01

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