TWI474403B - 高效能高準確度加熱驅動器 - Google Patents

高效能高準確度加熱驅動器 Download PDF

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Publication number
TWI474403B
TWI474403B TW100105125A TW100105125A TWI474403B TW I474403 B TWI474403 B TW I474403B TW 100105125 A TW100105125 A TW 100105125A TW 100105125 A TW100105125 A TW 100105125A TW I474403 B TWI474403 B TW I474403B
Authority
TW
Taiwan
Prior art keywords
transistor
temperature
wafer
power
processing chamber
Prior art date
Application number
TW100105125A
Other languages
English (en)
Chinese (zh)
Other versions
TW201145395A (en
Inventor
高汀亞歷山大
希莉布萊諾夫歐佳Ｖ
Original Assignee
應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TW201145395A publication Critical patent/TW201145395A/zh
Application granted granted Critical
Publication of TWI474403B publication Critical patent/TWI474403B/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C15/00—Details
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C15/00—Details
    • F24C15/24—Radiant bodies or panels for radiation heaters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0233—Industrial applications for semiconductors manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Control Of Resistance Heating (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Control Of Temperature (AREA)
  • Control Of Electrical Variables (AREA)
TW100105125A 2010-02-19 2011-02-16 高效能高準確度加熱驅動器 TWI474403B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/708,648 US8548312B2 (en) 2010-02-19 2010-02-19 High efficiency high accuracy heater driver

Publications (2)

Publication Number Publication Date
TW201145395A TW201145395A (en) 2011-12-16
TWI474403B true TWI474403B (zh) 2015-02-21

Family

ID=44476555

Family Applications (2)

Application Number Title Priority Date Filing Date
TW100105125A TWI474403B (zh) 2010-02-19 2011-02-16 高效能高準確度加熱驅動器
TW103144545A TWI590333B (zh) 2010-02-19 2011-02-16 高效能高準確度加熱驅動器

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW103144545A TWI590333B (zh) 2010-02-19 2011-02-16 高效能高準確度加熱驅動器

Country Status (8)

Country Link
US (3) US8548312B2 (https=)
EP (1) EP2537178A4 (https=)
JP (3) JP5887282B2 (https=)
KR (2) KR101824234B1 (https=)
CN (2) CN104617013B (https=)
SG (1) SG183187A1 (https=)
TW (2) TWI474403B (https=)
WO (1) WO2011103391A2 (https=)

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US10734257B2 (en) * 2012-04-25 2020-08-04 Applied Materials, Inc. Direct current lamp driver for substrate processing
US9734659B2 (en) * 2014-08-06 2017-08-15 Mido Play Inc. Single platform system for multiple jurisdiction lotteries and social media
TWI691233B (zh) * 2015-01-05 2020-04-11 美商應用材料股份有限公司 用於低壓環境的燈驅動器
TWI612259B (zh) * 2016-02-26 2018-01-21 財團法人工業技術研究院 加熱設備以及加熱方法
CN109863584B (zh) 2016-06-15 2023-05-26 沃特洛电气制造公司 用于热系统的功率转换器
US10908195B2 (en) 2016-06-15 2021-02-02 Watlow Electric Manufacturing Company System and method for controlling power to a heater
CN111226498B (zh) * 2017-08-10 2022-04-12 沃特洛电气制造公司 用于控制给加热器的功率的系统和方法
CN109429382A (zh) * 2017-08-24 2019-03-05 江苏威能电气有限公司 快速升降温加热器
DE102018203945B4 (de) 2018-03-15 2023-08-10 Siltronic Ag Verfahren zur Herstellung von Halbleiterscheiben
CN110554717B (zh) * 2019-08-15 2021-08-24 国电南瑞科技股份有限公司 适用于电力电子装置温度闭环调节的散热风扇设速方法
CN113405323A (zh) * 2021-07-21 2021-09-17 东方凯特瑞(成都)环保科技有限公司 一种用于蜂窝scr脱硝催化剂的微波干燥方法及装置
CN114060892B (zh) * 2021-11-29 2023-05-16 奥普家居股份有限公司 一种恒温浴霸及其控制方法、存储介质

Citations (3)

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EP1091622A2 (en) * 1999-10-07 2001-04-11 Ushiodenki Kabushiki Kaisha Control apparatus for a light radiation-type rapid heating and processing device
US20060051077A1 (en) * 2004-08-24 2006-03-09 Fujitsu Limited Rapid thermal processing apparatus and method of manufacture of semiconductor device
TW200921791A (en) * 2007-11-05 2009-05-16 United Microelectronics Corp Method of cleaning transparent device in a thermal process apparatus, thermal process apparatus and process using the same thermal process apparatus

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JPH0327408A (ja) * 1989-06-24 1991-02-05 Matsushita Electric Works Ltd デユーテイ制御装置
JP3215613B2 (ja) * 1995-10-04 2001-10-09 古河電池株式会社 力率制御回路
US5751896A (en) * 1996-02-22 1998-05-12 Micron Technology, Inc. Method and apparatus to compensate for non-uniform film growth during chemical vapor deposition
US5841110A (en) 1997-08-27 1998-11-24 Steag-Ast Gmbh Method and apparatus for improved temperature control in rapid thermal processing (RTP) systems
JP3304894B2 (ja) * 1998-09-28 2002-07-22 ウシオ電機株式会社 フィラメントランプ点灯装置
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US20080090309A1 (en) 2003-10-27 2008-04-17 Ranish Joseph M Controlled annealing method
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KR100966375B1 (ko) * 2005-04-04 2010-06-28 가부시키가이샤 코쿠사이덴키 세미컨덕터 서비스 공급전력 조정기 및 반도체 제조장치
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KR20090069907A (ko) * 2007-12-26 2009-07-01 에이피시스템 주식회사 가열램프 제어장치 및 제어방법
JP5282409B2 (ja) 2008-02-25 2013-09-04 ウシオ電機株式会社 光照射式加熱方法及び光照射式加熱装置
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Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
EP1091622A2 (en) * 1999-10-07 2001-04-11 Ushiodenki Kabushiki Kaisha Control apparatus for a light radiation-type rapid heating and processing device
US20060051077A1 (en) * 2004-08-24 2006-03-09 Fujitsu Limited Rapid thermal processing apparatus and method of manufacture of semiconductor device
TW200921791A (en) * 2007-11-05 2009-05-16 United Microelectronics Corp Method of cleaning transparent device in a thermal process apparatus, thermal process apparatus and process using the same thermal process apparatus

Also Published As

Publication number Publication date
KR101890155B1 (ko) 2018-08-21
US20110206358A1 (en) 2011-08-25
JP5887282B2 (ja) 2016-03-16
WO2011103391A2 (en) 2011-08-25
TW201145395A (en) 2011-12-16
US8548312B2 (en) 2013-10-01
US20140027440A1 (en) 2014-01-30
CN102763201B (zh) 2015-07-15
EP2537178A4 (en) 2013-07-17
US20170162408A1 (en) 2017-06-08
KR20180014208A (ko) 2018-02-07
KR20120137367A (ko) 2012-12-20
CN102763201A (zh) 2012-10-31
CN104617013B (zh) 2017-11-14
JP6324938B2 (ja) 2018-05-16
TW201517176A (zh) 2015-05-01
SG183187A1 (en) 2012-09-27
KR101824234B1 (ko) 2018-01-31
JP2013520801A (ja) 2013-06-06
EP2537178A2 (en) 2012-12-26
TWI590333B (zh) 2017-07-01
JP2016076708A (ja) 2016-05-12
JP2018093210A (ja) 2018-06-14
CN104617013A (zh) 2015-05-13
WO2011103391A3 (en) 2012-02-09
US9612020B2 (en) 2017-04-04

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