TWI470759B - Package substrate and fabrication method thereof - Google Patents

Description

Package substrate and its preparation method

The invention relates to a package substrate and a preparation method thereof, in particular to a package substrate with a metal column and a preparation method thereof.

With the development trend of miniaturization of electronic products, the area of the printed circuit board (PCB) surface for mounting the semiconductor package structure is getting smaller and smaller, so a three-dimensional stacking technology of the semiconductor package structure is developed, which is attached to a semiconductor package structure. Metal bumps or metal pillars are formed thereon, and another semiconductor package structure is stacked on the metal bumps or metal pillars to form a package on package (POP) to conform to a small surface joint area. Requirements for setting with high density components.

Please refer to FIGS. 1A to 1J, which are cross-sectional views of a conventional package substrate for a package and a method of manufacturing the same.

As shown in FIG. 1A, a substrate body 10 is provided having an opposite first surface 10a and a second surface 10b. The first surface 10a has a plurality of first electrical contact pads 111 and a plurality of second electrical contact pads 112. The second surface 10b of the substrate body 10 has a plurality of third electrical contact pads 113. The first surface 10a, the first electrical contact pads 111 and the second electrical contact pads 112 are formed with a first insulation. The first insulating layer 12a has a first opening 121 and a second opening 122 respectively corresponding to the first electrical contact pads 111 and the second electrical contact pads 112, respectively, on the second surface A second insulating protective layer 12b is formed on the 10b and the third electrical contact pads 113, and the second insulating protective layer 12b has a corresponding corresponding exposed third electrical The third opening 123 of the contact pad 113.

As shown in FIG. 1B, a first conductive layer 13a is formed on the first insulating protective layer 12a, the first electrical contact pad 111 and the second electrical contact pad 112, and the second insulating protective layer 12b and the second insulating protective layer 12b A second conductive layer 13b is formed on the three-electrode contact pad 113.

As shown in FIG. 1C, a first resist layer 14a is formed on the first conductive layer 13a, and the first resist layer 14a has a first resistor corresponding to each of the first opening 121 and the second opening 122, respectively. The layer opening 141 and the second resist layer opening 142 form a third resist layer 14b on the second conductive layer 13b.

As shown in FIG. 1D, first metal bumps 151 and second metal bumps 152 are respectively plated in each of the first resistive layer opening 141 and the second resistive layer opening 142.

As shown in FIG. 1E, a second resist layer 17 is formed on the first resistive layer 14a, the first metal bump 151 and the second metal bump 152, and the second resist layer 17 has the second metal exposed. The third resistive opening 170 of the bump 152.

As shown in FIG. 1F, a solder layer 16 is formed on each of the second metal bumps 152.

As shown in FIG. 1G, the second resist layer 17, the first resist layer 14a and the third resist layer 14b are removed.

As shown in FIG. 1H, a fourth resist layer 19a is formed on the first conductive layer 13a and the solder layer 16, and the fourth resist layer 19a has a plurality of fourth resist layers corresponding to the first metal bumps 151. The hole 190 and the fifth resist layer 19b are formed on the second conductive layer 13b.

As shown in FIG. 1I, metal posts 18 are formed on each of the first metal bumps 151.

As shown in FIG. 1J, the fourth resist layer 19a and the first conductive layer 13a covered thereby are removed, and the fifth resist layer 19b and the second conductive layer 13b covered thereby are removed.

However, the conventional method for manufacturing a package substrate is three times of a resist layer patterning process and two resist layer removal processes, and the overall process flow is complicated, lengthy, and time consuming, so that the cost of the overall product is not easily reduced, and ultimately it is easy. Lead to loss of competitiveness.

Therefore, how to propose a package substrate and a manufacturing method thereof to avoid the problem that the manufacturing process of the prior art is too complicated and inefficient, resulting in an excessively high product cost has become a problem to be solved at present.

In view of the cumbersome process of the above-mentioned prior art, the present invention discloses a package substrate comprising: a substrate body having opposite first and second surfaces, and the first surface having a plurality of first electrical contact pads And a plurality of second electrical contact pads; the first insulating protective layer is formed on the first surface, the first electrical contact pad and the second electrical contact pad, and the first insulating protective layer has a plurality of corresponding corresponding exposed a first opening and a second opening of each of the first electrical contact pads and the second electrical contact pads; and a conductive layer formed on each of the first electrical contact pads, the second electrical contact pads, and the periphery thereof The first metal bump and the second metal bump are respectively formed on the conductive layer above the first electrical contact pad and the second electrical contact pad; the solder layer is Formed on the second metal bump; and gold The pillars are formed on the first metal bump, and the width of the metal pillar is different from the width of the first metal bump.

The present invention discloses a package substrate, comprising: a substrate body having opposite first and second surfaces, the first surface having a plurality of first electrical contact pads and a plurality of second electrical contact pads; a protective layer is formed on the first surface, the first electrical contact pad and the second electrical contact pad, the first insulating protective layer respectively corresponding to the exposed first electrical contact pads and the second electrical a first opening and a second opening of the contact pad; a conductive layer formed on each of the first electrical contact pad, the second electrical contact pad and the first insulating protective layer on the periphery thereof; the metal bump Corresponding to the conductive layer formed on each of the second electrical contact pads; a solder layer formed on the metal bump; and a metal pillar corresponding to the conductive layer formed on each of the first electrical contact pads On the floor.

The invention discloses a method for manufacturing a package substrate, comprising: providing a substrate body having opposite first and second surfaces, the first surface having a plurality of first electrical contact pads and a plurality of second electrical contact pads Forming, on the first surface, the first electrical contact pad and the second electrical contact pad, a first insulating protective layer, wherein the first insulating protective layer has a corresponding corresponding first exposed first electrical contact pad and a first opening and a second opening of the second electrical contact pad; forming a conductive layer on the first insulating protective layer, the first electrical contact pad and the second electrical contact pad; forming a first resistance on the conductive layer a first resist layer having a first resistive opening and a second resistive opening respectively corresponding to each of the first opening and the second opening; and the first resistive opening and the second Forming a first metal bump and a second metal bump respectively in the opening of the resist layer; Forming a solder layer on the first metal bump and the second metal bump; forming a second resist layer on the first resist layer and the solder layer, the second resist layer having a third corresponding to the first metal bump a barrier layer opening; removing a solder layer on the first metal bump; forming a metal pillar on each of the first metal bumps; and removing the second resist layer, the first resist layer, and the conductive layer covered thereby Floor.

The invention further discloses a method for fabricating another package substrate, comprising: providing a substrate body having opposite first and second surfaces, the first surface having a plurality of first electrical contact pads and a plurality of second electrical contacts a first insulating protective layer is formed on the first surface, the first electrical contact pad and the second electrical contact pad, and the first insulating protective layer has a corresponding corresponding first electrical contact pad and a first opening and a second opening of the second electrical contact pad; forming a conductive layer on the first insulating protective layer, the first electrical contact pad and the second electrical contact pad; forming a first layer on the conductive layer a first resist layer having a first resistive opening corresponding to each of the second openings; electroplating on the conductive layer in each of the first resistive openings to form a metal bump; Forming a solder layer on the block; removing the first resist layer; forming a second resist layer on the conductive layer, the metal bump and the solder layer, the second resist layer having a second resist layer corresponding to the first opening a hole; a metal pillar is formed on the conductive layer in each of the openings of the second resist layer; And removing the second resist layer and the conductive layer covered.

As can be seen from the above, since the present invention forms metal bumps and metal pillars on the package substrate with less resist patterning process and barrier removal process, the overall process steps and time can be shortened, thereby facilitating cost. reduce.

The other embodiments of the present invention will be readily understood by those skilled in the art from this disclosure.

It is to be understood that the structure, the proportions, the size, and the like of the present invention are intended to be used in conjunction with the disclosure of the specification, and are not intended to limit the invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effects and the objectives that can be achieved by the present invention. The technical content disclosed in the invention can be covered. In the meantime, the terms "upper", "peripheral" and "above" as used in the specification are merely for convenience of description, and are not intended to limit the scope of the invention, and the relative relationship may be changed or Adjustments, where there is no material change, are considered to be within the scope of the invention.

First embodiment

2A to 2I are cross-sectional views showing a first embodiment of a package substrate and a method of manufacturing the same according to the present invention, wherein the 2F' to 2I' and the 2F' to 2I' drawings are 2F to 2I. Different implementations.

As shown in FIG. 2A, a substrate body 20 is provided having an opposite first surface 20a and a second surface 20b. The first surface 20a has a plurality of first electrical contact pads 211 and a plurality of second electrical contact pads 212. The second surface 20b of the substrate body 20 has a plurality of third electrical contact pads 213, and a first insulation is formed on the first surface 20a, the first electrical contact pads 211 and the second electrical electrical contact pads 212. Protective layer 22a, the first insulation protection The layer 22a has a first opening 221 and a second opening 222 respectively corresponding to the first electrical contact pads 211 and the second electrical contact pads 212, and the second surface 20b and the third electrical contact pads 213. The second insulating protective layer 22b has a third opening 223 corresponding to each of the third electrical contact pads 213. The substrate body 20 can be a core board and has a core. Multilayer boards, coreless single layer boards or coreless multi-layer boards.

As shown in FIG. 2B, a first conductive layer 23a is formed on the first insulating protective layer 22a, the first electrical contact pad 211 and the second electrical contact pad 212, and the second insulating protective layer 22b and the second insulating protective layer 22b A second conductive layer 23b is formed on the three-electrode contact pad 213.

As shown in FIG. 2C, a first resist layer 24a is formed on the first conductive layer 23a, and the first resistive layer 24a has a first resistance corresponding to each of the first opening 221 and the second opening 222, respectively. The layer opening 241 and the second resist layer opening 242 form a third resist layer 24b on the second conductive layer 23b.

As shown in FIG. 2D, a first metal bump 251 and a second metal bump 252 are respectively plated in each of the first resistive layer opening 241 and the second resistive layer opening 242, and the first metal bump is formed. The material of the 251 and the second metal bumps 252 may be copper.

As shown in FIG. 2E, a solder layer 26 is formed on the first metal bump 251 and the second metal bump 252.

As shown in FIG. 2F, a second resist layer 27 is formed on the first resist layer 24a and the solder layer 26, and the second resist layer 27 has a third resistive opening 270 corresponding to the first metal bump 251. Wherein the hole of the third resistive layer opening 270 The diameter is equal to the aperture of the first resistive opening 241.

As shown in FIG. 2G, the solder layer 26 on the first metal bump 251 is removed.

As shown in FIG. 2H, a metal post 28 is formed on each of the first metal bumps 251, and the material of the metal post 28 may be copper.

As shown in FIG. 2I, the second resist layer 27, the first resist layer 24a and the first conductive layer 23a covered thereon are removed, and the third resist layer 24b and the second conductive layer covered thereby are removed. 23b.

Please also refer to the 2F′ to 2I′ and 2F′′ to 2I” diagrams, which are different implementations of the 2F to 2I diagrams, the main difference being only in the 2F′ to 2I′ diagrams. The aperture of the third resistive opening 270 is larger than the aperture of the first resistive opening 241, and the aperture of the third resistive opening 270 of the 2F' to 2I" is smaller than the first resistive opening 241. The apertures and other parts are substantially the same, and those skilled in the art to which the present invention pertains should be able to understand the specific steps of the 2F' to 2I' and 2F' to 2I" diagrams according to the 2F to 2I diagrams. Repeat them.

Second embodiment

3A to 3I are cross-sectional views showing a second embodiment of the package substrate of the present invention and a method of manufacturing the same.

As shown in FIG. 3A, a substrate body 20 is provided having an opposite first surface 20a and a second surface 20b. The first surface 20a has a plurality of first electrical contact pads 211 and a plurality of second electrical contact pads 212. The second surface 20b of the substrate body 20 has a plurality of third electrical contact pads 213, and the first surface 20a, the first electrical contact pads 211 and the second electrical contact pads A first insulating protective layer 22a is formed on the contact pad 212, and the first insulating protective layer 22a has a first opening 221 and a second corresponding to each of the first electrical contact pad 211 and the second electrical contact pad 212 respectively. The second insulating layer 22b is formed on the second surface 20b and the third electrical contact pad 213, and the second insulating protective layer 22b has a third corresponding to the third electrical contact pads 213. The opening 223, wherein the substrate body 20 can be a core board, a cored multi-layer board, a coreless single layer board or a coreless multi-layer board.

As shown in FIG. 3B, a first conductive layer 23a is formed on the first insulating protective layer 22a, the first electrical contact pads 211 and the second electrical contact pads 212, and the second insulating protective layer 22b and the second insulating protective layer 22b A second conductive layer 23b is formed on the three-electrode contact pad 213.

As shown in FIG. 3C, a first resistive layer 24a is formed on the first conductive layer 23a, and the first resistive layer 24a has a first resistive opening 240 corresponding to each of the second openings 222. A third resist layer 24b is formed on the second conductive layer 23b.

As shown in FIG. 3D, metal bumps 25 are formed on the first conductive layer 23a in each of the first barrier openings 240, and the metal bumps 25 may be made of copper.

As shown in FIG. 3E, a solder layer 26 is formed on the metal bumps 25.

As shown in FIG. 3F, the first resist layer 24a and the third resist layer 24b are removed.

As shown in FIG. 3G, a second resist layer 27a is formed on the first conductive layer 23a, the metal bumps 25 and the solder layer 26, and the second resist layer 27a has a second resist layer corresponding to the first opening 221 Opening 271, and in the second conductive A fourth resist layer 27b is formed on the layer 23b.

As shown in FIG. 3H, metal pillars 28 are formed on the first conductive layer 23a in each of the second resistive layer openings 271, and the metal pillars 28 may be made of copper.

As shown in FIG. 3I, the second resist layer 27a and the first conductive layer 23a covered thereby are removed, and the fourth resist layer 27b and the second conductive layer 23b covered thereby are removed.

The present invention further provides a package substrate, comprising: a substrate body 20 having opposite first and second surfaces 20a and 20b, and the first surface 20a has a plurality of first electrical contact pads 211 and a plurality of second electrical properties. The first insulating protective layer 22a is formed on the first surface 20a, the first electrical contact pad 211 and the second electrical contact pad 212, and the first insulating protective layer 22a has a plurality of corresponding The first opening 221 and the second opening 222 of the first electrical contact pad 211 and the second electrical contact pad 212 are exposed; the first conductive layer 23a is formed on each of the first electrical contact pads 211, The second electrical contact pad 212 and the peripheral first insulating protective layer 22a thereof; the first metal bump 251 and the second metal bump 252 are respectively formed on the first electrical contact pads 211 and the second On the first conductive layer 23a above the electrical contact pad 212; a solder layer 26 is formed on the second metal bump 252; and a metal pillar 28 is formed on the first metal bump 251, and the metal The width of the post 28 is different from the width of the first metal bump 251.

In the foregoing package substrate, the width of the metal pillar 28 is greater or smaller than the width of the first metal bump 251.

The second surface 20b of the substrate body 20 according to the package substrate as described above A plurality of third electrical contact pads 213 are formed, and a second insulating protective layer 22b is formed on the second surface 20b and the third electrical contact pads 213, and the second insulating protective layer 22b has corresponding corresponding exposed third electrical properties. The third opening 223 of the contact pad 213.

In the package substrate of the present invention, the substrate body 20 is a core board, a core multi-layer board, a coreless single layer board or a coreless multi-layer board, and the first metal bump 251 and the second metal bump The material of 252 and metal post 28 is copper.

The present invention further provides another package substrate, comprising: a substrate body 20 having an opposite first surface 20a and a second surface 20b, the first surface 20a having a plurality of first electrical contact pads 211 and a plurality of second electrical properties The first insulating protective layer 22a is formed on the first surface 20a, the first electrical contact pad 211 and the second electrical contact pad 212, and the first insulating protective layer 22a has a corresponding exposed surface. a first opening 221 and a second opening 222 of the first electrical contact pad 211 and the second electrical contact pad 212; the first conductive layer 23a is formed on each of the first electrical contact pads 211, a second electrical contact pad 212 and a peripheral insulating layer 22a thereon; a metal bump 25 corresponding to the first conductive layer 23a formed on each of the second electrical contact pads 212; the solder layer 26 And being formed on the metal bumps 25; and the metal pillars 28 are correspondingly formed on the first conductive layer 23a above the first electrical contact pads 211.

In the foregoing package substrate, the substrate body 20 is a core board, a core multi-layer board, a coreless single layer board or a coreless multi-layer board.

In the package substrate of the present invention, the second surface of the substrate body 20 20b has a plurality of third electrical contact pads 213, and a second insulating protective layer 22b is formed on the second surface 20b and the third electrical contact pads 213, and the second insulating protective layer 22b has corresponding corresponding exposed third electrical The third opening 223 of the contact pad 213.

In the package substrate, the metal bumps 25 and the metal pillars 28 are made of copper.

In summary, unlike the prior art, since the present invention forms metal bumps and metal pillars on the package substrate with fewer resist layer patterning processes and resist removal processes, the overall process steps can be shortened. Time, which in turn contributes to cost reduction.

The above embodiments are intended to illustrate the principles of the invention and its effects, and are not intended to limit the invention. Any of the above-described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the appended claims.

10,20‧‧‧Substrate body

10a, 20a‧‧‧ first surface

10b, 20b‧‧‧ second surface

111,211‧‧‧First electrical contact pads

112,212‧‧‧Second electrical contact pads

113,213‧‧‧ Third electrical contact pads

12a, 22a‧‧‧first insulating protective layer

12b, 22b‧‧‧Second insulation protection layer

121,221‧‧‧ first opening

122, 222‧‧‧ second opening

123, 223‧‧‧ third opening

13a, 23a‧‧‧ first conductive layer

13b, 23b‧‧‧ second conductive layer

14a, 24a‧‧‧ first barrier

14b, 24b‧‧‧ third resistive layer

141,240,241‧‧‧first barrier opening

142,242,271‧‧‧second barrier opening

151,251‧‧‧First metal bumps

152,252‧‧‧Second metal bumps

16,26‧‧‧ solder layer

17,27,27a‧‧‧second barrier

170, 270‧‧‧ third barrier opening

18,28‧‧‧Metal column

19a, 27b‧‧‧ fourth resistive layer

19b‧‧‧ fifth barrier layer

190‧‧‧4th barrier layer opening

25‧‧‧Metal bumps

1A to 1J are cross-sectional views of a conventional package substrate for laminating a package and a method of manufacturing the same; and FIGS. 2A to 2I are cross-sectional views showing a first embodiment of the package substrate of the present invention and a method of manufacturing the same, wherein the 2F' 2A' and 2F" to 2I" are different embodiments of the 2F to 2I drawings; and 3A to 3I are cross-sectional views of the second embodiment of the package substrate of the present invention and a method of manufacturing the same.

20‧‧‧Substrate body

20a‧‧‧ first surface

20b‧‧‧second surface

211‧‧‧First electrical contact pads

212‧‧‧Second electrical contact pads

213‧‧‧ Third electrical contact pad

22a‧‧‧First insulation protection layer

22b‧‧‧Second insulation protection layer

221‧‧‧ first opening

222‧‧‧Second opening

223‧‧‧ third opening

23a‧‧‧First conductive layer

251‧‧‧First metal bump

252‧‧‧Second metal bumps

26‧‧‧ solder layer

28‧‧‧Metal column

Claims (8)

A package substrate includes: a substrate body having opposite first and second surfaces, the first surface having a plurality of first electrical contact pads and a plurality of second electrical contact pads; a first insulating protective layer Formed on the first surface, the first electrical contact pad and the second electrical contact pad, the first insulating protective layer has a plurality of corresponding respective exposed first and second electrical contact pads a first opening and a second opening; a conductive layer formed on each of the first electrical contact pad, the second electrical contact pad and the first insulating protective layer on the periphery thereof; the metal bump corresponds to Formed on the conductive layer above each of the second electrical contact pads; a solder layer is formed on the metal bump; and a metal pillar corresponding to the conductive layer formed on each of the first electrical contact pads, And contacting the conductive layer above each of the first electrical contact pads, the metal pillars are higher than the solder layer, and are integrally formed. The package substrate according to claim 1, wherein the substrate is a core board, a core multi-layer board, a coreless single layer board or a coreless multi-layer board. The package substrate of claim 1, wherein the second surface of the substrate body has a plurality of third electrical contact pads, and the second surface and the third electrical contact pads are formed with a second insulating protective layer. The second insulating protective layer has a third corresponding to each of the third electrical contact pads Open the hole. The package substrate according to claim 1, wherein the metal bump and the metal pillar are made of copper. A method of manufacturing a package substrate, comprising: providing a substrate body having opposite first and second surfaces, the first surface having a plurality of first electrical contact pads and a plurality of second electrical contact pads a first insulating protective layer is formed on a surface, the first electrical contact pad and the second electrical contact pad, and the first insulating protective layer has a plurality of corresponding respective first electrical contact pads and second electrical properties respectively a first opening and a second opening of the contact pad; forming a conductive layer on the first insulating protective layer, the first electrical contact pad and the second electrical contact pad; forming a first resist layer on the conductive layer, and The first resistive layer has a first resistive opening corresponding to each of the second openings; a conductive bump is formed on the conductive layer in each of the first resistive openings to form a metal bump; and solder is formed on the metal bump Removing a first resist layer; forming a second resist layer on the conductive layer, the metal bump and the solder layer, the second resist layer having a second resist layer opening corresponding to the first opening; a metal pillar is integrally formed on the conductive layer in the opening of the second resist layer, Metal pillar in contact with each of the electrically conductive layer of the first side contact pads, and the metal-based post above the solder layer; and removing the resist layer and the second conductive layer is covered. The method for manufacturing a package substrate according to claim 5, wherein the substrate is a core plate, a core multi-layer plate, a coreless single layer plate or a coreless multi-layer plate. The method of manufacturing a package substrate according to claim 5, wherein the second surface of the substrate body has a plurality of third electrical contact pads, and the second surface and the third electrical contact pads are formed with a second insulation. a protective layer, the second insulating protective layer has a third opening corresponding to each of the third electrical contact pads. The method for manufacturing a package substrate according to claim 5, wherein the metal bump and the metal pillar are made of copper.