TW201601224A - Packaging substrate and method for fabricating the same - Google Patents

Abstract

A method for fabricating a packaging substrate is provided, including providing a metal layer having a plurality of conductive pads, forming an insulating protection layer on the metal layer, forming a dielectric layer on the insulating protection layer and the conductive pads, and forming on the dielectric layer a circuit layer electrically connected to the conductive pads. Through the subsequent formation of the insulating protection layer and the dielectric layer, the packaging substrate is robust, and the dielectric layer does not suffer from warpage. The packaging substrate does not need any additional supporting component. Therefore, the fabrication time for the packaging substrate is shortened. A packaging substrate is also provided.

Description

Package substrate structure and its preparation method

The invention relates to a package substrate structure, in particular to a package substrate structure and a method for manufacturing the same.

With the development of the electronics industry, today's electronic products have been designed in a light, short, and versatile manner, and semiconductor packaging technologies have also developed different packaging types. For different package structures, various package substrates for packaging have been developed to connect semiconductor wafers. In order to meet the packaging requirements for thinning semiconductor packages, a coreless package substrate technology has been developed.

1A to 1E are schematic cross-sectional views showing a method of manufacturing a package substrate 1 of a conventional coreless single-layer wiring.

As shown in FIG. 1A, a carrier 10 is provided which is constructed to form a support portion 10b on one side of a copper foil substrate 10a. Specifically, the copper foil substrate 10a has an insulating layer 101, and a copper foil layer 102 disposed on opposite surfaces of the insulating layer 101, and a glass fiber epoxy of the supporting portion 10b is formed on one of the copper foil layers 102. a fiberglass reinforced epoxy resin (such as FR-4) layer 103, the support portion 10b There is a first metal layer 104 (such as a copper layer) and a second metal layer 105 (such as a copper layer) sequentially formed on the glass fiber epoxy resin layer 103.

As shown in FIG. 1B, a patterning process is performed to form a plurality of electrical contact pads 11 on the second metal layer 105.

As shown in FIG. 1C, a dielectric layer 12 having a blind via 120 is formed on the second metal layer 105 and the electrical contact pads 11.

As shown in FIG. 1D, a circuit layer 13 is formed on the dielectric layer 12 by electroplating, and the circuit layer 13 has a plurality of conductive vias 130 formed in the blind via 120 to make the conductive via 130. The electrical contact pads 11 are electrically connected.

As shown in FIG. 1E, an insulating protective layer 14 is formed on the wiring layer 13 and the dielectric layer 12, and the insulating protective layer 14 is patterned to form an exposed portion 140 of the wiring layer 13. The package substrate 1 is on the carrier 10. Thereafter, a surface treatment layer 15 may be formed on the wiring layer 13 in the opening 140.

It can be applied to the packaging process in subsequent processes.

As shown in FIG. 1F, a wafer 16 is disposed on the insulating protective layer 14, and the wafer 16 is electrically connected to the wiring layer 13 by a plurality of bonding wires 17. Next, a molding operation is performed to form an encapsulant 18 on the insulating protective layer 14 to coat the wafer 16 and the bonding wire 17.

As shown in FIG. 1G, the first metal layer 104 and the second metal layer 105 are separated to remove the copper foil substrate 10a, the glass fiber epoxy layer 103, and the first metal layer 104. Specifically, the first metal layer 104 is physically The second metal layer 105 is combined with the high voltage, and the physical mode is a bonding, static electricity, adsorption, or adhesion, etc., and the first metal layer 104 may be physically stripped.

The second metal layer 105 is removed by etching as shown in FIG. 1H.

However, in the conventional method of manufacturing the package substrate 1 and the package, the carrier 10 having the copper foil substrate 10a and the support portion 10b is required as a support member to increase the structural support force and the strength of the overall structure, so that after the packaging process is performed, The copper foil substrate 10a, the glass fiber epoxy resin layer 103 and the first metal layer 104 are removed, and the second metal layer 105 is removed, that is, the process is removed twice, resulting in a large number of steps in the overall process. This results in lengthy process times and increases manufacturing costs.

Therefore, how to overcome the various problems of the above-mentioned prior art has become a difficult problem to be overcome in the industry.

The present invention provides a package substrate structure comprising: a metal layer having a plurality of electrical contact pads thereon; an insulating protective layer disposed on the metal layer, and the insulating protective layer The first surface and the second surface are opposite to expose the electrical contact pads to the first surface of the insulating protective layer, and the metal layer is only disposed on the second surface of the insulating protective layer; the dielectric layer And being disposed on the insulating protective layer and the electrical contact pads; and the circuit layer is disposed on the dielectric layer, and the circuit layer is electrically connected to the electrical contact pads.

The invention provides a method for fabricating a package substrate structure, comprising: providing a metal layer having a plurality of electrical contact pads; forming an insulating protective layer on On the metal layer, the insulating protective layer has a first surface and a second surface opposite to expose the electrical contact pads to the first surface of the insulating protective layer, and the second surface of the insulating protective layer Providing only the metal layer; forming a dielectric layer on the first surface of the insulating protective layer and the electrical contact pads; and forming a wiring layer on the dielectric layer, and the circuit layer is electrically connected to the electricity Sexual contact pads.

In the above method, the removing includes removing the metal layer to expose the insulating protective layer and the electrical contact pads.

In the above package substrate structure and method of manufacturing the same, the insulating protective layer is a solder resist layer.

In the foregoing package substrate structure and the method of manufacturing the same, the circuit layer has a plurality of conductive blind holes in the dielectric layer, so that the conductive blind holes are electrically connected to the electrical contact pads.

In the foregoing package substrate structure and method of manufacturing the same, the method further comprises forming a surface treatment layer on the circuit layer.

It can be seen from the above that the package substrate structure of the present invention and the method for manufacturing the same are formed by first forming the insulating protective layer to strengthen the supporting force of the overall structure by the insulating protective layer, so that the dielectric layer is not The warpage phenomenon occurs, so that the method of the present invention does not require the use of another support member such as a conventional copper foil substrate as a carrier as compared with the prior art.

Therefore, the method of the present invention uses the metal layer as a support member, so that only the metal layer needs to be removed after packaging, without removing the copper foil substrate or the glass fiber epoxy resin layer as conventionally removed. With the process of the first metal layer, the purpose of reducing the process steps and shortening the process time can be achieved, thereby reducing production cost.

1,2a‧‧‧Package substrate

10‧‧‧Carrier

10a‧‧‧copper foil substrate

10b‧‧‧Support

101‧‧‧Insulation

102‧‧‧copper layer

103‧‧‧glass fiber epoxy layer

104‧‧‧First metal layer

105‧‧‧Second metal layer

11,21‧‧‧Electrical contact pads

12,22‧‧‧ dielectric layer

120,220‧‧‧blind holes

13,23‧‧‧circuit layer

130, 230‧‧‧ conductive blind holes

14,24‧‧‧Insulating protective layer

140‧‧‧Opening

15,25‧‧‧ surface treatment layer

16‧‧‧ wafer

17,27‧‧‧welding line

18‧‧‧Package colloid

2‧‧‧Package substrate structure

20‧‧‧metal layer

24a‧‧‧ first surface

24b‧‧‧second surface

26‧‧‧Electronic components

28‧‧‧Package

T‧‧‧thickness

1A to 1H are schematic cross-sectional views showing a method of manufacturing a package substrate of a conventional single-layer wiring and a package thereof; and FIGS. 2A to 2H are schematic cross-sectional views showing a method of manufacturing the package substrate structure and the package thereof.

The other embodiments of the present invention will be readily understood by those skilled in the art from this disclosure.

It is to be understood that the structure, the proportions, the size, and the like of the present invention are intended to be used in conjunction with the disclosure of the specification, and are not intended to limit the invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effects and the objectives that can be achieved by the present invention. The technical content disclosed in the invention can be covered. In the meantime, the terms "upper", "first", "second", "one" and "the" are used in the description, and are not intended to limit the scope of the invention. Changes or adjustments in the relative relationship are considered to be within the scope of the invention without substantial changes.

2A to 2H are schematic cross-sectional views showing the structure of the package substrate and the method of packaging the same according to the present invention.

As shown in FIG. 2A, a metal layer 20 such as a copper foil is provided as supporting item.

In the present embodiment, the thickness t of the metal layer 20 is greater than 10 μm, thereby obtaining better support strength.

Moreover, the metal layer 20 is used to replace the conventional carrier 10, so the structure of the metal layer 20 is simpler.

As shown in FIG. 2B, a plurality of electrical contact pads 21 are formed on the metal layer 20.

As shown in FIG. 2C, an insulating protective layer 24 such as a solder mask, green lacquer or other material is formed on the metal layer 20, and the insulating protective layer 24 has a first surface 24a opposite to the first surface. Two surfaces 24b.

In this embodiment, the first surface 24a is flush with the surface of the electrical contact pads 21.

Moreover, by the formation of the insulating protective layer 24, the support force of the current overall structure can be enhanced, so that no additional support member can be produced, thereby reducing the processing time.

As shown in FIG. 2D, a dielectric layer 22 is formed on the first surface 24a of the insulating protective layer 24 and the electrical contact pads 21, and the dielectric layer 22 is patterned to form a plurality of exposed portions. A blind via 220 of the electrical contact pad 21 is on the dielectric layer 22.

As shown in FIG. 2E, a circuit layer 23 is formed on the dielectric layer 22, and the circuit layer 23 has a plurality of conductive vias 230 formed in the blind vias 220 to electrically connect the conductive vias 230. The electrical contact pads 21 are formed on the metal layer 20 with a core-free package substrate 2a having only a single layer. Thereafter, a surface treatment layer 25 may be formed on the wiring layer 23 on.

In the present embodiment, the material of the surface treatment layer 25 is one of a group consisting of an alloy of nickel, palladium, gold, a multilayer metal or an organic soldering preservative (OSP). For example, electroplating nickel/gold, electroless nickel/gold, nickel immersion gold (ENIG), enamel immersion gold (ENEPIG), electroless tin plating (Immersion Tin), and the like, but not limited thereto.

In the manufacturing method of the present invention, the dielectric layer 22 is formed by forming the insulating protective layer 24 first, so as to strengthen the supporting force of the overall structure by the insulating protective layer 24, so that the dielectric layer 22 does not warp. Phenomenon, in the process of the present invention, it is not necessary to use another support member such as a conventional copper foil substrate for carrying.

As shown in FIG. 2F, at least one electronic component 26 is disposed on the dielectric layer 22 (or the wiring layer 23), and the electronic component 26 is electrically connected to the wiring layer 23.

In this embodiment, the electronic component 26 is electrically connected to the circuit layer 23 by a plurality of bonding wires 27; in other embodiments, the electronic component 26 can be electrically connected to the circuit layer 23 by flip chip or other means.

Moreover, the electronic component 26 is an active component, a passive component or a combination thereof (such as a stacked combination, a side-by-side combination, etc.), and the active component is, for example, a wafer, and the passive component is, for example, a resistor, a capacitor, and an inductor.

As shown in FIG. 2G, a package material 28 is formed on the dielectric layer 22 to cover the circuit layer 23, the electronic component 26, and the bonding wire 27.

In this embodiment, the package material 28 is formed by a molding method; in other embodiments, a lamination may also be used. Made by the film. Therefore, the manner of fabricating the package material 28 can be selected according to requirements, and is not limited to the above.

Furthermore, the material of the package material 28 may be a dry film type epoxy resin (Epoxy), a fluid epoxy resin, or an organic material such as ABF (Ajinomoto Build-up Film) resin, but not Limited to the above.

As shown in FIG. 2H, the metal layer 20 is etched or otherwise removed, and the second surface 24b of the insulating protective layer 24 and the electrical contact pads 21 are exposed for a plurality of conductive elements such as solder balls (Fig. Slightly) bonded to the electrical contact pads 21.

In the manufacturing method of the present invention, the metal layer 20 replaces the conventional carrier, so that only the metal layer 20 needs to be removed, without removing the copper foil substrate, the glass fiber epoxy layer and the like as in the prior art. The process of a metal layer can achieve the purpose of shortening the process time, thereby reducing the manufacturing cost.

The present invention also provides a package substrate structure 2, comprising: a metal layer 20, an insulating protective layer 24 disposed on the metal layer 20, a dielectric layer 22 disposed on the insulating protective layer 24, and One of the circuit layers 23 on the dielectric layer 22.

The metal layer 20 has a plurality of electrical contact pads 21 on its surface.

The insulating protective layer 24 has a first surface 24a and a second surface 24b opposite to each other such that the metal layer 20 is disposed on the second surface 24b of the insulating protective layer 24, and the electrical contact pads 21 are provided. The surface of the insulating protective layer 24 is flush with the first surface 24a of the insulating protective layer 24, and the electrical contact pads 21 are exposed to the first surface 24a of the insulating protective layer 24.

The dielectric layer 22 is disposed on the electrical contact pads 21 .

The circuit layer 23 has a plurality of conductive blind holes 230 in the dielectric layer 22 to electrically connect the conductive blind holes 230 to the electrical contact pads 21.

In one embodiment, the package substrate structure 2 includes a surface treatment layer 25 formed on the circuit layer 23.

In summary, the package substrate structure of the present invention and the method of manufacturing the same, by forming the insulating protective layer, can enhance the supporting force of the overall structure during the back-end process, and further, the present invention does not require additional fabrication and removal. The carrier of the glass fiber epoxy layer can greatly reduce the process, thereby shortening the time course and achieving the purpose of reducing the manufacturing cost.

It can be seen from the above that the package substrate structure of the present invention and the manufacturing method thereof, by using the metal layer as a support member and forming the process design of the insulating protective layer, do not need to use other support members, and therefore, only need to be used in the packaging process The metal layer is removed, thereby effectively reducing the process time and reducing the manufacturing cost.

The above embodiments are intended to illustrate the principles of the invention and its effects, and are not intended to limit the invention. Any of the above-described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the appended claims.

2‧‧‧Package substrate structure

2a‧‧‧Package substrate

20‧‧‧metal layer

21‧‧‧Electrical contact pads

22‧‧‧Dielectric layer

220‧‧‧Blind hole

23‧‧‧Line layer

230‧‧‧conductive blind holes

24‧‧‧Insulation protective layer

25‧‧‧Surface treatment layer

Claims (9)

A package substrate structure includes: a metal layer having a plurality of electrical contact pads thereon; an insulating protective layer disposed on the metal layer, wherein the insulating protective layer has a first surface and a second surface opposite to each other The electrical contact pads are exposed on the first surface of the insulating protective layer, and the metal layer is only disposed on the second surface of the insulating protective layer; the dielectric layer is disposed on the insulating protective layer and the electrical properties And a circuit layer disposed on the dielectric layer and electrically connected to the electrical contact pads. The package substrate structure of claim 1, wherein the insulating protective layer is a solder resist layer. The package substrate structure of claim 1, wherein the circuit layer has a plurality of conductive blind holes formed in the dielectric layer, and the conductive blind holes are electrically connected to the electrical contact pads. The package substrate structure according to claim 1, further comprising a surface treatment layer formed on the circuit layer. A method for fabricating a package substrate structure includes: providing a metal layer having a plurality of electrical contact pads; forming an insulating protective layer on the metal layer, wherein the insulating protective layer has opposite first and second surfaces to The electrical contact pads are exposed on the first surface of the insulating protective layer, and only the metal layer is disposed above the second surface of the insulating protective layer; Forming a dielectric layer on the first surface of the insulating protective layer and the electrical contact pads; and forming a wiring layer on the dielectric layer, and electrically connecting the circuit layers to the electrical contact pads. The method of fabricating a package substrate structure according to claim 5, wherein the insulating protective layer is a solder resist layer. The method for manufacturing a package substrate structure according to claim 5, wherein the circuit layer has a plurality of conductive blind holes formed in the dielectric layer, so that the conductive blind holes are electrically connected to the electrical contact pads. . The method for fabricating a package substrate structure according to claim 5, further comprising forming a surface treatment layer on the circuit layer. The method for fabricating a package substrate structure according to claim 5, further comprising removing the metal layer and exposing the insulating protective layer and the electrical contact pads.