TWI456749B - 製造固態成像器件之方法，固態成像器件，及電子裝置 - Google Patents

製造固態成像器件之方法，固態成像器件，及電子裝置 Download PDF

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TWI456749B
TWI456749B TW100130805A TW100130805A TWI456749B TW I456749 B TWI456749 B TW I456749B TW 100130805 A TW100130805 A TW 100130805A TW 100130805 A TW100130805 A TW 100130805A TW I456749 B TWI456749 B TW I456749B
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patterns
imaging device
state imaging
solid
manufacturing
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TW100130805A
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TW201225271A (en
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Tomomi Ito
Ryoji Suzuki
Taichi Natori
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Sony Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14623—Optical shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14621—Colour filter arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14629—Reflectors

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Optical Filters (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Color Television Image Signal Generators (AREA)

Claims (9)

  1. 一種製造一固態成像器件之方法，其包括：在配置於一基板之一表面上之複數個光電轉換單元中之一些光電轉換單元上形成複數個第一圖案，每一第一圖案具有一獨立島形形狀，該第一圖案係從一光學濾光器材料加以組態；於每一第一圖案之一側壁上形成一混合色彩防止層；在該複數個光電轉換單元中之剩餘光電轉換單元上形成複數個第二圖案，每一第二圖案具有一獨立島形形狀，該第二圖案係從一光學濾光器材料加以組態，該混合色彩防止層係安置於每一第一圖案與每一第二圖案之間；及分別在該複數個第一圖案與第二圖案之上形成複數個透鏡，其中，每一第一圖案對應至一紅色濾光器、綠色濾光器及一藍色濾光器，每一第二圖案對應至一白色濾光器，及該複數個第二圖案及該複數個透鏡係從一相同材料形成，以使一第二圖案及其上之一相對應透鏡係一體成形。
  2. 如請求項1之製造一固態成像器件之方法，其中該混合色彩防止層之形成係藉由各向同性形成覆蓋該第一圖案之具有比該第一圖案薄之一厚度之該混合色彩防止層加 以執行。
  3. 如請求項2之製造一固態成像器件之方法，其中該混合色彩防止層之形成係藉由覆蓋具有該混合色彩防止層之該複數個第一圖案及移除該混合色彩防止層加以執行，以使該混合色彩防止層係僅留於每一第一圖案之該側壁上。
  4. 如請求項1之製造一固態成像器件之方法，其中每一第二圖案係安置於該等第一圖案之一者及該等第一圖案之另一者之間。
  5. 如請求項1之製造一固態成像器件之方法，其中該混合色彩防止層具有低於該第一圖案之一折射率及該第二圖案之一折射率之一折射率。
  6. 如請求項1之製造一固態成像器件之方法，其中該複數個第一圖案及該複數個第二圖案係安置成一棋盤圖案。
  7. 如請求項1之製造一固態成像器件之方法，其中該相同材料係一無色透明材料。
  8. 如請求項1之製造一固態成像器件之方法，其中該無色透明材料從一紅色區域傳送光至一藍色區域。
  9. 如請求項1之製造一固態成像器件之方法，其中該相同材料係一有機材料。
TW100130805A 2010-09-28 2011-08-26 製造固態成像器件之方法，固態成像器件，及電子裝置 TWI456749B (zh)

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JP2010217861A JP2012074521A (ja) 2010-09-28 2010-09-28 固体撮像装置の製造方法、固体撮像装置、および電子機器

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TW201225271A TW201225271A (en) 2012-06-16
TWI456749B true TWI456749B (zh) 2014-10-11

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US (2) US8669134B2 (zh)
JP (1) JP2012074521A (zh)
KR (1) KR20120032416A (zh)
CN (1) CN102420235A (zh)
TW (1) TWI456749B (zh)

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Also Published As

Publication number Publication date
JP2012074521A (ja) 2012-04-12
CN102420235A (zh) 2012-04-18
TW201225271A (en) 2012-06-16
US20120075509A1 (en) 2012-03-29
KR20120032416A (ko) 2012-04-05
US8669134B2 (en) 2014-03-11
US20140117482A1 (en) 2014-05-01

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