TWI456357B - 曝光裝置及曝光方法 - Google Patents

曝光裝置及曝光方法 Download PDF

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Publication number
TWI456357B
TWI456357B TW100137558A TW100137558A TWI456357B TW I456357 B TWI456357 B TW I456357B TW 100137558 A TW100137558 A TW 100137558A TW 100137558 A TW100137558 A TW 100137558A TW I456357 B TWI456357 B TW I456357B
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TW
Taiwan
Prior art keywords
workpiece
workpieces
base plate
disk
exposure
Prior art date
Application number
TW100137558A
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English (en)
Other versions
TW201224675A (en
Inventor
Masayuki Itaba
Naoki Ota
Original Assignee
Ushio Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ushio Electric Inc filed Critical Ushio Electric Inc
Publication of TW201224675A publication Critical patent/TW201224675A/zh
Application granted granted Critical
Publication of TWI456357B publication Critical patent/TWI456357B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Claims (3)

  1. 一種曝光裝置，係對載置於工作台上之複數之工件，針對每一片進行校準，使光照射部所射出之光透過形成有圖案之光罩對工作台上之工件進行照射，而逐次對各工件進行曝光處理，其特徵為：上述工作台，係由基台、可裝卸於該基台上之保持複數工件之工件盤所構成，該工件盤設置於該基台上時，以基台及工件盤來構成上述工作台，準備著複數之上述工件盤，於該工件盤，配設著使上述複數之工件定位於工件盤上之特定位置的手段，於上述基台，配設著使上述工件盤定位於特定位置之手段、及使該基台於水平方向移動之移動機構。
  2. 如申請專利範圍第1項所述之曝光裝置，其中上述曝光裝置係具備：工件搬入手段，將複數之工件載置於上述工件盤；及工件盤搬入手段，將利用上述工件搬入手段而載置著複數之工件的工件盤，載置於上述基台之上。
  3. 一種曝光方法，其係具有由基台、及可裝卸於該基台上之保持複數工件之工件盤所構成，該工件盤設置於該基台上時，係由該基台及該工件盤構成工作台，對載置於該工作台上之複數之工件，針對每一片進行校準，使光照射部所射出之光透過形成有圖案之光罩對工作台上之工件進行照射，而逐次對各工件進行曝光處理，其特徵為： 準備著複數之上述工件盤，具備：第1工序，將複數之工件載置於上述工件盤；第2工序，將載置著上述複數工件之上述工件盤載置於基台上；第3工序，一邊移動由上述基台及上述工件盤所構成之工作台一邊依序實施上述工件盤上之上述複數工件之曝光；第4工序，將載置著曝光結束之上述複數工件的上述工件盤，從上述基台取出；以及第5工序，從上述工件盤取出曝光結束之上述複數工件；於上述第2、第3、及第4工序之實施中，實施上述第1工序及/或第5工序。
TW100137558A 2010-12-13 2011-10-17 曝光裝置及曝光方法 TWI456357B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010276802A JP5510299B2 (ja) 2010-12-13 2010-12-13 露光装置および露光方法

Publications (2)

Publication Number Publication Date
TW201224675A TW201224675A (en) 2012-06-16
TWI456357B true TWI456357B (zh) 2014-10-11

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ID=46412020

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100137558A TWI456357B (zh) 2010-12-13 2011-10-17 曝光裝置及曝光方法

Country Status (4)

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JP (1) JP5510299B2 (zh)
KR (1) KR101436195B1 (zh)
CN (1) CN102566305B (zh)
TW (1) TWI456357B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5986447B2 (ja) * 2012-07-25 2016-09-06 株式会社アルバック トレイ、基板の位置調整システム、及び露光装置
CN106886132B (zh) * 2017-04-25 2018-04-13 电子科技大学 一种基于dmd的扫描式光刻机灰度图像曝光方法
WO2024085055A1 (ja) * 2022-10-18 2024-04-25 株式会社ニコン 露光装置

Citations (3)

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Publication number Priority date Publication date Assignee Title
US20060092399A1 (en) * 2004-10-29 2006-05-04 Asml Netherlands B.V. Lithographic apparatus, a control system for controlling a lithographic apparatus, and a device manufacturing method
TW200707124A (en) * 2005-06-29 2007-02-16 Nikon Corp Exposure apparatus, substrate processing method, and device producing method
TW200944961A (en) * 2004-02-02 2009-11-01 Nikon Corp Stage drive method and stage unit, exposure apparatus, and device manufacturing method

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JPS6146730U (ja) * 1984-08-31 1986-03-28 株式会社日立製作所 ウエハ載置用カセツト
JP4015234B2 (ja) * 1997-07-30 2007-11-28 日置電機株式会社 レーザービーム直接描画装置
JP2001269610A (ja) * 2000-01-17 2001-10-02 Canon Inc 塗布方法、塗布装置および被膜の作製方法
JP2003203843A (ja) * 2002-01-07 2003-07-18 Ntt Advanced Technology Corp マーク合わせ装置
US7206652B2 (en) * 2004-08-20 2007-04-17 International Business Machines Corporation Method and system for intelligent automated reticle management
JP4865325B2 (ja) * 2005-12-27 2012-02-01 日置電機株式会社 回路基板保持具
JP5099318B2 (ja) 2007-06-05 2012-12-19 Ｎｓｋテクノロジー株式会社 露光装置及び露光方法
KR101111933B1 (ko) * 2007-04-03 2012-04-06 닛본 세이고 가부시끼가이샤 노광 장치 및 노광 방법
JP5226557B2 (ja) * 2008-04-22 2013-07-03 富士フイルム株式会社 レーザ露光方法、フォトレジスト層の加工方法およびパターン成形品の製造方法

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
TW200944961A (en) * 2004-02-02 2009-11-01 Nikon Corp Stage drive method and stage unit, exposure apparatus, and device manufacturing method
US20060092399A1 (en) * 2004-10-29 2006-05-04 Asml Netherlands B.V. Lithographic apparatus, a control system for controlling a lithographic apparatus, and a device manufacturing method
TW200707124A (en) * 2005-06-29 2007-02-16 Nikon Corp Exposure apparatus, substrate processing method, and device producing method

Also Published As

Publication number Publication date
KR101436195B1 (ko) 2014-09-01
JP2012129231A (ja) 2012-07-05
JP5510299B2 (ja) 2014-06-04
CN102566305B (zh) 2014-11-05
KR20120065935A (ko) 2012-06-21
CN102566305A (zh) 2012-07-11
TW201224675A (en) 2012-06-16

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