TWI451821B - - Google Patents

Info

Publication number
TWI451821B
TWI451821B TW101128512A TW101128512A TWI451821B TW I451821 B TWI451821 B TW I451821B TW 101128512 A TW101128512 A TW 101128512A TW 101128512 A TW101128512 A TW 101128512A TW I451821 B TWI451821 B TW I451821B
Authority
TW
Taiwan
Application number
TW101128512A
Other languages
Chinese (zh)
Other versions
TW201408153A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW101128512A priority Critical patent/TW201408153A/zh
Priority to US13/944,673 priority patent/US20140041909A1/en
Priority to CN201310322863.6A priority patent/CN103533765A/zh
Publication of TW201408153A publication Critical patent/TW201408153A/zh
Application granted granted Critical
Publication of TWI451821B publication Critical patent/TWI451821B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW101128512A 2012-08-07 2012-08-07 改善陶瓷貫孔基板上金屬表面粗糙度之方法 TW201408153A (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW101128512A TW201408153A (zh) 2012-08-07 2012-08-07 改善陶瓷貫孔基板上金屬表面粗糙度之方法
US13/944,673 US20140041909A1 (en) 2012-08-07 2013-07-17 Ceramic Substrate and Method for Reducing Surface Roughness of Metal Filled Via Holes Thereon
CN201310322863.6A CN103533765A (zh) 2012-08-07 2013-07-29 改善陶瓷贯孔基板上金属表面粗糙度的方法及陶瓷基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101128512A TW201408153A (zh) 2012-08-07 2012-08-07 改善陶瓷貫孔基板上金屬表面粗糙度之方法

Publications (2)

Publication Number Publication Date
TW201408153A TW201408153A (zh) 2014-02-16
TWI451821B true TWI451821B (cg-RX-API-DMAC7.html) 2014-09-01

Family

ID=49935329

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101128512A TW201408153A (zh) 2012-08-07 2012-08-07 改善陶瓷貫孔基板上金屬表面粗糙度之方法

Country Status (3)

Country Link
US (1) US20140041909A1 (cg-RX-API-DMAC7.html)
CN (1) CN103533765A (cg-RX-API-DMAC7.html)
TW (1) TW201408153A (cg-RX-API-DMAC7.html)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105491795B (zh) * 2014-09-18 2018-07-03 浙江德汇电子陶瓷有限公司 一种陶瓷金属化基板的制造方法和由该方法制造的陶瓷金属化基板
CN104600184B (zh) * 2014-12-31 2017-07-07 东莞市凯昶德电子科技股份有限公司 一种在陶瓷基板上电镀亮银的方法
CN104640344A (zh) * 2015-02-16 2015-05-20 上海贺鸿电子有限公司 镀铜的陶瓷线路板及其制造方法
CN105624749B (zh) * 2016-03-28 2018-07-10 上海申和热磁电子有限公司 一种陶瓷基板表面金属化的方法
CN106535501A (zh) * 2016-10-17 2017-03-22 奥士康精密电路（惠州）有限公司 一种高厚径比线路板的孔金属化方法
KR102414973B1 (ko) * 2017-03-03 2022-07-05 주식회사 잉크테크 미세 회로 형성방법 및 에칭액 조성물
US10700252B2 (en) * 2017-04-18 2020-06-30 Bridgelux Chongqing Co., Ltd. System and method of manufacture for LED packages
CN107708296A (zh) * 2017-10-19 2018-02-16 深圳职业技术学院 一种高导热的金属基电路板及其制作方法
TWI687531B (zh) * 2018-01-26 2020-03-11 謝孟修 陶瓷電路板及其製法
CN111490018A (zh) * 2019-01-29 2020-08-04 瑷司柏电子股份有限公司 具有金属导热凸块接垫的陶瓷基板元件、组件及制法
CN110459668B (zh) * 2019-08-16 2020-12-25 国网河南省电力公司邓州市供电公司 一种大功率led散热基板的制备方法
JP7287210B2 (ja) * 2019-09-19 2023-06-06 コニカミノルタ株式会社 画像処理装置及びプログラム
CN111628063A (zh) * 2020-03-04 2020-09-04 深圳雷曼光电科技股份有限公司 一种Micro-LED的固晶方法
DE112021003875A5 (de) * 2020-07-21 2023-05-25 Ams-Osram International Gmbh Optoelektronisches halbleiterbauteil, herstellungsverfahren und basisplatte
CN112178591A (zh) * 2020-09-18 2021-01-05 广州光联电子科技有限公司 一种激光用波长转换装置的制备方法及波长转换装置
CN112419915A (zh) * 2020-12-04 2021-02-26 深圳市前海恒云联科技有限公司 一种基于pet双面金属材料的柔性透明led显示器
CN112930044B (zh) * 2021-02-06 2022-03-22 深圳市迅捷兴科技股份有限公司 电路板三种不同表面处理制作方法
CN113966099B (zh) * 2021-06-30 2024-06-11 西安空间无线电技术研究所 一种适用于固放产品的微波集成电路薄膜加厚工艺
US20230096301A1 (en) * 2021-09-29 2023-03-30 Catlam, Llc. Circuit Board Traces in Channels using Electroless and Electroplated Depositions
CN114695129A (zh) * 2022-02-17 2022-07-01 中国电子科技集团公司第十三研究所 表面凹槽金属化热沉结构陶瓷管壳的制备方法及陶瓷管壳
CN115348740A (zh) * 2022-08-08 2022-11-15 中国电子科技集团公司第十三研究所 陶瓷基板的制造方法、陶瓷基板及陶瓷外壳
CN116283361B (zh) * 2022-12-31 2023-12-05 博睿光电(泰州)有限公司 一种dpa陶瓷线路板及其制作方法
CN115802598B (zh) * 2023-01-31 2023-10-31 博睿光电(泰州)有限公司 一种陶瓷基板及其制作方法和应用
CN120322138A (zh) * 2025-06-11 2025-07-15 四川科尔威光电科技有限公司 一种铜互连半导体制冷器的填孔方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI353205B (cg-RX-API-DMAC7.html) * 2009-12-31 2011-11-21

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6297155B1 (en) * 1999-05-03 2001-10-02 Motorola Inc. Method for forming a copper layer over a semiconductor wafer
KR100632556B1 (ko) * 2005-01-28 2006-10-11 삼성전기주식회사 인쇄회로기판의 제조방법
CN102157436A (zh) * 2010-02-11 2011-08-17 中芯国际集成电路制造(上海)有限公司 一种降低金属损伤的电镀铜方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI353205B (cg-RX-API-DMAC7.html) * 2009-12-31 2011-11-21

Also Published As

Publication number Publication date
TW201408153A (zh) 2014-02-16
CN103533765A (zh) 2014-01-22
US20140041909A1 (en) 2014-02-13

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