TWI449770B - 使用熔融顆粒製造由矽構成的單晶體的方法 - Google Patents
使用熔融顆粒製造由矽構成的單晶體的方法 Download PDFInfo
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000013078 crystal Substances 0.000 claims description 48
- 230000006698 induction Effects 0.000 claims description 40
- 238000010438 heat treatment Methods 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 31
- 238000002844 melting Methods 0.000 claims description 17
- 230000008018 melting Effects 0.000 claims description 17
- 238000002425 crystallisation Methods 0.000 claims description 11
- 230000008025 crystallization Effects 0.000 claims description 11
- 239000002245 particle Substances 0.000 claims description 11
- 229910052715 tantalum Inorganic materials 0.000 claims description 9
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 9
- 239000001307 helium Substances 0.000 claims description 5
- 229910052734 helium Inorganic materials 0.000 claims description 5
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 5
- 239000007788 liquid Substances 0.000 description 5
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 229910052707 ruthenium Inorganic materials 0.000 description 4
- 229910052746 lanthanum Inorganic materials 0.000 description 3
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 3
- 239000008187 granular material Substances 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Description
本發明係關於一種使用熔融顆粒製造由矽構成的單晶體的方法。該方法包括:藉助一第一感應加熱線圈,在一生長的單晶體與一由矽構成的錐形管的下端之間產生一第一體積的熔融矽,該管係下端封閉的,且圍出一由矽構成的轉動板的中心開口,該管延伸到該板的下方,且該第一感應加熱線圈係設置在該板的下方;藉助於一設置在該板上方的第二感應加熱線圈產生一第二體積的熔融矽;將該管的下端熔化到產生一供該第二體積的熔融矽用的通道開口的程度;以及在消耗該第一和該第二體積的熔融矽的情況下使單晶矽在生長的單晶體上結晶。
首先結晶細頸、然後一單晶體的錐形延伸區段、最後一單晶體的圓柱形區段。在該方法開始時,結晶所需的熔融矽係源自一晶種和一錐形管的下端,該錐形管的下端係為此目的而被熔化。在該方法的進一步過程中,結晶所需的熔融矽還通過第二感應加熱線圈熔化該板的上側和管的內壁獲得。單晶體結晶所需的矽的主要部分係通過傳送到板上的顆粒所獲得,該顆粒係經第二感應加熱線圈熔化並以液體膜之形式通過管來傳導到該生長的單晶體。
該方法與浮區方法(FZ方法)主要不同在於,為了提供單晶體生長所需的熔融矽的主要部分,熔化的是顆粒、而不是多晶體塊,基於此,專用的感應加熱線圈(“感應線圈”)係分別用於熔化顆粒和用於控制單晶體的結晶。
在該方法開始時,此時下端封閉的錐形管初始係藉助於設置在該板下方的第一感應加熱線圈熔化。熔融的矽滴出現在錐形管的下端處,晶種附著到該矽滴,然後,晶種藉助於第一感應加熱線圈再次結晶,以形成細頸,且所得之細頸上的熔融矽的體積係通過使管下端之另外的矽逐漸熔化而增加到第一體積的熔融矽。與FZ方法類似,在細頸上係結晶出單晶體的無位錯的錐形延伸區段,且最終結晶出單晶體的圓柱形區段。在單晶體的錐形延伸區段結晶過程中或甚至在單晶體的錐形延伸區段結晶之前,錐形管的下端係經熔化至使用於熔融矽的通道開口在管的下端產生的程度。從該時刻開始,第二體積的熔融矽可沿著管的內壁流動並通過通道開口流入第一體積的熔融矽。第二體積的熔融矽係藉助於第二感應加熱線圈產生。
該方法和適合於執行該方法的裝置係例如描述於DE 102 04 178 A1中。
DE 10 2008 013 326 A1描述了一種感應加熱線圈,該感應加熱線圈可用作本方法的第二感應加熱線圈。它在下側的中心處具有突出區段,藉助於該突出區段,流過錐形管的熔融矽的膜可被加熱和保持為液態。
當執行該方法時,可能產生干擾事件,該干擾事件降低了單晶體的生產率,單晶體半導體晶圓可由該單晶體製造。因此,位錯可能突然地形成,或熔融矽可能在單晶體已生長到那點的一側流走。
本發明的發明人已經找出了這種干擾的原因,且在這一過程中提出了本發明。本發明的目的是減少該干擾事件的發生。
上述目的係通過一種使用熔融顆粒產生由矽構成的單晶體的方法實現,該方法包括:藉助於一第一感應加熱線圈,在一生長的單晶體與一由矽構成的錐形管的下端之間產生一第一體積的熔融矽,該管係下端封閉的,且圍出一由矽構成的轉動板的中心開口,該管延伸到該板的下方,且該第一感應加熱線圈係設置在該板的下方;藉助於一設置在該板上方的第二感應加熱線圈產生一第二體積的熔融矽;將該管的下端熔化到產生一供該第二體積的熔融矽用的通道開口的程度,該通道開口係在該第二體積的熔融矽還沒有出現或少於該第一體積的熔融矽的體積的兩倍時產生;以及在消耗該第一和該第二體積的熔融矽的情況下使單晶矽在生長的單晶體上結晶。
因在該錐形管中產生通道開口而對該生長的單晶體所施加的過高載荷被認為是干擾事件的原因。如果該第二體積的熔融矽隨著通道開口的產生即幾乎即刻流入該第一體積的熔融矽,則會對該生長的單晶體施加載荷。根據本發明,係通過使通道開口在該第二體積的熔融矽還沒有出現或少於該第一體積的熔融矽的體積的兩倍時產生,而限制此一載荷。如果該方法通過該措施執行,則該干擾事件變的很少。
以下茲參考第1圖詳細說明本發明。第1圖係示出了馬上要在錐形管中產生通道開口的階段。
在該方法開始時,錐形管1的下端初始係藉助於第一感應加熱線圈2而熔化,從而出現熔融的矽滴。在該階段,第一感應加熱線圈和錐形管較佳係彼此相對設置成使第一感應加熱線圈中的內孔的邊緣與熔融的矽滴之間的距離盡可能小。該距離較佳係藉由從同軸佈置位置向一側移動第一感應加熱線圈而被縮短。此時,與錐形管和第一感應加熱線圈同軸佈置的情況相比,以感應方式傳遞到矽滴和管之下端的能量密度較高。隨後,特別是在單晶體的圓柱形區段正在結晶時,較佳係採用同軸佈置。錐形管1在由矽構成的轉動板3中圍出一中心開口,且延伸到板的下方。板的下側藉助於設置在板與第一感應加熱線圈2之間的冷卻裝置4而冷卻,以使得板3的下側不會被熔化。冷卻裝置4也可被實施為第一感應加熱線圈2的上層。
單晶體晶種係從下方浸泡到因管之下端的初始熔化而產生的熔融的矽滴中。該晶種隨即藉助第一感應加熱線圈2再結晶而形成細頸5,以便當晶種與矽滴接觸時形成的位錯係從晶格指向。在該方法的進一步過程中,細頸5與錐形管1的端部之間的垂直距離係逐漸地增加,首先,單晶體的錐形延伸區段(未示出)在細頸5上結晶,然後,單晶體的圓柱形區段(同樣未示出)在錐形延伸區段上結晶。
單晶體較佳包含至少一種摻雜物,該摻雜物係以例如摻雜氣體的形式添加至熔融矽中,或係在熔化之前即包含在矽中。
結晶所需的熔融的矽初始係源自晶種和錐形管的下端,隨後係源自板的上側和管的內壁,特別是在單晶體的圓柱形區段的結晶過程中係源自傳送到板3上的顆粒6,該顆粒係藉助於設置在板3上方的第二感應加熱線圈7熔化,且係以液體膜8的形式通過管傳導到生長中的單晶體。熔化的顆粒也可經用於單晶體的錐形延伸區段的結晶。
第二感應加熱線圈較佳以與DE 10 2008 013 326 A1中描述的感應加熱線圈類似地實施,而具有伸入到錐形管1中的區段12。
第1圖示出了單晶體的細頸5已結晶時的狀態。第一體積9的熔融矽係位於錐形管1之封閉的下端與細頸5之間。
根據本方法的第一實施例,第二體積10的熔融矽係藉助於第二感應加熱線圈7來熔化轉動的板3的上側和錐形管1的內壁而在封閉的錐形管1中產生。第二體積10的熔融矽係積聚在錐形管的下端中。此時,它也可已經包含源自顆粒6的熔融矽,顆粒6係通過一或多個料斗11和第二感應線圈7中之相應數量的開口而傳送到轉動的板3上,然後藉助於第二感應加熱線圈7而被熔化。
錐形管1的下端係藉助於第一感應加熱線圈2而被進一步熔化,直到在錐形管下端封閉錐形管1的下端的那部分已被完全熔化為止。從而,在錐形管1中產生通道開口,已積聚在管中的第二體積10的熔融矽幾乎即刻通過該通道開口流入第一體積9的熔融矽。較佳地,係通過暫時將第二感應加熱線圈7之伸入管中的區段12下降到距離管的內壁一較小距離,以支持通道開口的產生,直到已經產生通道開口為止。
根據本方法的第一實施例,通道開口係在第二體積10的熔融矽少於第一體積9的熔融矽的體積的兩倍時產生。在這種情況下,由生長中的單晶體構成的敏感系統僅被輕微干擾,使得形成位元錯或組合熔融體積的熔融矽行進超過接合邊緣到達生長的單晶體的可能性低。
根據本方法的第二實施例,通道開口係在錐形管中還沒有第二體積10的熔融矽時產生在錐形管1中。在這種情況下,藉助於第二感應加熱線圈7熔化矽的過程僅在通道開口已在錐形管中產生之後才開始。在該過程的情況下,對生長的單晶體的相關干擾係保持在不明顯的程度。
1...錐形管
2...第一感應加熱線圈
3...轉動板
4...冷卻裝置
5...細頸
6...顆粒
7...第二感應加熱線圈
8...液體膜
9...第一體積
10...第二體積
11...料斗
12...區段
第1圖係示出了馬上要在錐形管中產生通道開口的階段。
1...錐形管
2...第一感應加熱線圈
3...轉動板
4...冷卻裝置
5...細頸
6...顆粒
7...第二感應加熱線圈
8...液體膜
9...第一體積
10...第二體積
11...料斗
12...區段
Claims (5)
- 一種使用熔融顆粒製造由矽構成的單晶體的方法,包括:藉助一第一感應加熱線圈,在一生長的單晶體與一由矽構成的錐形管的下端之間產生一第一體積的熔融矽,該管係下端封閉的,且圍出一由矽構成的轉動板的中心開口,該管延伸到該板的下方,且該第一感應加熱線圈係設置在該板的下方;藉助於一設置在該板上方的第二感應加熱線圈產生一第二體積的熔融矽;將該管的下端熔化到產生一供該第二體積的熔融矽用的通道開口的程度,該通道開口係在該第二體積的熔融矽還沒有出現或少於該第一體積的熔融矽的體積的兩倍時產生;以及在消耗該第一和該第二體積的熔融矽的情況下使單晶矽在該生長的單晶體上結晶。
- 如請求項1所述的方法,包含藉由降低該第二感應加熱線圈伸入到該管中的區段,來幫助該通道開口的產生。
- 如請求項1或2所述的方法,包含藉由從該板的上側和該管的內壁熔化矽,來產生一部分該第二體積的熔融矽。
- 如請求項1或2所述的方法,包含在該單晶體的錐形延伸區段的結晶期間或之後,開始熔化傳送到該板的顆粒。
- 如請求項3所述的方法,包含在該單晶體的錐形延伸區段的結晶期間或之後,開始熔化傳送到該板的顆粒。
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US9664448B2 (en) | 2012-07-30 | 2017-05-30 | Solar World Industries America Inc. | Melting apparatus |
DE102012213506A1 (de) * | 2012-07-31 | 2014-02-06 | Siltronic Ag | Verfahren zur Herstellung eines Einkristalls aus Silizium |
DE102012215677B3 (de) * | 2012-09-04 | 2013-10-10 | Siltronic Ag | Verfahren zum Herstellen eines Einkristalls aus Silizium |
DE102014207149A1 (de) * | 2014-04-14 | 2015-10-29 | Siltronic Ag | Vorrichtung und Verfahren zur Herstellung eines Einkristalls aus Silizium |
DE102014210936B3 (de) * | 2014-06-06 | 2015-10-22 | Siltronic Ag | Vorrichtung und Verfahren zur Herstellung eines Kristalls aus Halbleitermaterial |
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JPH11180798A (ja) * | 1997-12-22 | 1999-07-06 | Shin Etsu Handotai Co Ltd | シリコン単結晶の製造方法及び製造装置 |
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KR20110090794A (ko) | 2011-08-10 |
SG173302A1 (en) | 2011-08-29 |
DK2354278T3 (da) | 2012-09-24 |
TW201127937A (de) | 2011-08-16 |
CN102140674B (zh) | 2014-01-01 |
US20110185963A1 (en) | 2011-08-04 |
DE102010006724B4 (de) | 2012-05-16 |
CN102140674A (zh) | 2011-08-03 |
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