TWI448337B - Rolled copper foil - Google Patents

Rolled copper foil Download PDF

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TWI448337B
TWI448337B TW100135862A TW100135862A TWI448337B TW I448337 B TWI448337 B TW I448337B TW 100135862 A TW100135862 A TW 100135862A TW 100135862 A TW100135862 A TW 100135862A TW I448337 B TWI448337 B TW I448337B
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copper foil
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rolling
final
cold rolling
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TW201217076A (en
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Yoshihiro Chiba
Kaichiro Nakamuro
Mitsuhiro Ookubo
Daisuke Samejima
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Jx Nippon Mining & Metals Corp
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Description

壓延銅箔Calendered copper foil

本發明係關於一種可較佳地使用於要求彎曲性之FPC中之壓延銅箔。The present invention relates to a rolled copper foil which can be preferably used in an FPC requiring flexibility.

用於彎曲用FPC(可撓性印刷電路基板)之銅箔要求較高之彎曲性。用以對銅箔賦予彎曲性之方法,眾所周知有提高銅箔之(200)面之結晶方位的取向度技術(專利文獻1)、使銅箔板厚方向上貫通之晶粒之比例增多之技術(專利文獻2)、將銅箔之相當於油坑(oil pit)深度之表面粗糙度Ry(最大高度)降低至2.0μm以下之技術(專利文獻3)。Copper foil for FPC (flexible printed circuit board) for bending requires high flexibility. A technique for imparting flexibility to a copper foil is known as a technique for improving the crystal orientation of the (200) plane of the copper foil (Patent Document 1) and a technique for increasing the ratio of crystal grains which are penetrated in the thickness direction of the copper foil. (Patent Document 2) A technique in which the surface roughness Ry (maximum height) corresponding to the depth of the oil pit of the copper foil is reduced to 2.0 μm or less (Patent Document 3).

通常之FPC製造步驟係如以下所示。首先,將銅箔與樹脂膜接合。接合方法有藉由對塗佈於銅箔上之清漆施加熱處理而使其醯亞胺化之方法、或使附有接著劑之樹脂膜與銅箔疊合進行層壓之方法。藉由該等步驟而接合之附有樹脂膜之銅箔稱作CCL(覆銅積層板)。藉由該CCL製造步驟中之熱處理,而使銅箔進行再結晶。The usual FPC manufacturing steps are as follows. First, a copper foil is bonded to a resin film. The joining method is a method of imidating ruthenium by applying heat treatment to a varnish applied to a copper foil, or laminating a resin film with an adhesive attached to a copper foil. The copper foil with a resin film joined by these steps is called CCL (Copper Cladding Laminate). The copper foil is recrystallized by the heat treatment in the CCL manufacturing step.

然而,於使用銅箔製造FPC時,若為了提高與被覆膜之密接性而蝕刻銅箔表面,則存在於表面產生直徑數10μm左右之凹陷(碟型下陷)之問題,尤其易發生於高彎曲性之銅箔中。該原因在於,為了賦予高彎曲性,而以再結晶退火後之立方體組織擴展之方式,將銅箔之結晶方位(200)面控制為一致。即,可認為即便進行了如此之控制,亦無法使全部之結晶方位一致,於均勻之組織中局部地存在不同結晶方位之晶粒。此時,因經蝕刻之結晶面而導致蝕刻速度不同,故使該晶粒於局部蝕刻得比周圍深而成為凹陷。該凹陷成為使電路之蝕刻性下降,或者於外觀檢查中判定為不良並使良率下降之原因。However, when the FPC is produced by using a copper foil, if the surface of the copper foil is etched in order to improve the adhesion to the coating film, there is a problem that a depression having a diameter of about 10 μm (disc sinking) occurs on the surface, and it is particularly likely to occur at a high level. In the curved copper foil. This is because the crystal orientation (200) plane of the copper foil is controlled to be uniform so as to impart high flexibility and to expand the cubic structure after recrystallization annealing. That is, it is considered that even if such control is performed, it is impossible to make all the crystal orientations uniform, and crystal grains having different crystal orientations are locally present in a uniform structure. At this time, since the etching rate differs depending on the crystal surface to be etched, the crystal grains are locally etched to be deeper than the periphery and become depressed. This depression is a cause of a decrease in the etching property of the circuit or a defect in the visual inspection and a decrease in the yield.

減少如此之凹陷之方法,報告有如下之技術:於壓延前或壓延後,對銅箔表面進行機械研磨,賦予成為加工變質層之變形後,進行再結晶(專利文獻4)。根據該技術,藉由加工變質層而於再結晶後使表面群發不均勻之晶粒,使得結晶方位不同之晶粒不會單獨地存在。In the method of reducing such a depression, there has been reported a technique of mechanically polishing the surface of the copper foil before or after rolling, and imparting deformation to the modified layer after processing, and then performing recrystallization (Patent Document 4). According to this technique, by processing the altered layer, the surface group is unevenly crystallized after recrystallization, so that crystal grains having different crystal orientations are not separately present.

[專利文獻1]日本專利第3009383號公報[Patent Document 1] Japanese Patent No. 3009383

[專利文獻2]日本特開2006-117977號公報[Patent Document 2] Japanese Patent Laid-Open Publication No. 2006-117977

[專利文獻3]日本特開2001-058203號公報[Patent Document 3] Japanese Patent Laid-Open Publication No. 2001-058203

[專利文獻4]日本特開2009-280855號公報[Patent Document 4] Japanese Patent Laid-Open Publication No. 2009-280855

然而,於專利文獻4記載之技術之情形時,存在因不均勻之晶粒較多,銅箔表面之結晶未取向於(200)面,故彎曲性降低之問題。However, in the case of the technique described in Patent Document 4, there are many problems in that the crystal grains on the surface of the copper foil are not oriented on the (200) plane because the crystal grains are not uniform, and the bendability is lowered.

另一方面,專利文獻3所記載之高光澤之銅箔中,結晶方位易一致,又,碟型下陷之產生亦較少。然而,高光澤之銅箔由於表面易劃有傷痕等不易操作,而不佳。On the other hand, in the high-gloss copper foil described in Patent Document 3, the crystal orientation is easily uniform, and the dishing is less likely to occur. However, the high-gloss copper foil is not easy to handle due to the easy scratching of the surface, and is not preferable.

因此,本發明係為解決上述問題而成者,其目的在於提供一種使銅箔表面變得適度地粗糙之狀態而使操作性良好、彎曲性優異,並且表面蝕刻特性良好之壓延銅箔。In view of the above, it is an object of the present invention to provide a rolled copper foil which is excellent in workability, excellent in flexibility, and excellent in surface etching property, in a state in which the surface of the copper foil is appropriately roughened.

本發明人等經過各種研討,結果發現:於最終冷壓延之最終道次之前,不使銅箔之表面變得粗糙,而於最終冷壓延之最終道次中,使銅箔之表面變得粗糙,藉此,使最終之銅箔表面變得粗糙,並使油坑之形態與頻度(表面狀態)成為不易產生剪切帶,而使彎曲性優異,並且碟型下陷變少。而且,本發明人發現可藉由自共軛焦顯微鏡像之油坑面積率而宏觀地評價不易產生剪切帶之油坑之形態與頻度(表面狀態)。The inventors of the present invention have conducted various studies and found that the surface of the copper foil is not roughened before the final pass of the final cold rolling, and the surface of the copper foil is roughened in the final pass of the final cold rolling. As a result, the surface of the final copper foil is roughened, and the shape and frequency (surface state) of the oil pit are less likely to cause shear bands, and the bending property is excellent, and the dish type is less depressed. Further, the inventors have found that the form and frequency (surface state) of the oil crater which is less likely to cause the shear band can be macroscopically evaluated by the crater area ratio of the self-conjugated focal microscope image.

為達成上述之目的,本發明之壓延銅箔中,在銅箔表面於壓延平行方向長度為175μm測定之表面粗糙度Ra與上述銅箔之厚度t之比Ra/t為0.004以上0.007以下,以200℃加熱30分鐘調質為再結晶組織之狀態下,由壓延面之X射線繞射所求得之(200)面之強度(I)相對於由微粉末銅之X射線繞射所求得之(200)面之強度(I0 )為I/I0 ≧50,在銅箔表面於壓延平行方向長度為175μm,且於壓延直角方向分別相隔50μm以上之3條直線上,相當於油坑最大深度之各直線之厚度方向的最大高度與最小高度之差的平均值d與上述銅箔之厚度t之比d/t為0.1以下,利用共軛焦顯微鏡測定時之油坑之面積率為6%以上15%以下。In order to achieve the above object, in the rolled copper foil of the present invention, the ratio Ra/t of the surface roughness Ra measured on the surface of the copper foil in the direction parallel to the rolling parallel direction of 175 μm and the thickness t of the copper foil is 0.004 or more and 0.007 or less. The strength of the (200) plane (I) obtained by X-ray diffraction of the calendering surface is obtained by X-ray diffraction of the micropowder copper in a state where the crystal is recrystallized at 200 ° C for 30 minutes. The strength (I 0 ) of the (200) plane is I/I 0 ≧ 50, and the length of the copper foil surface is 175 μm in the parallel direction of the rolling, and is three lines which are separated by 50 μm or more in the direction perpendicular to the rolling, which corresponds to the oil pit. The ratio d/t of the average value d of the difference between the maximum height and the minimum height in the thickness direction of each straight line of the maximum depth and the thickness t of the copper foil is 0.1 or less, and the area ratio of the oil pit when measured by a conjugate focal microscope is 6% or more and 15% or less.

對上述之經200℃×30分鐘熱處理後的銅箔表面於電解研磨後以EBSD進行觀察後,較佳為自[100]方位之角度差為15度以上之晶粒的面積率為20%以下。After the surface of the copper foil after heat treatment at 200 ° C for 30 minutes is observed by EBSD after electrolytic polishing, it is preferable that the area ratio of crystal grains having an angle difference of 15 degrees or more from [100] orientation is 20% or less. .

於對鑄塊進行熱壓延後,反覆進行冷壓延與退火,並最終進行最終冷壓延而製造,且於該最終冷壓延步驟中,較佳為,於最終道次前之階段中,Ra/t為0.002以上0.004以下。After the ingot is subjected to hot rolling, it is repeatedly subjected to cold rolling and annealing, and finally to final cold rolling, and in the final cold rolling step, preferably, in the stage before the final pass, Ra/ t is 0.002 or more and 0.004 or less.

根據本發明,可獲得使銅箔表面適度地變得粗糙而提高操作性,且彎曲性優異,並且表面蝕刻特性良好之壓延銅箔。According to the present invention, it is possible to obtain a rolled copper foil which has a surface of a copper foil which is moderately roughened to improve workability, is excellent in flexibility, and has excellent surface etching characteristics.

以下,對本發明之實施形態之壓延銅箔進行說明。再者,於本發明中所謂%只要未特別說明則表示質量%。Hereinafter, the rolled copper foil according to the embodiment of the present invention will be described. In addition, in the present invention, the % is expressed by mass unless otherwise specified.

首先,參照圖1,對本發明之技術思想進行說明。若使最終冷壓延中之輥粗糙度變大,使銅箔表面變得粗糙,則雖然銅箔之操作性提高,但變得易產生碟型下陷(圖1之先前例1)。此可如以下般考慮。First, the technical idea of the present invention will be described with reference to Fig. 1 . When the roughness of the roll in the final cold rolling is increased and the surface of the copper foil is roughened, the operability of the copper foil is improved, but the dishing is likely to occur (previous example 1 of Fig. 1). This can be considered as follows.

藉由最終冷壓延中粗糙之輥,於銅箔之表面形成油坑,但隨著加工進行,於油坑之前端部易產生剪切變形帶,若進一步繼續加工則剪切變形帶較深地擴展。如此可認為:產生較深剪切變形帶之油坑部分於再結晶時,於其他均勻之組織中成為結晶方位不同之晶粒,而成為蝕刻時之碟型下陷的起點。The oil pit is formed on the surface of the copper foil by the cold rolling of the rough rolling roller. However, as the processing progresses, the shear deformation zone is easily formed at the end of the oil pit, and if the processing is further processed, the shear deformation zone is deeper. Expansion. Therefore, it can be considered that the sump portion which generates the deeper shear deformation band becomes a crystal grain having a different crystal orientation in other uniform tissues at the time of recrystallization, and becomes a starting point of the dish type sag at the time of etching.

另一方面,為獲得銅箔之彎曲性而提高光澤度(表面粗糙度)之方法自先前已為眾所周知。可認為此係為了以粗糙度較低之輥進行最終冷壓延,抑制油坑之形成,藉此使剪切變形帶不易產生。然而,因若提高銅箔之光澤度(使表面粗糙度變小),則銅箔之操作性降低(圖1之先前例2),故就利用銅箔之方面而言不佳。On the other hand, a method of improving the gloss (surface roughness) in order to obtain the bendability of the copper foil has been known from the prior art. It is considered that this is to prevent the formation of the oil crater by performing the final cold rolling with a roller having a low roughness, whereby the shear deformation belt is less likely to be generated. However, if the glossiness of the copper foil is increased (the surface roughness is made small), the handleability of the copper foil is lowered (previous example 2 of Fig. 1), so that it is not preferable in terms of copper foil.

相對於此,本發明人發現可藉由於最終冷壓延之最終道次前不使銅箔之表面變得粗糙(例如,以粗糙度較低之輥進行壓延),且於最終冷壓延之最終道次中使銅箔之表面變得粗糙(例如,以較粗糙之輥進行壓延),使油坑形成而使最終之銅箔表面變為粗糙之狀態,且成為剪切變形帶未充分擴展之油坑形狀與頻度,結果於均勻之組織中結晶方位不同之晶粒減少,且碟型下陷減少(圖1之本發明例)。In contrast, the inventors have discovered that the surface of the copper foil can be prevented from being roughened by the final pass of the final cold rolling (for example, rolling with a roll having a lower roughness), and finally in the final cold rolling. In the second, the surface of the copper foil is roughened (for example, calendered with a rougher roll), the oil sump is formed to make the surface of the final copper foil rough, and the oil is not fully expanded by the shear deformation zone. The shape and frequency of the pits result in a decrease in crystal grains having different crystal orientations in a uniform structure, and a dish sinking is reduced (the inventive example of Fig. 1).

即,先前係認為銅箔之取向性單純依存於銅箔表面之粗糙度,但實際可知材料內部之剪切變形帶之規模(擴展度)會對取向度(及碟型下陷)產生影響。而且,於最終冷壓延中,若於最終道次以前之道次中可充分地抑制剪切帶之擴展,則即便於最終道次中將銅箔表面精加工成較為粗糙,亦可獲得較高之取向性。That is, it has been previously considered that the orientation of the copper foil is purely dependent on the roughness of the surface of the copper foil, but it is actually known that the scale (spreadness) of the shear deformation zone inside the material affects the degree of orientation (and dishing). Moreover, in the final cold rolling, if the expansion of the shear band can be sufficiently suppressed in the pass before the final pass, even if the surface of the copper foil is finished to be rough in the final pass, it can be obtained higher. Orientation.

又,本發明之特徵在於:對上述之剪切帶之擴展度藉由利用共軛焦顯微鏡像觀察之油坑之面積率進行宏觀地評價,且發現碟型下陷減少之面積率之範圍。Further, the present invention is characterized in that the degree of expansion of the above shear band is macroscopically evaluated by the area ratio of the oil pit observed by the conjugate focal microscope image, and the range of the area ratio at which the dish type is reduced is found.

相對於此,僅以自先前使用之表面粗糙度之值無法明確地獲得油坑之資訊。即,若觀察壓延銅箔表面,則觀察到油坑沿著壓延直角方向TD產生,但如圖2所示,可知:於油坑之剖面形狀中,除了TD方向之長度較短之三角形者(圖2之符號P1),亦存在梯形形狀者(圖2之符號P2)。又,即便油坑之深度相同,於RD方向上存在坑之開放程度較寬者及較窄者。可認為:以進行銅箔表面起伏之測定之一般所謂Ra、Ry、Rz、Sm之表面粗糙度的測定中,無法充分地反映該等油坑之形狀之不同。On the other hand, the information of the oil pit cannot be clearly obtained only from the value of the surface roughness used previously. That is, when the surface of the rolled copper foil is observed, it is observed that the oil sump is generated along the right angle direction TD of the rolling, but as shown in FIG. 2, it is understood that in the cross-sectional shape of the oil pit, a triangle having a shorter length in the TD direction is known ( The symbol P1) of Fig. 2 also has a trapezoidal shape (symbol P2 of Fig. 2). Moreover, even if the depth of the oil pit is the same, there is a wide openness and a narrower pit in the RD direction. It is considered that the measurement of the surface roughness of the general so-called Ra, Ry, Rz, and Sm for measuring the surface roughness of the copper foil does not sufficiently reflect the difference in the shape of the oil pits.

因此,使用共軛焦(共焦點)顯微鏡,求得與油坑相當之圖像區域之比例(面積率),藉此可反應油坑之形狀,且可獲得對應於碟型下陷或彎曲性之優劣之差異。再者,油坑之面積率係將利用共軛焦顯微鏡拍攝之Z軸(高度方向)之高度差於特定臨限值前後進行2值化,將較該臨限值深之部分作為油坑部分來進行選取,從而求得其面積比例。Therefore, using a conjugate focal (confocal) microscope, the ratio (area ratio) of the image area corresponding to the oil pit is obtained, whereby the shape of the oil puddle can be reflected, and the dishing or bending property corresponding to the dish can be obtained. The difference between good and bad. Furthermore, the area ratio of the sump is binarized by the height difference of the Z-axis (height direction) taken by the conjugate focal length microscope before and after the specific threshold, and the portion deeper than the threshold is used as the sump portion. To select, to obtain the proportion of its area.

其次,對本發明之壓延銅箔之規定及組成進行說明。Next, the specification and composition of the rolled copper foil of the present invention will be described.

(1)油坑之面積率(1) Area ratio of oil pit

如上述般,以於最終冷壓延之最終道次前不使銅箔之表面變得粗糙,於最終冷壓延之最終道次中使銅箔之表面變得粗糙,而最終使銅箔之表面變得粗糙,並且可獲得剪切變形帶不易擴展的油坑之形狀,且碟型下陷變少。而且藉由本發明人等之試驗(下述之實施例)可知:具有如此之剪切變形帶不易擴展的油坑之表面於以共軛焦顯微鏡測定時之油坑之面積率為6%以上15%以下。As described above, the surface of the copper foil is not roughened before the final pass of the final cold rolling, and the surface of the copper foil is roughened in the final pass of the final cold rolling, and finally the surface of the copper foil is changed. It is rough, and the shape of the oil pit where the shear deformation band is difficult to expand can be obtained, and the dish type is less depressed. Further, it has been found by the inventors of the present invention (the following examples) that the surface of the oil sump having such a shear deformation band which is not easily spread is 6% or more in the area of the oil pit when measured by a conjugate focal microscope. %the following.

若油坑之面積率超過15%,則擴展有剪切變形帶之油坑增加。若剪切變形帶於材料內部擴展,則於再結晶時,於其他之均勻組織中成為結晶方位不同之晶粒,易產生蝕刻時之碟型下陷。If the area ratio of the oil pit exceeds 15%, the oil pit extending the shear deformation zone increases. If the shear deformation band spreads inside the material, it will become a crystal grain having different crystal orientations in other uniform tissues during recrystallization, and it is easy to cause dishing in the etching.

另一方面,油坑之面積率未達6%之情形,存在2個條件。條件1為於最終冷壓延之全部道次中使用粗度較低之輥。於該條件下,因較深油坑較少,且剪切變形帶亦不易擴展,故碟型下陷減少,但因銅箔之表面粗糙度變得過小(不滿足下述Ra/t之要件),銅箔製品不易操作,故不佳。On the other hand, in the case where the area ratio of the oil pit is less than 6%, there are two conditions. Condition 1 is the use of a lower thickness roll in all passes of the final cold rolling. Under this condition, the deeper oil sump is less, and the shear deformation zone is not easy to expand, so the dish type sinking is reduced, but the surface roughness of the copper foil becomes too small (the following Ra/t requirements are not satisfied) Copper foil products are not easy to handle, so they are not good.

第2項條件為:於最終冷壓延之最終道次前使銅箔之表面變得粗糙,而於最終冷壓延之最終道次中使用粗糙度較低之輥使銅箔之表面變得平滑。於該條件下,利用於最終道次中使用粗糙度較低之輥,而使最終道次前形成之油坑中接近銅箔表面之部分於最終道次中擴大而趨近平坦,表面粗糙度變小。然而,油坑內部之狹窄谷部分依然殘留。因此,雖油坑之表面部分之開口變窄且油坑之面積率本身變小,但因於最終道次前使用較粗糙之輥,故於油坑中剪切變形帶擴展,於最終道次後亦殘留有剪切變形帶,且產生多個碟型下陷。而且,如此油坑之面積率雖較小但產生多個碟型下陷之狀態,於油坑之面積率未達6%之情形時變得顯著。The second condition is that the surface of the copper foil is roughened before the final pass of the final cold rolling, and the surface of the copper foil is smoothed by using a roller having a lower roughness in the final pass of the final cold rolling. Under this condition, the lower roughness of the roller is used in the final pass, so that the portion of the oil pit formed before the final pass is close to the surface of the copper foil and is flattened in the final pass, and the surface roughness is obtained. Become smaller. However, the narrow valley portion inside the oil pit remains. Therefore, although the opening of the surface portion of the oil pit is narrowed and the area ratio of the oil pit itself becomes small, since the rougher roller is used before the final pass, the shear deformation band expands in the oil pit, and the final pass After that, a shear deformation band remains, and a plurality of dish forms are depressed. Further, although the area ratio of the oil pit is small, a state in which a plurality of dish forms are depressed is caused, and when the area ratio of the oil pit is less than 6%, it becomes remarkable.

再者,使油坑之面積率為6%以上之方法,只要於如上述之最終冷壓延中,在最終道次前之道次中的較淺且未擴展有剪切帶之油坑中,以形成油坑之方式於最終冷壓延之最終道次前之道次中使用粗糙度(表面粗糙度Ra例如為0.05μm以下)較小之輥進行壓延,且於最終冷壓延之最終道次中使用粗糙度(表面粗糙度Ra例如為0.06μm以上)較大之輥進行壓延,而使最終獲得之銅箔表面變得粗糙即可。因於最終道次前之道次中形成之油坑較淺,剪切帶未擴展,故即便於最終冷壓延之最終道次中使銅箔之表面變得粗糙,剪切帶擴展之油坑亦無法增加,且碟型下陷變少。另一方面,於最終冷壓延之最終道次前之道次中若使用粗糙度(表面粗糙度Ra例如超過0.05μm)較大之輥壓延,則形成剪切帶易擴展之油坑,並於最終道次中油坑擴展,且其面積增加,油坑之面積率超過15%,剪切帶之擴展變得顯著,易產生碟型下陷。Furthermore, the method of making the area ratio of the oil pits 6% or more is as long as in the final cold rolling as described above, in the shallower and unexpanded shear sump in the pass before the final pass, Rolling using a roll having a smaller roughness (surface roughness Ra, for example, 0.05 μm or less) in a pass before the final pass of the final cold rolling in the form of a sump, and in the final pass of the final cold rolling Calendering is performed using a roll having a large roughness (surface roughness Ra, for example, 0.06 μm or more), and the surface of the finally obtained copper foil may be roughened. Since the oil pit formed in the pass before the final pass is shallow, the shear band is not expanded, so even if the surface of the copper foil is roughened in the final pass of the final cold rolling, the oil band of the shear band is expanded. It is also impossible to increase, and the dish type is less depressed. On the other hand, if a roll having a large roughness (surface roughness Ra, for example, more than 0.05 μm) is used in the pass before the final pass of the final cold rolling, a crater in which the shear band is easily expanded is formed, and In the final pass, the oil pit expands, and its area increases. The area ratio of the oil pit exceeds 15%, and the expansion of the shear band becomes remarkable, which is easy to cause dish-shaped subsidence.

此處,於最終冷壓延步驟中,以於較最終道次更前之道次中使用粗糙度(表面粗糙度Ra例如為0.05μm以下)較小之輥,而使最終冷壓延之銅箔表面變得較為平滑。具體而言,於最終冷壓延步驟之最終道次之1道次前之階.段中,表面粗糙度Ra與箔厚度t之比(Ra/t)較佳為0.0020以上0.0040以下。若以如Ra/t處於該範圍般之表面狀態進行最終道次之壓延,則因即便於最終道次中銅箔之表面變得粗糙,亦不易向已形成之油坑中導入剪切帶,故而較佳。Here, in the final cold rolling step, the surface of the final cold-rolled copper foil is used in a pass which is smaller than the final pass, such as a roll having a roughness (surface roughness Ra of, for example, 0.05 μm or less). It becomes smoother. Specifically, in the step before the first pass of the final pass of the final cold rolling step, the ratio (Ra/t) of the surface roughness Ra to the foil thickness t is preferably 0.0020 or more and 0.0040 or less. If the final pass is rolled in a surface state such as Ra/t in this range, since the surface of the copper foil becomes rough even in the final pass, it is difficult to introduce the shear band into the formed oil pit. Therefore, it is better.

再者,如下述般,使最終冷壓延步驟之最終道次結束後之(Ra/t)為0.004以上0.007以下。Further, as described below, (Ra/t) after the end of the final pass of the final cold rolling step is 0.004 or more and 0.007 or less.

(2)I/I0 (2) I/I 0

為對本發明之銅箔賦予較高彎曲性,故將於以200℃加熱30分鐘調質為再結晶組織之狀態下,由壓延面之X射線繞射所求得之(200)面之強度(I),規定為相對於由微粉末銅之X射線繞射所求得之(200)面之強度(I0 )為I/I0 ≧50。藉此,彎曲性優異之(200)面之取向度提高。若達到I/I0 <50,則彎曲性下降。上述以200℃進行30分鐘之退火係模仿CCL製造步驟中賦予銅箔之溫度歷程。In order to impart high flexibility to the copper foil of the present invention, the strength of the (200) plane obtained by the X-ray diffraction of the calendering surface will be adjusted to a recrystallized structure by heating at 200 ° C for 30 minutes ( I) is defined as I/I 0 ≧50 with respect to the intensity (I 0 ) of the (200) plane obtained by X-ray diffraction of fine powder copper. Thereby, the degree of orientation of the (200) plane excellent in flexibility is improved. If I/I 0 <50 is reached, the bendability is lowered. The above annealing at 200 ° C for 30 minutes mimics the temperature history of the copper foil imparted in the CCL manufacturing step.

再者,為使I/I0 ≧50,較理想的是最終冷壓延之加工度為98%以上。Further, in order to make I/I 0 ≧ 50, it is preferable that the degree of final cold rolling is 98% or more.

(3)Ra/t(3) Ra/t

為以表面粗糙度與先前者相比未改變地使碟型下陷減少,將最終冷壓延後之Ra(mm)/t(mm)規定為0.004以上0.007以下。若如此,則可使表面粗糙度與先前之銅箔相同,並且減少碟型下陷。再者,利用將表面粗糙度除以厚度,則可不根據銅箔厚度地來進行銅箔表面粗糙度之評價。例如,若銅箔之厚度t變薄,則存在以下問題:即便為相同之表面粗糙度,佔據銅箔厚度之表面凹凸之比例亦變大,且無法充分地進行根據上述之油坑之面積率的銅箔表面評價。In order to reduce the dishing shape without changing the surface roughness as compared with the former, Ra (mm) / t (mm) after the final cold rolling is specified to be 0.004 or more and 0.007 or less. If so, the surface roughness can be made the same as the previous copper foil, and the dishing can be reduced. Further, by dividing the surface roughness by the thickness, the surface roughness of the copper foil can be evaluated without depending on the thickness of the copper foil. For example, if the thickness t of the copper foil is thin, there is a problem in that even if the surface roughness is the same, the ratio of the surface unevenness which occupies the thickness of the copper foil becomes large, and the area ratio of the oil pit according to the above cannot be sufficiently performed. Copper foil surface evaluation.

此處,將Ra(中心線平均粗度)規定為JIS B0601,於本發明中,係在銅箔表面於壓延平行方向長度為175μm,且於壓延直角方向分別相隔50μm以上之3根直線上所測得之值的平均值。Here, Ra (center line average roughness) is defined as JIS B0601, and in the present invention, the length of the surface of the copper foil in the parallel direction of the rolling is 175 μm, and the straight lines in the direction perpendicular to the rolling are separated by three lines of 50 μm or more. The average of the measured values.

(4)d/t(4)d/t

即便於考慮到銅箔表面之粗糙度不是太大,且多數之油坑中未擴展有剪切變形帶之情形時,亦有存在幾個較深之油坑之情形。於較深之油坑中剪切變形帶擴展可能性較高,且於此情形時,其為碟型下陷產生之起點。因此,於本發明中,將油坑之最大深度之平均值d規定為d/t≦0.1。That is, it is convenient to consider that the roughness of the surface of the copper foil is not too large, and in the case where the shear deformation zone is not expanded in most of the oil pits, there are also several deep oil pits. The shear deformation zone is more likely to expand in deeper oil pits, and in this case it is the starting point for dishing. Therefore, in the present invention, the average value d of the maximum depth of the oil pit is defined as d/t ≦ 0.1.

以將油坑之最大深度之平均值d除以厚度t,則可不根據銅箔厚度而進行銅箔表面評價。即,即便油坑之最大深 度相同,但若銅箔之厚度t較薄,則其影響變大。By dividing the average value d of the maximum depth of the oil pit by the thickness t, the copper foil surface evaluation can be performed without depending on the thickness of the copper foil. That is, even the maximum depth of the oil pit The degree is the same, but if the thickness t of the copper foil is thin, the influence becomes large.

此處,油坑之最大深度之平均值d係:如圖3所示於銅箔表面在壓延平行方向RD長度為175μm,且於壓延直角方向TD分別相隔50μm以上之3條直線L1 ~L3 上,相當於油坑之最大深度的各直線L1 ~L3 之厚度方向的最大高度HM 與最小高度HS 之差di之平均值。具體而言,以接觸式粗糙度,測定L1 ~L3 上之厚度方向之分佈,求得最大高度HM 與最小高度HS ,將各直線L1 ~L3 之di加以平均即可。Here, the average value of the maximum pit depth of an oil-based d: the surface of the copper foil 3 in parallel to the rolling direction RD of 175 m length, and at right angles to the rolling direction TD of more than 50 m 3, respectively straight lines L 1 ~ L apart 3 is an average value of the difference di between the maximum height H M and the minimum height H S of the respective straight lines L 1 to L 3 corresponding to the maximum depth of the oil pit. Specifically, the distribution in the thickness direction on L 1 to L 3 is measured by the contact roughness, and the maximum height H M and the minimum height H S are obtained , and the di of the straight lines L 1 to L 3 may be averaged.

銅箔(或銅合金箔)之厚度並無特別限制,例如可較佳地使用5~50μm者。The thickness of the copper foil (or copper alloy foil) is not particularly limited, and for example, 5 to 50 μm can be preferably used.

(5)EBSD之方位差(5) Azimuth difference of EBSD

如上述般,碟型下陷係於藉由將銅箔與樹脂膜接合之時之熱處理,於再結晶之均勻組織中結晶方位不同之晶粒單獨存在之比率較多之情形時,於蝕刻時該單獨晶粒可較周圍更深地蝕刻之凹陷。因此,上述熱處理,以模仿CCL製造步驟中賦予銅箔之溫度歷程的熱處理條件(以200℃進行30分鐘)加熱銅箔而調質為再結晶組織。接下來,該狀態之結晶方位,於對銅箔表面進行電解研磨後以EBSD進行觀察之情形時,較佳為自[100]方位之角度差為15度以上之晶粒之面積率為20%以下。再者,對已經接受熱歷程之成為CCL之銅箔,可以200℃加熱30分鐘。因經熱處理直至暫時再結晶為止者,即便再次加熱亦幾乎不會變化,故於以EBSD之觀察時,並不區分接受熱歷程之銅箔與未接受之銅箔,均以200℃加熱30分鐘。As described above, the dish type is recessed by heat treatment when the copper foil and the resin film are joined, and when the ratio of the crystal grains having different crystal orientations in the uniform structure of the recrystallization is large, the etching is performed at the time of etching. Individual dies can etch deeper than the surrounding. Therefore, in the above heat treatment, the copper foil is heated to a recrystallized structure by heat treatment conditions (for 30 minutes at 200 ° C) which mimic the temperature history of the copper foil in the CCL manufacturing step. Next, in the case where the surface of the copper foil is subjected to electrolytic polishing on the surface of the copper foil and observed by EBSD, it is preferable that the area ratio of the crystal grains having an angle difference of 15 degrees or more from [100] is 20%. the following. Further, the copper foil which has been subjected to the heat history and becomes CCL can be heated at 200 ° C for 30 minutes. Since it is heat-treated until it is temporarily recrystallized, it does not change almost even if it is heated again. Therefore, when the EBSD is observed, the copper foil which receives the heat history and the unacceptable copper foil are not distinguished, and are heated at 200 ° C for 30 minutes. .

於以EBSD進行觀察之情形時,若上述面積率未達20%,則銅箔表面之晶粒彼此之方位差較小,均勻之組織中結晶方位不同之晶粒單獨存在之比例較少,故蝕刻造成之凹陷(碟型下陷)減少。再者,於以EBSD進行觀察之情形時為使上述面積率未達20%,需如上所述可藉由於最終冷壓延中,在最終道次前之道次中抑制剪切帶之擴展,即,於最終冷壓延之最終道次前之道次中使用粗糙度(表面粗糙度Ra例如為0.5μm以下)相對較小之輥壓延即可。In the case of observation by EBSD, if the area ratio is less than 20%, the difference in orientation between the crystal grains on the surface of the copper foil is small, and the proportion of crystal grains having different crystal orientations in the uniform structure is small, so The depression caused by etching (disc sinking) is reduced. Furthermore, in the case of observation by EBSD, in order to make the above area ratio less than 20%, it is necessary to suppress the expansion of the shear band in the pass before the final pass by the final cold rolling as described above, that is, It is sufficient to use a roll having a relatively small roughness (surface roughness Ra, for example, 0.5 μm or less) in the pass before the final pass of the final cold rolling.

(6)組成(6) Composition

銅箔,可使用純度99.9wt%以上之精銅、無氧銅,又,可根據需求之強度或導電性使用周知之銅合金。As the copper foil, fine copper or oxygen-free copper having a purity of 99.9 wt% or more can be used, and a well-known copper alloy can be used depending on the strength or conductivity required.

無氧銅之規格為JIS-H3510(合金編號C1011)、JIS-H3100(合金編號C1020),且精銅之規格為JIS-H3100(合金編號C1100)。The specifications of the oxygen-free copper are JIS-H3510 (alloy No. C1011) and JIS-H3100 (alloy No. C1020), and the specifications of the refined copper are JIS-H3100 (alloy No. C1100).

周知之銅合金,例如可列舉0.01~0.3wt%之摻錫銅合金(更佳為0.001~0.02wt%之摻錫銅合金);0.01~0.05wt%之摻銀銅合金;0.005~0.02wt%之摻銦銅合金;0.005~0.02wt%之摻鉻銅合金;包含合計為0.05wt%以下之選自由錫、銀、銦及鉻所組成之群之一種以上之銅合金;其中,導電性優異者多使用Cu-0.02wt%Ag。A well-known copper alloy, for example, may be 0.01 to 0.3 wt% of a tin-doped copper alloy (more preferably 0.001 to 0.02 wt% of a tin-doped copper alloy); 0.01 to 0.05 wt% of a silver-doped copper alloy; 0.005 to 0.02 wt% Indium-doped copper alloy; 0.005 to 0.02 wt% of a chromium-doped copper alloy; and a copper alloy containing a total of 0.05 wt% or less selected from the group consisting of tin, silver, indium, and chromium; wherein the conductivity is excellent Cu-0.02 wt% Ag is often used.

其次,對本發明之壓延銅箔之製造方法之一例進行說明。首先,將由銅及必要之合金元素進而由不可避免之雜質所構成之鑄塊熱壓延後,反覆進行冷壓延與退火,最後以最終冷壓延精加工成特定厚度。Next, an example of a method for producing a rolled copper foil of the present invention will be described. First, an ingot composed of copper and a necessary alloying element and further an unavoidable impurity is hot-rolled, then subjected to cold rolling and annealing, and finally to a specific thickness by final cold rolling.

此處,如上述般,於最終冷壓延之最終道次前,不使銅箔之表面變得較粗糙,而於最終冷壓延之最終道次中使銅箔之表面變得較粗糙,藉此使其雖使最終之銅箔表面變得粗糙,但成為具有剪切變形帶不易擴展之油坑之表面狀態,且碟型下陷減少。而且,如此之剪切變形帶較少之表面,油坑之面積率為6%以上15%以下。Here, as described above, the surface of the copper foil is not roughened before the final pass of the final cold rolling, and the surface of the copper foil is roughened in the final pass of the final cold rolling. Even if the surface of the final copper foil is roughened, it becomes a surface state of the oil pit having a shear deformation band which is not easily expanded, and the dish type is reduced. Further, such a surface having a small shear deformation band has an area ratio of 6% to 15% or less.

因此,於最終冷壓延之最終道次前,為使銅箔之表面不變得粗糙,使用粗糙度(表面粗糙度Ra例如為0.05μm以下)相對較小之輥進行壓延,或者將最終冷壓延中之1道次加工度變大來進行壓延即可。另一方面,於最終冷壓延之最終道次中,使用粗糙度(表面粗糙度Ra例如為0.06μm以上)相對較大之輥進行壓延,或者使用黏度較高之壓延油進行壓延,使最終所得之銅箔表面變得粗糙。Therefore, before the final pass of the final cold rolling, in order to make the surface of the copper foil not rough, the roll having a relatively small roughness (surface roughness Ra, for example, 0.05 μm or less) is used, or the final cold rolling is performed. In the first pass, the degree of processing becomes large and the rolling can be performed. On the other hand, in the final pass of the final cold rolling, a roll having a relatively large roughness (surface roughness Ra, for example, 0.06 μm or more) is used, or a rolling oil having a high viscosity is used for rolling, and the final result is obtained. The surface of the copper foil becomes rough.

再者,為製作雖使最終之銅箔之表面粗糙,但具有剪切變形帶不易擴展之油坑之表面狀態,必需於最終冷壓延之最終2道次、或最終道次中,使用上述之較粗糙輥,或者使用黏度較高之壓延油進行壓延,但就便於調整之方面而言,較佳為調整最終道次中之壓延條件。另一方面,若自最終冷壓延之最終3道次前使輥之粗糙度變得粗糙,則於已形成之油坑中進一步因最終道次之加工而使剪切變形帶擴展。Furthermore, in order to produce a surface state in which the surface of the final copper foil is rough, but the shear deformation zone is difficult to expand, it is necessary to use the above-mentioned two passes in the final cold pass or the final pass. Calendering is carried out with a coarser roll or with a higher viscosity rolling oil, but in terms of ease of adjustment, it is preferred to adjust the rolling conditions in the final pass. On the other hand, if the roughness of the roll is roughened from the final three passes of the final cold rolling, the shear deformation zone is further expanded by the final pass in the formed oil pit.

再者,以使以最終冷壓延前之退火所得之再晶粒之平均粒徑成為5~20μm之方式,調整退火條件即可。又,使最終冷壓延中之壓延加工度達到98%以上即可。Further, the annealing conditions may be adjusted so that the average grain size of the recrystal grains obtained by the annealing before the final cold rolling is 5 to 20 μm. Further, the degree of rolling work in the final cold rolling may be 98% or more.

[實施例][Examples]

添加有表1所示組成之元素之精銅或無氧銅作為原料而鑄造鑄錠,且於800℃以上進行熱壓延直至厚度達到10mm,對表面之氧化皮進行平面切削後,重複進行冷壓延與退火,最後以最終冷壓延精加工成表1所記載之厚度。使最終冷壓延中之壓延加工度達到99.2%。The ingot is cast by adding copper or oxygen-free copper having the elements shown in Table 1 as a raw material, and hot rolling is performed at 800 ° C or higher until the thickness reaches 10 mm, and the surface scale is subjected to planar cutting, and then the cooling is repeated. Calendering and annealing were finally finished by final cold rolling to the thicknesses shown in Table 1. The degree of calendering in the final cold rolling is 99.2%.

再者,表1之組成欄之「添加0.02%Ag之TPC」係指於JIS-H3100(合金編號C1100)之精銅(TPC)中添加0.02質量%之Ag。又,表1之組成欄之「添加0.01%Ag0.005%Sn之OFC」係指於JIS-H3100(合金編號C1020)之無氧銅(OFC)中添加0.01質量%之Ag及0.005質量%之Sn。然而,僅於實施例6中使用規格為JIS-H3510(合金編號C1011)之無氧銅(OFC)作為無氧銅,於實施例4、5、8、9中使用規格為JIS-3100(合金編號C1020)之無氧銅(OFC)作為無氧銅。In addition, "TPC to which 0.02% of Ag is added" in the composition column of Table 1 means that 0.02% by mass of Ag is added to the refined copper (TPC) of JIS-H3100 (alloy No. C1100). In addition, "the addition of 0.01% Ag 0.005% Sn of OFC" in the composition column of Table 1 means that 0.01% by mass of Ag and 0.005% by mass are added to the oxygen-free copper (OFC) of JIS-H3100 (alloy No. C1020). Sn. However, oxygen-free copper (OFC) having a specification of JIS-H3510 (alloy No. C1011) was used as the oxygen-free copper only in Example 6, and the specification was JIS-3100 (alloy in Examples 4, 5, 8, and 9). Oxygen-free copper (OFC), number C1020), is used as oxygen-free copper.

再者,最終冷壓延係以10~15道次進行,且如表1所示,改變直至最終道次前之輥之表面粗糙度、及最終道次之輥之表面粗糙度進行壓延。自最終道次之第1道次直至最終道次前之輥之表面粗糙度全部相同。再者,最終壓延之加工度除比較例5以外為99%,比較例5為96%。Further, the final cold rolling was carried out in 10 to 15 passes, and as shown in Table 1, the surface roughness of the roll before the final pass, and the surface roughness of the final pass roll were rolled. The surface roughness of the rolls from the first pass of the final pass until the final pass is the same. Further, the degree of processing of the final rolling was 99% except for Comparative Example 5, and Comparative Example 5 was 96%.

對以此方式獲得之各銅箔試料,進行各特性之評價。Each of the copper foil samples obtained in this manner was evaluated for each characteristic.

(1)表面粗糙度Ra:Ra(中心線平均粗糙度)係以JIS B0601為基準而測定,且係於試料表面使用共軛焦顯微鏡(Lasertec公司製造、型號:HD100D),於壓延平行方向 長度為175μm而測定之值。(1) Surface roughness Ra: Ra (center line average roughness) is measured based on JIS B0601, and a conjugate focal length microscope (manufactured by Lasertec Co., Ltd., model: HD100D) is used on the surface of the sample in the parallel direction of rolling. The value measured was 175 μm in length.

(2)立方體集合組織(2) Cube collection organization

將試料以200℃加熱30分鐘後,求出由壓延面之X射線繞射所求得之(200)面強度之積分值(I)。將該值除以預先測定之微粉末銅(325mesh.氫氣流中以300℃加熱1小時後使用)之(200)面強度之積分值(I0 ),算出I/I0 值。After the sample was heated at 200 ° C for 30 minutes, the integral value (I) of the (200) plane intensity obtained by the X-ray diffraction of the rolled surface was obtained. This value was divided by the integral value (I 0 ) of the (200) plane intensity of the previously measured fine powder copper (used after heating at 300 ° C for 1 hour in a hydrogen stream), and the I/I 0 value was calculated.

(3)油坑之最大深度(平均值d)(3) Maximum depth of the oil pit (average d)

使用共軛焦顯微鏡(Lasertec公司製造、型號:HD100D),如圖3所示,分別求得在銅箔表面於壓延平行方向RD長度為175μm,且於壓延直角方向TD分別相隔50μm以上之3根直線L1 ~L3 上之最大高度HM 與最小高度HS 之差di。將各直線L1 ~L3 之di平均而作為d。再者,設為d(mm)/t(mm)。Using a conjugate focal length microscope (manufactured by Lasertec Co., Ltd., model: HD100D), as shown in Fig. 3, the length of the copper foil surface in the direction parallel to the rolling direction RD was 175 μm, and the length of the rolling orthogonal direction TD was separated by 50 μm or more. The difference di between the maximum height H M and the minimum height H S on the straight lines L 1 to L 3 . The di of each of the straight lines L 1 to L 3 is averaged as d. Furthermore, it is set to d (mm) / t (mm).

(4)EBSD之方位差(4) Azimuth difference of EBSD

對於(2)中以200℃加熱30分鐘後之試料表面進行電解研磨後以EBSD(電子背散射繞射裝置,日本電子股份有限公司JXA8500F、加速電壓20kV、電流2e -8A、測定範圍1000μm×1000μm、階寬5μm)觀察。以圖像分析求得來自[100]方位之角度差為15度以上之晶粒之面積率。進而,以目視計數試料表面1mm見方之觀察範圍內晶粒徑超過20μm者個數。接下來,對含有該觀察範圍之試料,使用ADEKATEC CL-8(ADEKA股份有限公司製造)20%溶液,於常溫下進行2分鐘蝕刻,並將以光學顯微鏡拍攝蝕刻後之表面所得之圖像明暗二值化,將超過短徑50μm之暗部作為碟型下陷進行計數。再者,蝕刻後之銅箔表面成為反映結晶方位之形狀,且具有[100]方位之組織成為與銅箔表面平行之面,相對於此,具有其他結晶方位之部分可產生因結晶方位引起之凹凸。因此,碟型下陷之部分在光學顯微鏡中顯得較暗。The surface of the sample after heating at 200 ° C for 30 minutes in (2) was subjected to electrolytic polishing to EBSD (Electronic Backscatter Diffraction Device, JEOL 8500F, Acceleration Voltage 20kV, Current 2 e -8A, Measurement Range 1000 μm × 1000 μm, step width 5 μm) was observed. The area ratio of the crystal grains having an angular difference of 15 degrees or more from the [100] orientation was obtained by image analysis. Further, the number of crystal grains in the observation range of 1 mm square on the surface of the sample was visually counted to exceed 20 μm. Next, the sample containing the observation range was etched at room temperature for 2 minutes using a 20% solution of ADEKATEC CL-8 (manufactured by Adeka Co., Ltd.), and the image obtained by photographing the surface after etching with an optical microscope was light-dark. In the binarization, the dark portion exceeding the short diameter of 50 μm was counted as a dish type sag. Further, the surface of the copper foil after the etching has a shape reflecting the crystal orientation, and the structure having the [100] orientation is a surface parallel to the surface of the copper foil. On the other hand, the portion having the other crystal orientation may be caused by the crystal orientation. Bump. Therefore, the dished portion is darker in the optical microscope.

再者,圖4係表示實施例1之表面之光學顯微鏡像,圖5係表示比較例3之表面光學顯微鏡像。4 is an optical microscope image showing the surface of Example 1, and FIG. 5 is a surface optical microscope image of Comparative Example 3.

(4)油坑之面積率(4) Area ratio of oil pit

對試料表面以共軛焦顯微鏡(Lasertec公司製造、型號:HD100D)針對300×300μm之測定視野進行測定。於測定視野內使試料於光軸(Z軸)方向移動,取得自銅箔表面10nm深之圖像(將其稱為FMS(Focus Scan Memory)圖像)。接下來,將自銅箔表面較10nm深之部分視為油坑而進行2值化處理。此圖像之例為圖6及圖7,明亮色之部分為油坑。接下來,對於測定視野300×300μm,使用市售之圖像處理軟體求得油坑之面積(明亮色之面積)面積,並算出油坑之面積率。The surface of the sample was measured with a conjugate focal length microscope (manufactured by Lasertec Co., Ltd., model: HD100D) for a measurement field of 300 × 300 μm. The sample was moved in the optical axis (Z-axis) direction in the measurement field of view, and an image having a depth of 10 nm from the surface of the copper foil was obtained (this is called an FMS (Focus Scan Memory) image). Next, a portion having a depth of 10 nm from the surface of the copper foil was treated as a crater and binarized. An example of this image is shown in Figures 6 and 7, and the bright color portion is a sump. Next, with respect to the measurement field of view of 300 × 300 μm, the area of the oil pit (area of bright color) was obtained using a commercially available image processing software, and the area ratio of the oil pit was calculated.

(5)表面之傷痕(5) Surface scars

對各試料之表面進行目測,且將於壓延方向具有10mm以上之長度之傷痕為5部位/m2 以上之情形設為×。The surface of each sample was visually observed, and the case where the flaw having a length of 10 mm or more in the rolling direction was 5 parts/m 2 or more was set as ×.

(6)彎曲性(6) Flexibility

將試料以200℃加熱30分鐘使其再結晶後,藉由圖8所示之彎曲試驗裝置,進行彎曲疲勞壽命之測定。該裝置成為於振盪驅動體4結合有振動傳遞構件3之構造,被試驗銅箔1係於箭頭表示之螺釘2之部分與3之前端部之共計4處固定於裝置。若將振動部3進行上下驅動,則銅箔1之中間部以特定之曲率半徑r彎曲為回管狀。本試驗係求出以下之條件下重複彎曲時之至斷裂之次數。After the sample was heated at 200 ° C for 30 minutes to recrystallize, the bending fatigue life was measured by the bending test apparatus shown in FIG. 8 . This device has a structure in which the vibration transmitting member 3 is coupled to the oscillation transmitting member 3, and the test copper foil 1 is fixed to the device by a total of four portions of the screw 2 indicated by the arrow and the front end portion of the third portion. When the vibrating portion 3 is driven up and down, the intermediate portion of the copper foil 1 is bent at a specific radius of curvature r into a tubular shape. This test is to determine the number of breaks to the time of repeated bending under the following conditions.

再者,於板厚為0.012mm之情形時,試驗條件為以下所述:試驗片寬度:12.7mm,試驗片長度:200mm,試驗片取集方向:以試驗片之長度方向成為與壓延方向平行之方式取集,曲率半徑r:2.5mm,振動衝程:25mm,振動速度:1500次/分鐘。再者,於彎曲疲勞壽命為3萬次以上之情形時,判斷為具有優異彎曲性。Further, in the case where the sheet thickness is 0.012 mm, the test conditions are as follows: test piece width: 12.7 mm, test piece length: 200 mm, test piece take-up direction: the test piece has a length direction parallel to the rolling direction The method is to collect, the radius of curvature r: 2.5 mm, the vibration stroke: 25 mm, and the vibration speed: 1500 times/min. In addition, when the bending fatigue life was 30,000 or more, it was judged that the bending property was excellent.

又,於板厚分別為0.018mm、0.006mm之情形時,以使板厚為0.012mm之情形時之彎曲試驗與彎曲應變相同之方式,將曲率半徑r分別變更為4mm、1.3mm,而其他試驗條件相同。Further, when the thicknesses are 0.018 mm and 0.006 mm, respectively, the curvature radius r is changed to 4 mm and 1.3 mm, respectively, so that the bending test is the same as the bending strain when the thickness is 0.012 mm. The test conditions are the same.

所得結果示於表1。The results obtained are shown in Table 1.

由表1可知,於I/I0 ≧50,d/t為0.1以下,且油坑之面積率為6以上15%以下之各實施例之情形時,EBSD之自[100]方位之角度差為15度以上之晶粒之面積率未達20%,碟型下陷之個數較少,進而銅箔表面傷痕較少,彎曲性亦優異。又,於各實施例之情形時,最終製品之Ra/t為0.004以上0.007以下。As can be seen from Table 1, the angle difference from the [100] orientation of EBSD when I/I 0 ≧ 50, d/t is 0.1 or less, and the area ratio of the oil pit is 6 or more and 15% or less. The area ratio of the crystal grains of 15 degrees or more is less than 20%, and the number of dish-type sags is small, and the surface of the copper foil is less scarred and excellent in flexibility. Further, in the case of each of the examples, the Ra/t of the final product was 0.004 or more and 0.007 or less.

另一方面,於最終冷壓延全部之道次(包含最終道次)之輥之表面粗糙度均為Ra=0.04μm以下之比較例1、5之情形時,因最終道次之Ra/t未達0.004,油坑之面積率未達6%故於銅箔表面劃有傷痕,操作性變差。On the other hand, in the case of Comparative Examples 1 and 5 in which the surface roughness of all the passes of the final cold rolling (including the final pass) was Ra = 0.44 μm or less, the Ra/t of the final pass was not Up to 0.004, the area ratio of the oil pit is less than 6%, so the surface of the copper foil is scratched, and the workability is deteriorated.

再者,於比較例5之情形時,雖表面粗糙度較小且油坑之面積率未達6%,但因於最終冷壓延中之壓延加工度為96%而為較低,故I/I0 <50,且為取向度較低而結晶方位不一致之狀態。於結晶方位不一致之情形時,意味著存在較多自[100]方位之角度差為15度以上之晶粒,因該晶粒之面積率超過20%,故碟型下陷亦產生較多。Further, in the case of Comparative Example 5, although the surface roughness was small and the area ratio of the oil pit was less than 6%, the calendering degree in the final cold rolling was 96%, which was low, so I/ I 0 <50, and is a state in which the degree of orientation is low and the crystal orientations are inconsistent. In the case where the crystal orientations are inconsistent, it means that there are many crystal grains having an angular difference of 15 degrees or more from the [100] orientation, and since the area ratio of the crystal grains exceeds 20%, the dish type sinking also occurs.

於最終冷壓延中,因使直至最終道次前之輥之表面粗糙度變粗糙為Ra=0.06μm以上,且使最終道次之輥之表面粗糙度為Ra=0.05μm以下之比較例2之情形時,最終製品之Ra/t小於0.004,故於銅箔表面劃有傷痕且操作性變差。又,因於最終道次前使用較粗糙之輥,故導致於油坑中剪切變形帶擴展,則即便於最終道次中使用粗糙度較小之輥亦殘留有剪切變形帶,且因油坑之面積率未達6%,故自[100]方位之角度差為15度以上之晶粒之面積率超過20%。其結果,產生多個碟型下陷。In the final cold rolling, the surface roughness of the roll before the final pass was roughened to Ra=0.06 μm or more, and the surface roughness of the roll of the final pass was Ra=0.05 μm or less. In the case, the Ra/t of the final product is less than 0.004, so that the surface of the copper foil is scratched and the workability is deteriorated. Moreover, since the rougher roll is used before the final pass, the shear deformation zone is expanded in the oil pit, and even if the roll having a small roughness is used in the final pass, the shear deformation zone remains, and The area ratio of the oil pit is less than 6%, so the area ratio of the crystal grains having an angle difference of 15 degrees or more from the [100] orientation exceeds 20%. As a result, a plurality of dish forms are depressed.

於最終冷壓延中,使直至最終道次前之輥之表面粗糙度、及最終道次之輥之表面粗糙度均變粗至Ra=0.06μm以上之比較例3、4、6之情形時,最終道次之1道次前之Ra/t為0.004以上,於最終道次前產生多個剪切變形帶擴展之油坑。因此,於最終道次後油坑面積率超過15%,自[100]方位之角度差為15度以上之晶粒之面積率超過20%。其結果,產生多個碟型下陷。In the case of Comparative Examples 3, 4, and 6 in which the surface roughness of the roll before the final pass and the surface roughness of the final pass are both coarsened to Ra = 0.06 μm or more in the final cold rolling, The Ra/t of the first pass of the final pass is 0.004 or more, and a plurality of oil pits with extended shear deformation zones are generated before the final pass. Therefore, after the final pass, the area ratio of the oil puddle exceeds 15%, and the area ratio of the crystal grains having an angle difference of 15 degrees or more from the [100] direction exceeds 20%. As a result, a plurality of dish forms are depressed.

再者,於比較例3、4之情形時,由於使最終冷壓延之全部道次之輥表面粗糙度變粗,故於材料內部,產生多個剪切變形帶顯著地擴展之油坑。因此,不僅是油坑面積率超過15%,銅箔表面之結晶之取向度亦降低,變為I/I0 <50。與此相對應,自[100]方位之角度差為15度以上之晶粒之面積率超過20%。另一方面,於比較例6之情形時,因直至最終道次前之輥之粗糙度較比較例3、4平滑,故I/I0 為50以上而為高於比較例3、4之值,彎曲性良好。Further, in the case of Comparative Examples 3 and 4, since the surface roughness of the entire pass of the final cold rolling was made thick, a plurality of oil pits in which the shear deformation zone was remarkably expanded were generated inside the material. Therefore, not only the area ratio of the sump is more than 15%, but also the degree of orientation of the crystal on the surface of the copper foil is lowered to become I/I 0 <50. Corresponding to this, the area ratio of the crystal grains having an angular difference of 15 degrees or more from the [100] orientation exceeds 20%. On the other hand, in the case of Comparative Example 6, since the roughness of the roll before the final pass was smoother than Comparative Examples 3 and 4, I/I 0 was 50 or more and higher than the values of Comparative Examples 3 and 4. Good bending.

1...銅箔1. . . Copper foil

2...螺釘2. . . Screw

3...振動傳遞構件3. . . Vibration transmitting member

4...振盪驅動體4. . . Oscillating drive

P1...油坑之剖面形狀P1. . . Oil pit shape

P2...油坑之剖面形狀P2. . . Oil pit shape

RD...壓延平行方向RD. . . Calendering parallel direction

TD...壓延直角方向TD. . . Calendering right angle

L1 ~L3 ...直線L 1 to L 3 . . . straight line

HM ...最大高度H M . . . maximum height

HS ...最小高度H S . . . Minimum height

Ry、Ra...表面粗糙度Ry, Ra. . . Surface roughness

d...平均值d. . . average value

di...最大高度與最小高度之差Di. . . The difference between the maximum height and the minimum height

I、I0 ...強度I, I 0 . . . strength

t...厚度t. . . thickness

r...曲率半徑r. . . Radius of curvature

圖1係表示銅箔表面之粗糙度與剪切變形帶關係之圖。Fig. 1 is a view showing the relationship between the roughness of the surface of the copper foil and the shear deformation band.

圖2係表示油坑形狀之圖。Fig. 2 is a view showing the shape of a sump.

圖3係表示相當於油坑最大深度之平均值d之測定法之圖。Fig. 3 is a view showing a measurement method corresponding to the average value d of the maximum depth of the oil pit.

圖4係表示實施例1之光學顯微鏡像之圖。Fig. 4 is a view showing an optical microscope image of Example 1.

圖5係表示比較例1之光學顯微鏡像之圖。Fig. 5 is a view showing an optical microscope image of Comparative Example 1.

圖6係表示實施例1之共軛焦顯微鏡像之圖。Fig. 6 is a view showing a conjugate focal microscope image of Example 1.

圖7係表示比較例1之共軛焦顯微鏡像之圖。Fig. 7 is a view showing a conjugate focal microscope image of Comparative Example 1.

圖8係表示藉由彎曲試驗裝置進行彎曲疲勞壽命之測定之方法之圖。Fig. 8 is a view showing a method of measuring the bending fatigue life by a bending test device.

Claims (3)

一種壓延銅箔,在銅箔表面於壓延平行方向長度為175μm測定之表面粗糙度Ra與該銅箔之厚度t之比Ra/t為0.004以上0.007以下,於以200℃加熱30分鐘調質為再結晶組織之狀態下,由壓延面之X射線繞射所求得之(200)面之強度(I)相對於由微粉末銅之X射線繞射所求得之(200)面之強度(I0 )為I/I0 ≧50;在銅箔表面於壓延平行方向長度為175μm,且於壓延直角方向分別相隔50μm以上之3條直線上,相當於油坑(oil pit)最大深度之各直線之厚度方向的最大高度與最小高度之差的平均值d與該銅箔之厚度t之比d/t為0.1以下;於利用共軛焦顯微鏡測定時之油坑之面積率為6%以上15%以下。A rolled copper foil having a ratio Ra/t of a surface roughness Ra measured on a surface of a copper foil in a direction parallel to a rolling direction of 175 μm and a thickness t of the copper foil of 0.004 or more and 0.007 or less, and is heated at 200 ° C for 30 minutes to adjust the quality to In the state of the recrystallized structure, the intensity of the (200) plane obtained by the X-ray diffraction of the calendering surface is relative to the intensity of the (200) plane obtained by the X-ray diffraction of the fine powder copper ( I 0 ) is I/I 0 ≧ 50; the length of the copper foil surface is 175 μm in the parallel direction of the rolling, and is three lines which are separated by 50 μm or more in the direction perpendicular to the rolling direction, which corresponds to the maximum depth of the oil pit. The ratio d/t of the average value d of the difference between the maximum height and the minimum height in the thickness direction of the straight line to the thickness t of the copper foil is 0.1 or less; and the area ratio of the oil pit when measured by a conjugate focal microscope is 6% or more 15% or less. 如申請專利範圍第1項之壓延銅箔,其中,對該經200℃×30分鐘熱處理後之銅箔表面進行電解研磨後以EBSD觀察時,自[100]方位之角度差為15度以上之晶粒的面積率為20%以下。The rolled copper foil according to claim 1, wherein the surface of the copper foil after heat treatment at 200 ° C for 30 minutes is subjected to electrolytic polishing, and then observed by EBSD, the angle difference from the [100] orientation is 15 degrees or more. The area ratio of the crystal grains is 20% or less. 如申請專利範圍第1或2項之壓延銅箔,其中,將鑄塊進行熱壓延後,反覆進行冷壓延與退火,最後進行最終冷壓延而加以製造,於該最終冷壓延步驟中,在最終道次前之階段中,Ra/t為0.002以上0.004以下。The rolled copper foil according to claim 1 or 2, wherein the ingot is subjected to hot rolling, followed by cold rolling and annealing, and finally subjected to final cold rolling to be manufactured. In the final cold rolling step, In the stage before the final pass, Ra/t is 0.002 or more and 0.004 or less.
TW100135862A 2010-10-28 2011-10-04 Rolled copper foil TWI448337B (en)

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